JPWO2012053452A1 - Laser cutting method - Google Patents

Abstract

In the laser cutting method of irradiating and cutting a pair of plate materials having different thicknesses and melting points, the opposite surface of the laser irradiation surface of the lower plate material of the pair of plate materials has a higher melting point. The plate material arrangement step of arranging a pair of plate materials so as to protrude from the opposite surface of the laser irradiation surface of the plate material, and the focal point of the laser, the laser irradiation surface of the plate material having the higher melting point of the pair of plate materials A focus adjustment step for matching the opposite back surface, and a plate material cutting step for irradiating a laser and cutting the pair of plate materials in a series of operations while maintaining the focal position of the laser with respect to the pair of plate materials.

Description

  The present invention relates to a laser cutting method for cutting a workpiece by a laser.

  2. Description of the Related Art Conventionally, a laser cutting method is known in which a work piece is irradiated with a focused laser, melted, and cut. JP2001-176501A discloses a method of laser cutting an electrode of a stacked battery. In JP2001-176501A, the workpiece is a current collector that forms an electrode by applying an active material to the surface. In the laser cutting, the generation of burrs caused by the wear of the press die can be suppressed as compared with the case of cutting with a press.

  By the way, in general, when a pair of plate materials having different thicknesses are cut by laser cutting, it is necessary to change the cutting conditions according to the thickness of the plate material and perform laser cutting under cutting conditions suitable for each. Therefore, in order to cut | disconnect a pair of board | plate material from which thickness differs continuously, there exists a possibility that it may take the time for changing cutting conditions.

  The present invention has been made paying attention to such problems, and a laser cutting method capable of suppressing the burr height at the time of cutting and reducing the processing time of a pair of plate materials having different thicknesses. The purpose is to provide.

  In order to achieve the above object, according to an aspect of the present invention, there is provided a laser cutting method in which a pair of plate materials having different thicknesses and melting points are irradiated with a laser to cut, the lower melting point of the pair of plate materials. A pair of plate materials are arranged side by side so that the opposite surface of the laser irradiation surface of the plate material protrudes from the opposite surface of the laser irradiation surface of the plate material having a higher melting point, and the focal point of the laser has the higher melting point of the pair of plate materials A pair of plate materials are cut by a series of operations while maintaining the focal position of the laser with respect to the pair of plate materials by irradiating a laser in accordance with the back surface opposite to the laser irradiation surface of the other plate material.

  Embodiments of the present invention and advantages of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is a configuration diagram showing a laser cutting device used in a laser cutting method according to an embodiment of the present invention. FIG. 2 is an enlarged view around the machining head in the laser cutting apparatus of FIG. FIG. 3A is a diagram for explaining a plate material arranging step of the laser cutting method according to the embodiment of the present invention. FIG. 3B is a diagram illustrating a focus adjustment step of the laser cutting method according to an embodiment of the present invention. FIG. 3C is a diagram illustrating a plate cutting process of the laser cutting method according to the embodiment of the present invention. FIG. 3D is a diagram illustrating a gas spraying process of the laser cutting method according to an embodiment of the present invention. FIG. 4 is a graph showing the influence of the change in the laser focus position on the burr height. FIG. 5A is a graph showing the influence of the change in the laser focus position on the kerf width. FIG. 5B is a diagram illustrating the kerf width. FIG. 6 is a graph showing the influence of the change in the gas pressure of the assist gas on the maximum burr height.

  First, with reference to FIG.1 and FIG.2, the laminated battery 10 which has the positive electrode tab 11a and the negative electrode tab 12a which are workpieces is demonstrated.

  The laminated battery 10 is formed by laminating a positive electrode 11 and a negative electrode 12 via a separator (not shown) that is a porous film, and is housed in a laminate pack 15 together with an electrolyte. The laminated battery 10 is a laminated cell such as a lithium ion secondary battery.

  The positive electrode 11 includes a positive electrode current collector foil (not shown) coated with a positive electrode active material (not shown) and a positive electrode tab 11a joined to the positive electrode current collector foil. The positive electrode active material is formed of, for example, a lithium transition metal oxide such as lithium cobalt oxide or lithium manganate. The positive electrode current collector foil is formed of a metal such as aluminum, for example.

