JPWO2012133080A1 - Curable silicone resin composition and silicone resin cured product - Google Patents
Curable silicone resin composition and silicone resin cured product Download PDFInfo
- Publication number
- JPWO2012133080A1 JPWO2012133080A1 JP2013507445A JP2013507445A JPWO2012133080A1 JP WO2012133080 A1 JPWO2012133080 A1 JP WO2012133080A1 JP 2013507445 A JP2013507445 A JP 2013507445A JP 2013507445 A JP2013507445 A JP 2013507445A JP WO2012133080 A1 JPWO2012133080 A1 JP WO2012133080A1
- Authority
- JP
- Japan
- Prior art keywords
- group
- silicone resin
- resin
- resin composition
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920002050 silicone resin Polymers 0.000 title claims abstract description 112
- 239000011342 resin composition Substances 0.000 title claims abstract description 58
- 229920005989 resin Polymers 0.000 claims abstract description 159
- 239000011347 resin Substances 0.000 claims abstract description 159
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 8
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 6
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims abstract description 6
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims abstract description 5
- 125000001118 alkylidene group Chemical group 0.000 claims abstract description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 38
- 150000001875 compounds Chemical class 0.000 claims description 32
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 28
- 238000010526 radical polymerization reaction Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 description 73
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 45
- 238000006460 hydrolysis reaction Methods 0.000 description 44
- 230000015572 biosynthetic process Effects 0.000 description 37
- 238000003786 synthesis reaction Methods 0.000 description 37
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 36
- 238000006243 chemical reaction Methods 0.000 description 35
- 239000007795 chemical reaction product Substances 0.000 description 31
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 30
- -1 methacryloyl group Chemical group 0.000 description 23
- 238000010521 absorption reaction Methods 0.000 description 20
- 239000000047 product Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 19
- 238000005227 gel permeation chromatography Methods 0.000 description 17
- 150000003377 silicon compounds Chemical class 0.000 description 17
- 239000003054 catalyst Substances 0.000 description 16
- 239000012454 non-polar solvent Substances 0.000 description 15
- 239000000243 solution Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 13
- 239000007788 liquid Substances 0.000 description 12
- 239000003960 organic solvent Substances 0.000 description 12
- 238000005259 measurement Methods 0.000 description 11
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 10
- 239000002798 polar solvent Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 10
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 239000010408 film Substances 0.000 description 9
- 125000000524 functional group Chemical group 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 8
- 238000001723 curing Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000003505 polymerization initiator Substances 0.000 description 8
- 238000012719 thermal polymerization Methods 0.000 description 8
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 5
- 230000035484 reaction time Effects 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 238000005160 1H NMR spectroscopy Methods 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 4
- 125000004386 diacrylate group Chemical group 0.000 description 4
- 230000007062 hydrolysis Effects 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 239000012074 organic phase Substances 0.000 description 4
- 150000002978 peroxides Chemical class 0.000 description 4
- 238000000016 photochemical curing Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 3
- 238000006482 condensation reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 238000004949 mass spectrometry Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000007935 neutral effect Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 2
- HCLJOFJIQIJXHS-UHFFFAOYSA-N 2-[2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOCCOC(=O)C=C HCLJOFJIQIJXHS-UHFFFAOYSA-N 0.000 description 2
- MFGOFGRYDNHJTA-UHFFFAOYSA-N 2-amino-1-(2-fluorophenyl)ethanol Chemical compound NCC(O)C1=CC=CC=C1F MFGOFGRYDNHJTA-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical class [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 239000008346 aqueous phase Substances 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- FKPSBYZGRQJIMO-UHFFFAOYSA-M benzyl(triethyl)azanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC1=CC=CC=C1 FKPSBYZGRQJIMO-UHFFFAOYSA-M 0.000 description 2
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Inorganic materials [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000007810 chemical reaction solvent Substances 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000002330 electrospray ionisation mass spectrometry Methods 0.000 description 2
- 238000000119 electrospray ionisation mass spectrum Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- PRBBFHSSJFGXJS-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)C(O)=O.C=CC(=O)OCC(C)(C)COC(=O)C=C PRBBFHSSJFGXJS-UHFFFAOYSA-N 0.000 description 1
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 1
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- NNNLYDWXTKOQQX-UHFFFAOYSA-N 1,1-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OC(CC)(OC(=O)C=C)OC(=O)C=C NNNLYDWXTKOQQX-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- 125000002030 1,2-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([*:2])C([H])=C1[H] 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- OAMHTTBNEJBIKA-UHFFFAOYSA-N 2,2,2-trichloro-1-phenylethanone Chemical compound ClC(Cl)(Cl)C(=O)C1=CC=CC=C1 OAMHTTBNEJBIKA-UHFFFAOYSA-N 0.000 description 1
- QTKPMCIBUROOGY-UHFFFAOYSA-N 2,2,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(F)(F)F QTKPMCIBUROOGY-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- NFPBWZOKGZKYRE-UHFFFAOYSA-N 2-propan-2-ylperoxypropane Chemical compound CC(C)OOC(C)C NFPBWZOKGZKYRE-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- ZWNGBXQHXLKZLV-UHFFFAOYSA-N 9-hydroxynonyl prop-2-enoate Chemical compound OCCCCCCCCCOC(=O)C=C ZWNGBXQHXLKZLV-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- NDKBVBUGCNGSJJ-UHFFFAOYSA-M benzyltrimethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)CC1=CC=CC=C1 NDKBVBUGCNGSJJ-UHFFFAOYSA-M 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- XGZGKDQVCBHSGI-UHFFFAOYSA-N butyl(triethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)OCC XGZGKDQVCBHSGI-UHFFFAOYSA-N 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000132 electrospray ionisation Methods 0.000 description 1
- BLCTWBJQROOONQ-UHFFFAOYSA-N ethenyl prop-2-enoate Chemical compound C=COC(=O)C=C BLCTWBJQROOONQ-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 238000006459 hydrosilylation reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000654 isopropylidene group Chemical group C(C)(C)=* 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- RSVDRWTUCMTKBV-UHFFFAOYSA-N sbb057044 Chemical compound C12CC=CC2C2CC(OCCOC(=O)C=C)C1C2 RSVDRWTUCMTKBV-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
- CBXCPBUEXACCNR-UHFFFAOYSA-N tetraethylammonium Chemical compound CC[N+](CC)(CC)CC CBXCPBUEXACCNR-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- FHVAUDREWWXPRW-UHFFFAOYSA-N triethoxy(pentyl)silane Chemical compound CCCCC[Si](OCC)(OCC)OCC FHVAUDREWWXPRW-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- UZIAQVMNAXPCJQ-UHFFFAOYSA-N triethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)COC(=O)C(C)=C UZIAQVMNAXPCJQ-UHFFFAOYSA-N 0.000 description 1
- HILHCDFHSDUYNX-UHFFFAOYSA-N trimethoxy(pentyl)silane Chemical compound CCCCC[Si](OC)(OC)OC HILHCDFHSDUYNX-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- UOKUUKOEIMCYAI-UHFFFAOYSA-N trimethoxysilylmethyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)COC(=O)C(C)=C UOKUUKOEIMCYAI-UHFFFAOYSA-N 0.000 description 1
- BJAARRARQJZURR-UHFFFAOYSA-N trimethylazanium;hydroxide Chemical compound O.CN(C)C BJAARRARQJZURR-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F30/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F30/04—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F30/08—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
- C08F299/08—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F230/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
- C08F230/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal
- C08F230/08—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon
- C08F230/085—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing a metal containing silicon the monomer being a polymerisable silane, e.g. (meth)acryloyloxy trialkoxy silanes or vinyl trialkoxysilanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
- C08L43/04—Homopolymers or copolymers of monomers containing silicon
Abstract
下記一般式(1):[CH2=CHSiO3/2]n[R1SiO3/2]m[R2SiO3/2]j・・・(1){式(1)中、R1は、下記一般式(2):CH2=CR3−CO−O−R4− ・・・(2)[式(2)中、R3は、水素原子又はメチル基を示し、R4は、アルキレン基、アルキリデン基及びフェニレン基からなる群より選択されるいずれか一種を示す。]で表わされる(メタ)アクリロイル基を有する基を示し、R2は、水素原子、炭素数1〜6のアルキル基、フェニル基及びアリル基からなる群より選択されるいずれか一種を示し、n、m及びjは下記式(i)〜(iv):n≧1 ・・・(i)、m≧1 ・・・(ii)、j≧0 ・・・(iii)、n+m+j=h ・・・(iv)[式(iv)中、hは8、10、12及び14からなる群より選択される整数を示す。]で表わされる条件を満たす整数を示し、m及びjがそれぞれ2以上の場合にはR1及びR2はそれぞれ同一でも異なっていてもよい。}で表わされるかご型シルセスキオキサン樹脂と、ラジカル重合開始剤とを含有しており、前記樹脂の含有量が10〜80質量%である硬化性シリコーン樹脂組成物。The following general formula (1): [CH2 = CHSiO3 / 2] n [R1SiO3 / 2] m [R2SiO3 / 2] j (1) {In formula (1), R1 represents the following general formula (2): CH2 = CR3-CO-O-R4- (2) [In the formula (2), R3 represents a hydrogen atom or a methyl group, and R4 is selected from the group consisting of an alkylene group, an alkylidene group, and a phenylene group. Any one kind to be shown. Wherein R2 represents any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a phenyl group, and an allyl group, and n, m and j are the following formulas (i) to (iv): n ≧ 1 (i), m ≧ 1 (ii), j ≧ 0 (iii), n + m + j = h. (Iv) [In the formula (iv), h represents an integer selected from the group consisting of 8, 10, 12, and 14. In the case where m and j are each 2 or more, R1 and R2 may be the same or different. } The curable silicone resin composition which contains the cage silsesquioxane resin represented by these, and radical polymerization initiator, and content of the said resin is 10-80 mass%.
Description
本発明は、硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物に関する。さらに詳しくは、かご型シルセスキオキサン樹脂を含有する硬化性シリコーン樹脂組成物及びこれを硬化させて得られるシリコーン樹脂硬化物に関する。 The present invention relates to a curable silicone resin composition and a cured silicone resin. More specifically, the present invention relates to a curable silicone resin composition containing a cage silsesquioxane resin and a cured silicone resin obtained by curing the same.
一般に、液晶表示素子用基板、カラーフィルター用基板、有機EL表示素子用基板、電子ペーパー用基板、TFT用基板、太陽電池用基板等の透明基板としては、ガラス板が広く用いられている。しかしながら、ガラス板は、割れやすい、曲げられない、比重が大きく軽量化に不向きである等の理由から、近年その代替として透明プラスチック板を用いることが検討されている。 Generally, a glass plate is widely used as a transparent substrate such as a substrate for a liquid crystal display element, a substrate for a color filter, a substrate for an organic EL display element, a substrate for electronic paper, a substrate for TFT, or a substrate for solar cell. However, in recent years, the use of a transparent plastic plate as an alternative has been studied because glass plates are easily broken, cannot be bent, have a large specific gravity, and are not suitable for weight reduction.
一方、かご構造を有するシルセスキオキサンは、その特徴的な構造を利用することにより特異な機能を発現させることが可能であることから、様々な分野で注目されている。特に、かご型シルセスキオキサン樹脂の硬化物は、耐熱性、耐候性、光学特性、寸法安定性等に優れることから、ガラス板の代替となる透明プラスチック板の材料として期待されている。 On the other hand, silsesquioxane having a cage structure has attracted attention in various fields because it can express a specific function by utilizing its characteristic structure. In particular, a cured product of a cage-type silsesquioxane resin is expected as a material for a transparent plastic plate that can be used as a substitute for a glass plate because it has excellent heat resistance, weather resistance, optical properties, dimensional stability, and the like.
このようなかご型シルセスキオキサン樹脂の硬化物としては、例えば、特開2009−79163号公報(特許文献1)において、硬化性官能基としてビニル基を有するかご型シルセスキオキサンとSiH基を有する化合物とビニル基を有する化合物とをヒドロシリル化反応せしめて得られるシルセスキオキサン硬化物が開示されている。しかしながら、同文献に記載されている硬化物においては、ある程度高い耐熱性及び透明性が達成されているものの、ガラス板の代替材料として用いる場合には線膨張係数が大きく、さらに、ヒドロシリル化反応において一般的に用いられる白金触媒は高価であり経済的に不利であるという問題を有していた。 As a cured product of such a cage silsesquioxane resin, for example, in JP 2009-79163 A (Patent Document 1), a cage silsesquioxane having a vinyl group as a curable functional group and a SiH group. The silsesquioxane hardened | cured material obtained by hydrosilylating the compound which has this, and the compound which has a vinyl group is disclosed. However, in the cured product described in the same document, although high heat resistance and transparency are achieved to some extent, when used as an alternative material for a glass plate, the linear expansion coefficient is large, and further in the hydrosilylation reaction. Commonly used platinum catalysts have the problem of being expensive and economically disadvantageous.
また、特開2006−89685号公報(特許文献2)においては、[RSiO3/2]nで表され、(メタ)アクリロイル基を官能基として有するかご型シルセスキオキサン樹脂と不飽和化合物等とからなるシリコーン樹脂組成物をラジカル共重合させて得られたシリコーン樹脂共重合体が記載されている。In JP-A-2006-89685 (Patent Document 2), a cage silsesquioxane resin represented by [RSiO 3/2 ] n and having a (meth) acryloyl group as a functional group, an unsaturated compound, and the like A silicone resin copolymer obtained by radical copolymerization of a silicone resin composition comprising:
さらに、特開2004−143449号公報(特許文献3)においては、[RSiO3/2]nで表され、(メタ)アクリロイル基、グリシジル基及びビニル基のうちのいずれか一つを有するかご型シルセスキオキサン樹脂が開示されている。また、国際公開第2008/099850号(特許文献4)においては、ビニル基等を有するかご開裂型のシルセスキオキサン樹脂が開示されている。Furthermore, in JP 2004-143449 A (Patent Document 3), a cage type represented by [RSiO 3/2 ] n and having any one of a (meth) acryloyl group, a glycidyl group and a vinyl group. Silsesquioxane resins are disclosed. In addition, International Publication No. 2008/099850 (Patent Document 4) discloses a cage cleavage type silsesquioxane resin having a vinyl group or the like.
上記特許文献2に記載されているシリコーン樹脂共重合体においては、透明性が高く、ある程度小さい線膨張係数を有しているものの、同文献に記載されているシリコーン樹脂共重合体のようにかご型シルセスキオキサン骨格における全てのケイ素原子上に親水性基である(メタ)アクリロイル基を有する樹脂硬化物は、吸水性が高く、線膨張係数も大きくなるという問題を有していることを本発明者らは見出した。 The silicone resin copolymer described in Patent Document 2 is highly transparent and has a linear expansion coefficient that is small to some extent. However, the silicone resin copolymer described in Patent Document 2 has a cage like the silicone resin copolymer described in the same document. The cured resin having a (meth) acryloyl group which is a hydrophilic group on all silicon atoms in the type silsesquioxane skeleton has a problem of high water absorption and a large linear expansion coefficient. The inventors have found.
また、上記特許文献3に記載されているかご型シルセスキオキサン樹脂や上記特許文献4に記載されているかご開裂型のシルセスキオキサン樹脂のうち、例えば、ビニル基のみを有する樹脂を用いて硬化物を製造すると、得られる硬化物に割れが生じたり、硬化物が白濁してしまうといった問題が生じることを本発明者らは見出した。 Further, among the cage silsesquioxane resin described in Patent Document 3 and the cage cleavage silsesquioxane resin described in Patent Document 4, for example, a resin having only a vinyl group is used. The present inventors have found that when a cured product is produced, the resulting cured product is cracked or the cured product becomes cloudy.
本発明は、上記従来技術の有する課題に鑑みてなされたものであり、優れた透明性、成形性及び低吸水性を有し、線膨張係数が十分に小さいシリコーン樹脂硬化物を得ることができる硬化性シリコーン樹脂組成物及びこれを硬化させて得られるシリコーン樹脂硬化物を提供することを目的とする。 This invention is made | formed in view of the subject which the said prior art has, and can obtain the silicone resin hardened | cured material which has the outstanding transparency, a moldability, and low water absorption, and has a sufficiently small linear expansion coefficient. An object is to provide a curable silicone resin composition and a cured silicone resin obtained by curing the composition.
