TW201408471A - Imprint method and imprint device - Google Patents

Abstract

An imprint method that hardens a resin layer, the method having a resin layer formation step for forming a resin layer by coating a substrate with a resin, a template contact step for contacting a template that has a prescribed shape to the resin layer, and a template separation step for separating the template from the resin layer. The method has a deaeration step that is performed before contacting the template to the resin layer. The deaeration step includes, at least, a first pressure reduction step for reducing the pressure of the atmosphere surrounding the resin to a first pressure, a first pressure elevation step for elevating the pressure of the atmosphere surrounding the resin to a second pressure that is higher than the first pressure, a second pressure reduction step for reducing the pressure of the atmosphere surrounding the resin to a third pressure that is lower than the second pressure, and a second pressure elevation step for elevating the pressure of the atmosphere surrounding the resin to a fourth pressure that is higher than the third pressure.

Description

Imprinting method and imprinting device

The present invention relates to an imprint method and an imprint apparatus.

In the past, an imprint method has been known. For example, a resin such as a semiconductor wafer or a glass substrate for an LCD (Liquid Crystal Display) is formed by a resin which is polymerized and cured by irradiation with light, for example, ultraviolet rays. The resin layer is brought into contact with a template in which a pattern having a specific shape is formed. In this state, the resin layer is irradiated with ultraviolet rays to be cured, and the pattern shape of the template is transferred onto the resin layer.

This embossing method is such that when the resin layer is brought into contact with the stencil, there is a possibility that ambient air enters between the resin layer and the stencil. Further, if the surrounding air enters between the resin layer and the stencil as described above, the shape of the pattern transferred to the resin layer becomes defective. Therefore, a method of forming a surrounding environment into a reduced pressure environment and bringing the resin layer into contact with the template has been proposed (for example, refer to Patent Document 1).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2008-012858

As described above, the method of bringing the resin layer into contact with the template under a reduced pressure environment is such that when the resin layer is brought into contact with the template, the surrounding air is prevented from entering between the resin layer and the template. However, there is also an empty space before being applied to the substrate or when the resin is applied to the substrate. The possibility of gas entering the resin layer. Therefore, in the prior art, there is a problem in that the removal of bubbles is insufficient, and there is a case where the shape of the formed resin pattern is defective.

The present invention has been made in view of the above-described circumstances, and an object of the invention is to provide an imprint method and an imprint apparatus which can reliably form a resin pattern having a good shape.

An aspect of the imprint method of the present invention is characterized in that it comprises a resin layer forming step of applying a resin to a substrate to form a resin layer, and a template contacting step of forming the resin layer into a specific one a stencil contact of the shape; and a stencil removal step of detaching the stencil from the resin layer; and curing the resin layer, and performing a degassing step before contacting the resin layer with the template, the degassing step The method includes at least a first pressure reduction step of decompressing the environment around the resin to a first pressure, and a first pressure increasing step of raising the environment around the resin to be higher than the second pressure. a second pressure reduction step of depressurizing the environment around the resin to a third pressure lower than the second pressure; and a second pressure increasing step of raising the environment around the resin to be higher than The fourth pressure of the third pressure described above.

An aspect of the imprint apparatus of the present invention is characterized in that it comprises: a dropping mechanism for dropping a resin onto a substrate; and a coating mechanism for applying the resin dropped onto the substrate to the substrate Forming a resin layer; an imprinting mechanism that contacts and disengages the resin layer from a template formed into a specific shape; a hardening mechanism that hardens the resin layer; and a pressure adjusting mechanism that decompresses and raises the environment around the resin And a controller comprising: a memory mechanism storing a control program, the control program controlling the dropping mechanism, the coating mechanism, the stamping mechanism, the hardening mechanism, and the pressure adjusting mechanism; and the controller Before the resin layer is brought into contact with the template by the imprinting mechanism, a degassing step is performed to perform degassing of the resin, and the degassing step includes at least: a first decompression step, which is adjusted by the pressure Mechanism, and the ring around the above resin The first pressure-up step is to increase the environment around the resin to a second pressure higher than the first pressure by the pressure adjustment mechanism; and the second pressure reduction step, The pressure adjusting mechanism is configured to depressurize the environment around the resin to a third pressure lower than the second pressure; and a second pressure increasing step by using the pressure adjusting mechanism The environment around the resin is raised to a fourth pressure higher than the third pressure.

