JPWO2013183262A1 - Imprint method and imprint apparatus - Google Patents

Abstract

A resin layer forming step of forming a resin layer by applying a resin to a substrate; a template contact step of bringing a template having a predetermined shape into contact with the resin layer; and a template removing step of releasing the template from the resin layer; A first pressure reducing step of reducing the atmosphere around the resin to a first pressure, and a second pressure higher than the first pressure. A first boosting step for boosting the pressure to a second pressure, a second decompressing step for reducing the pressure to a third pressure lower than the second pressure, and a second boosting step for boosting to a fourth pressure higher than the third pressure. And a degassing step including at least the step of bringing the template into contact with the resin layer.

Description

  The present invention relates to an imprint method and an imprint apparatus.

  Conventionally, a template in which a pattern of a predetermined shape is formed by forming a resin layer made of a resin that is polymerized and solidified by irradiation of light, for example, ultraviolet rays, on a substrate such as a semiconductor wafer or a glass substrate for LCD, for example. In this state, an imprint method is known in which the resin layer is irradiated with ultraviolet rays to be solidified, and the pattern shape of the template is transferred to the resin layer.

  In such an imprint method, when the resin layer and the template are brought into contact with each other, ambient air may enter between the resin layer and the template. If ambient air enters between the resin layer and the template in this way, the shape of the pattern transferred to the resin layer becomes defective. For this reason, a method has been proposed in which the ambient atmosphere is a reduced-pressure atmosphere and the resin layer and the template are brought into contact (see, for example, Patent Document 1).

JP 2008-012858 A

  As described above, in the method in which the resin layer and the template are brought into contact with each other in a reduced-pressure atmosphere, ambient air can be prevented from entering between the resin layer and the template when the resin layer and the template are brought into contact with each other. However, ambient air may enter the resin layer before it is applied to the substrate or when the resin is applied to the substrate. For this reason, the conventional technique has a problem that bubbles are not sufficiently removed, and the shape of the formed resin pattern may be defective.

  The present invention has been made in response to the above-described conventional circumstances, and an object thereof is to provide an imprint method and an imprint apparatus capable of reliably forming a resin pattern having a good shape.

  One aspect of the imprint method of the present invention includes a resin layer forming step of forming a resin layer by applying a resin to a substrate, a template contact step of bringing a template having a predetermined shape into contact with the resin layer, and the resin layer A template detachment step for detaching the template from, and an imprint method for curing the resin layer, wherein the atmosphere around the resin is depressurized to a first pressure, A first pressure increasing step for increasing the pressure to a second pressure higher than the first pressure; a second pressure reducing step for decreasing the pressure to a third pressure lower than the second pressure; and a second pressure increasing step higher than the third pressure. A degassing step including at least a second pressure increasing step for increasing the pressure to 4 before the template is brought into contact with the resin layer.

  One aspect of the imprint apparatus of the present invention includes a dropping mechanism for dropping a resin on a substrate, an application mechanism for applying the resin dropped on the substrate to the substrate to form a resin layer, and a predetermined amount on the resin layer. An imprint mechanism for contacting and releasing the shaped template; a curing mechanism for curing the resin layer; a pressure adjusting mechanism for depressurizing and increasing the atmosphere around the resin; the dropping mechanism; and the coating mechanism. And an imprint apparatus comprising a controller having a storage unit storing a control program for controlling the imprint mechanism, the curing mechanism, and the pressure adjusting mechanism, wherein the controller includes the controller Before the template is brought into contact with the resin layer by the imprint mechanism, the atmosphere around the resin is reduced to the first pressure by the pressure adjusting mechanism. A depressurization step, a first pressure increase step for increasing the pressure to a second pressure higher than the first pressure, a second pressure decrease step for reducing the pressure to a third pressure lower than the second pressure, and the third pressure And degassing the resin by performing a degassing step including at least a second pressure increasing step of increasing the pressure to a fourth pressure higher than the pressure.

  ADVANTAGE OF THE INVENTION According to this invention, the imprint method and the imprint apparatus which can form the resin-made pattern of a favorable shape reliably can be provided.