本発明者らは、上記目的を達成すべく鋭意研究を重ねた結果、シリコーン樹脂組成物において、ビニル基と(メタ)アクリロイル基とを有する特定の構造のかご型シルセスキオキサン樹脂を含有する硬化性シリコーン樹脂組成物を硬化させることにより、優れた透明性、成形性及び低吸水性を有し、線膨張係数が十分に小さいシリコーン樹脂硬化物を得られることを見出し、本発明を完成するに至った。 As a result of intensive studies to achieve the above object, the present inventors contain a cage silsesquioxane resin having a specific structure having a vinyl group and a (meth) acryloyl group in the silicone resin composition. It is found that by curing a curable silicone resin composition, a cured silicone resin having excellent transparency, moldability and low water absorption and a sufficiently small linear expansion coefficient can be obtained, and the present invention is completed. It came to.
すなわち、本発明の硬化性シリコーン樹脂組成物は、
下記一般式(1):
[CH2=CHSiO3/2]n[R1SiO3/2]m[R2SiO3/2]j ・・・(1)
{式(1)中、R1は、下記一般式(2):
CH2=CR3−CO−O−R4− ・・・(2)
[式(2)中、R3は、水素原子又はメチル基を示し、R4は、アルキレン基、アルキリデン基及びフェニレン基からなる群より選択されるいずれか一種を示す。]
で表わされる(メタ)アクリロイル基を有する基を示し、R2は、水素原子、炭素数1〜6のアルキル基、フェニル基及びアリル基からなる群より選択されるいずれか一種を示し、n、m及びjは下記式(i)〜(iv):
n≧1 ・・・(i)、
m≧1 ・・・(ii)、
j≧0 ・・・(iii)、
n+m+j=h ・・・(iv)
[式(iv)中、hは8、10、12及び14からなる群より選択されるいずれかの整数を示す。]
で表わされる条件を満たす整数を示し、m及びjがそれぞれ2以上の場合にはR1及びR2はそれぞれ同一でも異なっていてもよい。}
で表わされるかご型シルセスキオキサン樹脂と、ラジカル重合開始剤とを含有しており、
前記かご型シルセスキオキサン樹脂の含有量が10〜80質量%であるものである。That is, the curable silicone resin composition of the present invention is
The following general formula (1):
[CH 2 = CHSiO 3/2 ] n [R 1 SiO 3/2 ] m [R 2 SiO 3/2 ] j (1)
{In Formula (1), R 1 is the following General Formula (2):
CH 2 = CR 3 —CO—O—R 4 − (2)
[In Formula (2), R 3 represents a hydrogen atom or a methyl group, and R 4 represents any one selected from the group consisting of an alkylene group, an alkylidene group, and a phenylene group. ]
Wherein R 2 represents any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a phenyl group, and an allyl group, and n, m and j are the following formulas (i) to (iv):
n ≧ 1 (i),
m ≧ 1 (ii),
j ≧ 0 (iii),
n + m + j = h (iv)
[In the formula (iv), h represents any integer selected from the group consisting of 8, 10, 12, and 14. ]
When m and j are each 2 or more, R 1 and R 2 may be the same or different. }
A cage-type silsesquioxane resin represented by: and a radical polymerization initiator,
Content of the said cage silsesquioxane resin is 10-80 mass%.
前記かご型シルセスキオキサン樹脂において、ビニル基の数と(メタ)アクリロイル基の数との比(全ビニル基数:全(メタ)アクリロイル基数)が1:4〜13:1であることが好ましい。また、本発明の硬化性シリコーン樹脂組成物としては、(メタ)アクリロイル基を有する不飽和化合物を更に含有することが好ましく、前記ラジカル重合開始剤の含有量が0.01〜10質量%であることが好ましい。また、本発明のシリコーン樹脂硬化物は、前記硬化性シリコーン樹脂組成物をラジカル重合させて得られたものである。 In the cage silsesquioxane resin, the ratio of the number of vinyl groups to the number of (meth) acryloyl groups (total number of vinyl groups: total number of (meth) acryloyl groups) is preferably 1: 4 to 13: 1. . The curable silicone resin composition of the present invention preferably further contains an unsaturated compound having a (meth) acryloyl group, and the content of the radical polymerization initiator is 0.01 to 10% by mass. It is preferable. The cured silicone resin of the present invention is obtained by radical polymerization of the curable silicone resin composition.
なお、本発明の構成によって前記目的が達成される理由は必ずしも定かではないが、本発明者らは以下のように推察する。すなわち、本発明の硬化性シリコーン樹脂組成物においては、硬化性官能基としてビニル基と(メタ)アクリロイル基とを組み合わせて含有していることにより、驚くべきことに、両官能基の優れた特性のみが失われずに発揮され、優れた透明性及び成形性が発揮されると共に、吸水性が低く、線膨張係数が十分に小さいシリコーン樹脂硬化物を得ることができると本発明者らは推察する。なお、本発明において、(メタ)アクリロイル基とは、メタクリロイル基及びアクリロイル基を意味する。 The reason why the object is achieved by the configuration of the present invention is not necessarily clear, but the present inventors infer as follows. That is, in the curable silicone resin composition of the present invention, the combination of a vinyl group and a (meth) acryloyl group as a curable functional group surprisingly has excellent characteristics of both functional groups. The present inventors speculate that it is possible to obtain a cured silicone resin having a low water absorption and a sufficiently low linear expansion coefficient, as well as being exhibited without loss, excellent transparency and moldability. . In the present invention, the (meth) acryloyl group means a methacryloyl group and an acryloyl group.
また、本発明の硬化性シリコーン樹脂組成物においては、官能基を2種以上含有しているために他の化合物との相溶性に優れており、更に他の化合物を含有せしめても均一な樹脂組成物を得ることができる。従って、得られるシリコーン樹脂硬化物において優れた透明性及び成形性が発揮されるものと本発明者らは推察する。 Moreover, in the curable silicone resin composition of the present invention, since it contains two or more functional groups, it has excellent compatibility with other compounds, and even if other compounds are contained, it is a uniform resin. A composition can be obtained. Therefore, the present inventors speculate that the cured silicone resin obtained exhibits excellent transparency and moldability.
さらに、例えば、上記特許文献3や上記特許文献4に記載されている樹脂のうち、ビニル基のみを有する樹脂を用いて硬化物を製造する場合に(メタ)アクリロイル基を有する不飽和化合物を更に含有せしめて硬化物を製造しようとしても、ビニル基と(メタ)アクリロイル基との重合反応性に差があるためにかご型シルセスキオキサン樹脂が遊離して白濁してしまうが、本発明においては、上記のように官能基を2種以上含有しているため、硬化後においてもかご型シルセスキオキサン樹脂が遊離することなく透明性に優れた樹脂硬化物を得ることができる。 Furthermore, for example, when producing a cured product using a resin having only a vinyl group among the resins described in Patent Document 3 and Patent Document 4, an unsaturated compound having a (meth) acryloyl group is further added. Even if it is intended to produce a cured product, the cage silsesquioxane resin is liberated and becomes cloudy due to the difference in polymerization reactivity between the vinyl group and the (meth) acryloyl group. Since it contains two or more types of functional groups as described above, a caged silsesquioxane resin is not liberated even after curing, and a cured resin product having excellent transparency can be obtained.
本発明によれば、優れた透明性、成形性及び低吸水性を有し、線膨張係数が十分に小さいシリコーン樹脂硬化物を得ることができる硬化性シリコーン樹脂組成物及びこれを硬化させて得られるシリコーン樹脂硬化物を提供することが可能となる。 According to the present invention, a curable silicone resin composition having excellent transparency, moldability and low water absorption, and capable of obtaining a cured silicone resin having a sufficiently small linear expansion coefficient, and obtained by curing the same. It is possible to provide a cured silicone resin.
以下、本発明をその好適な実施形態に即して詳細に説明する。 Hereinafter, the present invention will be described in detail with reference to preferred embodiments thereof.
先ず、本発明の硬化性シリコーン樹脂組成物について説明する。本発明の硬化性シリコーン樹脂組成物は、かご型シルセスキオキサン樹脂と、ラジカル重合開始剤とを含有しており、前記かご型シルセスキオキサン樹脂の含有量が10〜80質量%である。 First, the curable silicone resin composition of the present invention will be described. The curable silicone resin composition of the present invention contains a cage silsesquioxane resin and a radical polymerization initiator, and the content of the cage silsesquioxane resin is 10 to 80% by mass. .
本発明に係るかご型シルセスキオキサン樹脂は、下記一般式(1):
[CH2=CHSiO3/2]n[R1SiO3/2]m[R2SiO3/2]j ・・・(1)
で表わされる。The cage silsesquioxane resin according to the present invention has the following general formula (1):
[CH 2 = CHSiO 3/2 ] n [R 1 SiO 3/2 ] m [R 2 SiO 3/2 ] j (1)
It is represented by
前記式(1)中、R1は、下記一般式(2):
CH2=CR3−CO−O−R4− ・・・(2)
で表わされる(メタ)アクリロイル基を有する基を示す。前記式(2)中、R3は、水素原子又はメチル基を示す。R3としては、立体構造の反発効果により、吸水性をより低減できるという観点から、メチル基が特に好ましい。また、前記式(2)中、R4は、アルキレン基、アルキリデン基及びフェニレン基からなる群より選択されるいずれか一種を示し、前記アルキレン基としては、直鎖状であっても分岐鎖状であってもよく、線膨張係数が小さくなるという観点から、炭素数が1〜3であることが好ましく、前記アルキリデン基としては、直鎖状であっても分岐鎖状であってもよく、例えば、プロパン−2−イリデン等が挙げられ、前記フェニレン基としては、例えば、無置換フェニレン基に加えて、低級アルキル基を有する1,2−フェニレン等が挙げられ、中でも、原料の入手が容易であるという観点から、炭素数が1〜3のアルキレン基が好ましい。これらの中でも、R4としては、原料の入手が容易であり、架橋間距離が大きくならず、また、線膨張係数が小さくなるという観点から、プロピレン基がより好ましい。In the formula (1), R 1 represents the following general formula (2):
CH 2 = CR 3 —CO—O—R 4 − (2)
The group which has (meth) acryloyl group represented by these is shown. In the formula (2), R 3 represents a hydrogen atom or a methyl group. R 3 is particularly preferably a methyl group from the viewpoint that water absorption can be further reduced due to the repulsive effect of the three-dimensional structure. In the formula (2), R 4 represents any one selected from the group consisting of an alkylene group, an alkylidene group, and a phenylene group, and the alkylene group may be linear or branched. From the viewpoint that the linear expansion coefficient is small, the number of carbon atoms is preferably 1 to 3, and the alkylidene group may be linear or branched, Examples thereof include propan-2-ylidene, and the phenylene group includes, for example, 1,2-phenylene having a lower alkyl group in addition to the unsubstituted phenylene group. From the viewpoint of being, an alkylene group having 1 to 3 carbon atoms is preferable. Among these, as R 4 , a propylene group is more preferable from the viewpoint that the raw materials are easily available, the distance between crosslinks is not increased, and the linear expansion coefficient is decreased.
また、前記式(1)中、R2は、水素原子、炭素数1〜6のアルキル基、フェニル基及びアリル基からなる群より選択されるいずれか一種を示す。前記アルキル基の炭素数が前記上限を超えると分子運動性が増加するため線膨張係数が増加する。これらの中でも、R2としては、線膨張係数が十分に小さくなるという観点から、水素原子、メチル基、エチル基、フェニル基、アリル基がより好ましい。Further, the formula (1), R 2 is a hydrogen atom, a kind one selected from the group consisting of alkyl group, a phenyl group and an allyl group having 1 to 6 carbon atoms. When the number of carbon atoms in the alkyl group exceeds the upper limit, the molecular mobility increases and the linear expansion coefficient increases. Among these, R 2 is more preferably a hydrogen atom, a methyl group, an ethyl group, a phenyl group, or an allyl group from the viewpoint that the linear expansion coefficient is sufficiently small.
さらに、前記式(1)中、n、m及びjは下記式(i)〜(iv):
n≧1 ・・・(i)、
m≧1 ・・・(ii)、
j≧0 ・・・(iii)、
n+m+j=h ・・・(iv)
[式(iv)中、hは8、10、12及び14からなる群より選択されるいずれかの整数を示す。]
で表わされる条件を満たす整数を示す。前記nが前記式(i)で表わされる条件を満たすことにより、本発明に係るかご型シルセスキオキサン樹脂は1つ以上のビニル基を有するため、ラジカル重合による架橋間距離が短くなり線膨張係数が十分に小さい硬化物を得ることが可能となる。また、前記mが前記式(ii)で表わされる条件を満たすことにより、本発明に係るかご型シルセスキオキサン樹脂は1つ以上の(メタ)アクリロイル基を有するため、ラジカル重合により透明な硬化物を得ることが可能となり、特に(メタ)アクリロイル基を有する不飽和化合物と共重合せしめる場合には相溶性が向上するためより透明な硬化物を得ることが可能となる。さらに、前記n、m及びjが前記式(i)〜(iv)で表わされる条件を満たすことにより、本発明に係るかご型シルセスキオキサン樹脂はほぼ完全に縮合したかご型構造となるため、優れた透明性、成形性及び低吸水性を有し、線膨張係数が十分に小さいシリコーン樹脂硬化物を得ることが可能となる。なお、m及びjがそれぞれ2以上の場合にはR1及びR2はそれぞれ同一でも異なっていてもよい。Furthermore, in said Formula (1), n, m, and j are following formula (i)-(iv):
n ≧ 1 (i),
m ≧ 1 (ii),
j ≧ 0 (iii),
n + m + j = h (iv)
[In the formula (iv), h represents any integer selected from the group consisting of 8, 10, 12, and 14. ]
An integer satisfying the condition represented by When the n satisfies the condition represented by the above formula (i), the cage silsesquioxane resin according to the present invention has one or more vinyl groups. It becomes possible to obtain a cured product having a sufficiently small coefficient. Moreover, since the cage silsesquioxane resin according to the present invention has one or more (meth) acryloyl groups by satisfying the condition represented by the above formula (ii), the transparent curing by radical polymerization. In particular, when copolymerizing with an unsaturated compound having a (meth) acryloyl group, the compatibility is improved, so that a more transparent cured product can be obtained. Furthermore, since the n, m and j satisfy the conditions represented by the above formulas (i) to (iv), the cage silsesquioxane resin according to the present invention has a cage structure which is almost completely condensed. Thus, it is possible to obtain a cured silicone resin having excellent transparency, moldability and low water absorption, and having a sufficiently small linear expansion coefficient. When m and j are each 2 or more, R 1 and R 2 may be the same or different.
また、n、m及びjとしては、線膨張係数が十分に小さいシリコーン樹脂硬化物が得られるという観点から、下記式(v):
(n+m)/j≧1 ・・・(v)
で表わされる条件を満たすことがより好ましい。Moreover, as n, m, and j, from the viewpoint that a cured silicone resin having a sufficiently small linear expansion coefficient can be obtained, the following formula (v):
(N + m) / j ≧ 1 (v)
It is more preferable that the condition represented by
さらに、本発明に係るかご型シルセスキオキサン樹脂においては、前記nと前記mとの比(n:m)が1:4〜13:1であることがさらに好ましく、1:3〜13:1であることが特に好ましい。前記nの数が前記下限未満の場合には樹脂の架橋密度が減少してシリコーン樹脂硬化物の線膨張係数が大きくなる傾向にあり、他方、前記上限を超える場合にはラジカル重合性が低いビニル基の含有量が多くなるために、シリコーン樹脂硬化物において未反応のビニル基が多く残存する傾向にあり、また、(メタ)アクリロイル基を有する不飽和化合物を更に含有せしめた場合に該不飽和化合物との相溶性が低下するため、かご型シルセスキオキサン樹脂が遊離してシリコーン樹脂硬化物が白濁する傾向にある。 Furthermore, in the cage silsesquioxane resin according to the present invention, the ratio of n to m (n: m) is more preferably 1: 4 to 13: 1, and 1: 3 to 13: 1 is particularly preferred. When the number of n is less than the lower limit, the crosslink density of the resin tends to decrease and the linear expansion coefficient of the cured silicone resin tends to increase. Since the content of the group increases, a large amount of unreacted vinyl groups tend to remain in the cured silicone resin, and when the unsaturated compound having a (meth) acryloyl group is further contained, Since the compatibility with the compound decreases, the cage silsesquioxane resin tends to be liberated and the cured silicone resin tends to become cloudy.