According to the present invention, it is possible to provide an imprint method and an imprint apparatus which can reliably form a resin pattern having a good shape.

1‧‧‧Substrate

2‧‧‧Photocurable resin

3‧‧‧ resin layer

4‧‧‧ resin pattern

5‧‧‧ UV

6‧‧‧ template

6a‧‧‧Special patterns

10‧‧‧Drip/Coating Module

11, 51‧‧ ‧ processing room

12‧‧‧Rotating table

13‧‧‧Nozzles

15‧‧‧Degassing mechanism

23‧‧‧UV light source

24‧‧‧ gas exhaust line

24a‧‧‧vacuum pump

24b‧‧‧Exhaust valve

25‧‧‧ gas supply line

25a‧‧‧Supply valve

30‧‧‧ Imprinting module

31, 41, 61, 71‧‧ ‧ chamber

32‧‧‧Upper side

33‧‧‧lower side

40‧‧‧Drip/degassing module

42‧‧‧Substrate holder

50‧‧‧ Coating module

60‧‧‧ degassing module

62‧‧‧Substrate retention mechanism

70‧‧‧Drip/degassing/coating module

100, 100a, 100b, 100c, 100d‧‧‧ imprinting device

101‧‧‧Load/Unload埠

102‧‧‧Transport module

110‧‧‧Transport module

111‧‧‧Process Controller

112‧‧‧Users face

113‧‧‧Memory Department

151‧‧‧Resin import line

151a‧‧‧Resin introduction valve

152‧‧‧Resin discharge line

152a‧‧‧Resin discharge valve

153‧‧‧ gas introduction line

153a‧‧‧ gas introduction valve

154‧‧‧ gas exhaust line

154a‧‧‧Exhaust valve

155‧‧‧vacuum pump

BRIEF DESCRIPTION OF THE DRAWINGS Figures 1 (a) to (e) are views for explaining steps of an imprint method according to an embodiment of the present invention.

Fig. 2 is a view showing the configuration of a deaeration mechanism of the embodiment.

Fig. 3 is a graph showing a state of pressure change in the deaeration mechanism of the embodiment.

Fig. 4 is a view showing the configuration of a dropping/coating module of the embodiment.

Fig. 5 is a view showing the configuration of an imprint module of the embodiment.

Fig. 6 is a view showing the configuration of the imprint apparatus of the first embodiment.

Fig. 7 is a view showing the configuration of a dropping/degassing module of the embodiment.

Fig. 8 is a view showing the configuration of a coating module of the embodiment.

Fig. 9 is a view showing the configuration of an imprint apparatus according to a second embodiment.

Fig. 10 is a view showing the configuration of a degassing module of the embodiment.

Fig. 11 is a view showing the configuration of an imprint apparatus according to a third embodiment.

Fig. 12 is a view showing the configuration of a dropping/degassing/coating module.

Fig. 13 is a view showing the configuration of an imprint apparatus according to a fourth embodiment;

Fig. 14 is a view showing the configuration of an imprint apparatus according to a fifth embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view schematically showing the steps of an imprint method according to an embodiment of the present invention. This imprint method is used for forming a resin pattern 4 having a specific shape, for example, an etch mask or a lens for an optical element, on the substrate 1 such as a semiconductor wafer or a glass substrate for LCD. .

As shown in Fig. 1, the imprint method of the present embodiment firstly drops the photocurable resin 2 on the substantially center of the substrate 1 (Fig. 1(a)). The photocurable resin 2 is a resin which is polymerized and cured by irradiation with light, for example, ultraviolet rays, and for example, a photocurable resin 2 containing an epoxy resin or an acrylic resin can be used.