The figure for demonstrating the process of the imprint method of one Embodiment of this invention. The figure which shows the structure of the deaeration mechanism which concerns on embodiment. The graph which shows the state of the change of the pressure in the deaeration mechanism which concerns on embodiment. The figure which shows the structure of the dripping / coating module which concerns on embodiment. The figure which shows the structure of the imprint module which concerns on embodiment. The figure which shows the structure of the imprint apparatus of 1st Embodiment. The figure which shows the structure of the dripping / deaeration module which concerns on embodiment. The figure which shows the structure of the application | coating module which concerns on embodiment. The figure which shows the structure of the imprint apparatus of 2nd Embodiment. The figure which shows the structure of the deaeration module which concerns on embodiment. The figure which shows the structure of the imprint apparatus of 3rd Embodiment. The figure which shows the structure of a dripping / deaeration / application | coating module. The figure which shows the structure of the imprint apparatus of 4th Embodiment. The figure which shows the structure of the imprint apparatus of 5th Embodiment.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a diagram schematically showing steps of an imprint method according to an embodiment of the present invention. This imprint method is for forming a resin pattern 4 having a resin layer 3 in a predetermined shape, such as an etching mask or a lens for an optical element, on a substrate 1 such as a semiconductor wafer or a glass substrate for LCD. Is.

  In the imprint method of this embodiment, as shown in FIG. 1, first, the photocurable resin 2 is dropped on the substantial center of the substrate 1 (FIG. 1A). The photocurable resin 2 is a resin that is polymerized and cured by irradiation with light, for example, ultraviolet rays. For example, a photocurable resin 2 made of an epoxy resin, an acrylic resin, or the like can be used.

  Next, the photocurable resin 2 dropped on the substrate 1 is applied to the entire surface of the substrate 1 and spread to form a resin layer 3 made of the photocurable resin 2 (FIG. 1B). In this case, as will be described later, a spin coating apparatus that rotates the substrate 1 and diffuses it by centrifugal force can be used. The thickness of the resin layer 3 is, for example, about several microns (for example, 1 to 10 μm).

  Next, positioning is performed with the template 6 facing the resin layer 3 (FIG. 1C), the template 6 is brought into contact with the resin layer 3, and the resin layer 3 is irradiated with ultraviolet rays 5 in this state. The solidification by polymerization is advanced (FIG. 1 (d)). In addition, as shown in FIG.1 (d), the irradiation of the ultraviolet-ray 5 may use the method of irradiating from the side other than the method performed from the upper direction of the template 6 via the template 6. FIG.

  Then, solidification by polymerization in the resin layer 3 proceeds, and after the template 6 is detached, the shape transferred to the resin layer 3 (resin pattern 4) is maintained, and then the resin layer 3 (resin A mold release step for removing the template 6 from the pattern 4) is performed (FIG. 1E).

  Moreover, in this embodiment, before making the template 6 contact the resin layer 3 as mentioned above, deaeration of the photocurable resin 2 is performed by adjusting the pressure of the atmosphere around the photocurable resin 2. . In the deaeration process in the present embodiment, for example, a deaeration mechanism 15 configured as shown in FIG. 2 is used. The deaeration mechanism 15 includes a tank 150 that stores the photocurable resin 2 therein.

  A resin introduction line 151 is connected to the ceiling of the tank 150, and a resin introduction valve 151 a is inserted in the resin introduction line 151. A resin discharge line 152 is connected to the bottom of the tank 150. A resin discharge valve 152 a is inserted into the resin discharge line 152, and a nozzle 13 is connected to the tip of the resin discharge line 152. ing.

  A gas introduction line 153 and a gas exhaust line 154 are connected to the side wall portion of the tank 150. A gas introduction valve 153a is inserted in the gas introduction line 153. An exhaust valve 154 a is inserted in the gas exhaust line 154, and a vacuum pump 155 is connected to the tip of the exhaust line 154.

