JPWO2013051208A1 - Lamps and luminaires - Google Patents

Abstract

The lamp 1 includes a metal housing 60 formed in a cylindrical shape, a power supply unit 40 housed in the housing 60, and a metal housing attached to one end of the housing 60 in the cylinder axis direction. A base 70, a base 70 disposed at the other end of the casing 60 in the cylinder axis direction in a state of being electrically insulated from the casing 60, and for supplying power from an external power source to the power supply unit 40; And a light emitting unit disposed on the upper side of the table 20. An insulating sheet 80 is interposed between the base 20 and the light emitting unit 13, and the peripheral edge of the insulating sheet 80 has a minimum distance between the peripheral edge of the metal substrate 86 and the electrode part 13 b in plan view. In the part which becomes, it extends outside the periphery of the metal substrate 86.

Description

  The present invention relates to a lamp using an LED (light emitting diode) or the like, and more particularly to a technique for improving dielectric strength performance.

  Conventionally, a light bulb shaped lamp using an LED or the like has been proposed (see Patent Document 1).

  An example of this type of light bulb shaped lamp is shown in FIG. FIG. 17A is a perspective view of the lamp 1000, and FIG. 17B is a cross-sectional view of a portion surrounded by an alternate long and short dash line A1 in FIG.

  As shown in FIG. 17A, a lamp 1000 includes a light emitting unit 1013 and a module substrate 1011 on which the light emitting unit 1013 is mounted, and a power supply unit (not shown) that supplies power to the light emitting module 1010. 2), a casing 1060 formed of a metal in a cylindrical shape and housing a power supply unit therein, a base 1020 formed of metal and attached to one end of the casing 1060 in the cylinder axis direction, and a casing 1060 A base 1070 attached to the other end of the light source and a globe 1030 attached to the housing 1060 so as to cover the light emitting module 1010. Here, the light emitting portion 1013 includes a sealing body 1013a that seals a semiconductor light emitting element (not shown) and an electrode portion 1013b that is electrically connected to the semiconductor light emitting element. A hole 1011 a is formed at the center of the module substrate 1011, and a twisted pair wiring 1043 led out from the power supply unit is connected to a power supply terminal 1018 provided on the module substrate 1011 via a connector 1015. The power supply terminal 1018 and the electrode portion 1013b are connected via a wiring pattern 1017. Further, an insulator 1072 is interposed between the housing 1060 and the base 1070, and the housing 1060 and the base 1070 are electrically insulated.

  As shown in FIG. 17B, the module substrate 1011 includes a metal substrate 1086 formed in a plate shape from a metal such as aluminum, and an insulating sheet 1080 provided on the main surface of the metal substrate 1086. Has been.

JP 2010-86946 A

  By the way, in this light bulb shaped lamp, in order to ensure safety, a withstand voltage is required between the housing 1060 and the circuit including the light emitting module 1010, the power supply unit and the base 1070. In particular, since the lamp is sometimes used at a rated voltage of 220 V to 250 V higher than the rated voltage of 100 V to 110 V in Japan, a higher withstand voltage is required.

  As a method for evaluating the withstand voltage of the lamp 1000, for example, as shown in FIG. 18, an alternating current of 4 kV is provided between the base 1070 and the housing 1060 in a state where the shell 1070a and the eyelet 1070c of the base 1070 are short-circuited. This is performed by determining whether or not a current flows through the housing 1060 when a voltage (for example, a frequency of 60 Hz) is applied. Note that the shell 1070a and the eyelet 1070c are normally electrically insulated by an insulating portion 1070b.

  However, when the above-mentioned dielectric strength test is performed on the lamp 1000, the electrode portion having the smallest distance from the base 1020 in contact with the housing 1060 in the circuit electrically connected to the base 1070. Creeping discharge may occur between 1013b and the base 1020, and a desired withstand voltage performance may not be obtained. As shown in FIG. 17B, when a part of the module substrate 1011 is a metal substrate 1086, the minimum creepage distance between the electrode portion 1013b and the metal substrate 1086 in contact with the base 1020 is obtained. When W is 1.5 mm or less, the occurrence rate of creeping discharge is greatly increased.

  On the other hand, the arrangement of the light emitting unit 1013 is changed so as to be closer to the central part of the module substrate 1011 or the area of the module substrate 1011 is increased so that the space between the light emitting unit 1013 and the base 1020 is increased. It is possible to increase the creepage distance.

  However, if the arrangement of the light emitting units 1013 is changed so as to approach the center of the module substrate 1011, there is a possibility that desired light distribution characteristics cannot be obtained. Further, when the module substrate 1011 is enlarged, the housing 1060 for housing the module substrate 1011 must be enlarged, and the lamp 1000 itself is increased in size.

  Moreover, it is required to reduce the manufacturing cost of the lamp by using the module substrate 1011 for both the overseas lamp and the domestic lamp. Therefore, it is not appropriate to increase the area of the module substrate 1011 or to change the arrangement of the light emitting units 1013 only for lamps for overseas.

  The present invention has been made in view of the above-described reasons, and it is an object of the present invention to provide a lamp capable of improving performance with respect to a withstand voltage test, maintaining light distribution characteristics, and reducing manufacturing costs.

