JPWO2012102303A1 - Electronic component module and electronic component element - Google Patents
Electronic component module and electronic component element Download PDFInfo
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- JPWO2012102303A1 JPWO2012102303A1 JP2012554816A JP2012554816A JPWO2012102303A1 JP WO2012102303 A1 JPWO2012102303 A1 JP WO2012102303A1 JP 2012554816 A JP2012554816 A JP 2012554816A JP 2012554816 A JP2012554816 A JP 2012554816A JP WO2012102303 A1 JPWO2012102303 A1 JP WO2012102303A1
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- electronic component
- electrode
- substrate
- solder
- component module
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
Abstract
はんだスプラッシュの発生を抑制した電子部品モジュールを提供する。電子部品モジュール100は、複数の基板電極2が形成された基板1上に、複数のパッド電極5が形成された電子部品素子4が対向して配置され、基板電極2とパッド電極5がはんだバンプにより接続されたものからなり、パッド電極上に柱状電極7が形成され、柱状電極7上にはんだバンプ9が設けられるとともに、パッド電極5上に、柱状電極7を囲むように、環状電極8が形成されたものからなる。Provided is an electronic component module in which the occurrence of solder splash is suppressed. In the electronic component module 100, an electronic component element 4 on which a plurality of pad electrodes 5 are formed is disposed on a substrate 1 on which a plurality of substrate electrodes 2 are formed so that the substrate electrodes 2 and the pad electrodes 5 are solder bumps. The columnar electrode 7 is formed on the pad electrode, the solder bump 9 is provided on the columnar electrode 7, and the annular electrode 8 is formed on the pad electrode 5 so as to surround the columnar electrode 7. Consists of formed.
Description
本発明は、基板上に電子部品素子がフリップチップ実装された電子部品モジュールに関し、さらに詳しくは、基板と電子部品素子の接合構造に改良が加えられた電子部品モジュールに関する。 The present invention relates to an electronic component module in which an electronic component element is flip-chip mounted on a substrate, and more particularly, to an electronic component module in which a bonding structure between a substrate and the electronic component element is improved.
また、本発明は、上記電子部品モジュールに使用するのに適した電子部品素子に関する。 The present invention also relates to an electronic component element suitable for use in the electronic component module.
近年、電子機器の小型化、高機能化により、半導体などの電子部品素子の基板への高密度実装が要求されている。その要求に応える方法として、フリップチップ実装が広く用いられている。このフリップチップ実装は、一般的には、電子部品素子側にはんだバンプを設け、リフローにより電子部品素子を基板にはんだ接合し、さらに接合力強化のために、基板と電子部品素子の間に樹脂を充填するようにしている。 In recent years, electronic devices such as semiconductors have been required to be mounted on a substrate at high density due to miniaturization and high functionality of electronic devices. As a method for meeting the demand, flip chip mounting is widely used. In this flip chip mounting, generally, a solder bump is provided on the electronic component element side, the electronic component element is soldered to the substrate by reflow, and a resin is interposed between the substrate and the electronic component element to further strengthen the bonding force. To be filled.
このように、基板に電子部品素子をフリップチップ実装した電子部品モジュールは、さらに、より大きな実装基板にリフローはんだにより実装されることが多い。しかしながら、電子部品モジュールを実装基板に実装する場合、リフロー加熱により、基板と電子部品素子を接合しているはんだが再溶融し、溶融したはんだが、電子部品素子と基板との接合面に沿って流出し、隣接した他のはんだバンプと電気的に短絡してしまう可能性があった。 As described above, an electronic component module in which an electronic component element is flip-chip mounted on a substrate is often mounted on a larger mounting substrate by reflow soldering. However, when an electronic component module is mounted on a mounting substrate, the solder that joins the substrate and the electronic component element is remelted by reflow heating, and the molten solder moves along the joining surface between the electronic component element and the substrate. There was a possibility that it would flow out and be electrically short-circuited with other adjacent solder bumps.