Then, the photocurable resin 2 dropped onto the substrate 1 is applied onto the entire surface of the substrate 1 and applied to form a resin layer 3 containing the photocurable resin 2 (Fig. 1(b)). Further, in this case, as described below, a spin coating apparatus that rotates the substrate 1 and diffuses by centrifugal force can be used. Further, the thickness of the resin layer 3 is, for example, about several micrometers (for example, 1 to 10 μm).

Then, the resin layer 3 is aligned with the template 6 and positioned (Fig. 1 (c)), and the resin layer 3 is brought into contact with the template 6, and in this state, the ultraviolet rays 5 are irradiated onto the resin layer 3 to carry out the resin layer 3. Curing caused by polymerization in (Fig. 1(d)). Further, the irradiation of the ultraviolet rays 5 is not only a method of irradiating the template 6 from above the template 6 as shown in Fig. 1(d), but also a method of irradiating from the side.

Then, the curing is caused by the polymerization in the resin layer 3, and the template 6 is made from the resin layer 3 after the state in which the template 6 is removed and the shape (resin pattern 4) transferred to the resin layer 3 is maintained. The resin pattern 4) is released from the demolding step (Fig. 1 (e)).

Further, in the present embodiment, the pressure of the photocurable resin 2 is removed by adjusting the pressure of the surrounding environment of the photocurable resin 2 before the resin layer 3 is brought into contact with the template 6 as described above. In the degassing step of the present embodiment, for example, a deaeration mechanism 15 configured as shown in Fig. 2 is used. The deaeration mechanism 15 includes a storage tank 150 that houses the photocurable resin 2 therein.

A resin introduction line 151 is connected to the top plate portion of the storage tank 150, and a resin introduction valve 151a is inserted into the resin introduction line 151. Further, a resin discharge line 152 is connected to the bottom of the storage tank 150, and a resin discharge valve 152a is inserted into the resin discharge line 152, and a nozzle 13 is connected to the front end of the resin discharge line 152.

A gas introduction line 153 and a gas exhaust line 154 are connected to the side wall portion of the storage tank 150. A gas introduction valve 153a is inserted into the gas introduction line 153. Further, an exhaust valve 154a is inserted into the gas exhaust line 154, and a vacuum pump 155 is connected to the front end of the exhaust line 154.

The deaeration mechanism 15 configured as described above opens the resin introduction valve 151a, and introduces the photocurable resin 2 into the storage tank 150 from the resin introduction line 151. Then, the vacuum pump 155 is actuated to open the exhaust valve 154a, whereby the degassing of the photocurable resin 2 is performed. At this time, the pressure in the storage tank 150 is controlled by performing a degassing step including the first decompression step as shown in the graph of FIG. 3 in which the vertical axis is the ambient pressure and the horizontal axis is the time. a step of causing the pressure in the storage tank 150 to be a fixed lower pressure, that is, a first pressure; and a first pressure increasing step of causing the pressure in the storage tank 150 to be a second pressure higher than the first pressure; a depressurization step of bringing the pressure in the storage tank 150 to a third pressure lower than the second pressure; and a second pressure increasing step of causing the pressure in the storage tank 150 to be higher than the third pressure pressure.

The first pressure is preferably, for example, about 1/100 of atmospheric pressure (about 1 kPa), and the second pressure is preferably a pressure slightly higher than atmospheric pressure. The first pressure and the third pressure may be the same pressure or different pressures. Similarly, the second pressure and the fourth pressure may be the same pressure or different pressures.

When the first pressure is the same as the third pressure, and the second pressure and the fourth pressure are the same pressure, the pressure in the storage tank 150 is repeatedly repeated in the first pressure to be the first pressure state. The state is higher than the second pressure of the first pressure.

In this case, the above steps are realized by controlling the exhaust gas discharged from the inside of the storage tank 150 by the gas exhaust line 154 and introducing the gas in the storage tank 150 from the gas introduction line 153.