  As shown in FIG. 2, the positive electrode tab 11a is a plate having a laser irradiation surface 11b on which a laser is irradiated and a surface 11c opposite to the laser irradiation surface 11b. Here, the positive electrode tab 11a is formed of 0.4 [mm] thick aluminum compared with the positive electrode current collector foil.

  The negative electrode 12 includes a negative electrode current collector foil (not shown) coated with a negative electrode active material (not shown) and a negative electrode tab 12a joined to the negative electrode current collector foil. The negative electrode active material is formed of a carbon-based material such as hard carbon or graphite, for example. The negative electrode current collector foil is formed of a metal such as copper, for example.

  As shown in FIG. 2, the negative electrode tab 12a is also a plate material having a laser irradiation surface 12b irradiated with a laser and a surface 12c opposite to the laser irradiation surface 12b. Here, the negative electrode tab 12a is formed of copper having a thickness of 0.2 [mm] which is thicker than that of the negative electrode current collector foil.

  The positive electrode tab 11a and the negative electrode tab 12a have different thicknesses and melting points. Specifically, the negative electrode tab 12a is formed thinner than the positive electrode tab 11a. In addition, the negative electrode tab 12a formed of copper or the like has a higher melting point than the positive electrode tab 11a formed of aluminum.

  The positive electrode tab 11a and the negative electrode tab 12a are provided in parallel so that the laser irradiation surface 11b and the laser irradiation surface 12b are flush with each other. In other words, in the positive electrode tab 11a and the negative electrode tab 12a, the opposite surface 11c of the positive electrode tab 11a having a relatively low melting point is in the drawing than the opposite surface 12c of the negative electrode tab 12a having a relatively high melting point. It is provided in parallel with protruding downward. The positive electrode tab 11a and the negative electrode tab 12a correspond to a pair of plate materials.

  Next, with reference to FIG.1 and FIG.2, the laser cutting apparatus 100 used for the laser cutting method which concerns on embodiment of this invention is demonstrated.

  The laser cutting device 100 irradiates the condensed laser to the positive electrode tab 11a and the negative electrode tab 12a, melts them, and cuts them. The laser cutting device 100 includes a table 20 on which the stacked battery 10 is placed, a laser supply device 30 that supplies a laser, a processing head 40 that irradiates a laser, and an XY stage 50 that moves the processing head 40 in two directions. With.

  The table 20 has an upper surface 21 on which the stacked battery 10 is placed. The table 20 is formed in such a size as to hold only the laminate pack 15 when the stacked battery 10 is placed and the positive electrode tab 11a and the negative electrode tab 12a protrude outside.

  The laser supply device 30 includes a laser oscillator 31 that oscillates a laser and an optical fiber 32 that transmits the laser.

  The laser oscillator 31 outputs a fiber laser oscillated by the fiber itself. The laser oscillated from the laser oscillator 31 is a high energy density single mode fiber laser in which the energy distribution of the laser beam is a single mode. A single mode fiber laser is suitable for fine processing because of its high beam quality and excellent light condensing performance.

  The optical fiber 32 connects the laser oscillator 31 and the processing head 40. The laser oscillated by the laser oscillator 31 passes through the optical fiber 32 and is transmitted to the processing head 40.

  As shown in FIG. 2, the processing head 40 includes a collimator lens 42 and a condensing lens 43 that are coaxially arranged inside a main body 41. The laser transmitted by the optical fiber 32 becomes a parallel light beam when passing through the collimator lens 42, and is condensed toward the focal point after passing through the condenser lens 43. A nozzle 44 is formed at the tip of the processing head 40, and the laser is irradiated from the nozzle 44 to the outside.

  As shown in FIG. 1, the processing head 40 is held on an XY stage 50. The XY stage 50 has an X axis 51 that moves the machining head 40 in the width direction of the positive electrode tab 11a and the negative electrode tab 12a, and Y that moves the machining head 40 in the length direction of the positive electrode tab 11a and the negative electrode tab 12a. A shaft 52. Thereby, the processing head 40 can be translated while maintaining the focal position of the laser with respect to the positive electrode tab 11a and the negative electrode tab 12a.

  Here, when the machining head 40 is provided so as to be movable in the height direction, a movement error in the height direction of the machining head 40 may affect the focal position of the laser. Therefore, the machining head 40 is fixed so that it cannot move in the height direction. Thereby, the processing head 40 becomes a fixed optical system, and the focal position of the laser can be prevented from being shifted due to an error in movement of the processing head 40 in the height direction. Moreover, since it is not necessary to provide a mechanism for moving the machining head 40 in the height direction, the equipment can be simplified and the cost can be reduced.

