CN101797666A - Laser cutting head with extended depth of focus - Google Patents

Laser cutting head with extended depth of focus Download PDF

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CN101797666A
CN101797666A CN 201010133087 CN201010133087A CN101797666A CN 101797666 A CN101797666 A CN 101797666A CN 201010133087 CN201010133087 CN 201010133087 CN 201010133087 A CN201010133087 A CN 201010133087A CN 101797666 A CN101797666 A CN 101797666A
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binary phase
phase element
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周常河
余俊杰
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Shanghai Institute of Optics and Fine Mechanics of CAS
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Abstract

一种用于激光切割机的延长焦深的激光切割头,其构成包括沿激光入射方向依次的准直扩束透镜组、反射镜和消像差聚焦透镜,其特点在于:在所述的消像差聚焦透镜前加入一个二元相位元件,该二元相位元件与所述的消像差透镜共轴,该二元相位元件的通光孔径与所述的激光切割头的入射光瞳一致,该二元相位元件是中心对称的同心圆环的多区结构,该二元相位元件的相位自内向外依次按区0、π相间分布。本发明有利于提高这种激光切割机的切割速度和极限切割厚度,同时改善切割断面质量。对于提高激光切割机的切割速度和能量利用率,改善切割断面质量有重要的实用价值和应用前景。

Figure 201010133087

A laser cutting head for extending the focal depth of a laser cutting machine, which comprises a collimating beam expanding lens group, a reflector and an aberration correcting focusing lens in sequence along the incident direction of the laser, and is characterized in that: a binary phase element is added in front of the aberration correcting focusing lens, the binary phase element is coaxial with the aberration correcting lens, the aperture of the binary phase element is consistent with the incident pupil of the laser cutting head, the binary phase element is a multi-zone structure of concentric circular rings with central symmetry, and the phase of the binary phase element is distributed alternately from the inside to the outside according to zones 0 and π. The present invention is conducive to improving the cutting speed and the maximum cutting thickness of such a laser cutting machine, and at the same time improving the quality of the cut section. It has important practical value and application prospects for improving the cutting speed and energy utilization rate of the laser cutting machine and improving the quality of the cut section.

Figure 201010133087

Description

延长焦深的激光切割头 Laser cutting head with extended depth of focus

技术领域technical field

本发明涉及激光切割机,特别是一种用于激光切割机的延长焦深的激光切割头。The invention relates to a laser cutting machine, in particular to a laser cutting head for extending the focal depth of the laser cutting machine.

背景技术Background technique

自1960年激光器问世以来,激光技术得到了飞速的发展。由于激光独特的高亮度、高方向性、高单色性和高相干性,自其发明之初,就有人提出把激光用于材料加工。目前,激光加工技术已经发展成为一种重要激光应用技术。与传统机械加工相比,激光加工的主要特点有:激光束能量高度集中,加工区域小,因而热变形小;加工质量高、精度高、速度快;加工件不受尺寸、形状限制;不需冷却介质,而且无污染,噪声小。经过近五十年的发展,激光加工已与多个学科相结合形成多个应用技术领域,主要加工技术包括:激光切割、激光焊接、激光打标、激光打孔、激光热处理、激光快速成型、激光涂敷等。其中,激光切割已成为当前工业加工领域应用最多的激光加工方法,可占整个激光加工工业的70%以上。Since the advent of lasers in 1960, laser technology has developed rapidly. Due to the unique high brightness, high directivity, high monochromaticity and high coherence of laser, it has been proposed to use laser for material processing since its invention. At present, laser processing technology has developed into an important laser application technology. Compared with traditional mechanical processing, the main characteristics of laser processing are: the laser beam energy is highly concentrated, the processing area is small, so the thermal deformation is small; the processing quality is high, the precision is high, and the speed is fast; the processed parts are not limited by size and shape; Cooling medium, and no pollution, low noise. After nearly fifty years of development, laser processing has been combined with multiple disciplines to form multiple application technology fields. The main processing technologies include: laser cutting, laser welding, laser marking, laser drilling, laser heat treatment, laser rapid prototyping, Laser coating etc. Among them, laser cutting has become the most widely used laser processing method in the current industrial processing field, accounting for more than 70% of the entire laser processing industry.