  In order to achieve the above object, a lamp according to the present invention includes a cylindrical metal casing, a power supply unit housed in the casing, and one end of the casing in the cylinder axis direction. An attached metal base, and a base for supplying electric power from an external power source to the power supply unit at the other end in the cylinder axis direction of the housing in a state of being electrically insulated from the housing; A base plate disposed on a side opposite to the power supply unit side of the base, and a light emitting unit having an electrode portion and disposed on the side opposite to the base side of the base plate, the base and the light emitting unit, An insulating sheet is interposed between the insulating sheet, and in plan view, the peripheral edge of the insulating sheet extends outward from the peripheral edge of the substrate at least at a position where the distance between the peripheral edge of the substrate and the electrode portion is minimum. ing.

  According to this configuration, in the plan view, the peripheral edge of the insulating sheet extends outward from the peripheral edge of the substrate at least at a portion where the distance between the peripheral edge of the substrate and the electrode portion is minimum. Since the creeping distance between the portion and the base can be increased by the portion extending from the substrate of the insulating sheet, the withstand voltage between the electrode portion and the base can be improved. In addition, since the change of the arrangement of the light emitting portions is not necessary for the improvement of the withstand voltage, the light distribution characteristics can be maintained. Furthermore, since it is not necessary to change the specifications of the substrate, such as increasing the area of the substrate, it is possible to reduce the manufacturing cost of the lamp by sharing the specifications of the substrate.

The perspective view of the lamp | ramp which concerns on Embodiment 1. FIG. The lamp | ramp which concerns on Embodiment 1 is shown, (a) is sectional drawing, (b) is principal part sectional drawing. 1 is a schematic perspective view of a light emitting module according to Embodiment 1. FIG. Sectional drawing and schematic perspective view which show a part of manufacturing process of the light emitting module which concerns on Embodiment 1. FIG. Schematic perspective view showing a part of the manufacturing process of the lamp according to the first embodiment The perspective view of the lamp | ramp which concerns on Embodiment 2. FIG. The lamp | ramp which concerns on Embodiment 2 is shown, (a) is sectional drawing, (b) is principal part sectional drawing. The perspective view which shows a part of manufacturing process of the lamp | ramp which concerns on Embodiment 2. FIG. The partially broken side view of the lighting fixture which concerns on Embodiment 3 Sectional drawing of the lamp which concerns on a modification Sectional drawing of the lamp which concerns on a modification The perspective view which shows a part of manufacturing process of the lamp | ramp which concerns on a modification. The principal part schematic sectional drawing of the lamp | ramp which concerns on a modification The perspective view of the lamp | ramp which concerns on a modification Sectional drawing of the lamp which concerns on a modification Sectional drawing of the principal part of the lamp which concerns on a modification The lamp which concerns on a prior art example is shown, (a) is a perspective view, (b) is principal part sectional drawing. Diagram for explaining the method of dielectric strength test

<Embodiment 1>
<1> Configuration Hereinafter, the configuration of the lamp 1 according to the present embodiment will be described.

  FIG. 1 is a perspective view of the lamp 1. FIG. 2A is a cross-sectional view taken along the line A-A ′ shown in FIG. 1. FIG. 2B is a cross-sectional view of a portion A2 surrounded by a one-dot chain line in FIG. FIG. 3 is a schematic perspective view of the light emitting module 10. In FIG. 2, the alternate long and short dash line drawn along the vertical direction of the paper indicates the lamp axis J of the lamp 1, and the upper side of the paper is the front of the lamp 1 and the lower side of the paper is the rear of the lamp 1. . Further, in this specification, a state viewed from the front of the lamp 1 toward the rear is referred to as “plan view”.

  As shown in FIGS. 1 and 2 (a), the lamp 1 includes a housing 60, a circuit holder 50 disposed inside the housing 60, a power supply unit 40 housed in the circuit holder 50, A base 20 attached to the housing 60, a globe 30 disposed so as to cover the front of the base 20, a base 70 disposed in a state of being electrically insulated from the housing 60, and a base 20 and the light emitting module 10 disposed on the front surface.

<1-1> Housing The housing 60 is made of a metal such as aluminum, and has a cylindrical shape that is open at both ends and reduced in diameter from the front to the rear. Further, the base 20 and the opening end 31 of the globe 30 are accommodated in the front end 60 a of the housing 60. Here, the base 20 is fixed to the housing 60 in a state in which a part of the peripheral surface thereof is in contact with the inner peripheral surface 60 b of the housing 60. The outer peripheral surface 25 of the base 20 is tapered according to the shape of the inner peripheral surface 60 b of the housing 60, and is in surface contact with the inner peripheral surface 60 b of the housing 60. Thereby, the heat generated in the light emitting module 10 is easily transmitted to the housing 60 via the base 20.

<1-2> Circuit Holder The circuit holder 50 is made of an insulating material such as a synthetic resin and has a substantially cylindrical shape with both sides opened. The circuit holder 50 includes a large-diameter portion 50a, a small-diameter portion 50b located on the rear side of the large-diameter portion 50a, and a lid 50c that covers a front-side opening of the large-diameter portion 50a. A power supply unit 40 is accommodated in the large diameter portion 50a. On the other hand, a base 70 is fitted on the small diameter portion 50b. Here, the rear side opening 50 d of the small diameter portion 50 b is closed by the base 70.