  Further, the laser cutting device 100 includes a gas supply device 60 that supplies assist gas sprayed coaxially with the laser to the positive electrode tab 11a and the negative electrode tab 12a.

  The gas supply device 60 includes a gas tank 61 that stores compressed high-pressure gas, and a pipe 62 that connects the gas tank 61 and the processing head 40.

  The gas tank 61 is filled with an assist gas that assists laser cutting. The gas tank 61 is connected to the processing head 40 by a pipe 62 and supplies assist gas to the processing head 40.

  Here, the assist gas is compressed air. The assist gas is blown to the part to be laser-cut, and the melted and evaporated gas is blown off and removed. Thereby, it can suppress that a molten material adheres to a to-be-processed part. The assist gas is properly used depending on the material to be cut. As the assist gas, oxygen, nitrogen, argon, or the like may be used.

  Next, a laser cutting method in the laser cutting device 100 will be described mainly with reference to FIGS. 3A to 3D.

  First, the stacked battery 10 is placed on the upper surface 21 of the table 20, and the laser irradiation surface 11b of the positive electrode tab 11a and the laser irradiation surface 12b of the negative electrode tab 12a are arranged side by side in parallel. (Plate material arrangement process # 101). Here, since the stacked battery 10 is formed so that the laser irradiation surface 11 b and the laser irradiation surface 12 b are flush with each other, the placement is completed only by placing the stacked battery 10 on the upper surface 21 of the table 20.

  Next, it adjusts so that the focal position of the laser irradiated from the process head 40 may correspond with the back surface 12c of the negative electrode tab 12a. That is, the focal position of the laser is adjusted to the back surface 12c opposite to the laser irradiation surface 12b in the thinner one of the positive electrode tab 11a and the negative electrode tab 12a (focus adjustment step # 102). The focal position of the laser can be adjusted by adjusting the fixed position of the processing head 40 in the optical axis direction (vertical direction in FIG. 2) or adjusting the fixed position of the condenser lens 43 in the optical axis direction. Here, the processing head 40 is a fixed optical system. When the stacked battery 10 is placed on the upper surface 21 of the table 20, the focal position of the laser is aligned with the back surface 12c of the negative electrode tab 12a.

  Next, the XY stage 50 is driven in a state in which laser is irradiated from the processing head 40, and the processing head 40 is moved in parallel. Specifically, the machining head 40 is moved while maintaining the focal position of the laser with respect to the positive electrode tab 11a and the negative electrode tab 12a. Here, the output of the laser is set to 300 [W (Watt)].

  Referring to FIG. 1, the machining head 40 moves in the direction of the X axis 51 to continuously laser-cut the positive electrode tab 11a and the negative electrode tab 12a (plate material cutting step # 103). Thereby, the positive electrode tab 11a and the negative electrode tab 12a are cut into a desired length.

  At this time, the assist gas is blown from the gas supply device 60 to the positive electrode tab 11a and the negative electrode tab 12a together with the laser irradiated from the processing head 40 (gas blowing step # 104). The positive electrode tab 11a and the negative electrode tab 12a are continuously laser-cut while keeping the supply conditions of the assist gas constant. The assist gas is supplied at a pressure of 1.5 [MPa].

  The molten metal (cut product) in the portion melted by the irradiation of the laser on the positive electrode tab 11a and the negative electrode tab 12a is blown off by the assist gas. Therefore, it is suppressed that molten metal adheres to a cutting part.

  In the present embodiment, continuous laser cutting means that the positive electrode tab 11a and the negative electrode tab 12a are cut in a series of operations in which the laser output and the assist gas supply conditions are kept constant. It means that.

  Hereinafter, the operation of the laser cutting method according to the embodiment of the present invention will be described with reference to FIGS.

  In FIG. 4, the horizontal axis is the focal position [mm] of the laser when the laser irradiation surface 11b and the laser irradiation surface 12b are zero, and the vertical axis is the height [μm] of the burr generated by laser cutting. is there. A one-dot chain line in FIG. 4 indicates a case where the focal position of the laser is −0.2 [mm].