激光切割主要的原理是依靠激光的高度集中的光场能量,直接将工件需切割部位气化或熔化,达到切割目的,也就是说,激光的高能量密度是至关重要的因素。正是因为聚焦的激光束极高的能量密度,才可以瞬间将工件气化或熔化,而热效应还来不及向周围传递,从而不会产生热变形。也正是这种极高的能量密度,才使得快速切割成为可能。而决定聚焦激光束的能量密度的是其在焦点附近的光强分布,这种在焦点附近的聚焦光场分布才是影响激光切割质量和速度的最本质因素。在激光加工领域,人们通常用焦点附近的焦斑半径R和焦深DOF来衡量一台激光切割机的性能。当前,纵向的焦深是影响激光切割速度和切割厚度的一个瓶颈因素。对于比较薄的工件,在工件相对激光切割头快速移动过程中,往往会出现离焦现象,尤其对于一些表面不平(如曲面)的工件。这时,就必须提高激光的工作能量,这样就会使激光能量的利用率降低,同时也会影响工件的切割断面质量。一种可行的方案就是加入一个自动聚焦的聚焦伺服系统,这样又会增加成本。同时,如果聚焦伺服的速度跟不上工件的移动速度,同样也会出现离焦,这时,聚焦伺服速度就变成了提高切割速度的一个严重瓶颈。另一方面,当切割比较厚的工件的时候,如果工件的厚度超过了焦深,那么这将是一个极大的挑战。此时,仅仅通过提高激光输出能量是不能解决问题的。因为,一方面,激光器的输出能量是有限的,当激光器长期处于高功率、超负荷运作状态,其寿命会明显缩短。同时,仅仅提高激光输出能量,在超出焦深范围,光强分布是很不均匀的,这样带来的后果是工件的切割断面的平行度很差。这就是说,任何一台激光切割机都有一个最大的可切割的工件厚度,我们把这个厚度称为它的极限切割厚度。显而易见,聚焦焦深越大,其极限切割厚度也越大。The main principle of laser cutting is to rely on the highly concentrated light field energy of the laser to directly vaporize or melt the part of the workpiece to be cut to achieve the purpose of cutting. That is to say, the high energy density of the laser is a crucial factor. It is precisely because of the extremely high energy density of the focused laser beam that the workpiece can be vaporized or melted instantly, and the thermal effect is not transmitted to the surroundings in time, so that thermal deformation will not occur. It is this extremely high energy density that makes fast cutting possible. What determines the energy density of the focused laser beam is its light intensity distribution near the focus. This focused light field distribution near the focus is the most essential factor affecting the quality and speed of laser cutting. In the field of laser processing, people usually use the focal spot radius R and focal depth DOF near the focal point to measure the performance of a laser cutting machine. Currently, longitudinal depth of focus is a bottleneck factor affecting laser cutting speed and cutting thickness. For relatively thin workpieces, defocusing often occurs during the rapid movement of the workpiece relative to the laser cutting head, especially for workpieces with uneven surfaces (such as curved surfaces). At this time, it is necessary to increase the working energy of the laser, which will reduce the utilization rate of laser energy and affect the quality of the cutting section of the workpiece. A possible solution is to add a focus servo system for autofocus, which will increase the cost again. At the same time, if the speed of the focus servo cannot keep up with the moving speed of the workpiece, defocusing will also occur. At this time, the speed of the focus servo has become a serious bottleneck for increasing the cutting speed. On the other hand, when cutting thicker workpieces, if the thickness of the workpiece exceeds the depth of focus, then it will be a great challenge. At this time, the problem cannot be solved simply by increasing the laser output energy. Because, on the one hand, the output energy of the laser is limited, when the laser is in high power and overload operation for a long time, its life will be significantly shortened. At the same time, if the laser output energy is only increased, the light intensity distribution is very uneven beyond the focal depth range, and the result of this is that the parallelism of the cutting section of the workpiece is very poor. That is to say, any laser cutting machine has a maximum cutable workpiece thickness, and we call this thickness its limit cutting thickness. Obviously, the larger the depth of focus, the larger the limit cutting thickness.