<1-3> Power Supply Unit The power supply unit 40 is for supplying power to the light emitting module 10, and includes a circuit board 40a and various electronic components 40b mounted on the circuit board 40a. . In the drawings, only some electronic components are denoted by reference numerals. The power supply unit 40 is fixed to the circuit holder 50 by screwing, bonding, engagement, or the like. Two lead wires 43 a and 43 b connected to the connector 15 are led out from the power supply unit 40. The two lead wires 43a and 43b constitute a twisted pair wiring. The power supply unit 40 and the base 70 are connected via two power supply lines 41a and 41b.

<1-4> Base The base 20 is formed of a metal such as aluminum and has a substantially disk shape. The base 20 is arranged in a posture in which the central axis coincides with the lamp axis J (see FIG. 2). Therefore, both the front surface and the rear surface orthogonal to the lamp axis J in the base 20 are substantially annular. A concave portion 20b having a rectangular shape in plan view is formed on the front side of the base 20. The external dimensions of the recess 20b in plan view are substantially the same as the external dimensions of the module substrate 11 of the light emitting module 10. The module substrate 11 is fitted inside the recess 20b. Here, the module substrate 11 is fixed to the bottom of the recess 20b with an adhesive 22 applied to the bottom of the recess 20b. In addition, a through-hole 20c that penetrates in the thickness direction of the base 20 and through which the lead wires 43a and 43b led out from the power supply unit 40 are inserted is provided substantially at the center of the recess 20b. Further, a step portion 20 a is formed in the peripheral portion of the base 20.

<1-5> Globe The globe 30 has a shape imitating a bulb of an A-shaped bulb that is a general bulb shape, and covers the front of the light emitting module 10. The opening-side end portion 31 of the globe 30 is disposed in a region between the inside of the front-side end portion 60 a of the housing 60 and the step portion 20 a formed on the peripheral portion of the base 20. The opening-side end 31 of the globe 30 is fixed to the housing 60 with an adhesive 34 filled in a region between the front-side end 60a and the stepped portion 20a. In addition, the shape of the globe 30 is not limited to the shape imitating the bulb of an A-shaped bulb, and may be any shape. Further, the lamp 1 may be configured without a globe. The globe 30 may be fixed to the housing 60 by press fitting or the like.

  The inner surface 32 of the globe 30 is subjected to a diffusion process (for example, a diffusion process using silica, a white pigment, or the like) that diffuses light emitted from the light emitting module 10. Light incident on the inner surface 32 of the globe 30 passes through the globe 30 and is extracted to the outside of the globe 30.

<1-6> Base The base 70 is a member for receiving electric power from the socket of the lighting fixture when the lamp 1 is attached to the lighting fixture and turned on. The type of the base 70 is an E26 base that is an Edison type. The base 70 includes a shell 70a having a substantially cylindrical shape and an outer peripheral surface being a male screw, and an eyelet 70c attached to the shell 70a via an insulating portion 70b. An insulator 72 is interposed between the shell 70 a and the housing 60. A power line 41a is connected to the shell 70a, and a power line 41b is connected to the eyelet 70c.

<1-7> Light-Emitting Module The light-emitting module 10 includes a module substrate 11 and a plurality (12 in FIG. 1) of light-emitting units 13 disposed on the module substrate 11. This light emitting module 10 is shown in FIG. The light emitting unit 13 includes a sealing body 13a that seals a semiconductor light emitting element (not shown), and an electrode part 13b that is electrically connected to the semiconductor light emitting element and extends to the outside of the sealing body 13a. Here, the semiconductor light emitting element is an LED that emits blue light, and the sealing body 13a is made of silicone resin mixed with phosphor particles that convert the wavelength of blue light into yellow light. Then, part of the blue light emitted from the semiconductor light emitting element is wavelength-converted into yellow light by the sealing body, and white light generated by the color mixture of the unconverted blue light and the converted yellow light is emitted from the light emitting unit 13. It is emitted from.

  As shown in FIG. 3, the module substrate 11 has a metal substrate 86 formed in a rectangular plate shape, and is formed to be larger than the metal substrate 86 in plan view, on the surface of the metal substrate 86 on the side where the light emitting unit 13 is provided. And an insulating sheet 80 having a circular shape in plan view. Here, the metal substrate 86 is made of a metal such as aluminum, for example. The insulating sheet 80 is made of polyamide resin or the like and has flexibility. The shape of the insulating sheet 80 is not limited to a circular shape in a plan view, and may be, for example, a rectangular shape, an elliptical shape, a star shape, or other shapes in a plan view. Further, the module substrate 11 is formed with a hole 11a through which the lead wires 43a and 43b are inserted at the center. A power supply terminal 18 is disposed in the vicinity of the hole 11 a in the module substrate 11. The power supply terminal 18 and the electrode portion 13 b are electrically connected via a wiring pattern 17 formed on the insulating sheet 80. The plurality of light emitting units 13 are also connected in series by wiring patterns 82 a formed on the insulating sheet 80. In FIG. 3, only a part of the plurality of wiring patterns 82a is illustrated. A connector 15 connected to the tip of the lead wires 43a and 43b is attached to the power supply terminal 18.