  The positive electrode tab 11a is formed thicker than the positive current collector foil, and the negative electrode tab 12a is formed thicker than the negative current collector foil. Therefore, when laser cutting the positive electrode tab 11a and the negative electrode tab 12a, burrs are more likely to occur than when laser cutting the positive electrode current collector foil and the negative electrode current collector foil.

  The two curves in the graph of FIG. 4 indicate the burr height [μm] corresponding to the focal positions of the lasers of the positive electrode tab 11a and the negative electrode tab 12a, respectively. As shown in FIG. 4, the positive electrode tab 11 a has a minimum burr height and becomes minimum when the focal position of the laser is about 0 [mm] to −0.5 [mm]. On the other hand, the burr height of the negative electrode tab 12a is minimized when the focal position of the laser is about -0.2 [mm].

  Here, since the focal position is aligned with the back surface 12c of the negative electrode tab 12a, the focal point is at a position of -0.2 [mm] away from the laser irradiation surface 12b by the thickness of the negative electrode tab 12a. . It can be seen from the graph of FIG. 4 that the burr height when the focal position of the laser is −0.2 [mm] is suppressed to the minimum in both the positive electrode tab 11a and the negative electrode tab 12a.

  This is because the focus position of the laser is aligned with the back surface 12c of the negative electrode tab 12a, and compared with the case where the laser focus position is aligned with the upper surfaces of the positive electrode tab 11a and the negative electrode tab 12a. This is because the laser scattering between the plate thicknesses of the negative electrode tab 12a is suppressed.

  Therefore, it is possible to prevent the scattered laser from melting the positive electrode tab 11a and the negative electrode tab 12a more than necessary and causing the cut surface to become rough. Therefore, the height of burrs generated when the positive electrode tab 11a and the negative electrode tab 12a are cut can be suppressed.

  As described above, when the focal position of the laser is matched with the back surface 12c of the negative electrode tab 12a, the burr height can be minimized with both the positive electrode tab 11a and the negative electrode tab 12a. Therefore, it is possible to continuously laser-cut the positive electrode tab 11a and the negative electrode tab 12a having different thicknesses while keeping the focal position of the laser constant. Therefore, there is no need to change the laser cutting conditions during laser cutting, and the processing time of the positive electrode tab 11a and the negative electrode tab 12a having different thicknesses can be shortened.

  Further, as indicated by the dotted line in FIG. 4, the positive electrode tab 11a suppresses the burr height within an allowable range when the focal position of the laser is in the range of −0.6 [mm] to 0.4 [mm]. If the range is exceeded, the burr height increases rapidly and cannot be kept within the allowable range. If the burr height is not suppressed within an allowable range, the positive electrode tab 11a may not be cut. From this result, the tolerance of the focal position of the laser (hereinafter referred to as “focal tolerance”) when the plate thickness of the positive electrode tab 11a is 0.4 [mm] is −0.6 [mm]. To 0.4 [mm], and the width of the focus latitude is 1.0 [mm].

  On the other hand, as indicated by a broken line in FIG. 4, the negative electrode tab 12a suppresses the burr height within an allowable range when the focal position of the laser is in the range of −0.4 [mm] to 0.2 [mm]. If the range is exceeded, the burr height increases rapidly and cannot be kept within the allowable range. If the burr height is not suppressed within an allowable range, the negative electrode tab 12a may not be cut. From this result, the focal latitude when the thickness of the negative electrode tab 12a is 0.2 [mm] can be considered to be in the range of −0.4 [mm] to 0.2 [mm]. The width of the focus latitude is 0.6 [mm].

  Here, the width of the focus tolerance varies depending on the melting point and the plate thickness of the electrode tab. Specifically, the higher the melting point of the electrode tab and the thicker the plate thickness, the harder it is to cut, so the range of focus latitude becomes narrower.

  In the present embodiment, the width of the focus tolerance of the positive electrode tab 11a is wider than the width of the focus tolerance of the negative electrode tab 12a. Therefore, when laser cutting is performed within the range of the focus latitude of the negative electrode tab 12a, the plate thickness of the positive electrode tab 11a can be made thicker than the current 0.4 [mm].

  Specifically, since the width of the focal margin and the plate thickness are proportional, when the width of the focal margin of the positive electrode tab 11a is changed from 1.0 [mm] to 0.6 [mm] The plate thickness of the positive electrode tab 11a can be increased to 1.67 (= 1.0 / 0.6) times. That is, the plate thickness of the positive electrode tab 11a can be increased to 0.67 [mm] (= 0.4 [mm] × 1.67).