By repeating the state in which the pressure is low and the state in which the pressure is high alternately in this manner, the photocurable resin 2 can be more efficiently performed than in the case where the pressure is reduced to a fixed pressure only for a fixed period of time. Degas. It is presumed that the bubble in the photocurable resin 2 is dynamically expanded and contracted due to fluctuations in ambient pressure. In this case, degassing can be performed in a shorter period of time by avoiding excessive pressure drop during decompression and avoiding excessive pressure rise during boosting.

For example, after the degassing is carried out by the method of maintaining the reduced pressure to a fixed pressure for a fixed period of time, the photocurable resin 2 is removed, and the photocurable resin is not removed even if the state of the reduced pressure is maintained for 3 minutes. 2 bubbles inside. On the other hand, after the above-described degassing step in which the state of the lower pressure and the state of the higher pressure are alternately repeated, the bubble existing in the photocurable resin 2 can be completely removed by the degassing step of 3 minutes. .

Next, the imprint apparatus of this embodiment will be described. In the respective steps of the imprint method of the present embodiment, the step of dropping the photocurable resin 2 onto the substrate 1 and the step of applying the added photocurable resin 2 to the substrate 1 and forming the resin layer 3 are performed. For example, a drip/coating module 10 constructed as shown in FIG. 4 can be used.

The dropping/coating module 10 shown in FIG. 4 is disposed in the processing chamber 11, and is provided with a rotatable rotating table 12 on which the substrate 1 is placed, and a nozzle 13 for supplying the photocurable resin 2. Further, the photocurable resin 2 is dropped from the nozzle 13 at substantially the center of the substrate 1 placed on the turntable 12, and the substrate 1 is rotated by the turntable 12, whereby the substrate 1 is dropped onto the substrate 1. The photocurable resin 2 is diffused by centrifugal force, and the photocurable resin 2 is applied to the entire surface of the substrate 1 to form a resin layer. In the present embodiment, the deaeration mechanism 15 is used in combination with the resin coating module 10 having the above configuration, and the photocurable resin 2 deaerated by the deaeration mechanism 15 is supplied from the nozzle 13 to the substrate 1.

Further, in the step of bringing the resin layer 3 into contact with the template 6, the step of irradiating the resin layer 3 with the ultraviolet rays 5, and the step of removing the template 6 from the resin layer 3 (imprinting step), for example, a pattern can be used. The imprint module 30 shown in FIG. The embossing module 30 is disposed in the processing chamber 31: an upper table 32 holding a template 6 having a specific pattern 6a; and a lower table 33 holding the substrate 1; and At least one of them is provided with a drive mechanism (not shown) that can move up and down. Further, a position alignment mechanism for aligning the substrate 1 and the template 6 is disposed in the drive mechanism.

Further, a UV (Ultraviolet) light source 23 for irradiating ultraviolet rays is disposed in the top plate portion of the processing chamber 31. As the UV light source 23, for example, a UV lamp including an LED (Light-Emitting Diode) and having a wavelength of about 365 nm of about 300 mW can be used. Further, a gas exhaust line 24 and a gas supply line 25 for supplying a gas such as nitrogen gas are connected to the processing chamber 31. A vacuum pump 24a is connected to the gas exhaust line 24, and an exhaust valve 24b is inserted. Further, a supply valve 25a is inserted into the gas supply line 25.

The imprint module 30 having the above configuration positions the substrate 1 and the template 6 at a specific position to bring the resin layer 3 of the substrate 1 into contact with the template 6. Then, the resin layer 3 is cured by irradiating the ultraviolet light 5 from the UV light source 23. In this case, among the photocurable resin (UV curable resin), it is difficult to be cured when oxygen is present in the environment. Therefore, the inside of the processing chamber 31 can be made into a reduced pressure environment, a nitrogen-filled environment, etc. Then, after the resin layer 3 is cured, the template 6 is detached from the resin layer 3 of the substrate 1, whereby the specific pattern 6a formed on the template 6 is transferred to the resin layer 3. In the present embodiment, when the resin layer 3 is brought into contact with the template 6, in order to prevent air bubbles from being mixed in the resin layer 3, the imprinting step is performed in a state where the inside of the processing chamber 31 is in a reduced pressure environment.