本発明の硬化性シリコーン樹脂組成物においては、このようなかご型シルセスキオキサン樹脂を用いることにより、優れた透明性、成形性及び低吸水性を有し、線膨張係数が十分に小さいシリコーン樹脂硬化物を得ることができる。 In the curable silicone resin composition of the present invention, by using such a cage-type silsesquioxane resin, a silicone having excellent transparency, moldability and low water absorption, and having a sufficiently small linear expansion coefficient. A cured resin can be obtained.
本発明に用いられる好ましいかご型シルセスキオキサン樹脂としては、例えば、上記一般式(1)中、nが7であり、mが1であり、jが0であり、R4が(CH2)kであり、下記式(3):As a preferable cage-type silsesquioxane resin used in the present invention, for example, in the above general formula (1), n is 7, m is 1, j is 0, and R 4 is (CH 2 K ) and the following formula (3):
[式(3)中、kは1〜3の整数を示す。]
で表わされる化合物、上記一般式(1)中、nが6であり、mが2であり、jが0であり、R4が(CH2)kであり、下記式(4):[In Formula (3), k shows the integer of 1-3. ]
In the compound represented by the general formula (1), n is 6, m is 2, j is 0, R 4 is (CH 2 ) k , and the following formula (4):
[式(4)中、kは1〜3の整数を示す。]
で表わされる化合物、上記一般式(1)中、nが4であり、mが4であり、jが0であり、R4が(CH2)kであり、下記式(5):[In Formula (4), k shows the integer of 1-3. ]
In the compound represented by general formula (1), n is 4, m is 4, j is 0, R 4 is (CH 2 ) k , and the following formula (5):
[式(5)中、kは1〜3の整数を示す。]
で表わされる化合物、上記一般式(1)中、nが8であり、mが2であり、jが0であり、R4が(CH2)kであり、下記式(6):[In formula (5), k shows the integer of 1-3. ]
In the compound represented by general formula (1), n is 8, m is 2, j is 0, R 4 is (CH 2 ) k , and the following formula (6):
[式(6)中、kは1〜3の整数を示す。]
で表わされる化合物、上記一般式(1)中、nが6であり、mが2であり、jが2であり、R4が(CH2)kであり、R2がCH3CH2−であり、下記式(7):[In Formula (6), k shows the integer of 1-3. ]
In the compound represented by formula (1), n is 6, m is 2, j is 2, R 4 is (CH 2 ) k , and R 2 is CH 3 CH 2 —. And the following formula (7):
[式(7)中、kは1〜3の整数を示す。]
で表わされる化合物、上記一般式(1)中、nが7であり、mが3であり、jが0であり、R4が(CH2)kであり、下記式(8):[In formula (7), k shows the integer of 1-3. ]
In the compound represented by the general formula (1), n is 7, m is 3, j is 0, R 4 is (CH 2 ) k , and the following formula (8):
[式(8)中、kは1〜3の整数を示す。]
で表わされる化合物、上記一般式(1)中、nが6であり、mが4であり、jが0であり、R4が(CH2)kであり、下記式(9):[In formula (8), k shows the integer of 1-3. ]
In the compound represented by general formula (1), n is 6, m is 4, j is 0, R 4 is (CH 2 ) k , and the following formula (9):
[式(9)中、kは1〜3の整数を示す。]
で表わされる化合物、上記一般式(1)中、nが11であり、mが1であり、jが0であり、R4が(CH2)kであり、下記式(10):[In formula (9), k shows the integer of 1-3. ]
In the compound represented by the general formula (1), n is 11, m is 1, j is 0, R 4 is (CH 2 ) k , and the following formula (10):
[式(10)中、kは1〜3の整数を示す。]
で表わされる化合物、上記一般式(1)中、nが10であり、mが2であり、jが0であり、R4が(CH2)kであり、下記式(11):[In formula (10), k shows the integer of 1-3. ]
In the compound represented by general formula (1), n is 10, m is 2, j is 0, R 4 is (CH 2 ) k , and the following formula (11):
[式(11)中、kは1〜3の整数を示す。]
で表わされる化合物、上記一般式(1)中、nが8であり、mが4であり、jが0であり、R4が(CH2)kであり、下記式(12):[In formula (11), k shows the integer of 1-3. ]
In the compound represented by the general formula (1), n is 8, m is 4, j is 0, R 4 is (CH 2 ) k , and the following formula (12):
[式(12)中、kは1〜3の整数を示す。]
で表わされる化合物、上記一般式(1)中、nが10であり、mが4であり、jが0であり、R4が(CH2)であり、下記式(13):[In formula (12), k shows the integer of 1-3. ]
In the compound represented by formula (1), n is 10, m is 4, j is 0, R 4 is (CH 2 ), and the following formula (13):
で表わされる化合物、上記一般式(1)中、nが6であり、mが4であり、jが4であり、R4が(CH2)であり、R2がCH3CH2−であり、下記式(14)で表わされる化合物が挙げられる。In the compound represented by formula (1), n is 6, m is 4, j is 4, R 4 is (CH 2 ), and R 2 is CH 3 CH 2 —. Yes, a compound represented by the following formula (14) may be mentioned.
本発明の硬化性シリコーン樹脂組成物において、前記かご型シルセスキオキサン樹脂としては、1種を単独で用いても2種以上を組み合わせて用いてもよい。前記かご型シルセスキオキサン樹脂の含有量としては、本発明の硬化性シリコーン樹脂組成物に対して、前記かご型シルセスキオキサン樹脂の合計質量が10〜80質量%であることが必要である。前記かご型シルセスキオキサン樹脂の含有量が前記下限未満である場合にはシリコーン樹脂硬化物において、透明性、低熱膨張性、低吸水性、相溶性等の物性が低下する。他方、前記上限を超える場合には硬化性シリコーン樹脂組成物の粘度が増大して成形物の製造が困難となる。また、透明性、低熱膨張性、低吸水性がより良好となるという観点から、前記かご型シルセスキオキサン樹脂の含有量としては15〜80質量%であることが特に好ましい。 In the curable silicone resin composition of the present invention, as the cage silsesquioxane resin, one kind may be used alone, or two or more kinds may be used in combination. As content of the said cage silsesquioxane resin, the total mass of the said cage silsesquioxane resin needs to be 10-80 mass% with respect to the curable silicone resin composition of this invention. is there. When the content of the cage silsesquioxane resin is less than the lower limit, in the cured silicone resin, physical properties such as transparency, low thermal expansion, low water absorption, and compatibility are deteriorated. On the other hand, when the above upper limit is exceeded, the viscosity of the curable silicone resin composition increases, making it difficult to produce a molded product. Moreover, from the viewpoint that transparency, low thermal expansion, and low water absorption are better, the content of the cage silsesquioxane resin is particularly preferably 15 to 80% by mass.
また、本発明の硬化性シリコーン樹脂組成物において、前記かご型シルセスキオキサン樹脂全体におけるビニル基の数と全(メタ)アクリロイル基の数との比(全ビニル基数:全(メタ)アクリロイル基数)が1:4〜13:1であることが好ましい。前記ビニル基の含有量が前記下限未満である場合には樹脂の架橋密度が減少してシリコーン樹脂硬化物の線膨張係数が大きくなる傾向にあり、他方、前記上限を超える場合にはラジカル重合性が低いビニル基の割合が多くなるために、シリコーン樹脂硬化物において未反応のビニル基が多く残存する傾向にある。また、低熱膨張性、低吸水性がより良好になるという観点から、前記比(全ビニル基数:全(メタ)アクリロイル基数)としては1:3〜13:1であることがより好ましい。 In the curable silicone resin composition of the present invention, the ratio of the number of vinyl groups to the number of all (meth) acryloyl groups in the entire cage silsesquioxane resin (total number of vinyl groups: total number of (meth) acryloyl groups). ) Is preferably 1: 4 to 13: 1. When the vinyl group content is less than the lower limit, the crosslink density of the resin tends to decrease and the linear expansion coefficient of the cured silicone resin tends to increase. Since the ratio of low vinyl groups increases, many unreacted vinyl groups tend to remain in the cured silicone resin. Moreover, from the viewpoint that the low thermal expansion property and the low water absorption become better, the ratio (total number of vinyl groups: total number of (meth) acryloyl groups) is more preferably 1: 3 to 13: 1.
なお、本発明において、前記かご型シルセスキオキサン樹脂におけるビニル基の数と全(メタ)アクリロイル基の数との比は、1H−NMR(機器名:JNM−ECA400、製造社名:JEOL、溶媒:重クロロホルム、温度:23℃、400MHz)を用いて測定されたビニル基及び(メタ)アクリロイル基のピークの積分比から求めることができる。In the present invention, the ratio between the number of vinyl groups and the total number of (meth) acryloyl groups in the cage silsesquioxane resin is 1 H-NMR (device name: JNM-ECA400, manufacturer name: JEOL, (Solvent: deuterated chloroform, temperature: 23 ° C., 400 MHz), which can be determined from the integration ratio of peaks of vinyl group and (meth) acryloyl group.
このようなかご型シルセスキオキサン樹脂の製造方法としては、例えば、下記一般式(15):
CH2=CHSiX3 ・・・(15)
[式(15)中、Xはアルコキシ基、アセトキシ基、ハロゲン原子及びヒドロキシ基からなる群より選択されるいずれか一種の加水分解性基を示す。]
で表されるケイ素化合物(A)と、下記一般式(16):
R1SiY3 ・・・(16)
[式(16)中、R1は、上記式(1)中のR1と同義であり、Yはアルコキシ基、アセトキシ基、ハロゲン原子及びヒドロキシ基からなる群より選択されるいずれか一種の加水分解性基を示す。]
で表されるケイ素化合物(B)と、下記一般式(17):
R2SiZ3 ・・・(17)
[式(17)中、R2は、上記式(1)中のR2と同義であり、Zは、アルコキシ基、アセトキシ基、ハロゲン原子及びヒドロキシ基からなる群より選択されるいずれか一種の加水分解性基を示す。]
で表されるケイ素化合物(C)とを混合し、塩基性触媒存在下において、非極性溶媒及び/又は極性溶媒中で加水分解反応せしめると共に一部縮合させ、得られた加水分解反応生成物を更に非極性溶媒及び塩基性触媒の存在下で再縮合せしめる方法が挙げられる。As a method for producing such a cage silsesquioxane resin, for example, the following general formula (15):
CH 2 = CHSiX 3 (15)
[In the formula (15), X represents any one hydrolyzable group selected from the group consisting of an alkoxy group, an acetoxy group, a halogen atom and a hydroxy group. ]
A silicon compound (A) represented by the following general formula (16):
R 1 SiY 3 (16)
[In Formula (16), R 1 is synonymous with R 1 in Formula (1), and Y is any one kind of water selected from the group consisting of an alkoxy group, an acetoxy group, a halogen atom and a hydroxy group. Decomposable group is shown. ]
A silicon compound (B) represented by the following general formula (17):
R 2 SiZ 3 (17)
[In formula (17), R 2 has the same meaning as R 2 in formula (1), and Z is any one selected from the group consisting of an alkoxy group, an acetoxy group, a halogen atom and a hydroxy group. A hydrolyzable group is shown. ]
In the presence of a basic catalyst, and in the presence of a basic catalyst, it is hydrolyzed in a nonpolar solvent and / or polar solvent and partially condensed, and the resulting hydrolysis reaction product is Furthermore, a method of recondensing in the presence of a nonpolar solvent and a basic catalyst can be mentioned.
前記ケイ素化合物(A)としては、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニルトリクロロシラン等が挙げられ、これらを単独で用いても2種以上を組み合わせて用いてもよい。中でも、原料の入手が容易であるという観点から、ビニルトリメトキシシランを用いることが好ましい。 Examples of the silicon compound (A) include vinyltrimethoxysilane, vinyltriethoxysilane, and vinyltrichlorosilane. These may be used alone or in combination of two or more. Among these, vinyltrimethoxysilane is preferably used from the viewpoint of easy availability of raw materials.
前記ケイ素化合物(B)としては、メタクリロキシメチルトリメトキシシラン、メタクリロキシメチルトリエトキシシラン、3−メタクリロキシプロピルトリメトキシシラン、3−メタクリロキシプロピルトリエトキシシラン、3−アクリロキシプロピルトリメトキシシラン、3−アクリロキシプロピルトリエトキシシラン等が挙げられ、これらを単独で用いても2種以上を組み合わせて用いてもよい。中でも、原料の入手が容易であるという観点から、3−メタクリロキシプロピルトリメトキシシランを用いることが好ましい。 Examples of the silicon compound (B) include methacryloxymethyltrimethoxysilane, methacryloxymethyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, Examples thereof include 3-acryloxypropyltriethoxysilane, and these may be used alone or in combination of two or more. Especially, it is preferable to use 3-methacryloxypropyl trimethoxysilane from a viewpoint that the acquisition of a raw material is easy.
前記ケイ素化合物(C)としてはフェニルトリメトキシシラン、フェニルトリエトキシシラン、メチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、n−プロピルトリメトキシシラン、n−プロピルトリエトキシシラン、ブチルトリメトキシシラン、ブチルトリエトキシシラン、ペンチルトリメトキシシラン、ペンチルトリエトキシシラン、アリルトリメトキシシラン、アリルトリエトキシシラン、p-スチリルトリメトキシシラン、p−スチリルトリエトキシシラン等が挙げられ、これらを単独で用いても2種以上を組み合わせて用いてもよい。 Examples of the silicon compound (C) include phenyltrimethoxysilane, phenyltriethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, n-propyltrimethoxysilane, and n-propyltriethoxy. Silane, butyltrimethoxysilane, butyltriethoxysilane, pentyltrimethoxysilane, pentyltriethoxysilane, allyltrimethoxysilane, allyltriethoxysilane, p-styryltrimethoxysilane, p-styryltriethoxysilane, etc. These may be used alone or in combination of two or more.
前記ケイ素化合物(A)、前記ケイ素化合物(B)及び前記ケイ素化合物(C)の混合比としては、前記ケイ素化合物(A)及び前記ケイ素化合物(B)のモル比(Aのモル数:Bのモル数)が1:4〜13:1であり、前記ケイ素化合物(A)及び前記ケイ素化合物(B)の合計に対する前記ケイ素化合物(C)のモル比(A+Bのモル数:Cのモル数)が1:0〜5:2となるように混合することが好ましい。 As a mixing ratio of the silicon compound (A), the silicon compound (B), and the silicon compound (C), a molar ratio of the silicon compound (A) and the silicon compound (B) (number of moles of A: B Mole number) is 1: 4 to 13: 1, and the mole ratio of the silicon compound (C) to the sum of the silicon compound (A) and the silicon compound (B) (number of moles of A + B: number of moles of C). Is preferably mixed so that the ratio is 1: 0 to 5: 2.
前記加水分解反応に用いられる塩基性触媒としては、水酸化カリウム、水酸化ナトリウム、水酸化セシウム等のアルカリ金属水酸化物;テトラメチルアンモニウムヒドロキシド、テトラエチルアンモニウムヒドロキシド、テトラブチルアンモニウムヒドロキシド、ベンジルトリメチルアンモニウムヒドロキシド、ベンジルトリエチルアンモニウムヒドロキシド等の水酸化アンモニウム塩が挙げられる。これらの中でも、触媒活性が高いという観点からテトラメチルアンモニウムヒドロキシドを用いることが好ましい。このような塩基性触媒の量としては、前記ケイ素化合物(A)〜(C)の全質量に対して0.01〜20質量%であることが好ましい。なお、前記塩基性触媒は、通常水溶液として使用される。 The basic catalyst used in the hydrolysis reaction includes alkali metal hydroxides such as potassium hydroxide, sodium hydroxide, cesium hydroxide; tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrabutylammonium hydroxide, benzyl Examples thereof include ammonium hydroxide salts such as trimethylammonium hydroxide and benzyltriethylammonium hydroxide. Among these, it is preferable to use tetramethylammonium hydroxide from the viewpoint of high catalytic activity. The amount of such a basic catalyst is preferably 0.01 to 20% by mass with respect to the total mass of the silicon compounds (A) to (C). The basic catalyst is usually used as an aqueous solution.