  Therefore, when the positive electrode tab 11a is made of aluminum and the negative electrode tab 12a is made of copper, the positive electrode negative tab 11a is used when performing laser cutting in the range of the focus tolerance of the negative electrode tab 12a. Even if the plate thickness is increased to 3.3 (= 0.67 [mm] /0.2 [mm]) times the plate thickness of the negative electrode tab 12a, the burr height is suppressed. In addition, the positive electrode tab 11a can be cut.

  In this way, when two types of plate materials having different melting points are laser-cut by a series of operations, the thickness of the plate material having the lower melting point depends on the focus tolerance width of the plate material having the higher melting point. The maximum value can be set.

  In FIG. 5A, the horizontal axis is the laser focal position [mm] when the laser irradiation surface 11b and the laser irradiation surface 12b are zero, and the vertical axis is the kerf width [μm corresponding to the change of the laser focal position. ].

  As shown in FIG. 5B, the kerf width is a width of a portion cut by laser cutting. The smaller the kerf width, the smaller the amount of molten metal produced when laser cutting is performed, and the more accurate machining is possible.

  The plot in the graph of FIG. 5A shows the kerf width [mm] of the negative electrode tab 12a with respect to the focal position of the laser. The state where the focal position of the laser is 0 [mm] is a state where the focal position of the laser is aligned with the laser irradiation surface 12b of the negative electrode tab 12a. As shown in FIG. 5A, when the focal position of the laser is 0 [mm], the kerf width is about 45 [μm], which is relatively large. When the kerf width is increased, it is considered that the scattered laser melts the negative electrode tab 12a more than necessary, and the cut surface becomes rough, so that the burr height increases.

  On the other hand, when the focal position of the laser is −0.2 [mm], the kerf width in the negative electrode tab 12a is minimized. This coincides with the case where the laser is focused on the opposite surface 12c of the negative electrode tab 12a. Therefore, the kerf width of the negative electrode tab 12a can be minimized by adjusting the focal position of the laser to the surface 12c opposite to the laser irradiation surface 12b of the negative electrode tab 12a.

  In FIG. 6, the horizontal axis represents the gas pressure [MPa] of the assist gas supplied by the gas supply device 60, and the vertical axis represents the maximum burr height [μm] corresponding to the change in gas pressure.

  In general, an inert gas is more suitable for laser cutting of aluminum than oxygen gas, and oxygen gas is suitable for laser cutting of copper. Therefore, when continuously processing the positive electrode tab 11a made of aluminum and the negative electrode tab 12a made of copper, it is desirable to change the conditions such as the type and pressure of the assist gas in the middle.

  On the other hand, in the laser cutting method according to the present embodiment, air compressed to a high pressure of at least 1.5 [MPa] or more is used as a single assist gas. The plot in the graph of FIG. 6 shows the maximum burr height [μm] when the gas pressure is changed from 1.5 [MPa] to 2.0 [MPa]. The white plot in the graph of FIG. 6 shows the maximum burr height of the positive electrode tab 11a made of aluminum, and the black plot shows the maximum burr height of the negative electrode tab 12a made of copper.

  From the graph of FIG. 6, if the gas pressure is set to at least 1.5 [MPa] or more, the maximum burr height is suppressed in both the positive electrode tab 11a made of aluminum and the negative electrode tab 12a made of copper. I understand that. Therefore, even when compressed air is used as the assist gas, the generation of burrs in the negative electrode tab 12a, which is copper, can be suppressed.

  This is considered to be because the absolute amount of supplied oxygen is increased by increasing the pressure of the compressed air. Moreover, since about 80% of air is nitrogen which is an inert gas, generation | occurrence | production of the burr | flash in the positive electrode tab 11a which is aluminum can be suppressed. Furthermore, since the compressed air has a high pressure of 1.5 [MPa] or more, the molten metal of aluminum or copper can be blown away by blowing the compressed air, and the generation of burrs in laser cutting can be suppressed.

  As described above, the positive electrode tab 11a and the negative electrode tab 12a can be continuously processed under the same conditions without changing the assist gas conditions. By using a single assist gas, the processing time can be shortened and the equipment can be simplified. Moreover, by using compressed air, the running cost can be suppressed as compared with the case where noble gases are used.