Next, an embodiment of the imprint apparatus 100 configured by combining the dropping/coating module 10, the deaeration mechanism 15, and the imprinting module 30, which are configured as described above, will be described with reference to FIG.

In the imprint apparatus 100 of the first embodiment shown in FIG. 6, a loading/unloading cassette 101 is disposed at a left end portion of the drawing, and a transport module 102 is connected to the loading/unloading cassette 101. and Further, along the left side of the drawing, the dropping/coating module 10, the deaeration mechanism 15, and the imprinting module 30 are disposed along the left side of the drawing module 102.

Also, the imprint apparatus 100 includes a controller 110. Further, the loading/unloading cassette 101, the conveying module 102, the dropping/coating module 10, the deaeration mechanism 15, the imprinting module 30, and the like are collectively controlled by the controller 110.

The controller 110 includes a CPU, and is provided with a process controller 111 that controls each part of the imprint apparatus 100, a user interface 112, and a memory unit 113.

The user interface 112 includes a keyboard that the step manager performs an input operation for managing the imprint apparatus 100, and a display that visually displays the operation state of the imprint apparatus 100.

In the storage unit 113, a control program (software) for realizing various processes executed by the imprint apparatus 100 by the control of the process controller 111, and a recipe for storing processing condition data and the like are stored. Further, if necessary, any recipe is called from the memory unit 113 in accordance with an instruction from the user interface 112, etc., and is executed by the process controller 111, whereby the imprint apparatus 100 is controlled under the control of the process controller 111. The required processing in the middle. Further, the recipes of the control program or the processing condition data and the like may be stored in a state of a computer-readable memory medium (for example, a hard disk, a CD, a floppy disk, a semiconductor memory, etc.), or from another device. For example, dedicated lines are transmitted at any time and used online.

In the loading/unloading cassette 101, for example, a transfer cassette or a wafer cassette in which a semiconductor wafer is housed is placed. Then, after the semiconductor wafer is taken out from the transfer cassette or the wafer cassette by the transfer robot disposed in the transfer module 102, it is first carried into the drip/coating module 10. Then, in the dropping/coating module 10, a photocurable resin is applied to the semiconductor wafer to form a resin layer. At this time, the photocurable resin is degassed by the deaeration mechanism 15 and then dropped onto the semiconductor wafer. Therefore, the photocurable resin is supplied to the semiconductor wafer and applied in a state where no bubbles are contained.

Next, the semiconductor wafer is carried into the pressure by the transfer robot of the transfer module 102. Print module 30. Then, here, the resin layer on the semiconductor wafer is brought into contact with the template, the resin layer is cured by irradiation of ultraviolet rays, and the shape of the template is transferred to the resin layer on the semiconductor wafer. Furthermore, as described above, the imprinting step of the imprint module 30 is carried out under a reduced pressure environment. In this case, the pressure is adjusted so that at least one of the first pressure and the third pressure, which is a fixed lower pressure of the degassing step of the deaeration mechanism 15, is lower than the pressure of the surrounding environment when the imprinting step is performed. . Thereby, it is possible to prevent bubbles which have not appeared in the degassing step from occurring in the imprinting step.

Then, after the resin layer is cured, the template is detached from the resin layer, and the semiconductor wafer on which the resin pattern is formed is accommodated in the transfer cassette placed on the loading/unloading cassette 101 by the transfer robot of the transport module 102. Or inside the boat box.

According to the above steps, a resin pattern (resin pattern 4 shown in FIG. 1) is formed on the semiconductor wafer by the imprint apparatus 100.

Further, the imprint apparatus 100 is configured to degas the photocurable resin by the deaeration mechanism 15 and then drop it onto the semiconductor wafer, but may also add the photocurable resin to the semiconductor wafer. Degas. In this case, for example, the dropping/degassing module 40 constructed as shown in Fig. 7 can be used.