前記加水分解反応においては水の存在が必須であるが、これは前記塩基性触媒の水溶液から供給することもできるし、別途水として加えてもよい。水の量は加水分解性基を加水分解するのに十分な質量以上であればよく、前記ケイ素化合物(A)〜(C)の質量から算出される加水分解性基の理論量(質量)の1.0〜1.5倍量であることが好ましい。 In the hydrolysis reaction, the presence of water is essential, but this can be supplied from an aqueous solution of the basic catalyst or added separately as water. The amount of water should just be more than the mass sufficient to hydrolyze a hydrolyzable group, and is the theoretical amount (mass) of the hydrolyzable group calculated from the mass of the silicon compounds (A) to (C). The amount is preferably 1.0 to 1.5 times.
また、前記加水分解反応においては、非極性溶媒及び/又は極性溶媒を用いることが好ましい。このような溶媒としては、非極性溶媒のみを用いると反応系が均一にならず、加水分解反応が十分に進行せずに未反応の加水分解性基が残存する傾向にあるという観点から、非極性溶媒及び極性溶媒の両方を用いるか、極性溶媒のみを用いることが好ましい。前記極性溶媒としては、メタノール、エタノール、2−プロパノール等のアルコール類、或いは他の極性溶媒を用いることができる。中でも、水と溶解性のある炭素数1〜6の低級アルコール類を用いることが好ましく、2−プロパノールを用いることがより好ましい。前記非極性溶媒及び/又は前記極性溶媒の使用量は、前記ケイ素化合物(A)〜(C)の合計モル濃度(モル/リットル:M)が0.01〜10Mとなる範囲であることが好ましい。 In the hydrolysis reaction, it is preferable to use a nonpolar solvent and / or a polar solvent. As such a solvent, if only a nonpolar solvent is used, the reaction system will not be uniform, and the hydrolysis reaction will not proceed sufficiently, and unreacted hydrolyzable groups tend to remain. It is preferable to use both a polar solvent and a polar solvent, or use only a polar solvent. As the polar solvent, alcohols such as methanol, ethanol, 2-propanol, or other polar solvents can be used. Among these, it is preferable to use lower alcohols having 1 to 6 carbon atoms that are soluble in water, and it is more preferable to use 2-propanol. The amount of the nonpolar solvent and / or the polar solvent used is preferably in a range where the total molar concentration (mol / liter: M) of the silicon compounds (A) to (C) is 0.01 to 10M. .
前記加水分解の反応条件としては、反応温度が0〜60℃であることが好ましく、20〜40℃であることがより好ましい。反応温度が前記下限未満の場合には、反応速度が遅くなるため加水分解性基が未反応の状態で残存してしまい、反応時間が長くなる傾向にある。他方、反応温度が前記上限を超える場合には、反応速度が速すぎるために複雑な縮合反応が進行し、結果として加水分解反応生成物の高分子量化が促進される傾向にある。また、前記加水分解の反応条件としては、反応時間が2時間以上であることが好ましい。反応時間が前記下限未満の場合には、加水分解反応が十分に進行せず加水分解性基が未反応の状態で残存してしまう傾向にある。 As reaction conditions for the hydrolysis, the reaction temperature is preferably 0 to 60 ° C, and more preferably 20 to 40 ° C. When the reaction temperature is less than the lower limit, the reaction rate becomes slow, so that the hydrolyzable group remains in an unreacted state, and the reaction time tends to be long. On the other hand, when the reaction temperature exceeds the above upper limit, the reaction rate is too high, so that a complex condensation reaction proceeds, and as a result, high molecular weight of the hydrolysis reaction product tends to be promoted. Moreover, as reaction conditions for the hydrolysis, the reaction time is preferably 2 hours or more. When the reaction time is less than the lower limit, the hydrolysis reaction does not proceed sufficiently and the hydrolyzable group tends to remain in an unreacted state.
前記加水分解反応終了後に加水分解反応生成物を回収する方法としては、先ず、弱酸性溶液を用いて反応溶液を中性若しくは酸性よりにせしめ、次いで、水又は水含有反応溶媒を分離する方法が挙げられる。前記弱酸性溶液としては、硫酸希釈溶液、塩酸希釈溶液、クエン酸溶液、酢酸、塩化アンモニウム水溶液、リンゴ酸溶液、リン酸溶液、シュウ酸溶液等が挙げられる。また、前記水又は水含有反応溶媒を分離する方法としては、反応溶液を食塩水等で洗浄して水分やその他の不純物を十分に除去した後、無水硫酸マグネシウム等の乾燥剤で乾燥させる等の手段が採用できる。 As a method for recovering the hydrolysis reaction product after completion of the hydrolysis reaction, first, the reaction solution is made neutral or acidic using a weakly acidic solution, and then water or a water-containing reaction solvent is separated. Can be mentioned. Examples of the weakly acidic solution include sulfuric acid diluted solution, hydrochloric acid diluted solution, citric acid solution, acetic acid, ammonium chloride aqueous solution, malic acid solution, phosphoric acid solution, oxalic acid solution and the like. In addition, as a method of separating the water or the water-containing reaction solvent, the reaction solution is washed with a saline solution or the like to sufficiently remove moisture and other impurities, and then dried with a drying agent such as anhydrous magnesium sulfate. Means can be employed.
また、前記溶媒として極性溶媒を用いた場合に加水分解反応生成物を回収する方法としては、先ず、極性溶媒を減圧蒸発等により除去し、次いで、非極性溶媒を添加して加水分解反応生成物を溶解せしめた後、上記と同様に洗浄及び乾燥を行う方法が採用できる。また、前記溶媒として非極性溶媒を用いた場合には、非極性溶媒を蒸発等の手段で分離すれば加水分解反応生成物を回収することができるが、該非極性溶媒が次の再縮合反応で使用する非極性溶媒として使用可能であれば、これを分離する必要はない。 In addition, as a method for recovering the hydrolysis reaction product when a polar solvent is used as the solvent, first, the polar solvent is removed by evaporation under reduced pressure, and then a nonpolar solvent is added to the hydrolysis reaction product. A method of washing and drying in the same manner as described above can be employed after dissolving the above. In addition, when a nonpolar solvent is used as the solvent, the hydrolysis reaction product can be recovered by separating the nonpolar solvent by means such as evaporation. However, the nonpolar solvent is used in the next recondensation reaction. If it can be used as the nonpolar solvent to be used, it is not necessary to separate it.
前記加水分解反応においては、加水分解と共に加水分解物の縮合反応が生じるため、前記加水分解反応において前記ケイ素化合物(A)〜(C)における加水分解性基の大部分、好ましくはほぼ全部がOH基に置換され、更に、前記縮合反応によりそのOH基の大部分、好ましくは80%以上が縮合されている。従って、前記加水分解反応生成物には、前記縮合により生成する重縮合物が含有されており、このような重縮合物は、反応条件により異なるが、数平均分子量が500〜10000の樹脂(又はオリゴマー)混合物であり、複数種のかご型、不完全なかご型、はしご型、ランダム型の構造を有するシロキサンからなる。 In the hydrolysis reaction, since a condensation reaction of the hydrolyzate occurs together with the hydrolysis, most of the hydrolyzable groups in the silicon compounds (A) to (C) in the hydrolysis reaction, preferably almost all, are OH. Further, most of the OH groups, preferably 80% or more, are condensed by the condensation reaction. Therefore, the hydrolysis reaction product contains a polycondensate produced by the condensation. Such a polycondensate varies depending on the reaction conditions, but has a number average molecular weight of 500 to 10,000 resin (or Oligomer) mixture, which is composed of siloxanes having a plurality of types of cage-type, incomplete cage-type, ladder-type, and random-type structures.
本発明に係るかご型シルセスキオキサン樹脂の製造方法においては、前記加水分解反応生成物を更に、非極性溶媒及び塩基性触媒の存在下で加熱し、シロキサン結合を縮合(再縮合という)させることにより再縮合物(かご型構造のシロキサン)を選択的に製造することが好ましい。 In the method for producing a cage silsesquioxane resin according to the present invention, the hydrolysis reaction product is further heated in the presence of a nonpolar solvent and a basic catalyst to condense the siloxane bond (referred to as recondensation). Thus, it is preferable to selectively produce a recondensate (a siloxane having a cage structure).
前記非極性溶媒としては、水と溶解性が無いか、又はほとんど無いものであればよいが、炭化水素系溶媒であることが好ましい。前記炭化水素系溶媒としては、トルエン、ベンゼン、キシレン等の沸点の低い非極性溶媒を挙げることができ、中でもトルエンを用いることが好ましい。非極性溶媒の使用量としては、前記加水分解反応生成物を溶解するに足る量であること好ましく、前記加水分解反応生成物の合計質量に対して0.1〜20倍の質量であることが好ましい。 The nonpolar solvent may be any solvent that is not or hardly soluble in water, but is preferably a hydrocarbon solvent. Examples of the hydrocarbon solvent include nonpolar solvents having a low boiling point such as toluene, benzene, xylene, etc. Among them, it is preferable to use toluene. The amount of the nonpolar solvent used is preferably an amount sufficient to dissolve the hydrolysis reaction product, and is 0.1 to 20 times the mass of the total mass of the hydrolysis reaction product. preferable.
前記塩基性触媒としては、前記加水分解反応に使用される塩基性触媒が使用でき、水酸化カリウム、水酸化ナトリウム、水酸化セシウム等のアルカリ金属水酸化物;テトラメルアンモニウムヒヒドロキシド、テトラエチルアンモニウムヒドロキシド、テトラブチルアンモニウムヒドロキシド、ベンジルトリメチルアンモニウムヒドロキシド、ベンジルトリエチルアンモニウムヒドロキシド等の水酸化アンモニウム塩を挙げることができる。中でも、テトラアルキルアンモニウム等の非極性溶媒に可溶性の触媒が好ましい。このような塩基性触媒の量としては、前記加水分解反応生成物の0.01〜20質量%であることが好ましい。 As the basic catalyst, a basic catalyst used in the hydrolysis reaction can be used, and alkali metal hydroxides such as potassium hydroxide, sodium hydroxide and cesium hydroxide; tetramerammonium hyhydroxide, tetraethylammonium Mention may be made of ammonium hydroxide salts such as hydroxide, tetrabutylammonium hydroxide, benzyltrimethylammonium hydroxide and benzyltriethylammonium hydroxide. Among these, a catalyst that is soluble in a nonpolar solvent such as tetraalkylammonium is preferable. The amount of such a basic catalyst is preferably 0.01 to 20% by mass of the hydrolysis reaction product.
前記再縮合反応の反応条件としては、反応温度が90〜200℃であることが好ましく、100〜140℃であることがより好ましい。反応温度が前記下限未満の場合には、再縮合反応をさせるために十分なドライビングフォースが得られず反応が進行しない傾向にある。他方、反応温度が前記上限を超える場合には、ビニル基や(メタ)アクリロイル基等の反応性有機官能基が自己重合反応を起こす可能性があるので、反応温度を抑制するか、重合禁止剤等を添加する必要が生じる傾向にある。また、前記再縮合反応の反応条件としては、反応時間が2〜12時間であることが好ましい。 As reaction conditions for the recondensation reaction, the reaction temperature is preferably 90 to 200 ° C, more preferably 100 to 140 ° C. When the reaction temperature is lower than the lower limit, a sufficient driving force is not obtained to cause the recondensation reaction, and the reaction tends not to proceed. On the other hand, when the reaction temperature exceeds the above upper limit, a reactive organic functional group such as a vinyl group or a (meth) acryloyl group may cause a self-polymerization reaction. Etc. tend to arise. Moreover, as reaction conditions of the said recondensation reaction, it is preferable that reaction time is 2 to 12 hours.
また、再縮合に使用する加水分解反応生成物は前述のように洗浄及び乾燥せしめ、更に濃縮したものを用いることが好ましいが、これらの処理が施されていなくとも用いることができる。また、前記再縮合反応において、水は存在してもよいが積極的に加える必要はなく、塩基性触媒溶液から供給される水分程度に留めることが好ましい。但し、前記加水分解が十分に行われていない場合は、残存する加水分解性基を加水分解するに必要な量以上の水を添加することが好ましい。 The hydrolysis reaction product used for recondensation is preferably washed and dried as described above, and further concentrated, but can be used even if these treatments are not performed. In the recondensation reaction, water may be present, but it is not necessary to add it positively, and it is preferable to keep the amount of water supplied from the basic catalyst solution. However, when the hydrolysis is not sufficiently performed, it is preferable to add more water than is necessary for hydrolyzing the remaining hydrolyzable groups.
本発明に係るかご型シルセスキオキサン樹脂の製造方法においては、前記再縮合反応後に、反応溶液を洗浄して触媒を除去し、ロータリーエバポレーター等により濃縮せしめることにより得られる再縮合生成物中に、官能基の種類や反応条件や加水分解反応生成物の状態によって異なるが、上記式(3)〜(14)等で表わされる複数種の本発明に係るかご型シルセスキオキサン樹脂の混合物が得られる。このような本発明に係るかご型シルセスキオキサン樹脂の含有量は、前記再縮合生成物全体(樹脂混合物)の40質量%以上であることが好ましい。 In the method for producing a cage silsesquioxane resin according to the present invention, after the recondensation reaction, the reaction solution is washed to remove the catalyst, and concentrated in a rotary evaporator or the like. Depending on the type of functional group, the reaction conditions, and the state of the hydrolysis reaction product, a mixture of a plurality of types of cage silsesquioxane resins according to the present invention represented by the above formulas (3) to (14), etc. can get. The content of the cage silsesquioxane resin according to the present invention is preferably 40% by mass or more of the entire recondensation product (resin mixture).
本発明に係るラジカル重合開始剤としては、熱重合開始剤及び光重合開始剤が挙げられる。本発明の硬化性シリコーン樹脂組成物においては、前記ラジカル重合開始剤により前記かご型シルセスキオキサン樹脂のラジカル重合が促進され、優れた強度及び剛性を有するシリコーン樹脂硬化物を得ることができる。 Examples of the radical polymerization initiator according to the present invention include a thermal polymerization initiator and a photopolymerization initiator. In the curable silicone resin composition of the present invention, radical polymerization of the cage silsesquioxane resin is promoted by the radical polymerization initiator, and a cured silicone resin having excellent strength and rigidity can be obtained.
前記熱重合開始剤は、本発明の硬化性シリコーン樹脂組成物を熱硬化せしめる場合に用いる。このような熱重合開始剤としては有機過酸化物が好ましく、前記有機過酸化物としては、ケトンパーオキサイド類、ジアシルキルパーオキサイド類、ハイドロパーオキサイド類、ジアルキルパーオキサイド類、パーオキシケタール類、アルキルパーエステル類、パーカーボネート類等が挙げられる。これらの中でも、触媒活性が高いという観点から、ジアルキルパーオキサイドが好ましい。前記ジアルキルパーオキサイドとしては、具体的には、シクロヘキサノンパーオキサイド、1,1−ビス(t−ヘキサパーオキシ)シクロヘキサノン、クメンハイドロパーオキサイド、ジクミルパーオキサイド、ベンゾイルパーオキサイド、ジイソプロピルパーオキサイド、ジ−t−ブチルパーオキサイド、t−ヘキシルパーオキシイソプロピルモノカーボネート、t−ブチルパーオキシ−2−エチルヘキサノエート等が挙げられる。前記熱重合開始剤としては、これらのうちの1種を単独で使用してもよく、2種類以上を組み合わせて用いてもよい。 The thermal polymerization initiator is used when the curable silicone resin composition of the present invention is thermally cured. Such a thermal polymerization initiator is preferably an organic peroxide, and examples of the organic peroxide include ketone peroxides, diacylalkyl peroxides, hydroperoxides, dialkyl peroxides, peroxyketals, Examples thereof include alkyl peresters and percarbonates. Among these, dialkyl peroxide is preferable from the viewpoint of high catalytic activity. Specific examples of the dialkyl peroxide include cyclohexanone peroxide, 1,1-bis (t-hexaperoxy) cyclohexanone, cumene hydroperoxide, dicumyl peroxide, benzoyl peroxide, diisopropyl peroxide, di- Examples thereof include t-butyl peroxide, t-hexyl peroxyisopropyl monocarbonate, t-butyl peroxy-2-ethylhexanoate and the like. As the thermal polymerization initiator, one of these may be used alone, or two or more may be used in combination.