  In the deaeration mechanism 15 configured as described above, the resin introduction valve 151 a is opened to introduce the photocurable resin 2 into the tank 150 from the resin introduction line 151. Then, the photocurable resin 2 is deaerated by operating the vacuum pump 155 and opening the exhaust valve 154a. At this time, as shown in the graph of FIG. 3 in which the pressure in the tank 150 is the atmospheric pressure on the vertical axis and the time on the horizontal axis, the first pressure reducing step to set the first pressure as a constant low pressure, A first pressure increasing step for setting a second pressure higher than the first pressure; a second pressure reducing step for setting a third pressure lower than the second pressure; a fourth pressure higher than the third pressure; And the depressurization step including the second pressure increase step.

  For example, the first pressure is preferably about 1/100 of atmospheric pressure (about 1 kPa), and the second pressure is preferably slightly higher than atmospheric pressure, for example. The first pressure and the third pressure may be the same pressure or different pressures. Similarly, the second pressure and the fourth pressure may be the same pressure or different pressures.

  When the first pressure and the third pressure are the same, and the second pressure and the fourth pressure are the same pressure, the pressure in the tank 150 is substantially the first pressure. And a state where the second pressure is higher than the first pressure are alternately repeated a plurality of times.

  In this case, the above process is realized by controlling the exhaust from the tank 150 by the gas exhaust line 154 and the gas introduction from the gas introduction line 153 into the tank 150.

  As described above, by alternately repeating the low pressure state and the high pressure state, the photocurable resin 2 can be removed more efficiently compared to the case where the pressure is reduced to a constant pressure for a certain period of time. I can do it. This is presumed to be because bubbles in the photocurable resin 2 dynamically expand and contract due to fluctuations in the pressure of the surrounding atmosphere. In this case, deaeration can be efficiently performed in a shorter time by preventing the pressure from being excessively lowered when the pressure is reduced and preventing the pressure from being raised excessively when the pressure is increased.

  For example, when deaeration was performed by a method of maintaining the pressure reduced to a constant pressure for a certain period of time while visually observing the photocurable resin 2, even if the pressure was reduced for 3 minutes, The existing bubbles could not be removed. On the other hand, when the above-described degassing step that alternately repeats the low pressure state and the high pressure state was performed, the bubbles present in the photocurable resin 2 were completely removed by the degassing step for 3 minutes. I was able to.

  Next, the imprint apparatus according to this embodiment will be described. Among the steps of the imprint method of the present embodiment, the step of dropping the photocurable resin 2 onto the substrate 1 and the resin layer 3 by applying the dropped photocurable resin 2 to the substrate 1 are formed. In the coating process, for example, the dropping / coating module 10 having the configuration shown in FIG. 4 can be used.

  In the dropping / coating module 10 shown in FIG. 4, a rotating stage 12 on which the substrate 1 is placed and rotated and a nozzle 13 for supplying the photocurable resin 2 are disposed in the processing chamber 11. Has been. Then, the light curable resin 2 is dropped from the nozzle 13 onto the substantial center of the substrate 1 placed on the rotary stage 12, and the substrate 1 is rotated by the rotary stage 12, whereby the light dropped on the substrate 1. The curable resin 2 is diffused by centrifugal force, and the photocurable resin 2 is applied to the entire surface of the substrate 1 to form a resin layer. In the present embodiment, the deaeration mechanism 15 described above and the resin coating module 10 having the above configuration are used in combination, and the photocurable resin 2 deaerated by the deaeration mechanism 15 is supplied from the nozzle 13 to the substrate 1. .

  Further, in the step of bringing the template 6 into contact with the resin layer 3, the step of irradiating the resin layer 3 with the ultraviolet rays 5, and the step of removing the template 6 from the resin layer 3 (imprinting step), for example, FIG. The imprint module 30 shown can be used. In the imprint module 30, an upper stage 32 that holds a template 6 on which a predetermined pattern 6 a is formed and a lower stage 33 that holds a substrate 1 are disposed in a processing chamber 31. At least one of them is provided with a drive mechanism (not shown) that can move up and down. The drive mechanism is provided with an alignment mechanism for aligning the substrate 1 and the template 6.

  Further, a UV light source 23 for irradiating ultraviolet rays is disposed on the ceiling of the processing chamber 31. As the UV light source 23, for example, a UV lamp made of LED and having a wavelength of about 365 nm and about 300 mW can be used. Further, a gas exhaust line 24 and a gas supply line 25 for supplying a gas such as nitrogen gas are connected to the processing chamber 31. A vacuum pump 24a is connected to the gas exhaust line 24, and an exhaust valve 24b is inserted. In addition, a supply valve 25 a is inserted in the gas supply line 25.