  According to the above embodiment, the following effects are obtained.

  By aligning the focal point of the laser with the opposite surface 12c of the negative electrode tab 12a having a thin plate thickness and a high melting point compared to the positive electrode tab 11a, the laser focal point is formed on the upper surface of the positive electrode tab 11a and the negative electrode tab 12a. Compared with the case where the positions are matched, laser scattering between the plate thicknesses of the positive electrode tab 11a and the negative electrode tab 12a is suppressed.

  Therefore, the scattered laser can suppress the roughening of the cut surface by melting the positive electrode tab 11a and the negative electrode tab 12a more than necessary, and the laser is continuously applied to the positive electrode tab 11a and the negative electrode tab 12a having different thicknesses. It is possible to cut. Therefore, the burr height at the time of cutting can be suppressed, and the processing time of the positive electrode tab 11a and the negative electrode tab 12a having different thicknesses can be shortened.

  As mentioned above, although this invention has been described through specific embodiments, this invention is not limited to the above embodiments. Those skilled in the art can make various modifications or changes to the above-described embodiments within the technical scope of the present invention.

  For example, in the above-described embodiment of the present invention, the machining head 40 is moved by driving the XY stage 50. However, the machining head 40 may be fixed and the table 20 may be translated relative to the machining head 40. .

  Regarding the above explanation, the contents of Japanese Patent Application No. 2010-234722 in Japan, filed on October 19, 2010, are incorporated herein by reference.

Claims (7)

A laser cutting method of cutting a pair of plate materials (11a, 12a) having different thicknesses and melting points by irradiating with a laser,
Of the pair of plate members (11a, 12a), the surface (11c) opposite to the laser irradiation surface (11b) of the plate member (11a) having the lower melting point is the laser irradiation surface (12b) of the plate member (12a) having the higher melting point. A plate material arranging step of arranging the pair of plate materials (11a, 12a) side by side so as to protrude from the opposite surface (12c) of
A focus adjustment step (# 102) for adjusting the focal position of the laser to the opposite surface (12c) of the laser irradiation surface (12b) of the plate material (12a) having the higher melting point of the pair of plate materials (11a, 12a);
A plate material cutting step (# 103) for irradiating a laser and cutting the pair of plate materials (11a, 12a) by a series of operations while maintaining the focal position of the laser with respect to the pair of plate materials (11a, 12a);
A laser cutting method comprising:   The maximum value of the thickness of the plate (11a) having the lower melting point among the pair of plate materials (11a, 12a) is set according to the focus tolerance of the plate (12a) having the higher melting point, and the melting point is high. The laser cutting method according to claim 1, wherein the maximum value of the plate thickness of the plate (11a) having a lower melting point becomes smaller as the focal margin width of the plate (12a) becomes narrower. Of the pair of plate materials (11a, 12a), the plate material (11a) having a lower melting point is an aluminum plate, and the plate material (12a) having a higher melting point is a copper plate,
3. The laser cutting method according to claim 2, wherein the maximum value of the thickness of the plate material (11 a) having the lower melting point is set to 3.3 times the thickness of the plate material (12 a) having the higher melting point.   Prior to the focus adjustment step, a plate material arranging step (# 101) of arranging the laser irradiation surfaces (11b, 12b) of the pair of plate materials (11a, 12a) so as to be flush with each other is further provided. The laser cutting method according to any one of claims 1 to 3. In order to assist cutting with a laser, a gas spraying step (# 104) of spraying an assist gas onto the pair of plate members (11a, 12a) together with laser irradiation is further provided,
The laser cutting method according to any one of claims 1 to 4, wherein the pair of plate members (11a, 12a) are continuously cut in a state where the assist gas is supplied.   The laser cutting method according to claim 5, wherein the pair of plate members (11a, 12a) are continuously cut while maintaining the supply condition of the assist gas constant. Of the pair of plates (11a, 12a), the plate (11a) having the lower melting point is the positive electrode tab (11a) of the stacked battery (10), and the plate (12a) having the higher melting point is the laminated layer. Type battery (10) negative electrode tab (12a),
The said positive electrode tab (11a) and the said negative electrode tab (12a) are any one of Claim 1-6 formed thicker than the current collection foil which forms the electrode of the said laminated battery (10). The laser cutting method as described in one.

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