前記光重合開始剤は、本発明の硬化性シリコーン樹脂組成物を光硬化せしめる場合に用いる。このような光重合開始剤としては、アセトフェノン類、ベンゾイン類、ベンゾフェノン類、チオキサンソン類、アシルホスフィンオキサイド類等の化合物を用いることが好ましい。具体的には、トリクロロアセトフェノン、ジエトキシアセトフェノン、1−フェニル−2−ヒドロキシ−2−メチルプロパン−1−オン、1−ヒドロキシシクロヘキシルフェニルケトン、2−メチル−1−(4−メチルチオフェニル)−2−モルホリノプロパン−1−オン、ベンゾインメチルエーテル、ベンジルジメチルケタール、ベンゾフェノン、チオキサンソン、2,4,6−トリメチルベンゾイルジフェニルホスフィンオキサイド、メチルフェニルグリオキシレート、カンファーキノン、ベンジル、アンスラキノン、ミヒラーケトン等が挙げられる。前記光重合開始剤としては、これらのうちの1種を単独で使用してもよく、2種類以上を組み合わせて用いてもよい。 The said photoinitiator is used when photocuring the curable silicone resin composition of this invention. As such a photopolymerization initiator, it is preferable to use compounds such as acetophenones, benzoins, benzophenones, thioxanthones, and acylphosphine oxides. Specifically, trichloroacetophenone, diethoxyacetophenone, 1-phenyl-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4-methylthiophenyl) -2 -Morpholinopropan-1-one, benzoin methyl ether, benzyldimethyl ketal, benzophenone, thioxanthone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, methylphenylglyoxylate, camphorquinone, benzyl, anthraquinone, Michler's ketone, etc. It is done. As the photopolymerization initiator, one of these may be used alone, or two or more may be used in combination.
本発明に係るラジカル重合開始剤としては、前記熱重合開始剤又は前記光重合開始剤をそれぞれ単独で使用してもよく、両方を組み合わせて用いてもよい。このようなラジカル重合開始剤の含有量としては、本発明の硬化性シリコーン樹脂組成物において0.01〜10質量%であることが好ましく、0.05〜5質量%であることがより好ましい。含有量が前記下限未満の場合には、組成物の硬化が不十分となるため得られる成形体の強度及び剛性が低くなる傾向にあり、他方、前記上限を超える場合には、成形体が着色するといった問題が生じる傾向がある。 As the radical polymerization initiator according to the present invention, the thermal polymerization initiator or the photopolymerization initiator may be used alone, or both may be used in combination. The content of such radical polymerization initiator is preferably 0.01 to 10% by mass and more preferably 0.05 to 5% by mass in the curable silicone resin composition of the present invention. When the content is less than the lower limit, the composition is insufficiently cured, and thus the strength and rigidity of the obtained molded product tend to be low. On the other hand, when the content exceeds the upper limit, the molded product is colored. Tend to cause problems.
本発明の硬化性シリコーン樹脂組成物としては、(メタ)アクリロイル基を有する不飽和化合物を更に含有することが好ましい。このような不飽和化合物を含有することにより、シリコーン樹脂組成物の粘度や樹脂剛性、強度等の所望の物性を有する硬化物を得ることが可能となる。 The curable silicone resin composition of the present invention preferably further contains an unsaturated compound having a (meth) acryloyl group. By containing such an unsaturated compound, it becomes possible to obtain a cured product having desired physical properties such as viscosity, resin rigidity, and strength of the silicone resin composition.
前記不飽和化合物としては、前記かご型シルセスキオキサン樹脂とラジカル共重合可能な(メタ)アクリロイル基を有していればよく、特に限定されないが、硬化性シリコーン樹脂組成物の粘度が高くなると硬化物の製造が困難となるという観点から、構造単位の繰り返し数が2〜20程度の重合体である反応性のオリゴマー、低分子量及び/又は低粘度の反応性モノマー等が好ましい。 The unsaturated compound is not particularly limited as long as it has a (meth) acryloyl group capable of radical copolymerization with the cage silsesquioxane resin, and when the viscosity of the curable silicone resin composition is increased. From the viewpoint that it is difficult to produce a cured product, a reactive oligomer, a low molecular weight and / or low viscosity reactive monomer, etc., which is a polymer having a structural unit having about 2 to 20 repeating units, is preferred.
前記反応性のオリゴマーとしては、エポキシアクリレート、エポキシ化アクリレート、ウレタンアクリレート、不飽和ポリエステル、ポリエステルアクリレート、ポリエーテルアクリレート、ビニルアクリレート、ポリエン/チオール、シリコーンアクリレート、ポリスチリルエチルメタクリレート等が挙げられる。また、前記反応性モノマーとしては、ブチルアクリレート、2−エチルヘキシルアクリレート、n−ヘキシルアクリレート、シクロヘキシルアクリレート、n−デシルアクリレート、イソボニルアクリレート、ジシクロペンテニロキシエチルアクリレート、フェノキシエチルアクリレート、トリフルオロエチルメタクリレート等の単官能モノマー;ジシクロペンタニルジアクリレート、トリプロピレングリコールジアクリレート、1,6−ヘキサンジオールジアクリレート、1,9−ノナンジオールアクリレート、ジメチロールトリシクロデカンジアクリレート、ビスフェノールAジグリシジルエーテルジアクリレート、テトラエチレングリコールジアクリレート、ヒドロキシピバリン酸ネオペンチルグリコールジアクリレート、トリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、ジペンタエリスリトールヘキサアクリレート等の多官能モノマーが挙げられる。前記不飽和化合物としては、これらのうちの1種を単独で使用しても2種以上を組み合わせて用いてもよい。 Examples of the reactive oligomer include epoxy acrylate, epoxidized acrylate, urethane acrylate, unsaturated polyester, polyester acrylate, polyether acrylate, vinyl acrylate, polyene / thiol, silicone acrylate, and polystyrylethyl methacrylate. Examples of the reactive monomer include butyl acrylate, 2-ethylhexyl acrylate, n-hexyl acrylate, cyclohexyl acrylate, n-decyl acrylate, isobornyl acrylate, dicyclopentenyloxyethyl acrylate, phenoxyethyl acrylate, trifluoroethyl methacrylate. Monofunctional monomers such as dicyclopentanyl diacrylate, tripropylene glycol diacrylate, 1,6-hexanediol diacrylate, 1,9-nonanediol acrylate, dimethylol tricyclodecane diacrylate, bisphenol A diglycidyl ether di Acrylate, tetraethylene glycol diacrylate, hydroxypivalate neopentyl glycol diacrylate, trimethylo Le propane triacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, include polyfunctional monomers such as dipentaerythritol hexaacrylate. As the unsaturated compound, one of these may be used alone, or two or more may be used in combination.
このような不飽和化合物を含有する場合、その含有量としては、前記かご型シルセスキオキサン樹脂に対する質量比(かご型シルセスキオキサン樹脂:不飽和化合物)が10:90〜80:20となる質量であることが好ましい。含有量が前記下限未満の場合には、シリコーン樹脂組成物の粘度が増大して成形物の製造が困難となる傾向にあり、他方、前記上限を超える場合には、シリコーン樹脂硬化物において、透明性、低熱膨張性、低吸水性、相溶性等の物性が低下する傾向にある。 When such an unsaturated compound is contained, the content thereof is 10:90 to 80:20 in which the mass ratio to the cage silsesquioxane resin (cage silsesquioxane resin: unsaturated compound) is 10:90 to 80:20. Is preferable. If the content is less than the lower limit, the viscosity of the silicone resin composition tends to increase, making it difficult to produce a molded product. On the other hand, if the content exceeds the upper limit, the cured silicone resin is transparent. Properties, low thermal expansion, low water absorption, compatibility and the like tend to be reduced.
本発明の硬化性シリコーン樹脂組成物としては、更に、本発明の効果を阻害しない範囲において、他の樹脂を含有することができる。 The curable silicone resin composition of the present invention can further contain other resins as long as the effects of the present invention are not impaired.
前記他の樹脂としては、例えば、前記かご型シルセスキオキサン樹脂の製造において副反応物として生成したラダー型シロキサン及びンダム型シロキサン等が挙げられる。このような樹脂を含有する場合、その含有量は、前記本発明に係るかご型シルセスキオキサン樹脂の含有量(質量)の合計をa、前記不飽和化合物の含有量(質量)をb、前記ラダー型シロキサン及びランダム型シロキサン等の含有量(質量)をcとすると、下記式:
10/90 ≦ a/(b+c) ≦ 80/20
で表わされる条件を満たすことが好ましく、下記式:
20/80 ≦ a/(b+c) ≦ 75/25
で表わされる条件を満たすことがより好ましい。前記かご型シルセスキオキサン樹脂の含有量が前記下限未満である場合にはシリコーン樹脂硬化物の透明性、低熱膨張性、低吸水性、相溶性等の物性が低下する傾向にある。他方、前記上限を超える場合には、シリコーン樹脂組成物の粘度が増大して成形物の製造が困難となる傾向にある。Examples of the other resins include ladder-type siloxanes and random-type siloxanes produced as by-products in the production of the cage silsesquioxane resin. When such a resin is contained, the content is a sum of the contents (mass) of the cage silsesquioxane resin according to the present invention, b is the content (mass) of the unsaturated compound, When the content (mass) of the ladder type siloxane and the random type siloxane is c, the following formula:
10/90 ≦ a / (b + c) ≦ 80/20
It is preferable to satisfy the condition represented by the following formula:
20/80 ≦ a / (b + c) ≦ 75/25
It is more preferable that the condition represented by When the content of the cage silsesquioxane resin is less than the lower limit, physical properties such as transparency, low thermal expansion, low water absorption, and compatibility of the cured silicone resin tend to be lowered. On the other hand, when the said upper limit is exceeded, it exists in the tendency for the viscosity of a silicone resin composition to increase, and manufacture of a molded article to become difficult.
また、本発明の硬化性シリコーン樹脂組成物としては、更に、本発明の効果を阻害しない範囲において、シリコーン樹脂硬化物の物性を改良するため及び/又はラジカル重合を促進するため等の目的で、熱重合促進剤、光開始助剤、鋭感剤等を含有することができる。さらに、本発明の硬化性シリコーン樹脂組成物としては、有機/無機フィラー、無機質充填剤、可塑剤、難燃剤、熱安定剤、酸化防止剤、光安定剤、紫外線吸収剤、滑剤、帯電防止剤、離型剤、発泡剤、着色剤、架橋剤、分散助剤、樹脂成分等の各種添加剤を含有していてもよい。 Further, as the curable silicone resin composition of the present invention, in order to further improve the physical properties of the cured silicone resin and / or to promote radical polymerization, as long as the effects of the present invention are not impaired, A thermal polymerization accelerator, a photoinitiator aid, a sharpener, and the like can be contained. Further, the curable silicone resin composition of the present invention includes an organic / inorganic filler, an inorganic filler, a plasticizer, a flame retardant, a heat stabilizer, an antioxidant, a light stabilizer, an ultraviolet absorber, a lubricant, and an antistatic agent. Further, various additives such as a mold release agent, a foaming agent, a colorant, a crosslinking agent, a dispersion aid, and a resin component may be contained.
次いで、本発明のシリコーン樹脂硬化物について説明する。本発明のシリコーン樹脂硬化物は、前記硬化性シリコーン樹脂組成物をラジカル重合させて得られたものであることを特徴とするものである。前記ラジカル重合させる方法としては、加熱によって熱硬化せしめる方法及び光照射によって光硬化せしめる方法が挙げられる。本発明においては、前記熱硬化及び前記光硬化のいずれか1種の方法を単独で用いてもよく、両方の方法を組み合わせて用いてもよい。 Next, the cured silicone resin of the present invention will be described. The cured silicone resin of the present invention is obtained by radical polymerization of the curable silicone resin composition. Examples of the radical polymerization method include a method of thermosetting by heating and a method of photocuring by light irradiation. In the present invention, any one of the thermosetting and photocuring methods may be used alone, or both methods may be used in combination.
前記熱硬化の条件としては、前記熱重合開始剤や熱重合促進剤等を適宜選択することにより、その反応温度は室温(25℃程度)〜200℃程度、反応時間は0.5〜10時間程度の広い範囲から選択することができる。また、本発明においては、前記硬化性シリコーン樹脂組成物を金型内やスチールベルト上で重合硬化させることで所望の形状の成形体とすることができる。このような成形体を得る方法としては、射出成形、押出成形、圧縮成形、トランスファー成形、カレンダー成形、キャスト(注型)成形といった一般的な成形加工方法の全てを適用することができる。 As the thermosetting conditions, by appropriately selecting the thermal polymerization initiator, thermal polymerization accelerator, etc., the reaction temperature is room temperature (about 25 ° C.) to about 200 ° C., and the reaction time is 0.5 to 10 hours. A wide range of degrees can be selected. Moreover, in this invention, it can be set as the molded object of a desired shape by carrying out the polymerization hardening of the said curable silicone resin composition in a metal mold | die or on a steel belt. As a method for obtaining such a molded body, all of general molding methods such as injection molding, extrusion molding, compression molding, transfer molding, calendar molding, and cast (casting) molding can be applied.
前記光硬化の方法としては、例えば、波長10〜400nmの紫外線や波長400〜700nmの可視光線を1〜1200秒間程度前記硬化性シリコーン樹脂組成物に照射する方法が挙げられる。前記波長は特に制限されないが、波長200〜400nmの近紫外線であることが好ましい。前記紫外線の発生源として用いられるランプとしては、例えば、低圧水銀ランプ(出力:0.4〜4W/cm)、高圧水銀ランプ(40〜160W/cm)、超高圧水銀ランプ(173〜435W/cm)、メタルハライドランプ(80〜160W/cm)等が挙げられ、用いる前記光重合開始剤、前記光開始助剤及び前記鋭感剤の種類に応じて適宜選択することができる。本発明においては、例えば、前記硬化性シリコーン樹脂組成物を石英ガラス等の透明素材で構成された型内に注入し、ラジカル重合により硬化せしめた後、型から脱型させることで所望の形状の成形体を製造する方法や、前記スチールベルト上で硬化せしめる方法等により所望の形状の成形体を得ることができる。 Examples of the photocuring method include a method of irradiating the curable silicone resin composition with ultraviolet rays having a wavelength of 10 to 400 nm or visible rays having a wavelength of 400 to 700 nm for about 1 to 1200 seconds. The wavelength is not particularly limited, but is preferably near ultraviolet light having a wavelength of 200 to 400 nm. Examples of the lamp used as the ultraviolet ray generation source include a low pressure mercury lamp (output: 0.4 to 4 W / cm), a high pressure mercury lamp (40 to 160 W / cm), and an ultrahigh pressure mercury lamp (173 to 435 W / cm). ), Metal halide lamps (80 to 160 W / cm), and the like, and can be appropriately selected depending on the types of the photopolymerization initiator, the photoinitiator auxiliary, and the sharpening agent to be used. In the present invention, for example, the curable silicone resin composition is poured into a mold made of a transparent material such as quartz glass, cured by radical polymerization, and then removed from the mold to obtain a desired shape. A molded body having a desired shape can be obtained by a method of manufacturing a molded body, a method of curing on the steel belt, or the like.
以下、実施例及び比較例に基づいて本発明をより具体的に説明するが、本発明は以下の実施例に限定されるものではない。なお、各合成例において、GPC、1H−NMRの測定、質量分析はそれぞれ以下に示す方法により行った。EXAMPLES Hereinafter, although this invention is demonstrated more concretely based on an Example and a comparative example, this invention is not limited to a following example. In each synthesis example, GPC, 1 H-NMR measurement, and mass spectrometry were performed by the following methods.