The dropping/degassing module 40 shown in FIG. 7 includes a chamber 41 that can be airtightly held inside, and a substrate holding table 42 and a photocurable resin 2 are disposed in the chamber 41. It is applied to the nozzle 13 of the substrate 1. Further, a gas exhaust line 24 and a gas supply line 25 for supplying a gas are connected to the chamber 41. A vacuum pump 24a is connected to the gas exhaust line 24, and an exhaust valve 24b is inserted. Further, a supply valve 25a is inserted into the gas supply line 25. Further, after the photocurable resin 2 is dropped from the nozzle 13 to the substrate 1, the exhaust gas from the gas exhaust line 24 and the gas supply from the gas supply line 25 are alternately performed, whereby the pressure in the chamber 41 is used. Degassing is carried out in such a manner as to change as shown in FIG.

As described above, in the dropping/degassing module 40, after the substrate 1 is dropped and degassed by the photocurable resin 2, the photocurable resin is applied by the coating module 50 shown in FIG. 2 painted Deployed on the substrate 1. The coating module 50 has a configuration in which the rotating table 12 on which the substrate 1 is placed and which is rotatable is disposed in the processing chamber 51. In addition, the substrate 1 to which the photocurable resin 2 is dropped is rotated by the turntable 12, whereby the photocurable resin 2 on the substrate 1 is diffused by centrifugal force, and light is applied to the entire surface of the substrate 1. The curable resin 2 forms a resin layer. Thereafter, the transfer of the pattern of the resin layer 3 is performed by the imprint module 30 shown in FIG.

FIG. 9 is a view showing a configuration of the imprint apparatus 100a of the second embodiment in which the above-described dripping/degassing module 40, the coating module 50, and the imprint module 30 are combined. As shown in FIG. 9, the imprint apparatus 100a is disposed along the transport module 102, and the dripping/degassing module 40, the coating module 50, and the imprint module 30 are sequentially disposed from the left side of the drawing. Incidentally, the same reference numerals are given to the portions corresponding to the imprint apparatus 100 shown in Fig. 6, and the overlapping description will be omitted. Further, the semiconductor wafer is sequentially transferred to the dropping/degassing module 40, the coating module 50, and the imprinting module 30 by a transfer robot (not shown) disposed in the transport module 102. Thereby, the dropping, degassing, coating, and embossing steps of the photocurable resin are sequentially performed.

The imprint apparatus 100a according to the second embodiment described above is a combination of the dropping/degassing module 40 and the coating module 50. However, it may be used as shown in FIG. A plurality of substrates 1 to which the photocurable resin 2 is applied are degassed by a degassing module 60. The degassing module 60 shown in FIG. 10 includes a chamber 61 that can hermetically seal the interior, and a substrate holding mechanism 62 that holds a plurality of substrates 1 is disposed in the chamber 61.

Further, a gas exhaust line 24 and a gas supply line 25 for supplying a gas are connected to the chamber 61. A vacuum pump 24a is connected to the gas exhaust line 24, and an exhaust valve 24b is inserted. Further, a supply valve 25a is inserted into the gas supply line 25. Further, in a state where a plurality of substrates 1 to which the photocurable resin 2 is dropped are held by the substrate holding mechanism 62, the exhaust gas from the gas exhaust line 24 and the gas supply from the gas supply line 25 are alternately supplied, whereby Degassing is performed such that the pressure in the chamber 61 fluctuates as shown in FIG.

Fig. 11 shows the components of the imprint apparatus 100b of the third embodiment in which the degassing module 60, the dropping/coating module 10, and the imprinting module 30 are combined. As shown in Figure 11, The imprint apparatus 100b is disposed along the transport module 102, and the degassing module 60, the drip/coating module 10, and the imprinting module 30 are sequentially disposed from the left side in the drawing. Incidentally, the same portions as those of the imprint apparatus 100 shown in FIG. 6 are denoted by the same reference numerals, and the description thereof will not be repeated.