  The peripheral edge of the insulating sheet 80 extends outward from the peripheral edge of the metal substrate 86 in the plan view. As shown in FIG. 2, the insulating sheet 80 further extends outward from the peripheral edge of the base 20, and its tip is placed on the inner wall of the globe 30. That is, the insulating sheet 80 covers from the front surface of the base 20 to a part of the inner wall of the globe 30. Thereby, since the minimum value of the creeping distance along the direction from the electrode portion 13b toward the base 20 on the surface of the insulating sheet 80 can be increased, a high voltage (for example, between the casing 60 and the base 70 is used. In a dielectric strength test (see FIG. 18) performed by applying 4 kV), a dielectric breakdown (creeping surface) occurs between the base 20 electrically connected to the housing 60 and the electrode portion 13b electrically connected to the base. Discharge) hardly occurs, and such a dielectric strength test performance can be improved. Here, the minimum value of the creeping distance between the through hole 20 c of the base 20 and the wiring pattern 17 is larger than the minimum value of the creeping distance between the electrode portion 13 b of the light emitting unit 13 and the periphery of the metal substrate 86. It has become. Therefore, in the withstand voltage test, creeping discharge is more likely to occur between the electrode portion 13b and the periphery of the metal substrate 86 than between the through hole 20c and the wiring pattern.

  By the way, when the lamp 1 is used at a rated voltage of 220 V to 250 V overseas, insulation is ensured in an insulation withstand voltage test performed by applying an AC voltage of 4 kV between the housing 60 and the base 70. It is required that On the other hand, the inventor determines the size of the insulating sheet 80 in the configuration of the lamp 1 in the direction from the electrode portion 13b to the base 20 on the surface of the insulating sheet 80 between the electrode portion 13b and the base 20. If the minimum value of the creeping distance along the line (see FIG. 2B) is selected to be 1.5 mm or more, the insulation between the electrode portion 13b and the base 20 is ensured in the above-mentioned dielectric strength test. It was verified experimentally.

Therefore, when the lamp 1 is used at a rated voltage of 220 V to 250 V overseas, the creeping distance along the surface of the insulating sheet 80 between the electrode portion 13b and the base 20 is 1.5 mm or more. It is considered preferable that the size be such that By doing so, it is possible to ensure the performance required in the aforementioned dielectric strength test.
<2> Regarding Manufacturing Direction of Lamp A manufacturing method of the lamp 1 according to the present embodiment will be described with reference to FIGS. 4 and 5. Here, the manufacturing process of the light emitting module and the process of attaching the light emitting module 10 to the base 20 among the manufacturing processes of the lamp 1 will be described.

  First, the manufacturing method of the light emitting module 10 is demonstrated based on FIG. Here, the manufacturing process of the light emitting module 10 will be described particularly from the process of manufacturing the module substrate 11 to the process of mounting the light emitting unit 13 on the front surface of the module substrate 11.

  First, by laminating an insulating sheet 80 made of polyamide resin on a metal foil 82 made of copper, aluminum, or the like, it has flexibility consisting of the metal foil 82 and the insulating sheet 80 as shown in FIG. A film-like member 84 is obtained. Here, the film-like member 84 is manufactured by applying an organic solvent serving as a base of the insulating sheet 80 to one surface of the metal foil 82. The film-like member 84 has a circular shape in plan view as shown in FIG.

  Next, the film-like member 84 is formed of a metal such as aluminum and attached to the surface of the metal substrate 86 having a plate shape, whereby a module substrate base 88 as shown in FIG. obtain. Here, the module substrate base 88 is manufactured by heat-pressing with a press or the like in a state where the insulating sheet 80 side of the film-like member 84 is in close contact with the metal substrate 86. As shown in FIG. 4B-2, the film-like member 84 has an outer dimension larger than that of the metal substrate 86 in plan view. Here, the diameter of the film-like member 84 is determined so that the film-like member 84 covers the entire metal substrate 86 in plan view. In addition, a through hole 86a serving as a base of the hole portion 11a penetrates in the thickness direction at a substantially central portion of the metal substrate 86.

  Subsequently, a portion corresponding to the through hole 86a in the film-like member 84 is cut out. For example, the film member 84 is cut out using a laser trimming technique.

  Thereafter, by using the photolithography technique and the etching technique, the metal foil 82 of the module substrate base material 88 is patterned to obtain a wiring pattern 82a as shown in FIG.

  And while attaching the light emission part 13 on the wiring pattern 82a (die bonding), and arrange | positioning the electric power feeding terminal 18, the light emitting module 10 as shown to FIG.4 (d) and (d-2) is shown. obtain.

  Next, a process of attaching the manufactured light emitting module 10 to the base 20 will be described with reference to FIG.

  First, the module substrate 11 of the light emitting module 10 is fitted into a recess 20b formed at a substantially central portion of the base 20 (see FIG. 5A). At this time, the connector 15 led out from the through hole 20c penetrating the bottom of the recess 20b is inserted into the hole 11a of the module substrate 11. Further, an adhesive 22 is applied in advance to the bottom of the recess 20b. When the module substrate 11 is fitted into the recess 20b, the rear surface of the module substrate 11 (the surface opposite to the main surface on which the light emitting unit 13 is disposed) and the bottom of the recess 20b are bonded by the adhesive 22. .