これを防止した電子部品モジュールが、特許文献1(特開2004−47637号公報)に開示されている。 An electronic component module that prevents this is disclosed in Japanese Patent Application Laid-Open No. 2004-47637.
図8に、特許文献1に開示された電子部品モジュール(半導体パッケージ)400を示す。
FIG. 8 shows an electronic component module (semiconductor package) 400 disclosed in
電子部品モジュール400は、基板101を備える。基板101の主面上には、複数の基板電極102が形成されている。また、基板101の主面上には、基板電極102部分を除いて、はんだレジスト103が形成されている。
The
また、電子部品モジュール400は、電子部品素子(半導体素子)104を備える。電子部品素子104の主面上には、複数のパッド電極105が形成されている。また、電子部品素子104の主面上には、パッド電極105部分を除いて、絶縁膜106が形成されている。そして、絶縁膜106には、パッド電極105を囲むように、突起状のはんだダム106aが形成されている。はんだダム106aは、電子部品モジュール400を実装基板(図示せず)に実装するときに、溶融したはんだが流出するのを防止する機能をはたす。
The
そして、電子部品素子104は、パッド電極105上に設けられたはんだバンプ109を、基板101の基板電極102に接合することにより、基板101にフリップチップ実装されている。
The
さらに、電子部品モジュール400は、基板101と電子部品素子104の接合強度を大きくするために、基板101と電子部品素子104との間に、樹脂110が充填されている。
Further, the
しかしながら、上述した従来の電子部品モジュール400には、次のような問題があった。
However, the above-described conventional
すなわち、電子部品素子104の絶縁膜106に、はんだ流出防止のための突起状のはんだダム106aを形成するためには、ある程度の大きな面積を必要とするため、近時の、小型化、高密度化が要求される電子部品モジュールにおいては、絶縁膜106上にはんだダム106aを形成するための面積を確保することができないという問題があった。
That is, in order to form the protruding
また、一般的に、電子部品素子104に形成する絶縁膜106は、SiNなどで形成する場合が多いが、SiNなどからなる絶縁膜106およびはんだダム106aは、はんだを弾く傾向があるため、溶融したはんだバンプ109のはんだが、絶縁膜106上に留まらず、はんだダム106aを超えて流出しやすいという問題があった。そして、はんだダム106aを超えて流出したはんだが、隣接するはんだバンプ109と電気的に短絡してしまう場合があるという問題があった。
In general, the
そこで、本発明の目的は、狭ピッチにはんだバンプが形成されていたとしても、はんだの流出を防止することができる構造を備えた、電子部品モジュールを提供することである。 Accordingly, an object of the present invention is to provide an electronic component module having a structure capable of preventing the outflow of solder even if solder bumps are formed at a narrow pitch.
その手段として、本発明の電子部品モジュールは、複数の基板電極が形成された基板上に、複数のパッド電極を有する電子部品素子が前記基板電極と前記パッド電極とが対向するように配置され、基板電極とパッド電極とがはんだバンプを介して電気的に接続されてなる電子部品モジュールにおいて、パッド電極上に形成された柱状電極と、柱状電極の先端に形成されたはんだバンプと、柱状電極を囲むようにパッド電極上に形成された環状電極とを備えている、ものとした。かかる構造とすることにより、本発明の電子部品モジュールは、はんだの流出を確実に防止することができる。 As its means, in the electronic component module of the present invention, an electronic component element having a plurality of pad electrodes is arranged on a substrate on which a plurality of substrate electrodes are formed so that the substrate electrodes and the pad electrodes face each other. In an electronic component module in which a substrate electrode and a pad electrode are electrically connected via a solder bump, a columnar electrode formed on the pad electrode, a solder bump formed on the tip of the columnar electrode, and the columnar electrode And an annular electrode formed on the pad electrode so as to surround. By setting it as this structure, the electronic component module of this invention can prevent the outflow of solder reliably.
なお、環状電極は、パッド電極の表面から突出するように形成されていることが好ましい。この場合には、はんだの流出を防止する機能が高くなる。 The annular electrode is preferably formed so as to protrude from the surface of the pad electrode. In this case, the function of preventing the solder from flowing out is enhanced.
また、基板と電子部品素子の間に、樹脂を充填するようにしても良い。この場合には、基板と電子部品素子の接合強度をより大きくすることができる。 Further, a resin may be filled between the substrate and the electronic component element. In this case, the bonding strength between the substrate and the electronic component element can be further increased.
また、環状電極の高さが柱状電極の高さよりも高く、環状電極が基板電極に当接してしても良い。この場合には、環状電極によって柱状電極およびはんだバンプが完全に囲まれることになり、はんだの流出を完全に防止することができる。 Further, the height of the annular electrode may be higher than the height of the columnar electrode, and the annular electrode may be in contact with the substrate electrode. In this case, the columnar electrode and the solder bump are completely surrounded by the annular electrode, and the outflow of solder can be completely prevented.
また、基板電極に、別途、柱状電極および環状電極の少なくとも一方を設けるようにしても良い。この場合には、基板側においてはんだが流出する場合にも、はんだの流出を抑制することができる。 Further, at least one of a columnar electrode and an annular electrode may be separately provided on the substrate electrode. In this case, it is possible to suppress the outflow of solder even when the solder flows out on the substrate side.
また、本発明の電子部品素子は、実装面を有する電子部品本体と、実装面上に形成された複数のパッド電極と、パッド電極上に形成された柱状電極と、柱状電極の先端に形成されたはんだバンプと、柱状電極を囲むようにパッド電極上に形成された環状電極とを備えた構造とした。かかる構造とすることにより、本発明の電子部品素子は、基板に上記はんだバンプを使ってフリップチップ実装して電子部品モジュールを製造し、その電子部品モジュールを実装基板に実装する場合に、リフロー加熱によりはんだが再溶融しても、溶融したはんだが流出するのを確実に防止することができる。 The electronic component element of the present invention is formed on an electronic component body having a mounting surface, a plurality of pad electrodes formed on the mounting surface, a columnar electrode formed on the pad electrode, and a tip of the columnar electrode. The solder bumps and the annular electrode formed on the pad electrode so as to surround the columnar electrode were used. By adopting such a structure, the electronic component element of the present invention is manufactured by flip-chip mounting using the solder bumps on the substrate to manufacture an electronic component module, and when the electronic component module is mounted on the mounting substrate, reflow heating is performed. Thus, even if the solder is remelted, it is possible to reliably prevent the molten solder from flowing out.
本発明の電子部品モジュールは、パッド電極上に金属製の環状電極を形成したものであるため、特許文献1に開示された従来技術のように、SiNなど、はんだを弾く性質をもった絶縁膜にはんだダムを形成したものに比べて、はんだ流出を防止する機能が大きく向上している。
Since the electronic component module of the present invention is formed by forming a metal annular electrode on the pad electrode, as in the prior art disclosed in
また、本発明の電子部品モジュールは、はんだバンプが、パッド電極上に直接に設けられるのではなく、パッド電極上に形成された柱状電極上に設けられているため、各はんだバンプの配置位置をより正確に制御することができる。したがって、複数のはんだバンプを、狭いピッチで隣接して形成することができる。 In the electronic component module of the present invention, the solder bumps are not provided directly on the pad electrodes, but are provided on the columnar electrodes formed on the pad electrodes. It can be controlled more accurately. Therefore, a plurality of solder bumps can be formed adjacent to each other at a narrow pitch.
さらに、本発明の電子部品モジュールは、はんだバンプが、パッド電極上に形成された柱状電極上に設けられており、はんだバンプとパッド電極との間に一定の距離が設けられている。そのため、万一、はんだスプラッシュが発生しても、溶融したはんだは、柱状電極の側面、パッド電極の表面、環状電極を経由しなければ、隣接するパッド電極やはんだバンプに到達することができない。このように、はんだの経由経路が長くなっていることによっても、はんだ流出を防止する機能が大きく向上している。 Furthermore, in the electronic component module of the present invention, the solder bump is provided on the columnar electrode formed on the pad electrode, and a certain distance is provided between the solder bump and the pad electrode. For this reason, even if solder splash occurs, the molten solder cannot reach the adjacent pad electrode or solder bump unless it passes through the side surface of the columnar electrode, the surface of the pad electrode, and the annular electrode. As described above, the function of preventing the solder from flowing out is also greatly improved by the fact that the route through which the solder passes is long.
以下、本発明の実施形態について、図面を参照しながら説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(第1実施形態)
図1および図2に、本発明の第1実施形態にかかる電子部品モジュール100における基板と電子部品素子との接合状態を示す。ただし、図2は、図1の矢印A−A部分の断面を示している。(First embodiment)
1 and 2 show a joined state between a substrate and an electronic component element in the
電子部品モジュール100は、基板1を備える。基板1の材質には、たとえば、セラミックや樹脂などが用いられる。基板1の主面上には、複数の基板電極2が形成されている。基板電極2の材質には、たとえば、CuやAgなどが用いられる。
The
また、電子部品モジュール100は、電子部品素子4を備える。電子部品素子4としては、たとえば、半導体素子などが用いられ、一般的には矩形状のものが多い。電子部品素子4の主面上には、複数のパッド電極5が形成されている。パッド電極5の形状は問わないが、本実施形態では、電子部品素子4の形状に合わせて矩形状とした。パッド電極5の材質には、たとえば、Alなどが用いられる。また、電子部品素子4の主面上には、パッド電極5部分に開口を設けて、絶縁膜6が形成されている。絶縁膜6の材質には、たとえば、SiNなどが用いられる。
The
そして、電子部品素子4のパッド電極5の中心部上には、柱状電極7が形成されている。本実施形態においては、柱状電極7の形状を円柱状とした。ただし、柱状電極7の形状はこれには限定されず、多角柱状、円錐台状、多角錐台状などであっても良い。柱状電極7の材質には、たとえば、Cuが用いられる。ただし、Ni、Pt、Pdなど、Cu以外の金属であっても良い。
A
また、電子部品素子4のパッド電極5上には、柱状電極7を囲むように、環状電極8が形成されている。本実施形態においては、環状電極8の平面形状を円環状とした。ただし、円環状には限られず、矩形環状であっても良い。環状電極8は、パッド電極の表面から突出している。環状電極8の材質には、たとえば、Cuが用いられる。ただし、Ni、Pt、Pdなど、Cu以外の金属であっても良い。
An
そして、柱状電極7上に、はんだバンプ9が設けられている。
A
電子部品素子4は、柱状電極7上に設けられたはんだバンプ9を、基板1の基板電極2に接合することにより、基板1にフリップチップ実装されている。
The
さらに、電子部品モジュール100は、基板1と電子部品素子4の接合強度を大きくするために、基板1と電子部品素子4の間に、樹脂10が充填されている。ただし、しかし、電子部品リペアによる基板再利用等を想定して、樹脂10を充填しない場合もある。
Furthermore, in the
以上の構造からなる、本発明の第1実施形態にかかる電子部品モジュール100は、柱状電極7を囲む環状電極8がパッド電極5上に形成されているため、はんだスプラッシュ発生時に、溶融したはんだが隣接するはんだバンプ9に到達する経路が長くなっており、隣接するはんだバンプ9との短絡が抑制されている。さらに、柱状電極7および環状電極8が金属で形成されていることにより、従来のはんだを弾く作用のあるSiNなどで形成した場合に比べて、はんだ流失を防止する効果が高まっている。
In the
さらに、はんだバンプ9が、パッド電極5上に形成された柱状電極7上に設けられているため、各はんだバンプ9の配置位置が正確に制御されている。したがって、複数のはんだバンプ9を、狭いピッチで隣接して形成することができる。
Furthermore, since the solder bumps 9 are provided on the
なお、図示しないが、基板1は、配線用内層導体や容量形成用内層導体が形成された多層基板で構成され、その表面には、形成された外部端子が形成されている。電子部品素子4が実装されている基板電極2と外部端子電極の間はビアホール導体で接続されている。
Although not shown, the
また、基板1の電子部品素子4が実装されている基板電極2とは別の基板電極2にチップコンデンサなどが実装されていてもよい。また、基板1の内層導体にチップコンデンサなどが接続された状態で基板内に内蔵されていてもよい。
Further, a chip capacitor or the like may be mounted on a
次に、図3(a)〜図5(i)を参照して、電子部品モジュール100の製造方法の一例について説明する。
Next, an example of a manufacturing method of the
まず、図3(a)に示すように、予めAlなどからなる複数のパッド電極5が形成された半導体素子などの電子部品素子4を用意する。
First, as shown in FIG. 3A, an
次に、図3(b)に示すように、電子部品素子4上に、柱状電極7や環状電極8を形成の基礎となるシード層11を、蒸着やスパッタリングにより形成する。シード層11の材質には、たとえば、TiやCuを用いる。そして、シード層11を形成した後に、環状電極8を形成するためのレジスト12を形成する。レジスト12の材質には、たとえば、SiN、SiO2などが用いられる。レジスト12は、まずシード層11上の全面に塗布する。続いて、レジスト12上に、環状電極16を形成する部分を打ち抜きにしたマスク(図示せず)を覆せ、フォトリソグラフィの要領で、紫外線を照射して露光を行う。続いて、マスクを外し、現像液により現像処理を行う。現像処理により、レジスト12には、露光された形、すなわち環状電極8の平面形状(たとえば円環状)をした開口が形成される。Next, as shown in FIG. 3B, a
次に、図3(c)に示すように、めっき処理を施すことにより、レジスト12の開口部に環状電極8を形成する。
Next, as shown in FIG. 3C, an
次に、レジスト12を剥離除去することにより、図4(d)に示すように、パッド電極5上に、シード層11を介して、環状電極8が完成する。
Next, the resist 12 is peeled and removed, whereby the
続いて、柱状電極7およびはんだバンプ9の形成を行う。
Subsequently,
まず、図示しないが、環状電極8が形成されたシード層11上に、再度、レジスト13を塗布する。続いて、レジスト13上に、柱状電極7を形成する部分を打ち抜きにしたマスクを覆せ、フォトリソグラフィの要領で、紫外線を照射して露光を行う。続いて、マスクを外し、現像液により現像処理を行う。現像処理により、図4(e)に示すように、レジスト13には、露光された形、すなわち柱状電極7の平面形状(たとえば円形)をした開口が形成される。
First, although not shown, a resist 13 is applied again on the
次に、図4(f)に示すように、めっき処理を施すことにより、レジスト13の開口部に、まず、柱状電極7を形成し、続いてはんだバンプ9のもととなる、はんだめっき層9’を形成する。
Next, as shown in FIG. 4 (f), by performing a plating process, first, the
次に、図5(g)に示すように、残ったレジスト13を剥離除去し、続いて、エッチング処理により残ったシード層11を剥離除去する。
Next, as shown in FIG. 5G, the remaining resist 13 is stripped and removed, and then the
次に、図5(h)に示すように、リフロー処理を施すことにより、はんだ層9’を、略球状のはんだバンプ9に形成する。
Next, as shown in FIG. 5H, a
最後に、図5(i)に示すように、基板電極2にはんだバンプ9をリフローにより接合し、基板1に電子部品素子4をフリップチップ実装し、続いて、基板1と電子部品素子4の接合強度を高めるため、基板2と電子部品素子4の間に樹脂10を充填して、本実施形態にかかる電子部品モジュール100を完成させる。なお、図5(g)〜(i)においては、柱状電極7および環状電極8のシード層部分を図示しているが、完成状態を示す図1においては、図示を省略している。
Finally, as shown in FIG. 5 (i), solder bumps 9 are joined to the
以上、本発明の第1実施形態にかかる電子部品モジュール100の構造、および製造方法の一例について説明した。しかしながら、本発明の内容が上述した内容に限定されることはなく、発明の主旨に沿って、種々の変更をなすことができる。
The structure of the
たとえば、柱状電極7や環状電極8の形成は、フォトリソグラフィに代えて、蒸着や印刷などの方法によっても良い。
For example, the
また、金属製の電極とはんだとの界面を合金化させ、接合強度を高めるようにしても良い。 Further, the interface between the metal electrode and the solder may be alloyed to increase the bonding strength.
また、パッド電極5上にその表面から突出するように環状電極8を設けているが、パッド電極5の表面に凹溝を形成するような環状電極にしても、はんだ流出を防止する機能をはたす。
(第2実施形態)
図6に、本発明の第2実施形態にかかる電子部品モジュール200の要部を示す。Further, the
(Second Embodiment)
FIG. 6 shows a main part of an
電子部品モジュール200は、基板1の基板電極2上にも、柱状電極27および環状電極28を形成した。他の構成は、上述した第1実施形態にかかる電子部品モジュール100に準じた。
In the
本実施形態にかかる電子部品モジュール200においては、基板2側においてはんだが流出した場合にも、はんだの流出を抑制することができる。
(第3実施形態)
図7に、本発明の第3実施形態にかかる電子部品モジュール300の要部を示す。In the
(Third embodiment)
FIG. 7 shows a main part of an
電子部品モジュール300においては、環状電極18の高さh1を、柱状電極7の高さh2よりも高くした。この結果、環状電極18が基板電極2に当接し、パッド電極5と環状電極18と基板電極2とで空間13が形成され、空間13内には樹脂10は充填されない。電子部品モジュール300の他の構成は、上述した第1実施形態にかかる電子部品モジュール100に準じた。
In the
電子部品モジュール300においては、柱状電極7およびはんだバンプ9が環状電極18で完全に囲まれ、空間13が形成されているため、はんだスプラッシュが発生しない。仮にはんだスプラッシュが発生しても、環状電極18に囲まれているため、溶融したはんだが環状電極18を超えて周辺に漏れ出すことはない。
In the
1:基板
2:基板電極
4:電子部品素子(半導体素子など)
5:パッド電極
6:絶縁膜
7:柱状電極
8、18:環状電極
9:はんだバンプ
9’:はんだ層
10:樹脂
11:シード層
12、13:レジスト
27:(基板電極に形成された)柱状電極
28:(基板電極に形成された)環状電極
100、200、300:電子部品モジュール1: Substrate 2: Substrate electrode 4: Electronic component element (semiconductor element, etc.)
5: Pad electrode 6: Insulating film 7:
Claims (7)
前記パッド電極上に形成された柱状電極と、
前記柱状電極の先端に形成されたはんだバンプと、
前記柱状電極を囲むように前記パッド電極上に形成された環状電極とを備えている、
ことを特徴とする電子部品モジュール。An electronic component element having a plurality of pad electrodes is arranged on a substrate on which a plurality of substrate electrodes are formed so that the substrate electrodes and the pad electrodes face each other, and the substrate electrodes and the pad electrodes have solder bumps. In an electronic component module that is electrically connected via
A columnar electrode formed on the pad electrode;
A solder bump formed at the tip of the columnar electrode;
An annular electrode formed on the pad electrode so as to surround the columnar electrode;
An electronic component module characterized by that.
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