(GPC(ゲルパーミエーションクロマトグラフィ))
ゲルパーミエーションクロマトグラフィ(GPC)(装置名:HLC−8320GPC(東ソー社製)、溶媒:THF、カラム:超高速セミミクロSECカラム SuperH
シリーズ、温度:40℃、速度:0.6ml/min)を用いて行った。数平均分子量及び分子量分布(重量平均分子量/数平均分子量(Mw/Mn))は標準ポリスチレン(商品名:TSK−GEL、東ソー社製)による換算値として求めた。(GPC (gel permeation chromatography))
Gel permeation chromatography (GPC) (device name: HLC-8320GPC (manufactured by Tosoh Corporation), solvent: THF, column: ultra-high-speed semi-micro SEC column SuperH
Series, temperature: 40 ° C., speed: 0.6 ml / min). The number average molecular weight and molecular weight distribution (weight average molecular weight / number average molecular weight (Mw / Mn)) were determined as converted values using standard polystyrene (trade name: TSK-GEL, manufactured by Tosoh Corporation).
(1H−NMRの測定)
1H−NMR測定器(装置名:JNM−ECA400(JEOL社製)、溶媒:重クロロホルム、温度:23℃、400MHz)を用いて測定した。得られた各構成単位のピークの積分値を求め、これらの比からビニル基の数と(メタ)アクリロイル基の数とのモル比を決定した。(Measurement of 1 H-NMR)
The measurement was performed using a 1 H-NMR measuring instrument (device name: JNM-ECA400 (manufactured by JEOL), solvent: deuterated chloroform, temperature: 23 ° C., 400 MHz). The integrated value of the peak of each structural unit obtained was determined, and the molar ratio between the number of vinyl groups and the number of (meth) acryloyl groups was determined from these ratios.
(質量分析)
エレクトロスプレーイオン化質量分析(ESI−MS)装置(装置名:LC装置;Separation module 2690(Waters社製)、MS装置;ZMD4000(Micromass社製)、測定条件:エレクトロスプレーイオン化法、キャピラリ電圧:3.5kV、コーン電圧:+30V)を用いて測定した。(Mass spectrometry)
Electrospray ionization mass spectrometry (ESI-MS) apparatus (device name: LC apparatus; Separation module 2690 (manufactured by Waters), MS apparatus; ZMD4000 (manufactured by Micromass), measurement conditions: electrospray ionization method, capillary voltage: 3. 5 kV, cone voltage: +30 V).
(合成例I)
先ず、撹拌機、滴下漏斗、温度計を備えた反応容器に、溶媒として2−プロパノール(IPA)120ml、トルエン150ml、塩基性触媒として5%テトラメチルアンモニウムヒドロキシド水溶液(TMAH水溶液)30.0mlを入れた。次いで、ビニルトリメトキシシラン(KBM−1003、信越化学工業株式会社製)53.36g(0.36mol)及び3−メタクリロキシプロピルトリメトキシシラン(SZ−6300、東レ・ダウコーニング・シリコーン株式会社製)29.80g(0.12mol)を混合して滴下漏斗に入れ、前記反応容器内に、撹拌しながら室温(約25℃)で30分かけて滴下した。滴下終了後、加熱することなく2時間撹拌した。攪拌後の反応容器内の溶液(反応溶液)をクエン酸水溶液で中性(pH7)に調整した後、純水を添加して有機相と水相とに分液し、有機相に無水硫酸マグネシウム10gを添加して脱水した。前記無水硫酸マグネシウムを濾別し、ロータリーエバポレーターにより濃縮することで加水分解反応生成物(シルセスキオキサン)を48.49g得た。この加水分解反応生成物は種々の有機溶剤に可溶な無色の粘性液体であった。(Synthesis Example I)
First, in a reaction vessel equipped with a stirrer, a dropping funnel and a thermometer, 120 ml of 2-propanol (IPA) as a solvent, 150 ml of toluene, and 30.0 ml of a 5% tetramethylammonium hydroxide aqueous solution (TMAH aqueous solution) as a basic catalyst. I put it in. Next, 53.36 g (0.36 mol) of vinyltrimethoxysilane (KBM-1003, manufactured by Shin-Etsu Chemical Co., Ltd.) and 3-methacryloxypropyltrimethoxysilane (SZ-6300, manufactured by Toray Dow Corning Silicone Co., Ltd.) 29.80 g (0.12 mol) was mixed, put into a dropping funnel, and dropped into the reaction vessel over 30 minutes at room temperature (about 25 ° C.) with stirring. After completion of dropping, the mixture was stirred for 2 hours without heating. The solution (reaction solution) in the reaction vessel after stirring is adjusted to neutral (pH 7) with a citric acid aqueous solution, and then pure water is added to separate the organic phase and the aqueous phase, and anhydrous magnesium sulfate is added to the organic phase. 10 g was added and dehydrated. The anhydrous magnesium sulfate was filtered off and concentrated by a rotary evaporator to obtain 48.49 g of a hydrolysis reaction product (silsesquioxane). This hydrolysis reaction product was a colorless viscous liquid soluble in various organic solvents.
次いで、撹拌機、ディーンスターク、冷却管を備えた反応容器に、上記で得られた加水分解反応生成物45.0g、トルエン270ml、10%TMAH水溶液6.5mlを入れ、これを徐々に加熱して水を留去した。更に130℃まで加熱してトルエンの還流温度で再縮合反応を行った。なお、このときの温度は106℃であった。トルエンの還流後、2時間撹拌した後、反応を終了とした。攪拌後の反応容器内の溶液(反応溶液)をクエン酸水溶液で中性(pH7)に調整した後、純水を添加して有機相と水相とに分液し、有機相に無水硫酸マグネシウム10gを添加して脱水した。前記無水硫酸マグネシウムを濾別し、ロータリーエバポレーターにより濃縮することで樹脂混合物Iを39.15g得た。得られた樹脂混合物Iは種々の有機溶剤に可溶な無色の粘性液体であった。 Next, 45.0 g of the hydrolysis reaction product obtained above, 270 ml of toluene, and 6.5 ml of 10% TMAH aqueous solution were placed in a reaction vessel equipped with a stirrer, Dean Stark, and a cooling tube. Water was distilled off. Further, the mixture was heated to 130 ° C. to carry out a recondensation reaction at the reflux temperature of toluene. The temperature at this time was 106 ° C. After refluxing toluene, the reaction was terminated after stirring for 2 hours. The solution (reaction solution) in the reaction vessel after stirring is adjusted to neutral (pH 7) with a citric acid aqueous solution, and then pure water is added to separate the organic phase and the aqueous phase, and anhydrous magnesium sulfate is added to the organic phase. 10 g was added and dehydrated. The anhydrous magnesium sulfate was filtered off and concentrated by a rotary evaporator to obtain 39.15 g of a resin mixture I. The obtained resin mixture I was a colorless viscous liquid soluble in various organic solvents.
得られた樹脂混合物IのGPCの結果を示すクロマトグラムを図1に示す。この結果から、一般式(1)における(n+m)が14より大きいかご型シルセスキオキサン樹脂、ラダー型シロキサン、及びランダム型シロキサンを含むピーク1(Mw=4,959、Mw/Mn=1.23)と、前記(n+m)が14以下であるかご型シルセスキオキサン樹脂を含むピーク2(Mw=1,322、Mw/Mn=1.11)とが検出され、得られた樹脂混合物Iは次式(I):
[CH2=CHSiO3/2]n[CH2=C(CH3)COOC3H6SiO3/2]m・・・(I)
で表わされるかご型シルセスキオキサン樹脂を含む樹脂混合物であることが確認された。The chromatogram which shows the result of GPC of the obtained resin mixture I is shown in FIG. From this result, peak 1 (Mw = 4,959, Mw / Mn = 1.M) including a cage-type silsesquioxane resin, ladder-type siloxane, and random-type siloxane in which (n + m) in general formula (1) is greater than 14. 23) and peak 2 (Mw = 1,322, Mw / Mn = 1.11) containing a cage-type silsesquioxane resin in which (n + m) is 14 or less, and the resulting resin mixture I Is the following formula (I):
[CH 2 = CHSiO 3/2 ] n [CH 2 = C (CH 3 ) COOC 3 H 6 SiO 3/2 ] m (I)
It was confirmed that it is a resin mixture containing a cage silsesquioxane resin represented by
また、得られた樹脂混合物Iの1H−NMRスペクトルを示すグラフを図2A〜図2Bに示す。この結果から、6.1〜5.7ppmにビニル基のピークが、並びに、5.5ppmにメタアクリロイル基のピークが検出され、これらのピーク積分比はメタアクリロイル基1に対してビニル基2.96であり、得られたかご型シルセスキオキサン樹脂中のビニル基の数とメタアクリロイル基の数との比(全ビニル基数:全メタアクリロイル基数)は2.96:1であることが確認された。なお、この比は仕込み時のビニル基とメタアクリロイル基とのモル比と同比率の官能基を有する縮合物が得られていることを示す。Further, FIG. 2A~ Figure 2B a graph showing the 1 H-NMR spectrum of the resulting resin mixture I. From this result, a peak of vinyl group was detected at 6.1 to 5.7 ppm, and a peak of methacryloyl group was detected at 5.5 ppm, and the peak integration ratio of vinyl group 2 with respect to methacryloyl group 1 was 2. It was confirmed that the ratio of the number of vinyl groups to the number of methacryloyl groups in the resulting cage-type silsesquioxane resin (total number of vinyl groups: total number of methacryloyl groups) was 2.96: 1. It was done. In addition, this ratio shows that the condensate which has a functional group of the same ratio as the molar ratio of the vinyl group and methacryloyl group at the time of preparation is obtained.
さらに、得られた樹脂混合物IのESI−MSスペクトルを示すグラフを図3に示す。また、表1には、検出された主なピーク(m/z)と、それに相当する上記式(I)におけるn及びmの数値をまとめて示す。なお、検出されたピーク(m/z)は、上記式(I)(但し、nが1〜12であり、mが6〜14であり、nとmとの和が8〜14である。)で表されるかご型シルセスキオキサン樹脂の分子量に、アンモニウムイオンが付加した値である。この質量分析結果からも、ビニル基とメタアクリロイル基とを有するかご型シルセスキオキサン樹脂が得られたことが確認された。 Furthermore, the graph which shows the ESI-MS spectrum of the obtained resin mixture I is shown in FIG. Table 1 shows the detected main peaks (m / z) and the corresponding numerical values of n and m in the above formula (I). The detected peak (m / z) is the above formula (I) (where n is 1-12, m is 6-14, and the sum of n and m is 8-14). ) Is a value obtained by adding ammonium ions to the molecular weight of the cage silsesquioxane resin. From this mass spectrometry result, it was confirmed that a cage-type silsesquioxane resin having a vinyl group and a methacryloyl group was obtained.
(合成例II)
2−プロパノール(IPA)を110ml、トルエンを230mlとし、ビニルトリメトキシシランを70.76g(0.48mol)、3−メタクリロキシプロピルトリメトキシシランを16.94g(0.07mol)としたこと以外は合成例Iと同様にして加水分解反応生成物(シルセスキオキサン)を47.60g得た。この加水分解反応生成物は種々の有機溶剤に可溶な無色の粘性液体であった。(Synthesis Example II)
Except for 110 ml of 2-propanol (IPA) and 230 ml of toluene, 70.76 g (0.48 mol) of vinyltrimethoxysilane, and 16.94 g (0.07 mol) of 3-methacryloxypropyltrimethoxysilane. In the same manner as in Synthesis Example I, 47.60 g of a hydrolysis reaction product (silsesquioxane) was obtained. This hydrolysis reaction product was a colorless viscous liquid soluble in various organic solvents.
次いで、上記で得られた加水分解反応生成物を43.0g用い、トルエンを260mlとしたこと以外は合成例Iと同様にして樹脂混合物IIを36.55g得た。得られた樹脂混合物IIは種々の有機溶剤に可溶な無色の粘性液体であった。 Next, 36.55 g of a resin mixture II was obtained in the same manner as in Synthesis Example I except that 43.0 g of the hydrolysis reaction product obtained above was used and toluene was changed to 260 ml. The obtained resin mixture II was a colorless viscous liquid soluble in various organic solvents.
得られた樹脂混合物IIのGPCの結果を示すクロマトグラムを図4に示す。この結果から、一般式(1)における(n+m)が14より大きいかご型シルセスキオキサン樹脂、ラダー型シロキサン、及びランダム型シロキサンを含むピーク1(Mw=5,581、Mw/Mn=1.39)と、前記(n+m)が14以下であるかご型シルセスキオキサン樹脂を含むピーク2(Mw=1,171、Mw/Mn=1.11)とが検出され、得られた樹脂混合物IIは上記式(I)で表わされるかご型シルセスキオキサン樹脂を含む樹脂混合物であることが確認された。また、得られた樹脂混合物IIの1H−NMRスペクトルから求めたかご型シルセスキオキサン樹脂中の全ビニル基数:全メタアクリロイル基数は6.89:1であった。A chromatogram showing the results of GPC of the obtained resin mixture II is shown in FIG. From this result, peak 1 (Mw = 5,581, Mw / Mn = 1.M) including a cage-type silsesquioxane resin, ladder-type siloxane, and random-type siloxane in which (n + m) in general formula (1) is greater than 14. 39) and peak 2 (Mw = 1,171, Mw / Mn = 1.11) containing a cage-type silsesquioxane resin in which (n + m) is 14 or less, and the obtained resin mixture II Was confirmed to be a resin mixture containing a cage silsesquioxane resin represented by the above formula (I). Moreover, the total number of vinyl groups: total number of methacryloyl groups in the cage silsesquioxane resin determined from the 1 H-NMR spectrum of the obtained resin mixture II was 6.89: 1.
(合成例III)
2−プロパノール(IPA)を80ml、トルエンを160mlとし、ビニルトリメトキシシランを28.68g(0.19mol)、3−メタクリロキシプロピルトリメトキシシランを48.06g(0.19mol)としたこと以外は合成例Iと同様にして加水分解反応生成物(シルセスキオキサン)を48.68g得た。この加水分解反応生成物は種々の有機溶剤に可溶な無色の粘性液体であった。次いで、上記で得られた加水分解反応生成物を45.0g用いたこと以外は合成例Iと同様にして樹脂混合物IIIを38.33g得た。得られた樹脂混合物IIIは種々の有機溶剤に可溶な無色の粘性液体であった。(Synthesis Example III)
Except for 80 ml of 2-propanol (IPA) and 160 ml of toluene, 28.68 g (0.19 mol) of vinyltrimethoxysilane and 48.06 g (0.19 mol) of 3-methacryloxypropyltrimethoxysilane. In the same manner as in Synthesis Example I, 48.68 g of a hydrolysis reaction product (silsesquioxane) was obtained. This hydrolysis reaction product was a colorless viscous liquid soluble in various organic solvents. Next, 38.33 g of a resin mixture III was obtained in the same manner as in Synthesis Example I except that 45.0 g of the hydrolysis reaction product obtained above was used. The obtained resin mixture III was a colorless viscous liquid soluble in various organic solvents.
得られた樹脂混合物IIIのGPCの結果を示すクロマトグラムを図5に示す。この結果から、一般式(1)における(n+m)が14より大きいかご型シルセスキオキサン樹脂、ラダー型シロキサン、及びランダム型シロキサンを含むピーク1(Mw=6,047、Mw/Mn=1.05)と前記(n+m)が14以下であるかご型シルセスキオキサン樹脂を含むピーク2(Mw=1,891、Mw/Mn=1.41)が得られ、得られた樹脂混合物IIIは上記式(I)で表わされるかご型シルセスキオキサン樹脂を含む樹脂混合物であることが確認された。また、得られた樹脂混合物IIIの1H−NMRスペクトルから求めたかご型シルセスキオキサン樹脂中の全ビニル基数:全メタアクリロイル基数は0.98:1であった。A chromatogram showing the results of GPC of the obtained resin mixture III is shown in FIG. From this result, the peak 1 (Mw = 6,047, Mw / Mn = 1...) Including a cage-type silsesquioxane resin, ladder-type siloxane, and random-type siloxane with (n + m) greater than 14 in the general formula (1). 05) and peak 2 (Mw = 1,891, Mw / Mn = 1.41) containing a cage silsesquioxane resin in which (n + m) is 14 or less are obtained, and the obtained resin mixture III is the above It was confirmed that this was a resin mixture containing a cage silsesquioxane resin represented by the formula (I). Further, the total number of vinyl groups: the total number of methacryloyl groups in the cage silsesquioxane resin determined from the 1 H-NMR spectrum of the obtained resin mixture III was 0.98: 1.