  Next, the connector 15 connected to the tip ends of the lead wires 43a and 43b led out from the hole 11a of the module substrate 11 is attached to the power supply terminal 18 (see FIG. 5B). At this time, the peripheral edge of the insulating sheet 80 extends to the outside of the peripheral edge of the housing 60 in plan view over the entire periphery.

Then, with the periphery of the insulating sheet 80 bent from the outside of the housing 60 toward the inside front (see the dashed line and the arrow in FIG. 5B), the globe 30 is moved from the front of the housing 60 to the housing 60. The lamp 1 is completed by covering and fixing with an adhesive (see FIG. 5C).
<Embodiment 2>
<1> Configuration The lamp 2 according to the present embodiment is substantially the same as the configuration of the lamp 1 according to the first embodiment. As illustrated in FIGS. 6 and 7A, the shape and the base of the light emitting module 210 are the same. The shape of the base 220 is different from that of the first embodiment, and the first embodiment is that an insulating sheet 280 formed of a polyamide resin is interposed between the light emitting module 210 and the base 220. Is different. In addition, about the structure similar to Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably. FIG. 7A is a cross-sectional view taken along line AA ′ shown in FIG. FIG. 7B is a cross-sectional view of a portion A3 surrounded by a one-dot chain line in FIG.

<1-1> Base As shown in FIG. 6, the base 220 is formed in a circular shape in plan view. The base 220 is made of a metal such as aluminum. Then, slit portions 220b extending toward the central portion of the base 220 are formed at two portions facing each other across the central portion of the base 220, and lead wires are formed from the tip portions of the respective slit portions 220b. 43a and 43b are extended. The light emitting module 210 is attached to the front side of the base 220. A concave portion 220a having a rectangular shape in plan view is formed at a substantially central portion of the base 220.

<1-2> Light Emitting Module The light emitting module 210 includes a module substrate 211 and a plurality (eight in FIG. 6) of light emitting units 13 disposed on the module substrate 211. The light emitting unit 13 includes a sealing body 13a that seals the semiconductor light emitting element with a sealing body, and an electrode portion 13b that is electrically connected to the semiconductor light emitting element. Since the semiconductor light emitting element and the sealing body 13a are the same as those in the first embodiment, description thereof is omitted.

  As shown in FIG. 7, the module substrate 211 includes a metal substrate 286 formed in a rectangular shape in plan view, and an insulating sheet 281 provided on the front side of the metal substrate 286. The metal substrate 286 is made of a metal such as aluminum. The insulating sheet 281 is formed from an insulating material such as polyamide resin. The area of the insulating sheet 281 is approximately the same as the area of the metal substrate 286 in plan view, and the periphery of the insulating sheet 281 coincides with the periphery of the metal substrate 286. A wiring pattern 217 and a power supply terminal 210a (see FIG. 8B) are formed on the insulating sheet 281. And the connector 215 provided in the front-end | tip part of lead wire 43a, 43b is connected to the electric power feeding terminal 210a.

<1-3> Insulating Sheet The insulating sheet 280 is formed of an insulating material such as polyamide resin, has flexibility, and has a rectangular shape in plan view. The shape of the insulating sheet 280 is not limited to a rectangular shape, and may be, for example, a circular shape, an elliptical shape, a star shape, or other shapes.

  As shown in FIG. 7A, the insulating sheet 280 covers the rear surface of the module substrate 211 opposite to the main surface on which the light emitting unit 13 is disposed. Further, as shown in FIG. 6, the peripheral edge of the insulating sheet 280 extends outward over the entire outer periphery from the peripheral edge of the module substrate 211 in plan view. The periphery of the insulating sheet 280 extends forward from the periphery of the module substrate 211. In this case, as shown in FIG. 7B, the creepage distance W includes the distance along the front and back surfaces of the portion extending forward in the insulating sheet 280. The creepage distance along the direction from the electrode portion 13b toward the base 220 on both the front and back surfaces can be increased. That is, a creeping distance twice as long as that of the portion extending forward is obtained.

In addition, when the creepage distance W (see FIG. 7B) between the electrode portion 13b of the light emitting portion 13 and the base 220 is maintained at 1.5 mm or more, the space between the casing 60 and the base 70 is set. It is possible to prevent creeping discharge from occurring between the electrode portion 13b and the base 20 in the dielectric strength test (see FIG. 18) performed by applying an AC voltage of 4 kV to the base. Here, it is only necessary that the peripheral portion of the insulating sheet 280 extends from the outer peripheral portion of the module substrate 211 by 0.75 mm or more.
<2> Manufacturing Method of Lamp A manufacturing method of the lamp 2 according to the present embodiment will be described with reference to FIG. Here, the manufacturing process of the lamp 2 from the process of placing the insulating sheet 280 on the base 220 to the process of attaching the light emitting module 210 to the base 220 will be described.

  First, as shown in FIG. 8A, an insulating sheet 280 formed in a sheet shape is covered so as to cover the entire recess 220 a formed in the base 220. Here, an adhesive is applied in advance to the bottom of the recess 220a, and the insulating sheet 280 is bonded to the bottom of the recess 220a.

  Next, as illustrated in FIG. 8B, the light emitting module 210 is fitted into the recess 220 a from the front of the insulating sheet 280. At this time, since the insulating sheet 280 is flexible, the insulating sheet 280 is bent toward the inside of the recess 220a at the periphery of the module substrate 211 as the module substrate 211 is fitted into the recess 220a.