The imprint apparatus 100b having the above configuration is first transported to the drip/coating module 10 by a transfer robot (not shown) disposed in the transport module 102, where the semiconductor wafer is dropped. After the photocurable resin is added, the step of transporting to the degassing module 60 is repeated, and a plurality of semiconductor wafers are housed in the degassing module 60. Thereafter, degassing in the degassing module 60 is performed. Subsequently, the semiconductor wafer is sequentially transferred to the dropping/coating module 10 and the imprinting module 30, and the coating and imprinting steps of the photocurable resin are performed.

Fig. 12 is a view showing a configuration of a dropping/degassing/coating module 70 for performing dropwise addition, degassing, and coating of a photocurable resin. The dripping/degassing/coating module 70 includes a chamber 71 that can hermetically seal the interior, and a rotating table 12 on which the substrate 1 is placed and which is rotatable is disposed in the chamber 71, and is used to supply light. The nozzle 13 of the curable resin 2. Further, a gas exhaust line 24 and a gas supply line 25 for supplying a gas are connected to the chamber 71. A vacuum pump 24a is connected to the gas exhaust line 24, and an exhaust valve 24b is inserted. Further, a supply valve 25a is inserted into the gas supply line 25.

In the dripping/degassing/coating module 70 of the above configuration, the photocurable resin 2 is first dropped from the nozzle 13 to the substantially center of the substrate 1 placed on the turntable 12. Next, in a state where the substrate 1 to which the photocurable resin 2 is dropped is held on the turntable 12, the exhaust gas from the gas exhaust line 24 and the gas supply from the gas supply line 25 are alternately supplied, whereby The degassing of the photocurable resin 2 is performed so that the pressure in the chamber 71 fluctuates as shown in Fig. 3 . Thereafter, the substrate 1 is rotated by the turntable 12, whereby the photocurable resin 2 dropped onto the substrate 1 is diffused by centrifugal force, and the photocurable resin 2 is applied to the entire surface of the substrate 1 to form Resin layer.

Fig. 13 is a view showing a configuration of the imprint apparatus 100c of the fourth embodiment in which the above-described dripping/degassing/coating module 70 and the imprinting module 30 are combined. As shown in Figure 13, the imprinting device The 100c is disposed along the transport module 102, and the dripping/degassing/coating module 70 and the imprinting module 30 are sequentially disposed from the left side of the drawing. Incidentally, the same portions as those of the imprint apparatus 100 shown in FIG. 6 are denoted by the same reference numerals, and the description thereof will not be repeated.

The imprint apparatus 100c having the above configuration transfers the semiconductor wafer to the dropping/degassing/coating module 70 first by a transfer robot (not shown) disposed in the transport module 102. The photocurable resin is dropped onto the semiconductor wafer, and degassing and coating of the photocurable resin are performed. Thereafter, the semiconductor wafer is transferred to the imprint module 30 to perform an imprinting step.

Further, Fig. 14 is a view showing a configuration of the imprint apparatus 100d of the fifth embodiment in which the dropping/coating module 10 shown in Fig. 4 and the imprinting module 30 shown in Fig. 5 are combined. As shown in FIG. 14, the imprint apparatus 100d is provided along the transport module 102, and the dripping/coating module 10 and the imprinting module 30 are sequentially disposed from the left side in the drawing. Incidentally, the same portions as those of the imprint apparatus 100 shown in FIG. 6 are denoted by the same reference numerals, and the description thereof will not be repeated.