我们知道,焦深和聚焦透镜的数值孔径是紧密相关的。在低数值孔径范围(NA<0.5)内,焦深DOF与数值孔径NA之间的关系可以写成DOF∝λ/NA2,也就是说,焦深与聚焦透镜的数值孔径的平方成反比。要延长焦深,就必须减小数值孔径,而数值孔径减小,聚焦光斑就会增大,能量密度下降,不利于激光切割。也是说,单纯的降低数值孔径是一种以降低聚焦光斑分辨率和聚焦激光束能量密度为代价来延长焦深的方法。We know that the depth of focus and the numerical aperture of the focusing lens are closely related. In the low numerical aperture range (NA<0.5), the relationship between the depth of focus DOF and the numerical aperture NA can be written as DOF∝λ/NA 2 , that is, the depth of focus is inversely proportional to the square of the numerical aperture of the focusing lens. To prolong the depth of focus, the numerical aperture must be reduced, and as the numerical aperture decreases, the focus spot will increase, and the energy density will decrease, which is not conducive to laser cutting. That is to say, simply reducing the numerical aperture is a method to extend the depth of focus at the expense of reducing the resolution of the focused spot and the energy density of the focused laser beam.

基于上述原因,延长焦深并且不降低聚焦光斑横向分辨率的光场分布,即在保证聚焦激光束焦区能量密度足够大的前提下延长焦深,将十分有利于提高激光切割的速度和改善切割断面质量。Based on the above reasons, extending the focal depth without reducing the optical field distribution of the lateral resolution of the focused spot, that is, extending the focal depth on the premise of ensuring that the energy density in the focal area of the focused laser beam is sufficiently large, will be very beneficial to improving the speed of laser cutting and improving Cut section quality.

发明内容Contents of the invention

本发明的目的在于提出一种用于激光切割机的延长焦深的激光切割头,该延长焦深的激光切割头,可显著提高激光束聚焦焦深,同时还能保持横向焦斑基本不变,对提高激光切割机的切割速度和极限切割厚度,改善切割断面质量十分有利。The object of the present invention is to propose a laser cutting head for extending the focal depth of a laser cutting machine, the laser cutting head for extending the focal depth can significantly improve the focusing focal depth of the laser beam, while keeping the transverse focal spot basically unchanged , It is very beneficial to increase the cutting speed and limit cutting thickness of the laser cutting machine, and improve the quality of the cutting section.

本发明的技术解决方案如下:Technical solution of the present invention is as follows:

一种延长焦深的激光切割头,其构成包括沿激光入射方向依次的准直扩束透镜组、反射镜和消像差聚焦透镜,其特点在于:在所述的消像差聚焦透镜前加入一个二元相位元件,该二元相位元件与所述的消像差透镜共轴,该二元相位元件的通光孔径与所述的激光切割头的入射光瞳一致,该二元相位元件是中心对称的同心圆环的多区结构,该多区的相位自内向外依次按区0、π相间分布。A laser cutting head with an extended focal depth, which consists of a collimating beam expander lens group, a mirror and an aberration-eliminating focusing lens in sequence along the incident direction of the laser light, and is characterized in that: A binary phase element, the binary phase element is coaxial with the aberration-ablation lens, the clear aperture of the binary phase element is consistent with the entrance pupil of the laser cutting head, and the binary phase element is The multi-zone structure of the center-symmetrical concentric rings, the phases of the multi-zones are distributed sequentially according to zone 0 and π from the inside to the outside.

所述的二元相位元件为3区二元相位元件,对均匀强度分布的平面波该3区二元相位元件的归一化半径依次为:0、0.3029、0.9167和1。The binary phase element is a 3-zone binary phase element, and the normalized radii of the 3-zone binary phase element for a plane wave with uniform intensity distribution are: 0, 0.3029, 0.9167 and 1 in sequence.