When the light emitting module 210 is fitted inside the recess 220a, the peripheral portion of the insulating sheet 280 extends from the peripheral edge of the module substrate 211 toward the front of the module substrate 211 as shown in FIG. It will be in the state of taking out. Thereby, as shown in FIG.7 (b), along the front and back both surfaces of the site | part extended toward the front in the insulating sheet 280 in the creeping distance between the electrode part 13b of the light emission part 13, and the base 20 Since the distance is included, the creepage distance can be increased accordingly.
<Embodiment 3>
FIG. 9 shows the structure of a lighting fixture 601 according to this embodiment.

  The lighting fixture 601 includes the lamp 1 according to Embodiment 1 and a fixture main body 603. Here, the fixture body 603 is a so-called downlight illumination fixture.

  The appliance body 603 is connected to a socket 605 that is electrically connected to the lamp 1 and holds the lamp, a bowl-shaped reflector 607 that reflects light emitted from the lamp 1 in a predetermined direction, and an external commercial power source. Connecting portion 609.

  The reflection plate 607 is attached to the ceiling 611 in contact with the lower surface of the peripheral portion of the opening 613 of the ceiling 611. Here, the socket 605 disposed on the bottom side of the reflection plate 607 is located on the back side of the ceiling 611. Further, the central axis of the reflecting plate 607 coincides with the lamp axis J of the lamp 1.

  In addition, the structure of the lighting fixture 601 shown in FIG. 9 is a mere example, and is not limited to the above-mentioned lighting fixture for downlights. In the lighting fixture 601, the lamp axis J of the lamp 1 is arranged so as to coincide with the central axis of the bowl-shaped reflector 607. However, the lamp axis J of the lamp 1 is the central axis of the reflector 607. It may be arranged so as to be inclined with respect to. Furthermore, a part of the power supply unit of the lamp 1 may be arranged in the lighting fixture 601 instead of in the lamp 1.

<Modification>
(1) In the first embodiment, the example in which the insulating sheet 80 is disposed only on the front side of the metal substrate 86 with the light emitting module 10 attached to the base 20 has been described. It is not a thing. For example, as illustrated in FIG. 10, the lamp 3 may include a metal substrate 86 provided with an insulating sheet 380 on the rear side opposite to the front side.

  In the lamp 3 shown in FIG. 10, the circuit holder 350 includes a large diameter part 350a and a small diameter part 350b, and does not have a lid. Therefore, the circuit holder 350 and the housing 360 are miniaturized because there is no cover. Further, the base 320 is formed in an annular shape in plan view, and a first base portion 320a whose peripheral surface is in contact with the inner peripheral surface of the housing 360, and a first base portion 320a formed in an annular shape in plan view. It is comprised from the 2nd base part 320b arrange | positioned in back. Here, the 1st base part 320a is formed with metals, such as aluminum, and the 2nd base part 320b is formed with insulating materials, such as resin. The module substrate 11 is fixed so that the peripheral portion thereof is supported by the first base portion 320a. The power supply unit 40 is fixed in such a manner that the peripheral portion of the circuit board 40a is supported by the second base portion 320b.

  In the lamp 3, by providing the insulating sheet 380 on the rear side of the metal substrate 86, the withstand voltage between the metal substrate 86 and the wiring pattern formed on the circuit board 40a is improved.

  Thus, in the lamp 3, the wiring formed on the metal substrate 86 and the circuit board 40a is provided while the lid or the like is not interposed between the circuit board 40a and the metal substrate 86 on the rear surface side of the module substrate 11. It is possible to suppress the occurrence of discharge between the pattern (for example, the leading end portion of the lead wire protruding from the rear surface opposite to the surface on which the electronic component 40b is mounted on the circuit board 40a).

  (2) In the second embodiment, the example in which the entire rear surface of the metal substrate 286 is covered with the base 220 has been described. However, the present invention is not limited to this. For example, as illustrated in FIG. 11, the lamp 4 may be such that a part of the rear surface of the metal substrate 286 is not covered with the base 320.

  As shown in FIG. 11, in the lamp 4, the circuit holder 350 includes a large-diameter portion 350a and a small-diameter portion 350b, and the base 320 is a first base, as in the modification described in (1) above. It is comprised from the base part 320a and the 2nd base part 320b. As shown in FIG. 12A, the first base portion 320a has a concave portion 321a having a rectangular shape in plan view in the center portion, and a window portion having a rectangular shape in plan view in the substantially central portion of the concave portion 321a. 322a is provided.

  In the lamp 4, by providing the insulating sheet 280 so as to cover the rear surface side of the metal substrate 286, the withstand voltage between the metal substrate 286 and the wiring pattern formed on the circuit board 40 a is improved.

  Thereby, in the lamp 4, the metal substrate 286 and the circuit are connected to each other while the lid formed from an insulating material is not interposed between the circuit substrate 40 a and the metal substrate 286 on the rear surface side of the module substrate 211. Suppressing the generation of electric discharge between the wiring formed on the substrate 40a (for example, the tip of the lead wire of the electronic component 40b protruding from the rear surface opposite to the surface on which the electronic component 40b is mounted on the circuit substrate 40a) it can.

  The lamp 4 according to this modification can be manufactured, for example, using a manufacturing method as shown in FIG.

  First, the insulating sheet 280 is covered so that the recessed part 321a of the 1st base part 320a may be covered (refer Fig.12 (a)).

  Next, as shown in FIG. 12B, the light emitting module 210 is fitted into the recess 321 a from the front of the insulating sheet 280. At this time, since the insulating sheet 280 is flexible, the peripheral portion of the insulating sheet 280 is bent toward the inside of the concave portion 321a at the periphery of the module substrate 211 as the module substrate 211 is fitted into the concave portion 321a. . Then, in a state where the light emitting module 210 is fitted in the recess 321a, the peripheral portion of the insulating sheet 280 extends from the outer peripheral portion of the module substrate 211 toward the front of the module substrate 211 as shown in FIG. It will be in the state.

  Thereafter, as shown in FIG. 12C, the lead wires 43a and 43b are connected to the power supply terminal 210a so that the lead wires 43a and 43b straddle the periphery of the insulating sheet 280 on the front side of the module substrate 211. To do.

  (3) In the first embodiment, the example in which the insulating sheet 80 extends outward from the peripheral edge of the base 20 and the tip thereof is placed on the inner wall of the globe 30 has been described. However, the present invention is not limited to this. For example, as shown in FIG. 13A, the periphery of the insulating sheet 80a and the periphery of the surface of the base 20 on the side where the light emitting module 10 is attached coincide, that is, the planar view shape and the base of the insulating sheet 80a. The plan view shape of the table 20 may be the same. Thereby, when attaching the globe 30 to the housing 60, the opening end of the globe 30 and the insulating sheet 80a do not come into contact with each other, so that assembly workability can be improved.

  Further, the minimum value W1 of the creeping distance along the direction from the electrode part 13b on the surface of the insulating sheet 80a toward the base 20 between the electrode part 13b of the light emitting part 13 and the base 20 can be set to 1.5 mm or more. For example, in a withstand voltage test (see FIG. 18) performed by applying an AC voltage of 4 kV between the housing 60 and the base 70, creeping discharge generated between the electrode portion 13 b and the base 20 can be suppressed. it can.

  Note that the planar view shape of the insulating sheet 80a and the planar view shape of the base 20 do not necessarily match. For example, as shown in FIG. It may be present inside the base 20. In this case, the minimum value W2 of the creeping distance along the direction from the electrode part 13b on the surface of the insulating sheet 80b to the base 20 between the electrode part 13b of the light emitting part 13 and the base 20 is shown in FIG. ) Is smaller than the distance W1 shown in FIG.

  Alternatively, as shown in FIG. 13C, the peripheral edge of the insulating sheet 80c extends from the outer peripheral portion of the metal substrate 86 by a length W4 in plan view, so that the electrode portion 13b and the base 20 of the light emitting portion 13 are extended. The minimum value W3 of the creeping distance along the direction from the electrode portion 13b on the surface of the insulating sheet 80b toward the base 20 between the two may be increased.

  Even in this case, the minimum values W3 and W4 of the creeping distance along the direction from the electrode part 13b on the surface of the insulating sheet 80a toward the base 20 between the electrode part 13b of the light emitting part 13 and the base 20 are 1. If the thickness is set to 5 mm or more, in an insulation withstand voltage test (see FIG. 18) performed by applying an AC voltage of 4 kV between the casing 60 and the base 70, between the electrode portion 13b of the light emitting portion 13 and the base 20. The generated creeping discharge can be suppressed.

  Further, since the area of the insulating sheet 80c can be reduced, the material cost can be reduced.

  (4) In the second embodiment, the insulating sheet 280 covers the rear surface of the module substrate 211 opposite to the main surface on which the light emitting unit 13 is disposed, and the main surface of the module substrate 211 from the outer peripheral portion of the module substrate 211. Although the example of the lamp | ramp 2 extended to the side was demonstrated, it is not limited to this.

  For example, as shown in FIGS. 14 and 15, the insulating sheet 580 may be a lamp 5 that is larger than the area of the base 520 in a plan view and extends outward from the outer peripheral portion of the base 520. . FIG. 15 is a cross-sectional view along the line A-A ′ shown in FIG. 14.

  Here, the module substrate 511 constituting a part of the light emitting module 510 includes a metal substrate 586 formed in a rectangular shape in plan view and an insulating sheet 581 provided on the front side of the metal substrate 586. The area of the insulating sheet 581 is substantially the same as the area of the metal substrate 586 in plan view, and the periphery of the insulating sheet 581 and the periphery of the metal substrate 586 are coincident. The metal substrate 586 is made of a metal such as aluminum, and the insulating sheet 581 is made of an insulating material such as a polyamide resin.

  The insulating sheet 580 covers the rear surface of the module substrate 511 opposite to the main surface on which the light emitting unit 13 is disposed, and extends from the outer periphery of the module substrate 511 to the main surface side of the module substrate 511. The insulating sheet 580 further extends outward from the periphery of the base 520, and the tip portion of the extended portion is placed on the inner wall of the globe 30.

  (5) In the first embodiment, the example in which the insulating sheet 80 covers up to the opening peripheral edge on the surface side where the light emitting portion 13 in the hole portion 11a in the module substrate 11 is provided has been described, but is not limited thereto. For example, as shown to Fig.16 (a), the insulating sheet 680 may be provided in the form which covers to the inner wall of the hole 11a of the module board | substrate 11, and the through-hole 20c of the base 20. FIG.

  Also, as shown in FIG. 16B, a cylinder that is formed in a cylindrical shape, has an outer diameter that is substantially the same as the inner diameter of the hole portion 11a and the through hole 20c, and is disposed inside the hole portion 11a and the through hole 20c. There may be provided a bushing 780 composed of a shape portion 780a and a flange portion 780b extending from the light emitting portion 13 side in the cylinder axis direction of the cylindrical portion 780a to the opening outer peripheral portion of the hole portion 11a. The bushing 780 is made of a nonconductive material such as resin.

  Furthermore, as shown in FIG. 16 (c), the bottomed cylindrical first tubular portion 880a and the substantially central portion of the bottom portion of the first tubular portion 880a protrude in the tubular axial direction of the first tubular portion 880a. A bushing 880 having a second cylindrical portion 880b communicating with the inside of the first cylindrical portion 880a, and an insertion for inserting the lead wires 43a and 43b into the head 881a and the shaft portion 881b. A hole 881c may be formed, and a screw 881 having a male screw portion 881d formed at the tip of the shaft portion opposite to the head portion 881b may be provided. Then, with the screw 881 inserted through the second cylindrical portion 880b of the bushing 880, the male screw portion 881d is screwed into a female screw portion 620d formed on the inner wall of the through hole 620c of the base 620. . Here, the bottom portion of the first tubular portion 880a of the bushing 880 is sandwiched between the head portion 881a of the screw 881 and the outer peripheral portion of the opening portion 11a on the light emitting portion 13 side opening.

  (6) In the first embodiment, the example of the lamp 1 in which the peripheral edge of the insulating sheet 80 extends to the outside of the peripheral edge of the base 20 in a plan view over the entire periphery has been described. For example, a lamp in which only a part of the periphery of the insulating sheet 80 extends outside the periphery of the base 20 may be used.

  (7) In each of the above-described embodiments, the example in which the insulating sheets 80, 280, and 281 are formed from a polyamide resin has been described. However, the present invention is not limited to this. For example, the insulating sheets 80, 280, and 281 may be made of an aromatic polyamide resin, polyethersulfone, an acrylic resin, or the like.

  (8) In each of the above-described embodiments, the light emitting unit 13 may be a surface mounted LED, a COB (Chip On Board) LED, or the like. Any electrode portion that is electrically connected to the element is exposed on the surface of the module substrate 11.

  (9) In each of the above-described embodiments, the example in which the light emitting unit 13 includes the light emitting diode has been described. However, the present invention is not limited to this, and includes other light emitting elements such as an EL element. Also good.

  The lamp according to the present invention can be widely used in general lighting applications.

1, 2, 3, 4, 5 Lamp 10, 210, Light-emitting module 11, 211 Module substrate 13 Light-emitting part 13a Sealing body 13b Electrode part 15,215 Connector 17 Wiring pattern 18 Power supply terminal 20, 220, 320, 520 Base 30 Globe 40 Power supply unit 41a, 41b Power supply line 43a, 43b Lead wire 50 Circuit holder 60, 360 Case 70 Base 70a Shell part 70b Insulation part 70c Eyelet part 72 Insulator part 80, 280, 281 Insulation sheet 86 Metal substrate 320a First 1 base part 320b 2nd base part 601 Lighting fixture 603 Appliance main body 605 Socket

Claims (9)

A metal casing formed in a cylindrical shape;
A power supply unit housed in the housing;
A metal base attached to one end of the casing in the cylinder axis direction;
A base that is disposed in a state of being electrically insulated from the casing at the other end in the cylindrical axis direction of the casing and supplies power from an external power source to the power supply unit;
A substrate disposed on the opposite side of the base from the power supply unit side;
A light emitting portion having an electrode portion and disposed on the opposite side of the base side of the substrate;
An insulating sheet is interposed between the base and the light emitting unit,
In plan view, the peripheral edge of the insulating sheet extends outward from the peripheral edge of the substrate at least at a portion where the distance between the peripheral edge of the substrate and the electrode portion is minimum. . The lamp according to claim 1, wherein the insulating sheet is interposed between the substrate and the light emitting unit. The lamp according to claim 1, wherein the insulating sheet is interposed between the substrate and the base. The lamp according to any one of claims 1 to 3, wherein the insulating sheet extends outward from a peripheral edge of the base. A glove attached to the housing in a form in which an opening end is disposed between the one end portion in the cylindrical axis direction of the housing and the peripheral portion of the substrate;
5. The lamp according to claim 1, wherein a peripheral edge of the insulating sheet exists inside a peripheral edge of the base in a plan view. The base has a recess,
The peripheral part of the said insulating sheet is extended toward the said light emission part side in the said board | substrate from the outer peripheral part of the said board | substrate in the state in which the said board | substrate was fitted to the said recessed part. lamp. 7. The minimum value of the creeping distance along the surface of the insulating sheet between the electrode part and the base is 1.5 mm or more. 7. lamp. The lamp according to any one of claims 1 to 7, wherein the insulating sheet is made of a polyamide resin. A lighting fixture comprising the lamp according to any one of claims 1 to 8.

Images