  In the imprint module 30 configured as described above, the substrate 1 and the template 6 are aligned at a predetermined position, and the template 6 is brought into contact with the resin layer 3 of the substrate 1. Then, the resin layer 3 is cured by irradiating the ultraviolet light 5 from the UV light source 23. At this time, some photocurable resins (UV curable resins) are difficult to cure when oxygen is present in the atmosphere. For this reason, the inside of the processing chamber 31 can be set to a reduced-pressure atmosphere or a nitrogen-filled atmosphere. Then, after the resin layer 3 is cured, the template 6 is detached from the resin layer 3 of the substrate 1, thereby transferring the predetermined pattern 6 a formed on the template 6 to the resin layer 3. In the present embodiment, when the template 6 is brought into contact with the resin layer 3, the imprint process is performed in a state where the inside of the processing chamber 31 is in a reduced-pressure atmosphere in order to prevent bubbles from entering the resin layer 3. To implement.

  Next, an embodiment of the imprint apparatus 100 configured by combining the dropping / coating module 10 having the above-described configuration, the deaeration mechanism 15, the imprint module 30, and the like will be described with reference to FIG.

  In the imprint apparatus 100 according to the first embodiment shown in FIG. 6, a load / unload port 101 is disposed at the left end portion in the drawing, and a transport module 102 is connected to the load / unload port 101. . A dripping / coating module 10, a deaeration mechanism 15, and an imprint module 30 are arranged along the transport module 102 from the left side in the drawing.

  Further, the imprint apparatus 100 includes a controller 110. The load / unload port 101, the transfer module 102, the dropping / coating module 10, the deaeration mechanism 15, the imprint module 30, and the like are controlled by the controller 110 in a centralized manner.

  The controller 110 includes a process controller 111 that includes a CPU and controls each unit of the imprint apparatus 100, a user interface unit 112, and a storage unit 113.

  The user interface unit 112 includes a keyboard on which a process manager inputs commands to manage the imprint apparatus 100, a display that visualizes and displays the operating status of the imprint apparatus 100, and the like.

  The storage unit 113 stores a recipe in which a control program (software) for realizing various processes executed by the imprint apparatus 100 under the control of the process controller 111, processing condition data, and the like are stored. Then, if necessary, an arbitrary recipe is called from the storage unit 113 by an instruction from the user interface unit 112 and is executed by the process controller 111, so that the imprint apparatus 100 can control the process under the control of the process controller 111. Desired processing is performed. In addition, recipes such as control programs and processing condition data may be stored in a computer-readable storage medium (for example, a hard disk, CD, flexible disk, semiconductor memory, etc.) or other recipes. For example, it is possible to transmit the data from time to time via a dedicated line and use it online.

  On the load / unload port 101, for example, a hoop or a cassette containing a semiconductor wafer is placed. Then, the semiconductor wafer is taken out from the hoop or the cassette by the transfer robot disposed in the transfer module 102 and is first transferred into the dropping / coating module 10. In the dropping / coating module 10, a photocurable resin is applied to the semiconductor wafer to form a resin layer. At this time, the photocurable resin is deaerated by the deaeration mechanism 15 and then dropped onto the semiconductor wafer. Therefore, the photocurable resin is supplied to the semiconductor wafer and applied without containing bubbles.

  Next, the semiconductor wafer is carried into the imprint module 30 by the transfer robot of the transfer module 102. Here, the template is brought into contact with the resin layer on the semiconductor wafer, and the resin layer is cured by irradiating with ultraviolet rays, so that the shape of the template is transferred to the resin layer on the semiconductor wafer. As described above, the imprint process by the imprint module 30 is performed in a reduced pressure atmosphere. In this case, at least one of the first pressure and the third pressure, which are constant lower pressures in the deaeration process by the deaeration mechanism 15 described above than the pressure of the surrounding atmosphere when the imprint process is performed. Adjust the pressure so that one is lower. Thereby, bubbles that did not appear in the deaeration process can be prevented from appearing in the imprint process.