所述的二元相位元件为5区二元相位元件,对均匀强度分布的平面波该5区二元相位元件的归一化半径依次为:0、0.0196、0.3421、0.5523、0.9251和1。The binary phase element is a 5-zone binary phase element, and the normalized radii of the 5-zone binary phase element for a plane wave with uniform intensity distribution are: 0, 0.0196, 0.3421, 0.5523, 0.9251 and 1 in sequence.

本发明的技术效果Technical effect of the present invention

本发明在激光切割机聚焦光路中加入一个纯相位调制的二元衍射光学元件,达到了延长聚焦光束的焦深,同时不增加横向聚焦光斑大小,改善聚焦光场纵向能量密度分布均匀性的技术效果。这种在纵向上更加均匀的能量密度分布的聚焦光场,对于提高激光能量利用率、提高激光切割机的加工效率和加工质量,有着重要的实用价值和应用前景。The present invention adds a pure phase-modulated binary diffractive optical element to the focusing optical path of the laser cutting machine, thereby prolonging the focal depth of the focused beam without increasing the size of the transverse focusing spot and improving the uniformity of the longitudinal energy density distribution of the focused light field Effect. This focused light field with a more uniform energy density distribution in the longitudinal direction has important practical value and application prospects for improving the utilization rate of laser energy, improving the processing efficiency and processing quality of laser cutting machines.

附图说明Description of drawings

图1是本发明延长焦深的激光切割机光路示意图。其光路根据编号依次是:1-激光器;2准直扩束透镜组;3反射镜;4二元相位元件;5消像差聚焦透镜;6加工工件二维移动平台。Fig. 1 is a schematic diagram of the optical path of a laser cutting machine with extended focal depth according to the present invention. The optical path according to the serial number is: 1-laser; 2 collimating beam expander lens group; 3 mirror; 4 binary phase element; 5 aberration-eliminating focusing lens;

图2是激光切割头中聚焦激光束物理模型示意图。Fig. 2 is a schematic diagram of a physical model of a focused laser beam in a laser cutting head.

图3(a)典型的3区二元相位元件;(b)典型的5区二元相位元件。Figure 3(a) Typical 3-zone binary phase element; (b) Typical 5-zone binary phase element.

图4加入二元相位元件前后的聚焦焦深随高斯强度分布截断比β的变化。Fig. 4 The variation of the depth of focus with the truncation ratio β of the Gaussian intensity distribution before and after adding the binary phase element.

图5两种情况下(β→0和β=1)加入3区相位元件前后纵向(a)和横向(b)的光强分布。Fig. 5. Longitudinal (a) and transverse (b) light intensity distributions before and after adding 3-zone phase elements in two cases (β→0 and β=1).

具体实施方式Detailed ways

一、理论设计1. Theoretical design

1、激光切割机聚焦光路的物理模型的建立1. The establishment of the physical model of the laser cutting machine focusing optical path

典型的激光切割机光路如图1所示,依据编号依次是:激光器1;准直扩束透镜组2;反射镜3;消像差聚焦透镜5;加工工件二维移动平台6。经准直扩束之后的激光的聚焦光路可以简化为图2的物理模型。如图2所示,以聚焦透镜的焦点为圆心,建立直角坐标系,其中,光轴沿z轴方向。经准直扩束之后的激光束可以看作强度成高斯分布的平面波。激光切割中所采用的聚焦透镜数值孔径一般比较低(NA<0.1),因而其激光光束经过这种聚焦透镜的后场可以采用经典的标量衍射来计算。其在焦点附近的归一化电场分布可以表示为:A typical optical path of a laser cutting machine is shown in Figure 1. According to the number, it is: laser 1; collimating beam expander lens group 2; mirror 3; aberration-eliminating focusing lens 5; The focusing optical path of the laser beam after being collimated and expanded can be simplified to the physical model in Figure 2. As shown in FIG. 2 , a Cartesian coordinate system is established with the focal point of the focusing lens as the center of the circle, wherein the optical axis is along the z-axis direction. The laser beam after collimation and expansion can be regarded as a plane wave with a Gaussian intensity distribution. The numerical aperture of the focusing lens used in laser cutting is generally relatively low (NA<0.1), so the back field of the laser beam passing through the focusing lens can be calculated by classical scalar diffraction. Its normalized electric field distribution near the focus can be expressed as:

EE. (( uu ,, vv )) == 22 &Integral;&Integral; 00 11 LL (( rr )) TT (( rr )) JJ 00 (( vrvr )) expexp (( -- iuriur 22 // 22 )) rdrrdr -- -- -- (( 11 ))

其中:r=ρ/R为归一化的横向坐标,ρ为聚焦透镜所在平面的实际坐标,R为系统的通光孔径。u和v分别为Where: r=ρ/R is the normalized transverse coordinate, ρ is the actual coordinate of the plane where the focusing lens is located, and R is the clear aperture of the system. u and v are respectively

uu == 22 &pi;&pi; RR 22 &lambda;&lambda; (( 11 ff -- 11 ff ++ zz )) -- -- -- (( 22 aa ))

vv == 22 &pi;Rr&pi;Rr // &lambda;f&lambda;f == 22 &pi;&pi; xx 22 ++ ythe y 22 // &lambda;f&lambda; f -- -- -- (( 22 bb ))

而L(r)表征光束的横向振幅分布,对于在聚焦透镜上光斑半径(光斑半径定义为强度衰减为轴上强度的1/e时离光轴的横向距离)为ω的高斯光束,它可以表示为And L(r) characterizes the transverse amplitude distribution of the beam. For a Gaussian beam whose spot radius on the focusing lens (the spot radius is defined as the transverse distance from the optical axis when the intensity decays to 1/e of the on-axis intensity) is ω, it can be Expressed as

L(r)=exp(-β2r2)    (3)L(r)=exp(-β 2 r 2 ) (3)

其中,β=R/ω。where β=R/ω.

为了表征加入相位元件之后光场的变化,我们定义了以下几个参数:斯涅尔比(S)、旁瓣强度比(M)、纵向焦深和横向焦斑半径。其中,斯涅尔比S定义为加入相位元件之后中心主瓣强度与爱里斑中心主瓣强度的比值;旁瓣强度比M定义为横向光强分布中最大的旁瓣强度与中心主瓣强度的比值。而横向光斑半径定义为当光强降为轴上光强的1/e时的横向距离。在激光加工领域,纵向焦深定义为当光斑大小相对最小光斑(焦面上)增加了5%的时候纵向(光轴上)的两个点之间的距离。在本发明中,我们加入另外两个限制条件,即在焦深范围内,斯涅尔比S不得低于0.1,同时,旁瓣强度比M不得高于1/e。于是,焦深就可定义为In order to characterize the change of the light field after adding the phase element, we defined the following parameters: Snell ratio (S), side lobe intensity ratio (M), longitudinal focal depth and lateral focal spot radius. Among them, the Snell ratio S is defined as the ratio of the central main lobe intensity to the central main lobe intensity of the Airy disk after adding the phase element; the side lobe intensity ratio M is defined as the maximum side lobe intensity and the central main lobe intensity in the transverse light intensity distribution ratio. The lateral spot radius is defined as the lateral distance when the light intensity drops to 1/e of the on-axis light intensity. In the field of laser processing, the longitudinal depth of focus is defined as the distance between two points in the longitudinal direction (on the optical axis) when the spot size increases by 5% relative to the smallest spot (on the focal plane). In the present invention, we add two other restrictions, that is, within the focal depth range, the Snell ratio S must not be lower than 0.1, and at the same time, the side lobe intensity ratio M must not be higher than 1/e. Therefore, the depth of focus can be defined as

DOF=2|zt|    (4)DOF=2|z t | (4)

其中,zt=min(zm,zs,zp),而zm,zs,zp分别满足M(zm)=1/e,S(zs)=0.1和R(zp)=1.05R(z=0)。Among them, z t = min(z m , z s , z p ), and z m , z s , z p respectively satisfy M(z m )=1/e, S(z s )=0.1 and R(z p )=1.05R(z=0).