(合成例IV)
2−プロパノール(IPA)を100ml、トルエンを200mlとし、ビニルトリメトキシシランを44.36g(0.30mol)、3−メタクリロキシプロピルトリメトキシシランを29.73g(0.12mol)とし、更にエチルトリメトキシシラン(LS−890、信越化学工業株式会社製)8.99g(0.06mol)を混合して滴下漏斗に入れたこと以外は合成例Iと同様にして加水分解反応生成物(シルセスキオキサン)を47.09g得た。この加水分解反応生成物は種々の有機溶剤に可溶な無色の粘性液体であった。(Synthesis Example IV)
100 ml of 2-propanol (IPA) and 200 ml of toluene, 44.36 g (0.30 mol) of vinyltrimethoxysilane, 29.73 g (0.12 mol) of 3-methacryloxypropyltrimethoxysilane, Hydrolysis reaction product (Silsesukioki) in the same manner as in Synthesis Example I except that 8.99 g (0.06 mol) of methoxysilane (LS-890, manufactured by Shin-Etsu Chemical Co., Ltd.) was mixed and placed in the dropping funnel. Sun) was obtained. This hydrolysis reaction product was a colorless viscous liquid soluble in various organic solvents.
次いで、上記で得られた加水分解反応生成物を45.0g用い、トルエンの還流温度が105℃であったこと以外は合成例Iと同様にして樹脂混合物IVを38.20g得た。得られた樹脂混合物IVは種々の有機溶剤に可溶な無色の粘性液体であった。 Then, 45.0 g of the hydrolysis reaction product obtained above was used, and 38.20 g of a resin mixture IV was obtained in the same manner as in Synthesis Example I except that the reflux temperature of toluene was 105 ° C. The obtained resin mixture IV was a colorless viscous liquid soluble in various organic solvents.
得られた樹脂混合物IVのGPCの結果を示すクロマトグラムを図6に示す。この結果から、一般式(1)における(n+m+j)が14より大きいかご型シルセスキオキサン樹脂、ラダー型シロキサン、及びランダム型シロキサンを含むピーク1(Mw=5,593、Mw/Mn=1.28)と、前記(n+m+j)が14以下であるかご型シルセスキオキサン樹脂を含むピーク2(Mw=1,344、Mw/Mn=1.11)とが検出され、得られた樹脂混合物IVは次式(IV):
[CH2=CHSiO3/2]n[CH2=C(CH3)COOC3H6SiO3/2]m[CH3CH2SiO3/2]j・・・(IV)
で表わされるかご型シルセスキオキサン樹脂を含む樹脂混合物であることが確認された。また、得られた樹脂混合物IVの1H−NMRスペクトルから求めたかご型シルセスキオキサン樹脂中の全ビニル基数:全メタアクリロイル基数は4.96:2であった。A chromatogram showing the results of GPC of the obtained resin mixture IV is shown in FIG. From this result, peak 1 (Mw = 5,593, Mw / Mn = 1...) Including cage-type silsesquioxane resin, ladder-type siloxane, and random-type siloxane in which (n + m + j) in general formula (1) is greater than 14. 28) and peak 2 (Mw = 1,344, Mw / Mn = 1.11) containing a cage-type silsesquioxane resin in which (n + m + j) is 14 or less, and the obtained resin mixture IV Is the following formula (IV):
[CH 2 = CHSiO 3/2 ] n [CH 2 = C (CH 3 ) COOC 3 H 6 SiO 3/2 ] m [CH 3 CH 2 SiO 3/2 ] j (IV)
It was confirmed that it is a resin mixture containing a cage silsesquioxane resin represented by Further, the total number of vinyl groups: the total number of methacryloyl groups in the cage silsesquioxane resin determined from the 1 H-NMR spectrum of the obtained resin mixture IV was 4.96: 2.
(合成例V)
2−プロパノール(IPA)を60ml、トルエンを120mlとし、3−メタクリロキシプロピルトリメトキシシランを69.27g(0.28mol)とし、ビニルトリメトキシシランを用いなかったこと以外は合成例Iと同様にして加水分解反応生成物(シルセスキオキサン)を48.36g得た。この加水分解反応生成物は種々の有機溶剤に可溶な無色の粘性液体であった。(Synthesis Example V)
60 ml of 2-propanol (IPA), 120 ml of toluene, 69.27 g (0.28 mol) of 3-methacryloxypropyltrimethoxysilane, and the same as in Synthesis Example I except that vinyltrimethoxysilane was not used. As a result, 48.36 g of a hydrolysis reaction product (silsesquioxane) was obtained. This hydrolysis reaction product was a colorless viscous liquid soluble in various organic solvents.
次いで、上記で得られた加水分解反応生成物を45.0g用い、トルエンを260mlとしたこと以外は合成例Iと同様にして樹脂混合物Vを41.4g得た。得られた樹脂混合物Vは種々の有機溶剤に可溶な無色の粘性液体であった。 Subsequently, 41.4 g of the resin mixture V was obtained in the same manner as in Synthesis Example I except that 45.0 g of the hydrolysis reaction product obtained above was used and 260 ml of toluene was used. The obtained resin mixture V was a colorless viscous liquid soluble in various organic solvents.
得られた樹脂混合物Vについて、GPCの結果を示すクロマトグラムを図7に示す。この結果から、全メタクリロキシプロピルかご型シルセスキオキサン樹脂を含むピーク1(Mw=1,769、Mw/Mn=1.08)が検出され、得られた樹脂混合物Vは次式(V):
[CH2=C(CH3)COOC3H6SiO3/2]m・・・(V)
で表わされるかご型シルセスキオキサン樹脂を含む樹脂混合物であることが確認された。For the obtained resin mixture V, a chromatogram showing the results of GPC is shown in FIG. From this result, peak 1 (Mw = 1,769, Mw / Mn = 1.08) including all methacryloxypropyl cage silsesquioxane resins was detected, and the resulting resin mixture V was represented by the following formula (V) :
[CH 2 = C (CH 3 ) COOC 3 H 6 SiO 3/2 ] m (V)
It was confirmed that it is a resin mixture containing a cage silsesquioxane resin represented by
(合成例VI)
2−プロパノール(IPA)を130ml、トルエンを260mlとし、ビニルトリメトキシシランを93.65g(0.632mol)とし、3−メタクリロキシプロピルトリメトキシシランを用いなかったこと以外は合成例Iと同様にして加水分解反応生成物(シルセスキオキサン)を44.03g得た。この加水分解反応生成物は種々の有機溶剤に可溶な無色の粘性液体であった。(Synthesis Example VI)
The procedure was the same as in Synthesis Example I except that 130 ml of 2-propanol (IPA), 260 ml of toluene, 93.65 g (0.632 mol) of vinyltrimethoxysilane, and 3-methacryloxypropyltrimethoxysilane were not used. As a result, 44.03 g of a hydrolysis reaction product (silsesquioxane) was obtained. This hydrolysis reaction product was a colorless viscous liquid soluble in various organic solvents.
次いで、上記で得られた加水分解反応生成物を42.0g用い、トルエンを260mlとしたこと以外は合成例Iと同様にして樹脂混合物VIを38.24g得た。得られた樹脂混合物VIは種々の有機溶剤に可溶な無色の粘性液体であった。 Next, 38.24 g of a resin mixture VI was obtained in the same manner as in Synthesis Example I except that 42.0 g of the hydrolysis reaction product obtained above was used and toluene was changed to 260 ml. The obtained resin mixture VI was a colorless viscous liquid soluble in various organic solvents.
得られた樹脂混合物Vについて、GPCの結果を示すクロマトグラムを図8に示す。この結果から、一般式(1)におけるjが14より大きい全ビニルかご型シルセスキオキサン樹脂、ラダー型シロキサン、及びランダム型シロキサンを含むピーク1(Mw=3,229、Mw/Mn=1.40)と、前記jが14以下である全ビニルかご型シルセスキオキサン樹脂を含むピーク2(Mw=797、Mw/Mn=1.41)とが検出され、得られた樹脂混合物VIは次式(VI):
[CH2=CHSiO3/2]n・・・(VI)
で表わされるかご型シルセスキオキサン樹脂を含む樹脂混合物であることが確認された。For the obtained resin mixture V, a chromatogram showing the results of GPC is shown in FIG. From this result, peak 1 (Mw = 3,229, Mw / Mn = 1.M) including all vinyl cage silsesquioxane resins in which general formula (1) is greater than 14, ladder type siloxane, and random type siloxane. 40) and peak 2 (Mw = 797, Mw / Mn = 1.41) containing an all-vinyl cage silsesquioxane resin having j of 14 or less, and the resulting resin mixture VI is Formula (VI):
[CH 2 = CHSiO 3/2 ] n (VI)
It was confirmed that it is a resin mixture containing a cage silsesquioxane resin represented by
(実施例1)
先ず、合成例Iで得られたビニル基とメタアクリロイル基とを有するかご型シルセスキオキサン樹脂を含む樹脂混合物I(かご型シルセスキオキサン樹脂含有量:45質量%)100質量部に対し、重合開始剤として1−ヒドロキシシクロヘキシルフェニルケトン(Irg184、チバ・ジャパン株式会社製)1.0質量部及びジクミルパーオキサイド(パークミルD、日本油脂株式会社製)1.0質量部を混合し、硬化性シリコーン樹脂組成物を得た。Example 1
First, with respect to 100 parts by mass of resin mixture I (cage-type silsesquioxane resin content: 45% by mass) containing a cage-type silsesquioxane resin having a vinyl group and a methacryloyl group obtained in Synthesis Example I , 1.0 part by mass of 1-hydroxycyclohexyl phenyl ketone (Irg184, manufactured by Ciba Japan Co., Ltd.) and 1.0 part by mass of dicumyl peroxide (Park Mill D, manufactured by Nippon Oil & Fats Co., Ltd.) as a polymerization initiator are mixed. A curable silicone resin composition was obtained.
次いで、得られた硬化性シリコーン樹脂組成物をガラス板上に2g塗布し、高さ0.2mmの金属スペーサーを配置した後、さらに上からガラス板を被せ、ガラス板の自重で樹脂組成物を流延させて厚さを0.2mmとした後、30W/cmの高圧水銀ランプを用い、2000mJ/cm2の積算露光量で硬化させた。さらに、窒素雰囲気下、200℃で1時間加熱し、ガラス板から剥離して約100mm×100mm×厚さ0.2mmのフィルム状のシリコーン樹脂硬化物を得た。Next, 2 g of the obtained curable silicone resin composition was applied on a glass plate, a metal spacer having a height of 0.2 mm was disposed, and the glass plate was further covered from above, and the resin composition was applied by its own weight. After casting to a thickness of 0.2 mm, a 30 W / cm high-pressure mercury lamp was used and cured with an integrated exposure amount of 2000 mJ / cm 2 . Furthermore, it heated at 200 degreeC under nitrogen atmosphere for 1 hour, peeled from the glass plate, and obtained the film-form silicone resin hardened | cured material of about 100 mm x 100 mm x thickness 0.2mm.
(実施例2)
合成例Iで得られたビニル基とメタアクリロイル基とを有するかご型シルセスキオキサン樹脂を含む樹脂混合物I 70質量部、及びジシクロペンタニルジアクリレート(DCP−A、共栄社化学株式会社製) 30質量部を混合した合計100質量部の混合物に対し、重合開始剤として1−ヒドロキシシクロヘキシルフェニルケトン(Irg184、チバ・ジャパン株式会社製)1.0質量部及びジクミルパーオキサイド(パークミルD、日本油脂株式会社製)1.0質量部を混合し、硬化性シリコーン樹脂組成物を得た。また、得られた硬化性シリコーン樹脂組成物を用い、実施例1と同様にしてシリコーン樹脂硬化物を得た。(Example 2)
70 parts by mass of a resin mixture I containing a cage silsesquioxane resin having a vinyl group and a methacryloyl group obtained in Synthesis Example I, and dicyclopentanyl diacrylate (DCP-A, manufactured by Kyoeisha Chemical Co., Ltd.) As a polymerization initiator, 1.0 part by mass of 1-hydroxycyclohexyl phenyl ketone (Irg184, manufactured by Ciba Japan Co., Ltd.) and dicumyl peroxide (Park Mill D, Japan) are mixed with 100 parts by mass of 30 parts by mass. 1.0 parts by mass of Ogyu Co., Ltd.) was mixed to obtain a curable silicone resin composition. Further, a cured silicone resin was obtained in the same manner as in Example 1 using the obtained curable silicone resin composition.
(実施例3)
樹脂混合物Iに代えて合成例IIで得られた樹脂混合物II(かご型シルセスキオキサン樹脂含有量:50質量%)を用いたこと以外は実施例1と同様にして硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物を得た。(Example 3)
A curable silicone resin composition as in Example 1 except that the resin mixture II obtained in Synthesis Example II (cage-type silsesquioxane resin content: 50% by mass) was used instead of the resin mixture I. And the cured silicone resin was obtained.
(実施例4)
樹脂混合物Iに代えて合成例IIで得られた樹脂混合物IIを用いたこと以外は実施例2と同様にして硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物を得た。(Example 4)
A curable silicone resin composition and a cured silicone resin were obtained in the same manner as in Example 2 except that the resin mixture II obtained in Synthesis Example II was used in place of the resin mixture I.
(実施例5)
樹脂混合物Iに代えて合成例IIIで得られた樹脂混合物III(かご型シルセスキオキサン樹脂含有量:75質量%)を用いたこと以外は実施例1と同様にして硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物を得た。(Example 5)
A curable silicone resin composition as in Example 1 except that the resin mixture III obtained in Synthesis Example III (cage-type silsesquioxane resin content: 75% by mass) was used instead of the resin mixture I. And the cured silicone resin was obtained.
(実施例6)
樹脂混合物Iに代えて合成例IIIで得られた樹脂混合物IIIを用いたこと以外は実施例2と同様にして硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物を得た。(Example 6)
A curable silicone resin composition and a cured silicone resin were obtained in the same manner as in Example 2 except that the resin mixture III obtained in Synthesis Example III was used in place of the resin mixture I.
(実施例7)
樹脂混合物Iに代えて合成例IVで得られた樹脂混合物IV(かご型シルセスキオキサン樹脂含有量:45質量%)を用いたこと以外は実施例1と同様にして硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物を得た。(Example 7)
A curable silicone resin composition as in Example 1 except that the resin mixture IV (cage-type silsesquioxane resin content: 45% by mass) obtained in Synthesis Example IV was used in place of the resin mixture I. And the cured silicone resin was obtained.
(実施例8)
樹脂混合物Iに代えて合成例IVで得られた樹脂混合物IVを用いたこと以外は実施例2と同様にして硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物を得た。(Example 8)
A curable silicone resin composition and a cured silicone resin were obtained in the same manner as in Example 2 except that the resin mixture IV obtained in Synthesis Example IV was used in place of the resin mixture I.
(比較例1)
樹脂混合物Iに代えて合成例Vで得られた樹脂混合物Vを用いたこと以外は実施例1と同様にして硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物を得た。(Comparative Example 1)
A curable silicone resin composition and a cured silicone resin were obtained in the same manner as in Example 1 except that the resin mixture V obtained in Synthesis Example V was used in place of the resin mixture I.
(比較例2)
樹脂混合物Iに代えて合成例Vで得られた樹脂混合物Vを用いたこと以外は実施例2と同様にして硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物を得た。(Comparative Example 2)
A curable silicone resin composition and a cured silicone resin were obtained in the same manner as in Example 2 except that the resin mixture V obtained in Synthesis Example V was used in place of the resin mixture I.
(比較例3)
樹脂混合物Iに代えて合成例VIで得られた樹脂混合物VIを用いたこと以外は実施例1と同様にして硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物を得た。(Comparative Example 3)
A curable silicone resin composition and a cured silicone resin were obtained in the same manner as in Example 1 except that the resin mixture VI obtained in Synthesis Example VI was used in place of the resin mixture I.
(比較例4)
樹脂混合物Iに代えて合成例VIで得られた樹脂混合物VIを用いたこと以外は実施例2と同様にして硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物を得た。(Comparative Example 4)
A curable silicone resin composition and a cured silicone resin were obtained in the same manner as in Example 2 except that the resin mixture VI obtained in Synthesis Example VI was used in place of the resin mixture I.