  Then, after the curing of the resin layer has progressed, the template is detached from the resin layer, and the semiconductor wafer on which the resin pattern is formed is placed on the load / unload port 101 by the transport robot of the transport module 102 or Store in cassette.

  Through the above steps, the imprint apparatus 100 forms a resin pattern (resin pattern 4 shown in FIG. 1) on the semiconductor wafer.

  In the imprint apparatus 100 described above, the photocurable resin is degassed by the degassing mechanism 15 and then dropped onto the semiconductor wafer. However, the photocurable resin is degassed after being dropped onto the semiconductor wafer. It may be. In this case, for example, the dropping / degassing module 40 having the configuration shown in FIG. 7 can be used.

  The dripping / degassing module 40 shown in FIG. 7 includes a chamber 41 that can be hermetically held inside, and a substrate holding stage 42 and the photocurable resin 2 are attached to the substrate 1 in the chamber 41. A nozzle 13 for dropping is disposed. The chamber 41 is connected to a gas exhaust line 24 and a gas supply line 25 for supplying gas. A vacuum pump 24a is connected to the gas exhaust line 24, and an exhaust valve 24b is inserted. In addition, a supply valve 25 a is inserted in the gas supply line 25. Then, after the photocurable resin 2 is dropped from the nozzle 13 onto the substrate 1, the exhaust from the gas exhaust line 24 and the gas supply from the gas supply line 25 are alternately performed, whereby the pressure in the chamber 41 is changed to FIG. Degassing is performed in such a manner as to fluctuate as shown in FIG.

  As described above, after dropping and degassing the photocurable resin 2 on the substrate 1 in the dropping / degassing module 40, the photocurable resin 2 is applied to the substrate 1 by the coating module 50 as shown in FIG. Apply on top. The coating module 50 has a configuration in which a rotation stage 12 that can be rotated by placing the substrate 1 is disposed in a processing chamber 51. Then, the photocurable resin 2 on the substrate 1 is diffused by centrifugal force by rotating the substrate 1 on which the photocurable resin 2 is dropped by the rotary stage 12, and the photocurable resin 2 is spread on the entire surface of the substrate 1. Is applied to form a resin layer. Thereafter, the pattern is transferred to the resin film 3 by the imprint module 30 shown in FIG.

  FIG. 9 shows a configuration of an imprint apparatus 100a according to the second embodiment in which the dropping / degassing module 40, the coating module 50, and the imprint module 30 are combined. As shown in FIG. 9, in the imprint apparatus 100a, the dropping / degassing module 40, the coating module 50, and the imprint module 30 are arranged in this order along the transport module 102 from the left side in the drawing. Note that portions corresponding to those of the imprint apparatus 100 illustrated in FIG. 6 are denoted by the same reference numerals, and redundant description is omitted. Then, the semiconductor wafer is sequentially transferred to the dropping / degassing module 40, the coating module 50, and the imprint module 30 by a transfer robot (not shown) disposed in the transfer module 102, thereby dropping and removing the photocurable resin. The care, application, and imprint processes are sequentially performed.

  In the imprint apparatus 100a of the second embodiment, the case where the dropping / degassing module 40 and the coating module 50 are combined has been described. However, as illustrated in FIG. It is also possible to use a deaeration module 60 that accommodates the substrate 1 and performs deaeration. A deaeration module 60 shown in FIG. 10 includes a chamber 61 that can be hermetically closed. A substrate holding mechanism 62 that can hold a plurality of substrates 1 is disposed in the chamber 61. Yes.

  The chamber 61 is connected to a gas exhaust line 24 and a gas supply line 25 for supplying gas. A vacuum pump 24a is connected to the gas exhaust line 24, and an exhaust valve 24b is inserted. In addition, a supply valve 25 a is inserted in the gas supply line 25. Then, in a state where the plurality of substrates 1 onto which the photocurable resin 2 has been dropped is held by the substrate holding mechanism 62, the exhaust from the gas exhaust line 24 and the gas supply from the gas supply line 25 are alternately performed, Deaeration is performed such that the pressure in the chamber 61 fluctuates as shown in FIG.