The imprint apparatus 100d according to the fifth embodiment is incorporated in the dropping/coating module 10, and after the photocurable resin is dropped onto the semiconductor wafer and applied, in the imprint module 30, the semiconductor crystal is used. The circular load is placed in the state of the lower stage 33 shown in Fig. 5, and the exhaust gas from the gas exhaust line 24 and the gas supply from the gas supply line 25 are alternately performed, whereby the pressure in the chamber 31 is as shown in the figure Degassing of the photocurable resin is carried out in the manner shown in Fig. 3. Then, the template 6 is brought into contact with the resin layer to irradiate the ultraviolet ray 5, and thereafter, the stencil is detached from the resin layer, and an embossing step is performed.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the invention is not limited to the examples described above. For example, the degassing from the photocurable resin may be carried out in combination with degassing before the dropwise addition of the substrate, after the dropwise addition to the substrate, after the application of the substrate, and before the imprinting. Further, for example, a resin other than the photocurable resin (for example, a thermosetting resin) may be used as the resin to which the pattern shape of the template is transferred. In the case of using a thermosetting resin, for example, in the imprint module 30 shown in FIG. 5, a resistance heating type heater is embedded in the upper side table 32 and the lower side stage 33, and by the heating The resin layer 3 may be heat-hardened by an example of a curing mechanism in the case of using a thermosetting resin. In this case, it is not necessary to provide the UV light source 23 (an example of a hardening mechanism in the case of using a photocurable resin). In addition, it is to be understood that various modifications and changes can be made without departing from the scope of the invention as described in the appended claims.

1‧‧‧Substrate

2‧‧‧Photocurable resin

3‧‧‧ resin layer

4‧‧‧ resin pattern

5‧‧‧ UV

6‧‧‧ template

6a‧‧‧Special patterns

Claims (8)

An imprint method comprising: a resin layer forming step of applying a resin on a substrate to form a resin layer; and a template contacting step of contacting the resin layer with a template formed into a specific shape And a template detaching step of detaching the template from the resin layer; and the method is to cure the resin layer, and perform a degassing step before contacting the resin layer with the template, the degassing step comprising at least: a first pressure reduction step of depressurizing the environment around the resin to a first pressure; and a first pressure increasing step of raising an environment around the resin to a second pressure higher than the first pressure; a depressurization step of depressurizing the environment around the resin to a third pressure lower than the second pressure; and a second step of increasing the environment around the resin to be higher than the third The fourth pressure of pressure. The imprint method of claim 1, wherein the template contacting step is performed under a reduced pressure environment. The imprint method of claim 2, wherein the minimum value of the pressure in the degassing step is lower than the pressure in the decompression environment of the template contacting step. The imprint method according to any one of claims 1 to 3, wherein after the resin is dropped onto the substrate, the degassing step is performed before the resin is applied to the substrate. The imprint method according to any one of claims 1 to 3, wherein the resin is contained in an airtight manner before the resin is dropped onto the substrate The above degassing step is carried out in the vessel. The imprint method according to any one of claims 1 to 3, wherein the resin is a resin which is cured by irradiation with light, and the resin layer is cured by irradiating light in a wavelength region in which the resin is cured. An imprinting apparatus comprising: a dropping mechanism for dropping a resin onto a substrate; and a coating mechanism for applying the resin dropped onto the substrate to the substrate to form a resin layer; An imprinting mechanism that contacts and disengages the resin layer from a template formed into a specific shape; a hardening mechanism that hardens the resin layer; a pressure adjusting mechanism that decompresses and pressurizes an environment around the resin; and a controller And a memory device storing a control program, wherein the control program controls the dropping mechanism, the coating mechanism, the stamping mechanism, the hardening mechanism, and the pressure adjusting mechanism; the controller is embossed by the pressing Before the resin layer is brought into contact with the template, a degassing step is performed to perform degassing of the resin, and the degassing step includes at least a first depressurizing step of using the resin according to the pressure adjusting mechanism The surrounding environment is decompressed to the first pressure; the first pressure increasing step is to increase the environment around the resin by the pressure adjusting mechanism to a second pressure in the first pressure; and a second pressure reducing step of reducing the environment around the resin to a third pressure lower than the second pressure by the pressure adjusting mechanism; and In the step of boosting, the environment around the resin is raised to a fourth pressure higher than the third pressure by the pressure adjusting mechanism. An imprint apparatus as claimed in claim 7, wherein The resin is a resin which is cured by irradiation with light, and the curing means irradiates the resin layer with light in a wavelength region where the resin is cured.