実施例1〜8及び比較例1〜4において得られたシリコーン樹脂硬化物について、以下の方法によりフィルム成形性の評価、吸水率の測定、線膨張係数の測定、全光線透過率の測定を行った。 About the silicone resin hardened | cured material obtained in Examples 1-8 and Comparative Examples 1-4, evaluation of film moldability, the measurement of a water absorption, the measurement of a linear expansion coefficient, and the measurement of a total light transmittance were performed with the following method. It was.
(フィルム成形性の評価)
シリコーン樹脂硬化物の割れを目視により以下の基準:
評価A:フィルムに割れ、破断は観察されない
評価B:フィルムに網目状の割れまたは、破断が観察される
に従って評価した。得られた結果を表2に示す。(Evaluation of film formability)
Visually check for cracks in the cured silicone resin:
Evaluation A: No cracks or breaks are observed in the film. Evaluation B: Evaluation is made as a mesh-like crack or break is observed in the film. The obtained results are shown in Table 2.
(吸水率の測定)
先ず、得られたシリコーン樹脂硬化物を24時間、50℃において保持し、予備乾燥を行った。次いで、プラスチック―吸水率の求め方(JISK7209)に基づいて吸水率の測定を行った。得られた結果を表2に示す。(Measurement of water absorption)
First, the obtained cured silicone resin was kept at 50 ° C. for 24 hours and preliminarily dried. Next, the water absorption rate was measured based on the plastic-water absorption rate calculation method (JISK7209). The obtained results are shown in Table 2.
(線膨張係数の測定)
得られたシリコーン樹脂硬化物(5mm×5mm×厚さ1mm(厚さ0.2mmの試験片を5枚重ねたもの)について、機器名:TMA4000SA(BRUKER社製)を用いて熱機械分析法に基づき測定を行った(昇温速度:5℃/min、圧縮荷重:0.1N、温度範囲:50〜150℃)。
線膨張係数は、次式:
線膨張係数(ppm/K)=試験片1m当たりの変位量/温度変位量
により算出した。得られた結果を表2に示す。(Measurement of linear expansion coefficient)
About the obtained cured silicone resin (5 mm × 5 mm × thickness 1 mm (5 test pieces having a thickness of 0.2 mm)), a thermomechanical analysis method was performed using a device name: TMA4000SA (manufactured by BRUKER). Measurement was performed based on the temperature rise rate (temperature rising rate: 5 ° C./min, compression load: 0.1 N, temperature range: 50 to 150 ° C.).
The coefficient of linear expansion is:
The coefficient of linear expansion (ppm / K) was calculated from the displacement per 1 m of the test piece / temperature displacement. The obtained results are shown in Table 2.
(全光線透過率の測定)
得られたシリコーン樹脂硬化物(厚さ0.2mm)について、NDH2000(日本電色社製)を用いて全光の透過率を測定した。
透過率は、次式:
全光透過率(%)=透過光強度/入射光強度
により算出した。得られた結果を表2に示す。(Measurement of total light transmittance)
About the obtained silicone resin hardened | cured material (thickness 0.2mm), the transmittance | permeability of all the light was measured using NDH2000 (made by Nippon Denshoku).
The transmittance is the following formula:
The total light transmittance (%) was calculated from transmitted light intensity / incident light intensity. The obtained results are shown in Table 2.
表2に示した結果から明らかなように、実施例1〜8で得られたシリコーン樹脂硬化物は、いずれも優れた透明性、成形性及び低吸水性を有し、線膨張係数が十分に小さいことが確認された。他方、比較例1〜2で得られたシリコーン樹脂硬化物は、吸水率が高く、線膨張係数が高いことが確認され、比較例3〜4で得られたシリコーン樹脂硬化物は、フィルム成形性に劣ることが確認された。 As is clear from the results shown in Table 2, the cured silicone resins obtained in Examples 1 to 8 all have excellent transparency, moldability and low water absorption, and have a sufficient linear expansion coefficient. It was confirmed to be small. On the other hand, the cured silicone resin obtained in Comparative Examples 1 and 2 was confirmed to have a high water absorption rate and a high linear expansion coefficient, and the cured silicone resin obtained in Comparative Examples 3 to 4 was film moldability. It was confirmed to be inferior.
また、不飽和化合物であるジシクロペンタニルジアクリレートを更に含有せしめた実施例2、4、6、8においても、透明性に優れたシリコーン樹脂硬化物が得られることが確認された。他方、比較例4においては、白濁したシリコーン樹脂硬化物が得られた。これは、ビニル基とメタアクリロイル基との重合反応性の違いにより、かご型シルセスキオキサン樹脂が遊離して相分離(白濁)したためと推察される。 Moreover, also in Examples 2, 4, 6, and 8 in which dicyclopentanyl diacrylate which is an unsaturated compound was further contained, it was confirmed that a cured silicone resin excellent in transparency was obtained. On the other hand, in Comparative Example 4, a white turbid silicone resin cured product was obtained. This is presumably because the cage silsesquioxane resin was liberated and phase-separated (white turbidity) due to the difference in polymerization reactivity between the vinyl group and the methacryloyl group.
以上説明したように、本発明によれば、優れた透明性、成形性及び低吸水性を有し、線膨張係数が十分に小さいシリコーン樹脂硬化物を得ることができる硬化性シリコーン樹脂組成物及びこれを硬化させて得られるシリコーン樹脂硬化物を提供することが可能となる。 As described above, according to the present invention, a curable silicone resin composition capable of obtaining a cured silicone resin having excellent transparency, moldability and low water absorption, and having a sufficiently small linear expansion coefficient, and It becomes possible to provide a cured silicone resin obtained by curing this.
このようなシリコーン樹脂硬化物は、液晶表示素子用基板、カラーフィルター用基板、有機EL表示素子用基板、電子ペーパー用基板、TFT用基板、太陽電池基板等の透明基板や、タッチパネル、透明電極付フィルム、導光板、保護フィルム、偏光フィルム、位相差フィルム、レンズシート等の光学フィルム用途や各種輸送機械、住宅の窓材等のガラス代替材料として、その利用範囲は広範となりその産業上の利用価値が極めて高いものである。 Such silicone resin cured products include liquid crystal display element substrates, color filter substrates, organic EL display element substrates, electronic paper substrates, TFT substrates, solar cell substrates, and other transparent substrates, touch panels, and transparent electrodes. As an optical film application for films, light guide plates, protective films, polarizing films, retardation films, lens sheets, etc., as a glass substitute material for various transport machinery, housing window materials, etc., its range of use has become wide and its industrial utility value Is extremely high.
Claims (5)
[CH2=CHSiO3/2]n[R1SiO3/2]m[R2SiO3/2]j ・・・(1)
{式(1)中、R1は、下記一般式(2):
CH2=CR3−CO−O−R4− ・・・(2)
[式(2)中、R3は、水素原子又はメチル基を示し、R4は、アルキレン基、アルキリデン基及びフェニレン基からなる群より選択されるいずれか一種を示す。]
で表わされる(メタ)アクリロイル基を有する基を示し、R2は、水素原子、炭素数1〜6のアルキル基、フェニル基及びアリル基からなる群より選択されるいずれか一種を示し、n、m及びjは下記式(i)〜(iv):
n≧1 ・・・(i)、
m≧1 ・・・(ii)、
j≧0 ・・・(iii)、
n+m+j=h ・・・(iv)
[式(iv)中、hは8、10、12及び14からなる群より選択されるいずれかの整数を示す。]
で表わされる条件を満たす整数を示し、前記m及び前記jがそれぞれ2以上の場合にはR1及びR2はそれぞれ同一でも異なっていてもよい。}
で表わされるかご型シルセスキオキサン樹脂と、ラジカル重合開始剤とを含有しており、
前記かご型シルセスキオキサン樹脂の含有量が10〜80質量%である硬化性シリコーン樹脂組成物。The following general formula (1):
[CH 2 = CHSiO 3/2 ] n [R 1 SiO 3/2 ] m [R 2 SiO 3/2 ] j (1)
{In Formula (1), R 1 is the following General Formula (2):
CH 2 = CR 3 —CO—O—R 4 − (2)
[In Formula (2), R 3 represents a hydrogen atom or a methyl group, and R 4 represents any one selected from the group consisting of an alkylene group, an alkylidene group, and a phenylene group. ]
Wherein R 2 represents any one selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a phenyl group, and an allyl group, and n, m and j are the following formulas (i) to (iv):
n ≧ 1 (i),
m ≧ 1 (ii),
j ≧ 0 (iii),
n + m + j = h (iv)
[In the formula (iv), h represents any integer selected from the group consisting of 8, 10, 12, and 14. ]
In the case where m and j are each 2 or more, R 1 and R 2 may be the same or different. }
A cage-type silsesquioxane resin represented by: and a radical polymerization initiator,
Curable silicone resin composition whose content of the said cage silsesquioxane resin is 10-80 mass%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013507445A JP5844796B2 (en) | 2011-03-31 | 2012-03-22 | Curable silicone resin composition and silicone resin cured product |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011079496 | 2011-03-31 | ||
JP2011079496 | 2011-03-31 | ||
PCT/JP2012/057269 WO2012133080A1 (en) | 2011-03-31 | 2012-03-22 | Curable silicone resin composition and cured silicone resin |
JP2013507445A JP5844796B2 (en) | 2011-03-31 | 2012-03-22 | Curable silicone resin composition and silicone resin cured product |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012133080A1 true JPWO2012133080A1 (en) | 2014-07-28 |
JP5844796B2 JP5844796B2 (en) | 2016-01-20 |
Family
ID=46930808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013507445A Active JP5844796B2 (en) | 2011-03-31 | 2012-03-22 | Curable silicone resin composition and silicone resin cured product |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5844796B2 (en) |
KR (1) | KR101861774B1 (en) |
CN (1) | CN103459447B (en) |
TW (1) | TWI529202B (en) |
WO (1) | WO2012133080A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6021605B2 (en) * | 2012-11-19 | 2016-11-09 | 新日鉄住金化学株式会社 | Cage type silsesquioxane compound, curable resin composition and resin cured product using the same |
JP2015052695A (en) * | 2013-09-06 | 2015-03-19 | 富士フイルム株式会社 | Retardation plate, liquid crystal display device, and manufacturing method of retardation plate |
JP6648881B2 (en) | 2016-01-28 | 2020-02-14 | エルジー・ケム・リミテッド | Method for producing polyhedral oligomeric silsesquioxane |
KR102035831B1 (en) | 2016-03-17 | 2019-11-18 | 주식회사 엘지화학 | Polyhedral oligomeric silsesquioxane and method for preparing the same |
EP3511304A1 (en) * | 2018-01-11 | 2019-07-17 | Evonik Degussa GmbH | Special composition of organofunctional alkoxysilanes and their use |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002363414A (en) * | 2001-06-12 | 2002-12-18 | Asahi Kasei Corp | Basket-like silsesquioxane-containing composition |
JP2003510337A (en) * | 1999-08-04 | 2003-03-18 | ハイブリッド・プラスチックス | Method for forming polyhedral oligomeric silsesquioxane |
JP2004143449A (en) * | 2002-09-30 | 2004-05-20 | Nippon Steel Chem Co Ltd | Cage-type silsesquioxan resin with functional group and method for producing the same |
WO2006035646A1 (en) * | 2004-09-27 | 2006-04-06 | Nippon Steel Chemical Co., Ltd. | Silica-containing silicone resin composition and its molded product |
WO2008099850A1 (en) * | 2007-02-16 | 2008-08-21 | Nippon Steel Chemical Co., Ltd. | Cage-cleavable siloxane resin having functional group and method for production thereof |
JP2009167325A (en) * | 2008-01-17 | 2009-07-30 | Nippon Steel Chem Co Ltd | Curable cage-type silsesquioxane compound containing silanol group, copolymer using the same and method for producing them |
WO2009119253A1 (en) * | 2008-03-28 | 2009-10-01 | 新日鐵化学株式会社 | Silanol-group-containing curable cage-type silsesquioxane compound, cage-structure-containing curable silicone copolymer, processes for producing these, and curable resin composition |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101345170B1 (en) * | 2006-07-13 | 2013-12-26 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | Film laminate and method of manufacturing the same |
JP5328263B2 (en) | 2008-03-18 | 2013-10-30 | 昭和電工株式会社 | Magnetic recording medium manufacturing method, magnetic recording medium, and magnetic recording / reproducing apparatus |
-
2012
- 2012-03-22 CN CN201280015013.5A patent/CN103459447B/en active Active
- 2012-03-22 JP JP2013507445A patent/JP5844796B2/en active Active
- 2012-03-22 WO PCT/JP2012/057269 patent/WO2012133080A1/en active Application Filing
- 2012-03-22 KR KR1020137028713A patent/KR101861774B1/en active IP Right Grant
- 2012-03-29 TW TW101111072A patent/TWI529202B/en active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003510337A (en) * | 1999-08-04 | 2003-03-18 | ハイブリッド・プラスチックス | Method for forming polyhedral oligomeric silsesquioxane |
JP2002363414A (en) * | 2001-06-12 | 2002-12-18 | Asahi Kasei Corp | Basket-like silsesquioxane-containing composition |
JP2004143449A (en) * | 2002-09-30 | 2004-05-20 | Nippon Steel Chem Co Ltd | Cage-type silsesquioxan resin with functional group and method for producing the same |
WO2006035646A1 (en) * | 2004-09-27 | 2006-04-06 | Nippon Steel Chemical Co., Ltd. | Silica-containing silicone resin composition and its molded product |
WO2008099850A1 (en) * | 2007-02-16 | 2008-08-21 | Nippon Steel Chemical Co., Ltd. | Cage-cleavable siloxane resin having functional group and method for production thereof |
JP2009167325A (en) * | 2008-01-17 | 2009-07-30 | Nippon Steel Chem Co Ltd | Curable cage-type silsesquioxane compound containing silanol group, copolymer using the same and method for producing them |
WO2009119253A1 (en) * | 2008-03-28 | 2009-10-01 | 新日鐵化学株式会社 | Silanol-group-containing curable cage-type silsesquioxane compound, cage-structure-containing curable silicone copolymer, processes for producing these, and curable resin composition |
Also Published As
Publication number | Publication date |
---|---|
JP5844796B2 (en) | 2016-01-20 |
TWI529202B (en) | 2016-04-11 |
CN103459447B (en) | 2015-03-25 |
KR20140021634A (en) | 2014-02-20 |
KR101861774B1 (en) | 2018-05-28 |
TW201302864A (en) | 2013-01-16 |
CN103459447A (en) | 2013-12-18 |
WO2012133080A1 (en) | 2012-10-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6021605B2 (en) | Cage type silsesquioxane compound, curable resin composition and resin cured product using the same | |
JP5000303B2 (en) | Silica-containing silicone resin composition and molded article thereof | |
JP4558643B2 (en) | Silicone resin composition and molded body thereof | |
TWI476232B (en) | The silicone resin and the production method thereof are are the same as those of the hardened resin composition containing the silicone resin | |
JP5844796B2 (en) | Curable silicone resin composition and silicone resin cured product | |
JP2003137944A (en) | Silicone resin composition and silicone resin molded article | |
US20070260008A1 (en) | Silica-Containing Silicone Resin Composition and Its Molded Product | |
KR20140043488A (en) | Photosensitive alkali-soluble silicone resin composition | |
WO2009119253A1 (en) | Silanol-group-containing curable cage-type silsesquioxane compound, cage-structure-containing curable silicone copolymer, processes for producing these, and curable resin composition | |
JP2006089685A (en) | Silicone resin composition and molding | |
JP2013129766A (en) | Glass fiber-composited resin substrate | |
JP2007291313A (en) | Ultraviolet light curable resin composition, cured material of the same and various article derived from the same | |
KR101624924B1 (en) | Curable resin composition and cured product | |
JP5730009B2 (en) | Laminated body | |
JP2012184371A (en) | Silicone resin composition and its compact | |
WO2018110613A1 (en) | Polyorganosiloxane, polyorganosiloxane composition, cured product, polyorganosiloxane-containing electrolytic solution for electrolytic capacitor, and electrolytic capacitor using same | |
JP2006307088A (en) | Resin composition, optical member using the same and its manufacturing method | |
JP5336399B2 (en) | Heat-resistant compound lens | |
JP2020019870A (en) | Photocurable silicone resin composition and molded body thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140919 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150501 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150617 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20151106 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20151119 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5844796 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |