JPWO2012070637A1 - Thioether-containing alkoxysilane derivatives and uses thereof - Google Patents
Thioether-containing alkoxysilane derivatives and uses thereof Download PDFInfo
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- JPWO2012070637A1 JPWO2012070637A1 JP2012545799A JP2012545799A JPWO2012070637A1 JP WO2012070637 A1 JPWO2012070637 A1 JP WO2012070637A1 JP 2012545799 A JP2012545799 A JP 2012545799A JP 2012545799 A JP2012545799 A JP 2012545799A JP WO2012070637 A1 JPWO2012070637 A1 JP WO2012070637A1
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- thioether
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- containing alkoxysilane
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- 150000003568 thioethers Chemical class 0.000 title claims abstract description 41
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims abstract description 19
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 11
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims description 24
- -1 thiol compound Chemical class 0.000 claims description 20
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 15
- 125000000466 oxiranyl group Chemical group 0.000 claims description 9
- 239000004480 active ingredient Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 11
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000000126 substance Substances 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 description 16
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 13
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- 239000003973 paint Substances 0.000 description 10
- 238000009835 boiling Methods 0.000 description 9
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- 239000000047 product Substances 0.000 description 8
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- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
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- 238000004519 manufacturing process Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
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- 239000000463 material Substances 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- 0 CC*C(C)C(OCC1O[C@]1NC)=O Chemical compound CC*C(C)C(OCC1O[C@]1NC)=O 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 4
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 4
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- 229920000647 polyepoxide Polymers 0.000 description 4
- 150000003573 thiols Chemical class 0.000 description 4
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 239000007810 chemical reaction solvent Substances 0.000 description 3
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- 125000005369 trialkoxysilyl group Chemical group 0.000 description 3
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 2
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 2
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- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
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- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
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- 150000003141 primary amines Chemical class 0.000 description 2
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- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
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- FGYADSCZTQOAFK-UHFFFAOYSA-N 1-methylbenzimidazole Chemical compound C1=CC=C2N(C)C=NC2=C1 FGYADSCZTQOAFK-UHFFFAOYSA-N 0.000 description 1
- SEULWJSKCVACTH-UHFFFAOYSA-N 1-phenylimidazole Chemical compound C1=NC=CN1C1=CC=CC=C1 SEULWJSKCVACTH-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- BAXXIBXLWXEPGF-UHFFFAOYSA-N 2-benzyl-1-methylbenzimidazole Chemical compound N=1C2=CC=CC=C2N(C)C=1CC1=CC=CC=C1 BAXXIBXLWXEPGF-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
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- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
- C07F7/1804—Compounds having Si-O-C linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
無機基材への密着性向上効果に優れる新規なチオエーテル含有アルコキシシラン誘導体であって、下記式1で表されるチオエーテル含有アルコキシシラン誘導体である。
【化1】
(式中のaおよびbは0〜2の整数であり、cは1〜3の整数であり、a+b+c=3である。R1は下記式2で表される3価の基であり、R2は−CH2−CHR5−あるいは−CR5(CH3)−で表される2価の基あり、R3は−CH2−CHR6−あるいは−CR6(CH3)−で表される2価の基あり、R5とR6はそれぞれ独立に水素原子またはメチル基であり、R4はメチル基またはエチル基である。)
【化2】
(式中のmは1または2である。)A novel thioether-containing alkoxysilane derivative excellent in the effect of improving the adhesion to an inorganic substrate, which is a thioether-containing alkoxysilane derivative represented by the following formula 1.
[Chemical 1]
(In the formula, a and b are integers of 0 to 2, c is an integer of 1 to 3, and a + b + c = 3. R 1 is a trivalent group represented by the following formula 2; 2 is a divalent group represented by —CH 2 —CHR 5 — or —CR 5 (CH 3 ) —, and R 3 is represented by —CH 2 —CHR 6 — or —CR 6 (CH 3 ) —. R 5 and R 6 are each independently a hydrogen atom or a methyl group, and R 4 is a methyl group or an ethyl group.)
[Chemical 2]
(In the formula, m is 1 or 2.)
Description
本発明は、密着性向上剤等に好適に用いられる新規なチオエーテル含有アルコキシシラン誘導体とその用途に関する。 The present invention relates to a novel thioether-containing alkoxysilane derivative suitably used for an adhesion improver and the like and its use.
従来より、各種塗料をガラス等の無機基材に塗工する際に、密着性を向上させる目的でシランカップリング剤が塗料に添加されている(例えば、特許文献1を参照)。 Conventionally, when various paints are applied to an inorganic base material such as glass, a silane coupling agent has been added to the paint for the purpose of improving adhesion (see, for example, Patent Document 1).
しかしながら、シランカップリング剤の多くは炭素数1〜5個のアルキル基を主骨格とした構造であるため沸点が低く、高温塗工が必要な塗料に対しては多量に(例えば10〜20重量%)添加する必要があった。また、1分子当たりに1つのトリアルコキシシリル基しか有さないため密着性向上効果も充分とは言えず、例えばチタン、ジルコニウム等の塩や、イミダゾール等のアミン、リン酸エステル、ウレタン樹脂、チオール化合物等の密着性助剤も同時に添加することによって、初めて密着性を達成できる場合も多かった。しかしながら、これら密着性助剤の配合は工程数が増加するだけではなく、塗料特性を損なわない密着性助剤種や添加量の最適化作業が必要であった。また、トリアルコキシシリル基と反応性官能基を有するシランカップリング剤の多くはトリアルコキシシリル基と反応性基を結ぶ主骨格が炭素-炭素結合により構成されている。そのため、分子が剛直でアルコキシシリル基あるいは反応性基の反応効率が低くなっていた。 However, since most of the silane coupling agents have a structure having an alkyl group having 1 to 5 carbon atoms as the main skeleton, the boiling point is low, and a large amount (for example, 10 to 20 weights) is required for paints requiring high temperature coating. %) Had to be added. Moreover, since it has only one trialkoxysilyl group per molecule, it cannot be said that the effect of improving the adhesion is sufficient. For example, a salt such as titanium or zirconium, an amine such as imidazole, a phosphate ester, a urethane resin, a thiol In many cases, adhesion can be achieved for the first time by adding adhesion aids such as compounds at the same time. However, the formulation of these adhesion assistants not only increases the number of steps, but also requires an optimization operation of the adhesion assistant species and addition amount that do not impair the coating properties. In many silane coupling agents having a trialkoxysilyl group and a reactive functional group, the main skeleton connecting the trialkoxysilyl group and the reactive group is constituted by a carbon-carbon bond. Therefore, the molecule is rigid and the reaction efficiency of the alkoxysilyl group or reactive group is low.
そこで、本発明は上記課題に鑑みて成し遂げられたものであり、その目的は、無機基材への密着性向上効果に優れる新規なチオエーテル含有アルコキシシラン誘導体とその用途を提供することにある。 The present invention has been accomplished in view of the above problems, and an object of the present invention is to provide a novel thioether-containing alkoxysilane derivative excellent in the effect of improving the adhesion to an inorganic substrate and its use.
本発明者らは上記課題を解決するために鋭意検討を重ねた結果、特定の構造を有するチオエーテル含有アルコキシシラン誘導体が優れた密着性向上効果を有することを見出し、発明を完成するに至った。すなわち、本発明は次の〔1〕から〔4〕である。
〔1〕下記式1で表されるチオエーテル含有アルコキシシラン誘導体。
(式中のaおよびbは0〜2の整数であり、cは1〜3の整数であり、a+b+c=3である。R1は下記式2で表される3価の基であり、R2は−CH2−CHR5−あるいは−CR5(CH3)−で表される2価の基あり、R3は−CH2−CHR6−あるいは−CR6(CH3)−で表される2価の基あり、R5とR6はそれぞれ独立に水素原子またはメチル基であり、R4はメチル基またはエチル基である。)
(式中のmは1または2である。)
〔2〕下記式3で表されるアルコキシシリル基含有化合物と、下記式4で表される多価チオール化合物とを反応させてなる、〔1〕に記載のチオエーテル含有アルコキシシラン誘導体。
(式中のR4はメチル基またはエチル基であり、R5は水素原子またはメチル基である。)
(式中のmは1または2である。)
〔3〕さらに、下記式5で表されるオキシラン環含有化合物を同時に反応させてなる、〔2〕に記載のチオエーテル含有アルコキシシラン誘導体。
(R6は水素原子またはメチル基である。)
〔4〕〔1〕〜〔3〕のいずれかに記載のチオエーテル含有アルコキシシラン誘導体を有効成分とする密着性向上剤。As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that a thioether-containing alkoxysilane derivative having a specific structure has an excellent adhesion improving effect, and have completed the invention. That is, the present invention includes the following [1] to [4].
[1] A thioether-containing alkoxysilane derivative represented by the following
(In the formula, a and b are integers of 0 to 2, c is an integer of 1 to 3, and a + b + c = 3. R 1 is a trivalent group represented by the following
(In the formula, m is 1 or 2.)
[2] The thioether-containing alkoxysilane derivative according to [1], wherein an alkoxysilyl group-containing compound represented by the following
(In the formula, R 4 is a methyl group or an ethyl group, and R 5 is a hydrogen atom or a methyl group.)
(In the formula, m is 1 or 2.)
[3] The thioether-containing alkoxysilane derivative according to [2], wherein the oxirane ring-containing compound represented by the following
(R 6 is a hydrogen atom or a methyl group.)
[4] An adhesion improver comprising the thioether-containing alkoxysilane derivative according to any one of [1] to [3] as an active ingredient.
本発明のチオエーテル含有アルコキシシラン誘導体は、優れた密着性向上効果を有しており、塗料に例えば0.1〜10重量%という比較的少量添加することで、密着性助剤の添加を必要とすることなく塗料に高い密着性を付与することが可能である。 The thioether-containing alkoxysilane derivative of the present invention has an excellent adhesion improving effect and requires the addition of an adhesion assistant by adding a relatively small amount of, for example, 0.1 to 10% by weight to the paint. It is possible to impart high adhesion to the paint without having to do so.
チオールの結合角は炭素の結合角よりも大きいため、分子内にチオールエーテル基をもつ分子は炭素のみで結合している分子よりも多彩な構造を取ることができる。そのため本発明のチオエーテル含有アルコキシシラン誘導体は、炭素のみ結合しているアルココキシシラン誘導体よりも基材への配向性が高まり密着性の向上が可能である。加えて、本発明は従来のシランカップリング剤に比べてチオエーテルの結合角が広いため、分子構造に自由度が増し密な分子配向を取ることができ、同分子量のものと比べると沸点が高く、且つ低揮発性となっている。そのため、例えば塗料に0.1〜10重量%という比較的少量添加するだけでも、密着性助剤の添加を必要とすることなく塗料に高いシリコン基板への密着性を付与することが可能である。 Since the bond angle of thiol is larger than the bond angle of carbon, a molecule having a thiol ether group in the molecule can have a variety of structures than a molecule bonded only with carbon. Therefore, the orientation of the thioether-containing alkoxysilane derivative of the present invention to the base material is higher than that of the alkoxysilane derivative bonded only with carbon, and the adhesion can be improved. In addition, the present invention has a wider bond angle of thioether compared to conventional silane coupling agents, so the degree of freedom in the molecular structure can be increased and dense molecular orientation can be achieved, and the boiling point is higher than that of the same molecular weight. And low volatility. Therefore, for example, even if a relatively small amount of 0.1 to 10% by weight is added to the paint, it is possible to impart high adhesion to the silicon substrate to the paint without requiring the addition of an adhesion aid. .
本発明のチオエーテル含有アルコキシシラン誘導体は、主骨格にイソシアヌレート環を有するため基材への局在性に優れ、分子末端に存在するアルコキシシラン基が基材との間に化学結合を形成する、あるいは物理吸着することにより優れた密着性を発揮する。また、分子中に存在するチオエーテル結合は、CやOやNといった原子での結合と比べ結合角や結合長が柔軟に変化でき、様々な立体配座を取ることができるため、基材への配向性が高まると考えられる。本発明は低揮発性の多価チオール化合物とアルコキシシリル基含有化合物との反応生成物であるため、一般的なアルコキシシリル基含有化合物と比べ低揮発性となる。加えて、チオエーテル結合に由来するS原子は、CやOやNといった原子の最外殻がL殻であるのに対し、最外殻がM殻であるため、より大きな原子半径を有する。そのため、S原子を有することにより、より遠方に存在する分子へと相互作用を及ぼすことが可能となるため分子間力が向上し、低揮発化に繋がると考えられる。これにより本発明は、例えば塗料に0.1〜10重量%という比較的少量添加でも密着性助剤の添加を必要とすることなく塗料に高い密着性を付与することが可能である。 Since the thioether-containing alkoxysilane derivative of the present invention has an isocyanurate ring in the main skeleton, it has excellent localization to the base material, and an alkoxysilane group present at the molecular end forms a chemical bond with the base material. Alternatively, it exhibits excellent adhesion by physical adsorption. In addition, the thioether bond existing in the molecule can change the bond angle and bond length more flexibly than the bond of atoms such as C, O, and N, and can take various conformations. It is considered that the orientation is increased. Since the present invention is a reaction product of a low-volatility polyvalent thiol compound and an alkoxysilyl group-containing compound, it is less volatile than a general alkoxysilyl group-containing compound. In addition, the S atom derived from the thioether bond has a larger atomic radius because the outermost shell of atoms such as C, O, and N is the L shell while the outermost shell is the M shell. Therefore, by having S atoms, it is possible to interact with molecules that are located farther away, so that the intermolecular force is improved, leading to low volatility. As a result, the present invention can impart high adhesion to the paint without requiring the addition of an adhesion aid even when added in a relatively small amount of 0.1 to 10% by weight, for example.
加えて、チオエーテル含有アルコキシシラン誘導体は密着性の付与効果に優れているため、塗料などに密着性を付与する密着性向上剤として有用である。 In addition, since the thioether-containing alkoxysilane derivative is excellent in adhesion imparting effect, it is useful as an adhesion improver that imparts adhesion to paints and the like.
<チオエーテル含有アルコキシシラン誘導体>
本発明のチオエーテル含有アルコキシシラン誘導体は、下記式1で表される化合物である。
(式中のaおよびbは0〜2の整数であり、cは1〜3の整数であり、a+b+c=3である。R1は下記式2で表される3価の基であり、R2は−CH2−CHR5−あるいは−CR5(CH3)−で表される2価の基あり、R3は−CH2−CHR6−あるいは−CR6(CH3)−で表される2価の基あり、R5とR6はそれぞれ独立に水素原子またはメチル基であり、R4はメチル基またはエチル基である。)
(式中のmは1または2である。)<Thioether-containing alkoxysilane derivative>
The thioether-containing alkoxysilane derivative of the present invention is a compound represented by the following
(In the formula, a and b are integers of 0 to 2, c is an integer of 1 to 3, and a + b + c = 3. R 1 is a trivalent group represented by the following
(In the formula, m is 1 or 2.)
オキシラン環と反応する官能基を有する樹脂組成物に本発明のチオエーテル含有アルコキシシラン誘導体を添加する場合には、bが1以上であることが、密着性向上効果の面で好ましい。 When adding the thioether containing alkoxysilane derivative of this invention to the resin composition which has a functional group which reacts with an oxirane ring, it is preferable in terms of the adhesive improvement effect that b is 1 or more.
式1で表される本発明のチオエーテル含有アルコキシシラン誘導体は多くの樹脂に相溶するため、幅広い用途に用いることが可能であり、少量の添加(例えば0.1〜10重量%)で高い密着性を得ることができる。例えば、本発明のチオエーテル含有アルコキシシラン誘導体を使用することで樹脂と無機材料の密着性を改善できるため、FRP(繊維強化プラスチック)、FRTP(繊維強化熱可塑性プラスチック)、レジンコンクリート、人造大理石、プラスチックマグネット、ゴムマグネット、磁気テープのような、無機材料と樹脂とを組み合わせた複合材料用の密着性向上剤として有用である。また、粘着剤、接着剤、封止剤、シーラントなどにおいて、樹脂成分中に本発明のチオエーテル含有アルコキシシラン誘導体を配合することで、無機基材との密着力向上に効果がある。特に、ガラス基板等の無機基材に各種塗料を塗工する際の密着性向上剤として好適である。 Since the thioether-containing alkoxysilane derivative of the present invention represented by Formula 1 is compatible with many resins, it can be used for a wide range of applications, and has high adhesion with a small amount of addition (for example, 0.1 to 10% by weight). Sex can be obtained. For example, since the adhesion between the resin and the inorganic material can be improved by using the thioether-containing alkoxysilane derivative of the present invention, FRP (fiber reinforced plastic), FRTP (fiber reinforced thermoplastic), resin concrete, artificial marble, plastic It is useful as an adhesion improver for composite materials combining inorganic materials and resins, such as magnets, rubber magnets, and magnetic tapes. In addition, in the pressure-sensitive adhesive, adhesive, sealant, sealant and the like, blending the thioether-containing alkoxysilane derivative of the present invention in the resin component is effective in improving the adhesion to the inorganic substrate. In particular, it is suitable as an adhesion improver when various paints are applied to an inorganic base material such as a glass substrate.
<チオエーテル含有アルコキシシラン誘導体の製造方法>
前記式1で表されるチオエーテル含有アルコキシシラン誘導体は、少なくともアルコキシシリル基〔−Si(OR4)3〕と二重結合を有する化合物(以下、A成分ということがある)と、チオール基(−SH)を有する多価チオール化合物(以下、B成分ということがある)とを反応させることによって得ることができる。具体的には、少なくとも下記式3で表されるアルコキシシリル基含有化合物と、下記式4で表される多価チオール化合物とを反応させることにより得ることができる。
(式中のR4はメチル基またはエチル基であり、R5は水素原子またはメチル基である。)
(式中のmは1または2の整数である。)<Method for producing thioether-containing alkoxysilane derivative>
The thioether-containing alkoxysilane derivative represented by the
(In the formula, R 4 is a methyl group or an ethyl group, and R 5 is a hydrogen atom or a methyl group.)
(In the formula, m is an integer of 1 or 2.)
式3で表されるアルコキシシリル基含有化合物としては、例えば、3−メタクリロキシプロピルトリメトキシシラン、3−アクリロキシプロピルトリメトキシシラン、3−メタクリロキシプロピルトリエトキシシラン、3−アクリロキシプロピルトリメトキシシランなどを使用することができる。
Examples of the alkoxysilyl group-containing compound represented by
式4で表される多価チオール化合物としては、m=2のトリス[(3-メルカプトプロピオニロキシ)−エチル]イソシアヌレートが挙げられる。式4中m=1の多価チオール化合物としては、イソシアヌル酸トリス(2-ヒドロキシエチル)とチオグリコール酸との合成物が挙げられる。式4においてm≧3の化合物を使用した場合、疎水性かつ非極性である炭化水素数が増えることにより、チオエーテル基の基材への配向性が弱まり、本発明の効果である密着性を得にくくなる。
Examples of the polyvalent thiol compound represented by
さらに、本発明のチオエーテル含有アルコキシシラン誘導体を、オキシラン環と反応する官能基を有する樹脂組成物に添加する場合には、式3で表されるアルコキシシリル基含有化合物と、式4で表される多価チオール化合物とに加えて、下記式5で表されるオキシラン環含有化合物も同時に反応させることが好ましい。これにより、より高い密着性が付与できる。
(R6は水素原子またはメチル基である。)Further, when the thioether-containing alkoxysilane derivative of the present invention is added to a resin composition having a functional group that reacts with an oxirane ring, the alkoxysilyl group-containing compound represented by
(R 6 is a hydrogen atom or a methyl group.)
式5で表されるオキシラン環含有化合物としては、グリシジル(メタ)アクリレートが上げられる。
Examples of the oxirane ring-containing compound represented by
A成分とB成分とは、触媒またはラジカル発生剤の存在下で反応させることが好ましい。触媒やラジカル発生剤を添加すれば、より短時間で且つ高収率にて反応させることができるからである。 The A component and the B component are preferably reacted in the presence of a catalyst or a radical generator. This is because if a catalyst or a radical generator is added, the reaction can be performed in a shorter time and with a higher yield.
触媒としてはアミン系の塩基触媒が好ましく、一級、二級あるいは三級アミン類、もしくはイミダゾール系化合物が使用できる。例えば、一級アミンとしてメチルアミン、エチルアミン、プロピルアミン、ブチルアミン、エチレンジアミン等、二級アミンとしてジメチルアミン、ジエチルアミン、ジプロピルアミン、メチルエチルアミン、ジフェニルアミン等、三級アミンとしてトリメチルアミン、トリエチルアミン、トリプロピルアミン、トリフェニルアミン、1,8−ジアザビシクロ(5,4,0)−ウンデセン−7、2,4,6−トリス(ジメチルアミノメチル)フェノール等が挙げられる。イミダゾール系化合物として、例えば、1−メチルイミダゾール、1,2−ジメチルイミダゾール、1,4−ジメチル−2−エチルイミダゾール、1−フェニルイミダゾール等のイミダゾール同族体、1−メチル−2−オキシメチルイミダゾール、1−メチル−2−オキシエチルイミダゾール等のオキシアルキル誘導体、1−メチル−4(5)−ニトロイミダゾール、1,2−ジメチル−5(4)−アミノイミダゾール等のニトロおよびアミノ誘導体、ベンゾイミダゾール、1−メチルベンゾイミダゾール、1−メチル−2−ベンジルベンゾイミダゾール等が挙げられる。 The catalyst is preferably an amine base catalyst, and primary, secondary or tertiary amines, or imidazole compounds can be used. For example, methylamine, ethylamine, propylamine, butylamine, ethylenediamine etc. as primary amines, dimethylamine, diethylamine, dipropylamine, methylethylamine, diphenylamine etc. as secondary amines, trimethylamine, triethylamine, tripropylamine, Examples include phenylamine, 1,8-diazabicyclo (5,4,0) -undecene-7, 2,4,6-tris (dimethylaminomethyl) phenol. Examples of imidazole compounds include 1-methylimidazole, 1,2-dimethylimidazole, 1,4-dimethyl-2-ethylimidazole, imidazole analogues such as 1-phenylimidazole, 1-methyl-2-oxymethylimidazole, Oxyalkyl derivatives such as 1-methyl-2-oxyethylimidazole, nitro and amino derivatives such as 1-methyl-4 (5) -nitroimidazole, 1,2-dimethyl-5 (4) -aminoimidazole, benzimidazole, Examples thereof include 1-methylbenzimidazole and 1-methyl-2-benzylbenzimidazole.
ラジカル発生剤としては、過酸化物もしくはアゾ化合物が好ましい。過酸化物として例えば、過酸化ジベンゾイル、tert−ブチルペルオキシ−2−エチルヘキサノアート、ジラウロイルペルオキシド、tert−ブチルハイドロパーオキサイドなどが挙げられる。アゾ化合物としては例えば、アゾビス(イソ−ブチロニトリル)および2,2’−アゾビス(2−メチルブタンニトリル)などが挙げられる。 As the radical generator, a peroxide or an azo compound is preferable. Examples of the peroxide include dibenzoyl peroxide, tert-butylperoxy-2-ethylhexanoate, dilauroyl peroxide, tert-butyl hydroperoxide, and the like. Examples of the azo compound include azobis (iso-butyronitrile) and 2,2'-azobis (2-methylbutanenitrile).
このA・B二成分は、A成分の二重結合とB成分のチオール基とが、下記式6で表される反応式で反応する。なお、Xは水素原子またはメチル基、YはA成分の二重結合に結合するX以外の残基を表し、ZはB成分のチオール基に結合する残基を表す。
In the two components A and B, the double bond of the A component and the thiol group of the B component react with each other according to the reaction formula represented by the following
式6に示すように、A成分の二重結合を形成する2つの炭素のどちらもチオールのSと結合する。2つの生成物の生成比率は反応条件により異なり、例えば本反応の触媒にアミンなどの塩基触媒を反応系に添加した場合には、生成物(1)が多く生成し、ラジカル発生剤を反応系に添加した場合には生成物(2)が多く生成する傾向にある。多くの場合、製造後のチオエーテル含有アルコキシシラン誘導体は生成物(1)と(2)の混合物となっている。
As shown in
また、チオエーテル含有アルコキシシラン誘導体を製造するにあたり、B成分はチオール基を3個有しているため、式7のようにB成分のチオール基のうち一部がA成分と反応した生成物を得ることができる。なお、VはB成分のチオール基に結合する残基(イソシアヌレート環含有残基)を表す。 Further, when the thioether-containing alkoxysilane derivative is produced, since the B component has three thiol groups, a product in which a part of the thiol groups of the B component reacts with the A component as shown in Formula 7 is obtained. be able to. V represents a residue (isocyanurate ring-containing residue) bonded to the B component thiol group.
式7におけるA成分の付加個数が式1のcに相当する。多くの場合、製造後のチオエーテル含有アルコキシシラン誘導体は付加反応した置換基の数が異なる物質の混合物となっている。
The number of added A components in Equation 7 corresponds to c in
チオエーテル含有アルコキシシラン誘導体の製造方法においては、5℃以上の温度で反応させることができるが、5時間以内といった短時間で反応させるためには、60〜80℃において塩基触媒やラジカル発生剤を添加することが好ましい。 In the method for producing a thioether-containing alkoxysilane derivative, the reaction can be carried out at a temperature of 5 ° C. or higher, but in order to react in a short time such as within 5 hours, a base catalyst or radical generator is added at 60 to 80 ° C. It is preferable to do.
チオエーテル含有アルコキシシラン誘導体の製造方法においては、無溶剤でも反応を進行させることができるが、低温で反応させる場合など、粘度を下げたい場合には溶剤を加えて反応させることもできる。その際には、アルコキシシリル基、二重結合、チオール基と反応しない溶剤、例えばアルコール類、ケトン類、エステル類または芳香族類が好ましい。 In the method for producing a thioether-containing alkoxysilane derivative, the reaction can be allowed to proceed even without a solvent, but when the viscosity is to be lowered, for example, when the reaction is carried out at a low temperature, the reaction can be carried out by adding a solvent. In that case, a solvent that does not react with an alkoxysilyl group, a double bond, or a thiol group, for example, alcohols, ketones, esters, or aromatics is preferable.
アルコキシシリル基、二重結合、チオール基と反応しないアルコール類としては、炭素数が3以下で一級であるものが好ましく、また、沸点が反応温度よりも高い(例えば沸点が50〜190℃)ものが好ましい。その理由は、沸点が上記範囲よりも低い場合には、工業化した場合の製造が困難になるためであり、上記範囲よりも高い場合には、溶剤の除去が必要な場合に溶剤留去が困難になるためである。したがって、沸点はできるだけ高いものがよい。また、アルコール類としてより好ましいのは、メタノール、エタノールである。なぜなら、反応溶剤であるアルコール類と上記式3で示すアルコキシシリル基含有化合物とが反応中にエステル交換反応を起こす可能性があり、目的生成物の収率が低下する恐れがあるからである。そのため、上記式3においてR4がメチル基の化合物を用いた場合には反応溶剤としてメタノールを、R4がエチル基の化合物を用いた場合には反応溶剤としてエタノールを使用することが好ましい。Alcohols that do not react with alkoxysilyl groups, double bonds, and thiol groups are preferably those having 3 or less carbon atoms and primary, and those having a boiling point higher than the reaction temperature (for example, a boiling point of 50 to 190 ° C.). Is preferred. The reason is that when the boiling point is lower than the above range, it is difficult to produce when industrialized. When the boiling point is higher than the above range, it is difficult to remove the solvent when the solvent needs to be removed. Because it becomes. Therefore, the boiling point should be as high as possible. More preferred as alcohols are methanol and ethanol. This is because the alcohol as the reaction solvent and the alkoxysilyl group-containing compound represented by the
アルコキシシリル基、二重結合、チオール基と反応しないケトン類としては、沸点が反応温度よりも高いものが好ましい、また溶解性の観点から炭素数6以下のものが好ましい。これらを満たすものとして、例えばメチルエチルケトン、メチルイソブチルケトン等が挙げられる。 As ketones that do not react with an alkoxysilyl group, double bond, or thiol group, those having a boiling point higher than the reaction temperature are preferred, and those having 6 or less carbon atoms are preferred from the viewpoint of solubility. Examples of those satisfying these include methyl ethyl ketone and methyl isobutyl ketone.
アルコキシシリル基、二重結合、チオール基と反応しないエステル類としては、沸点が反応温度よりも高いものが好ましい、また溶解性の観点から直鎖炭素数6以下のものが好ましい。これらを満たすものとして、例えば酢酸エチル、酢酸メチル、酢酸ブチル、酢酸メトキシブチル、酢酸セロソルブ、酢酸アミル、乳酸メチル、乳酸エチル、乳酸ブチル等が挙げられる。 As the esters that do not react with the alkoxysilyl group, double bond, or thiol group, those having a boiling point higher than the reaction temperature are preferred, and those having a straight chain carbon number of 6 or less are preferred from the viewpoint of solubility. Examples of those satisfying these include ethyl acetate, methyl acetate, butyl acetate, methoxybutyl acetate, cellosolve acetate, amyl acetate, methyl lactate, ethyl lactate, and butyl lactate.
<密着性向上剤>
本発明のチオエーテル含有アルコキシシラン誘導体は、特にガラスや金属等の無機基材に対して高い密着性向上性能を有していることから、密着性向上剤として用いることができる。チオエーテル含有アルコキシシラン誘導体を有効成分とする密着性向上剤は、エポキシ樹脂、ウレタン樹脂、アクリル樹脂、ポリイミド樹脂、二重結合を有する化合物等に配合することによって、高い密着性向上効果を発揮することができる。<Adhesion improver>
The thioether-containing alkoxysilane derivative of the present invention can be used as an adhesion improver because it has a high adhesion improving performance especially for inorganic substrates such as glass and metal. Adhesion improver comprising thioether-containing alkoxysilane derivative as an active ingredient should exhibit high adhesion improvement effect by blending with epoxy resin, urethane resin, acrylic resin, polyimide resin, compound having double bond, etc. Can do.
さらに、式1で表される化合物であり、aが0でないチオエーテル含有アルコキシシラン誘導体はチオール基を有し、エポキシ基、二重結合、イソシアネート基と反応する。このため、式1においてaが0でないチオエーテル含有アルコキシシラン誘導体をエポキシ樹脂、アクリル樹脂、ウレタン樹脂、二重結合を有する化合物に添加することにより、さらに高い密着性効果を発揮することができる。
Furthermore, a thioether-containing alkoxysilane derivative that is a compound represented by
さらに、式1で表される化合物であり、bが0でないチオエーテル含有アルコキシシラン誘導体はオキシラン環を有し、エポキシ基、カルボキシル基、フェノール性水酸基、酸無水物基、アミノ基、アミド基と反応する。このため、式1においてbが0でないチオエーテル含有アルコキシシラン誘導体をオキシラン環と反応する官能基を有する樹脂組成物に添加することにより、さらに高い密着性効果を発揮することができる。
Further, the thioether-containing alkoxysilane derivative represented by the
チオエーテル含有アルコキシシラン誘導体を有効成分とする密着性向上剤は、有効成分として樹脂に対し好ましくは0.1〜30質量%、さらに好ましくは0.1〜15質量%添加すると高い密着性を発揮することができる。 The adhesion improver comprising a thioether-containing alkoxysilane derivative as an active ingredient preferably exhibits high adhesion when added to the resin as an active ingredient, preferably 0.1 to 30% by mass, and more preferably 0.1 to 15% by mass. be able to.
以下に、合成例、実施例および比較例を挙げて本発明をさらに具体的に説明する。各実施例および比較例で用いた測定方法と評価方法を下記に示す。 Hereinafter, the present invention will be described more specifically with reference to synthesis examples, examples and comparative examples. The measurement methods and evaluation methods used in each example and comparative example are shown below.
<赤外線吸収スペクトル分析(IR)>
機種;日本分光(株)製 FT/IR-600
セル;KBr上に展開、分解;4cm−1、積算回数;16回
<核磁気共鳴スペクトル分析(NMR)>
機種;日本ブルカー(株)製、400MHz−Advance400、条件;積算回数16回、溶媒;重クロロホルム
<粘度>
機種;東機産業(株)製(R型粘度計)、温度;25℃
<密着性評価>
硬化膜を形成したサンプルを温度121℃、相対湿度(RH)100%で30時間処理した後、JIS K5600−5−6に規定される塗膜の機械的性質−付着性(クロスカット法)試験法で評価を行った。この試験で、全く剥離の無いものを「○」とした。さらには、温度121℃、相対湿度(RH)100%で40時間処理した後のサンプルに対し同様な試験を行った結果、全く剥離の無いものを「◎」とした。剥離が観測されたものは「×」とした。<Infrared absorption spectrum analysis (IR)>
Model: JASCO Corporation FT / IR-600
Cell: Expanded on KBr, decomposed; 4 cm −1 , integration number: 16 times <Nuclear magnetic resonance spectrum analysis (NMR)>
Model: Nippon Bruker Co., Ltd., 400 MHz-Advanced 400, conditions: 16 times of accumulation, solvent: heavy chloroform <viscosity>
Model: Toki Sangyo Co., Ltd. (R type viscometer), temperature: 25 ° C
<Adhesion evaluation>
The sample on which the cured film was formed was treated at a temperature of 121 ° C. and a relative humidity (RH) of 100% for 30 hours, and then the mechanical property-adhesiveness (cross-cut method) test of the coating film defined in JIS K5600-5-6 Evaluation was performed by the law. In this test, “o” indicates that there was no peeling at all. Furthermore, as a result of performing a similar test on the sample after being treated at a temperature of 121 ° C. and a relative humidity (RH) of 100% for 40 hours, a sample having no separation was designated as “◎”. The case where peeling was observed was indicated as “x”.
以下に、本実施例および比較例で用いた試薬を示す。
<アルコキシシリル基を有する化合物:A成分>
A−1:3−メタクリロキシプロピルトリメトキシシラン。その構造を下記式12に示す。
<Compound having alkoxysilyl group: Component A>
A-1: 3-methacryloxypropyltrimethoxysilane. The structure is shown in the following formula 12.
A−2:3−アクリロキシプロピルトリメトキシシラン。その構造を下記式13に示す。
A−3:3−メタクリロキシプロピルトリエトキシシラン。その構造を下記式14に示す。
<多価チオール化合物:B成分>
B−1:トリス[(3−メルカプトプロピオニロキシ)−エチル]イソシアヌレート。その構造を下記式15に示す(粘度5.4Pa・s)。
B-1: Tris [(3-mercaptopropionyloxy) -ethyl] isocyanurate. The structure is shown in the following formula 15 (viscosity 5.4 Pa · s).
β−1:メチル−3−メルカプトプロピオネート。その構造を下記式16に示す。
<オキシラン環含有化合物:C成分>
C−1:グリシジルメタクリレート。その構造を下記式17に示す。
C-1: Glycidyl methacrylate. The structure is shown in the following formula 17.
<アミン:触媒>
ジアザビシクロウンデセン(DBU)。<Amine: Catalyst>
Diazabicycloundecene (DBU).
(実施例1−1〜1−4、比較例1)
セパラブルの4つ口フラスコに温度計と還流管を備え、内部を窒素雰囲気にした。この4つ口フラスコに、下記表1に従いA成分、B成分およびC成分を仕込み、表1の条件に従い90℃で8時間反応させた。反応後の粘度を表1に示す。(Examples 1-1 to 1-4, Comparative Example 1)
A separable four-necked flask was equipped with a thermometer and a reflux tube, and the inside was made a nitrogen atmosphere. Into this four-neck flask, A component, B component and C component were charged according to the following Table 1, and reacted at 90 ° C. for 8 hours according to the conditions of Table 1. Table 1 shows the viscosity after the reaction.
各実施例のIRの結果を次に示す。
<IRの結果>
(実施例1−1)
3629cm−1:92%T、2945cm−1:51%T、2841cm−1:59%T、1736cm−1:21%T、1697cm−1:18%T、1462cm−1:26%T、1371cm−1:70%T、1192cm−1:32%T、1086cm−1:21%T、820cm−1:45%T、764cm−1:52%TThe IR results for each example are shown below.
<Results of IR>
(Example 1-1)
3629cm -1: 92% T, 2945cm -1: 51% T, 2841cm -1: 59% T, 1736cm -1: 21% T, 1697cm -1: 18% T, 1462cm -1: 26% T, 1371cm - 1 : 70% T, 1192 cm −1 : 32% T, 1086 cm −1 : 21% T, 820 cm −1 : 45% T, 764 cm −1 : 52% T
(実施例1−2)
3627cm−1:91%T、2947cm−1:65%T、2841cm−1:76%T、2571cm−1:97%T、2360cm−1:98%T、1736cm−1:14%T、1693cm−1:9%T、1462cm−1:15%T、1352cm−1:57%T、1284cm−1:62%T、1244cm−1:42%T、1159cm−1:32%T、1084cm−1:33%T、822cm−1:59%T、764cm−1:46%T(Example 1-2)
3627cm -1: 91% T, 2947cm -1: 65% T, 2841cm -1: 76% T, 2571cm -1: 97% T, 2360cm -1: 98% T, 1736cm -1: 14% T, 1693cm - 1 : 9% T, 1462 cm −1 : 15% T, 1352 cm −1 : 57% T, 1284 cm −1 : 62% T, 1244 cm −1 : 42% T, 1159 cm −1 : 32% T, 1084 cm −1 : 33% T, 822 cm −1 : 59% T, 764 cm −1 : 46% T
(実施例1−3)
2925cm−1:63%T、1734cm−1:74%T、1697cm−1:73%T、1462cm−1:69%T、1373cm−1:84%T、1080cm−1:76%T、958cm−1:83%T、764cm−1:80%T(Example 1-3)
2925 cm −1 : 63% T, 1734 cm −1 : 74% T, 1697 cm −1 : 73% T, 1462 cm −1 : 69% T, 1373 cm −1 : 84% T, 1080 cm −1 : 76% T, 958 cm − 1 : 83% T, 764 cm −1 : 80% T
(実施例1−4)
3527cm−1:77%T、2949cm−1:49%T、2841cm−1:66%T、2571cm−1:92%T、2360cm−1:93%T、1734cm−1:16%T、1695cm−1:13%T、1462cm−1:17%T、1371cm−1:44%T、1352cm−1:46%T、1161cm−1:23%T、1084cm−1:25%T、820cm−1:49%T、764cm−1:34%T、671cm−1:89%T(Example 1-4)
3527 cm −1 : 77% T, 2949 cm −1 : 49% T, 2841 cm −1 : 66% T, 2571 cm −1 : 92% T, 2360 cm −1 : 93% T, 1734 cm −1 : 16% T, 1695 cm − 1 : 13% T, 1462 cm −1 : 17% T, 1371 cm −1 : 44% T, 1352 cm −1 : 46% T, 1161 cm −1 : 23% T, 1084 cm −1 : 25% T, 820 cm −1 : 49% T, 764 cm −1 : 34% T, 671 cm −1 : 89% T
<NMRの結果>
実施例1−1のNMRスペクトルを図1に、実施例1−2のNMRスペクトルを図2に、実施例1−3のNMRスペクトルを図3に、実施例1−4のNMRスペクトルを図4にそれぞれ示す。<Results of NMR>
FIG. 1 shows the NMR spectrum of Example 1-1, FIG. 2 shows the NMR spectrum of Example 1-2, FIG. 3 shows the NMR spectrum of Example 1-3, and FIG. 4 shows the NMR spectrum of Example 1-4. Respectively.
図1のNMRスペクトルにおけるピークの帰属を下記の式18に示す。
a:3.5〜3.6ppm、b:0.6〜0.7ppm、c:1.7〜1.8、d:4.3〜4.4ppm、e:2.5〜2.7ppm、f:1.1〜1.3ppm、g:2.6〜2.8ppm、h:2.6〜2.8ppm、i:2.6〜2.7ppm、j:4.2〜4.4ppm、k:3.4〜3.5ppmThe assignment of peaks in the NMR spectrum of FIG.
a: 3.5 to 3.6 ppm, b: 0.6 to 0.7 ppm, c: 1.7 to 1.8, d: 4.3 to 4.4 ppm, e: 2.5 to 2.7 ppm, f: 1.1-1.3 ppm, g: 2.6-2.8 ppm, h: 2.6-2.8 ppm, i: 2.6-2.7 ppm, j: 4.2-4.4 ppm, k: 3.4 to 3.5 ppm
図2のNMRスペクトルにおけるピークの帰属を下記の式19に示す。
a:3.5〜3.6ppm、b:0.6〜0.7ppm、c:1.7〜1.8、d:4.3〜4.4ppm、e:2.5〜2.7ppm、g:2.6〜2.8ppm、h:2.6〜2.8ppm、i:2.6〜2.7ppm、j:4.1〜4.2ppm、k:3.5〜3.6ppm、l:3.4〜3.5ppm、m:4.0〜4.2ppm、n:2.4〜2.6ppm、o:2.7〜2.9ppm、p:1.6〜1.7ppmThe assignment of the peak in the NMR spectrum of FIG.
a: 3.5 to 3.6 ppm, b: 0.6 to 0.7 ppm, c: 1.7 to 1.8, d: 4.3 to 4.4 ppm, e: 2.5 to 2.7 ppm, g: 2.6-2.8 ppm, h: 2.6-2.8 ppm, i: 2.6-2.7 ppm, j: 4.1-4.2 ppm, k: 3.5-3.6 ppm, l: 3.4-3.5 ppm, m: 4.0-4.2 ppm, n: 2.4-2.6 ppm, o: 2.7-2.9 ppm, p: 1.6-1.7 ppm
図3のNMRスペクトルにおけるピークの帰属を下記の式20に示す。
a:1.2〜1.3ppm、a’:3.7〜3.9ppm、b:0.6〜0.7ppm、c:1.7〜1.8、d:4.3〜4.4ppm、e:2.5〜2.7ppm、f:1.1〜1.3ppm、g:2.6〜2.8ppm、h:2.6〜2.8ppm、i:2.6〜2.7ppm、j:4.1〜4.2ppm、k:3.7〜3.8ppm、l:3.7〜3.8ppm、m:4.0〜4.2ppm、n:2.5〜2.6ppm、o:2.7〜2.9ppm、p:1.7〜1.8ppmThe assignment of peaks in the NMR spectrum of FIG.
a: 1.2 to 1.3 ppm, a ′: 3.7 to 3.9 ppm, b: 0.6 to 0.7 ppm, c: 1.7 to 1.8, d: 4.3 to 4.4 ppm E: 2.5-2.7 ppm, f: 1.1-1.3 ppm, g: 2.6-2.8 ppm, h: 2.6-2.8 ppm, i: 2.6-2.7 ppm , J: 4.1-4.2 ppm, k: 3.7-3.8 ppm, l: 3.7-3.8 ppm, m: 4.0-4.2 ppm, n: 2.5-2.6 ppm , O: 2.7 to 2.9 ppm, p: 1.7 to 1.8 ppm
図4のNMRスペクトルにおけるピークの帰属を下記の式21に示す。
a:1.2〜1.3ppm、b:0.6〜0.7ppm、c:1.7〜1.8、d:4.3〜4.4ppm、e:2.5〜2.7ppm、f:1.0〜1.2ppm、g:2.6〜2.8ppm、h:2.6〜2.8ppm、i:2.5〜2.7ppm、j:4.1〜4.2ppm、k:3.7〜3.8ppm、l:3.7〜3.8ppm、m:4.0〜4.2ppm、n:2.5〜2.6ppm、o:2.7〜2.9ppm、p:2.6〜2.8ppm、q:2.6〜2.8ppm、r:1.1〜1.3ppm、s:4.0〜4.2ppm、t:2.8〜2.9ppm、u:2.5〜2.7ppmThe assignment of peaks in the NMR spectrum of FIG.
a: 1.2-1.3 ppm, b: 0.6-0.7 ppm, c: 1.7-1.8, d: 4.3-4.4 ppm, e: 2.5-2.7 ppm, f: 1.0 to 1.2 ppm, g: 2.6 to 2.8 ppm, h: 2.6 to 2.8 ppm, i: 2.5 to 2.7 ppm, j: 4.1 to 4.2 ppm, k: 3.7 to 3.8 ppm, l: 3.7 to 3.8 ppm, m: 4.0 to 4.2 ppm, n: 2.5 to 2.6 ppm, o: 2.7 to 2.9 ppm, p: 2.6-2.8 ppm, q: 2.6-2.8 ppm, r: 1.1-1.3 ppm, s: 4.0-4.2 ppm, t: 2.8-2.9 ppm, u: 2.5-2.7 ppm
図1〜4及び上記帰属から、実施例1−2および実施例1−3はチオールに由来するピークが確認されたが、実施例1−1および実施例1−4においてはチオール基由来のピークは観測されなかった。また、CH2=CHに由来するピークが観測されないことから、A−1、A−2、A−3は反応していることがわかった。1-4 and the above attribution, Example 1-2 and Example 1-3 were confirmed to have peaks derived from thiols, but in Examples 1-1 and 1-4, peaks derived from thiol groups. Was not observed. Further, since the peak derived from CH 2 = CH is not observed, A-1, A-2 , A-3 was found to react.
(実施例2−1〜2−4、比較例2−1〜2−2)
エポキシ樹脂として、95質量%のYDPN638〔フェノールノボラック型エポキシ樹脂:東都化成(株)製、商品名〕と、5質量%のEH−4344S〔イミダゾール型触媒:(株)アデカ製、商品名〕の混合物を選択した(E−1)。このE−1へ、密着性向上剤として上記実施例1−1〜1−4、比較例1、及びB−1単独を、表2の配合量に従って配合した。当該配合したサンプルをOA−10〔無アルカリガラス:日本電気硝子(株)製、商品名〕にバーコーターで塗布し、150℃、1時間の条件で硬化させて樹脂成形物としての硬化膜を得た。得られた硬化膜の密着性を評価し、それらの結果を表2に示す。なお、表2中の数値はgである。(Examples 2-1 to 2-4, Comparative examples 2-1 to 2-2)
As an epoxy resin, 95% by mass of YDPN638 [phenol novolac type epoxy resin: manufactured by Toto Kasei Co., Ltd., trade name] and 5% by mass of EH-4344S [imidazole type catalyst: manufactured by Adeka Co., Ltd., trade name] A mixture was selected (E-1). To this E-1, the above Examples 1-1 to 1-4, Comparative Example 1 and B-1 alone were blended as adhesion improvers according to the blending amounts in Table 2. The blended sample is applied to OA-10 [non-alkali glass: product name, manufactured by Nippon Electric Glass Co., Ltd.] with a bar coater, and cured at 150 ° C. for 1 hour to form a cured film as a resin molded product. Obtained. The adhesion of the obtained cured film was evaluated, and the results are shown in Table 2. In addition, the numerical value in Table 2 is g.
表2に示した結果より、実施例2−1〜2−4では全く剥離は見られず、密着性が良好であった。その一方、比較例2−1〜2−2では本発明のチオエーテル含有アルコキシシラン誘導体以外の化合物を用いたことから、いずれも剥離が生じて密着性は不良であった。
From the results shown in Table 2, in Examples 2-1 to 2-4, no peeling was observed, and the adhesion was good. On the other hand, in Comparative Examples 2-1 to 2-2, since compounds other than the thioether-containing alkoxysilane derivative of the present invention were used, peeling occurred and the adhesion was poor.
Claims (4)
(式中のaおよびbは0〜2の整数であり、cは1〜3の整数であり、a+b+c=3である。R1は下記式2で表される3価の基であり、R2は−CH2−CHR5−あるいは−CR5(CH3)−で表される2価の基あり、R3は−CH2−CHR6−あるいは−CR6(CH3)−で表される2価の基あり、R5とR6はそれぞれ独立に水素原子またはメチル基であり、R4はメチル基またはエチル基である。)
(式中のmは1または2である。)A thioether-containing alkoxysilane derivative represented by the following formula 1.
(In the formula, a and b are integers of 0 to 2, c is an integer of 1 to 3, and a + b + c = 3. R 1 is a trivalent group represented by the following formula 2; 2 is a divalent group represented by —CH 2 —CHR 5 — or —CR 5 (CH 3 ) —, and R 3 is represented by —CH 2 —CHR 6 — or —CR 6 (CH 3 ) —. R 5 and R 6 are each independently a hydrogen atom or a methyl group, and R 4 is a methyl group or an ethyl group.)
(In the formula, m is 1 or 2.)
(式中のR4はメチル基またはエチル基であり、R5は水素原子またはメチル基である。)
(式中のmは1または2である。)The thioether-containing alkoxysilane derivative according to claim 1, wherein the alkoxysilyl group-containing compound represented by the following formula 3 is reacted with a polyvalent thiol compound represented by the following formula 4.
(In the formula, R 4 is a methyl group or an ethyl group, and R 5 is a hydrogen atom or a methyl group.)
(In the formula, m is 1 or 2.)
(R6は水素原子またはメチル基である。)Furthermore, the thioether containing alkoxysilane derivative | guide_body of Claim 2 formed by making the oxirane ring containing compound represented by following formula 5 react simultaneously.
(R 6 is a hydrogen atom or a methyl group.)
An adhesion improver comprising the thioether-containing alkoxysilane derivative according to any one of claims 1 to 3 as an active ingredient.
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JP6326875B2 (en) * | 2014-03-11 | 2018-05-23 | 日油株式会社 | Thioether-containing (meth) acrylate derivative and adhesion improver containing the same |
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US4569959A (en) * | 1985-01-17 | 1986-02-11 | Mallinckrodt, Inc. | Isocyanurate esters of thioamidophenols and polyolefin polymeric compositions stabilized therewith |
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