  FIG. 11 shows a configuration of an imprint apparatus 100b according to the third embodiment in which the deaeration module 60, the dropping / coating module 10, and the imprint module 30 are combined. As shown in FIG. 11, in the imprint apparatus 100b, a deaeration module 60, a drip / coating module 10, and an imprint module 30 are arranged in this order along the transport module 102 from the left side in the drawing. Note that portions corresponding to those of the imprint apparatus 100 illustrated in FIG. 6 are denoted by the same reference numerals, and redundant description is omitted.

  In the imprint apparatus 100b having the above-described configuration, the semiconductor wafer is first transferred to the dropping / coating module 10 by a transfer robot (not shown) disposed in the transfer module 102, where a photocurable resin is dropped onto the semiconductor wafer. Then, the process of transporting to the deaeration module 60 is repeated so that a plurality of semiconductor wafers are accommodated in the deaeration module 60. Thereafter, deaeration in the deaeration module 60 is performed. Thereafter, the semiconductor wafer is sequentially transported to the dropping / coating module 10 and the imprint module 30 to perform application and imprint processes of the photocurable resin.

  FIG. 12 shows a configuration of a dropping / degassing / coating module 70 that performs dropping, degassing, and coating of a photocurable resin. The dripping / degassing / coating module 70 includes a chamber 71 that can be hermetically closed inside, and in the chamber 71, a rotary stage 12 that can be rotated by placing the substrate 1 thereon. A nozzle 13 for supplying the photocurable resin 2 is disposed. The chamber 71 is connected to a gas exhaust line 24 and a gas supply line 25 for supplying gas. A vacuum pump 24a is connected to the gas exhaust line 24, and an exhaust valve 24b is inserted. In addition, a supply valve 25 a is inserted in the gas supply line 25.

  In the dropping / degassing / coating module 70 having the above configuration, first, the photocurable resin 2 is dropped from the nozzle 13 onto the substantial center of the substrate 1 placed on the rotary stage 12. Next, in a state where the substrate 1 onto which the photocurable resin 2 has been dropped is held on the rotary stage 12, the exhaust from the gas exhaust line 24 and the gas supply from the gas supply line 25 are alternately performed, whereby the chamber The photocurable resin 2 is degassed so that the pressure in 71 varies as shown in FIG. Thereafter, the substrate 1 is rotated by the rotation stage 12 to diffuse the photocurable resin 2 dropped on the substrate 1 by centrifugal force, and the resin layer is applied by applying the photocurable resin 2 to the entire surface of the substrate 1. Form.

  FIG. 13 shows a configuration of an imprint apparatus 100 c according to the fourth embodiment in which the dropping / degassing / coating module 70 and the imprint module 30 are combined. As shown in FIG. 13, in the imprint apparatus 100 c, a dripping / deaeration / coating module 70 and an imprint module 30 are arranged in this order from the left side in the drawing along the transport module 102. Note that portions corresponding to those of the imprint apparatus 100 illustrated in FIG. 6 are denoted by the same reference numerals, and redundant description is omitted.

  In the imprint apparatus 100c configured as described above, a semiconductor wafer is first transported to the dropping / degassing / coating module 70 by a transport robot (not shown) disposed in the transport module 102, where a photocurable resin is applied to the semiconductor wafer. It is dripped and deaeration and application | coating of photocurable resin are performed. Thereafter, the semiconductor wafer is transferred to the imprint module 30 and an imprint process is performed.

  FIG. 14 shows a configuration of an imprint apparatus 100d of the fifth embodiment configured by combining the dropping / coating module 10 shown in FIG. 4 and the imprint module 30 shown in FIG. As shown in FIG. 14, in the imprint apparatus 100d, the dropping / coating module 10 and the imprint module 30 are arranged in this order along the transport module 102 from the left side in the drawing. Note that portions corresponding to those of the imprint apparatus 100 illustrated in FIG. 6 are denoted by the same reference numerals, and redundant description is omitted.

  In the imprint apparatus 100d of the fifth embodiment, in the dropping / coating module 10, after the photocurable resin is dropped and applied to the semiconductor wafer, the imprint module 30 is applied to the lower stage 33 shown in FIG. By alternately performing exhaust from the gas exhaust line 24 and gas supply from the gas supply line 25 while the semiconductor wafer is mounted, the pressure in the chamber 31 varies as shown in FIG. To deaerate the photocurable resin. Then, after that, the template 6 is brought into contact with the resin layer, the ultraviolet ray 5 is irradiated, and thereafter, the template is detached from the resin layer, and the imprint process is performed.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. For example, deaeration from the photocurable resin may be performed by combining deaeration in each step such as before dropping onto the substrate, after dropping onto the substrate, after application onto the substrate, and before imprinting. Further, for example, as the resin to which the pattern shape of the template is transferred, a resin other than the photocurable resin (for example, a thermosetting resin) may be used. In the case of using a thermosetting resin, for example, in the imprint module 30 shown in FIG. 5, a resistance heating type heater is embedded in the upper stage 32 and the lower stage 33, and the heater (the thermosetting resin is used). The resin layer 3 may be heated and cured according to an example of the curing mechanism in the case. In this case, it is not necessary to provide the UV light source 23 (an example of a curing mechanism when using a photocurable resin). It is obvious for those skilled in the art that various changes or modifications can be made within the scope of the idea described in the claims. It is understood that it belongs to the range.

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2 ... Photocurable resin, 3 ... Resin layer, 4 ... Resin pattern, 5 ... Ultraviolet rays, 6 ... Template.

Claims (8)

A resin layer forming step of forming a resin layer by applying resin to a substrate;
A template contact step of bringing a template having a predetermined shape into contact with the resin layer;
A template removal step for removing the template from the resin layer;
An imprint method for curing the resin layer,
A first pressure reducing step for reducing the atmosphere around the resin to a first pressure, a first pressure increasing step for increasing the second pressure higher than the first pressure, and a pressure lower than the second pressure A degassing step including at least a second depressurizing step of depressurizing to a third pressure and a second pressurizing step of increasing the pressure to a fourth pressure higher than the third pressure; An imprinting method, which is performed before contact. The imprint method according to claim 1, comprising:
The imprinting method, wherein the template contact step is performed under a reduced pressure atmosphere. The imprint method according to claim 2, wherein
The imprint method characterized in that the minimum value of the pressure in the degassing step is lower than the pressure of the reduced pressure atmosphere in the template contact step. The imprint method according to any one of claims 1 to 3,
An imprint method comprising performing the degassing step after dropping the resin on the substrate and before spreading the resin on the substrate. The imprint method according to claim 1, wherein:
An imprinting method comprising: storing the resin in an airtight container before dropping the resin on the substrate, and performing the degassing step. The imprint method according to claim 1, wherein:
The imprinting method, wherein the resin is a resin that is cured by irradiating light, and the resin layer is irradiated with light in a wavelength region that cures the resin. A dropping mechanism for dropping the resin on the substrate;
An application mechanism for applying the resin dropped onto the substrate to the substrate to form a resin layer;
An imprint mechanism for contacting and releasing a template having a predetermined shape on the resin layer;
A curing mechanism for curing the resin layer;
A pressure adjusting mechanism for reducing and increasing the pressure around the resin;
An imprint apparatus comprising a controller having a storage unit storing a control program for controlling the dripping mechanism, the coating mechanism, the imprint mechanism, the curing mechanism, and the pressure adjusting mechanism. And
The controller includes a first depressurization step of depressurizing the atmosphere around the resin to a first pressure by the pressure adjustment mechanism before the template is brought into contact with the resin layer by the imprint mechanism; A first pressure increasing step for increasing the pressure to a second pressure higher than the first pressure; a second pressure reducing step for decreasing the pressure to a third pressure lower than the second pressure; and a second pressure increasing step higher than the third pressure. An imprint apparatus characterized in that the resin is deaerated by performing a deaeration process including at least a second pressure increase process for increasing the pressure to 4. The imprint apparatus according to claim 7, wherein
The resin is a resin that cures when irradiated with light,
The imprint apparatus, wherein the curing mechanism irradiates the resin layer with light in a wavelength region that cures the resin.

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