2、延长焦深的二元相位元件的优化设计2. Optimal design of binary phase element for extended depth of focus

通常光学系统是圆对称的,因而一般的二元相位元件也都采用圆对称结构。同时,二元结构易于加工,也是广为采用的。本发明正是采用了这种结构简单、易于加工、二元纯相位元件。图3a和b分别是典型的3区和5区的二元相位元件的示意图。把这种经特殊设计的二元相位元件加在聚焦透镜之前,即构成了本发明的延长焦深切割头光路,如图1所示。在切割头光路中加入二元相位元件4之后聚焦透镜后场,在焦斑附近光场分布的物理模型中,我们可以通过公式(1)初步计算其后场强度分布。然后依据这种近似的物理模型,通过改变二元相位元件的各区的归一化几何半径值,优化聚焦透镜后场的焦深(根据公式(4)所定义),即可得到延长焦深的二元相位元件。由聚焦光路(加入二元相位元件之后的光头聚焦光路)后场的归一化场强分布公式(1)可以看出,具有不同截断比的高斯光束,其归一化后场也是有区别的。这就是说,如果针对小β值的高斯光束优化的二元相位元件的归一化半径,对大β值的高斯光束情况下可能就不是最优的,甚至可能没有延长焦深的效果。所以,对于不同的激光切割机(即不同β值的高斯光束),二元相位元件的归一化半径需要重新优化。Generally, the optical system is circularly symmetric, so the general binary phase element also adopts circularly symmetric structure. At the same time, binary structures are easy to process and widely adopted. The present invention just adopts this binary pure phase element with simple structure and easy processing. Figures 3a and b are schematic diagrams of typical 3-zone and 5-zone binary phase elements, respectively. Adding this specially designed binary phase element before the focusing lens constitutes the optical path of the cutting head with extended focal depth of the present invention, as shown in FIG. 1 . After the binary phase element 4 is added to the optical path of the cutting head to focus the rear field of the lens, in the physical model of the optical field distribution near the focal spot, we can preliminarily calculate the distribution of the rear field intensity by formula (1). Then, according to this approximate physical model, by changing the normalized geometric radius value of each area of the binary phase element and optimizing the focal depth of the field behind the focusing lens (defined according to formula (4)), the depth of focal length can be obtained Binary phase element. It can be seen from the normalized field intensity distribution formula (1) of the backfield of the focusing optical path (the optical head focusing optical path after adding the binary phase element) that the normalized backfields of Gaussian beams with different truncation ratios are also different . That is to say, if the normalized radius of the binary phase element is optimized for a Gaussian beam with a small β value, it may not be optimal for a Gaussian beam with a large β value, and may not even have the effect of extending the depth of focus. Therefore, for different laser cutters (ie Gaussian beams with different β values), the normalized radius of the binary phase element needs to be re-optimized.

表1中所示是假设入射激光场为均匀强度分布(可以看作β→0的高斯光束)情况下,经过模拟退火优化的得到的3区和5区的归一化半径的最优解。同时,表中还列出了对应的斯涅尔比、旁瓣强度比、横向光斑半径比和对应焦深比(加入相位元件前后的焦深之比)等性能参数。从中可以看出,我们所设计的二元相位元件能够显著延长聚焦焦深(2~4倍)。同时,横向的光斑的大小基本不变(8%以内)。同时,表中还给出了两种优化结构在入射激光场为β=1的高斯强度分布情况下的斯涅尔比、旁瓣强度比、横向光斑半径比和对应焦深比等性能参数。Table 1 shows the optimal solutions of the normalized radii of the 3 and 5 regions obtained through simulated annealing optimization under the assumption that the incident laser field has a uniform intensity distribution (which can be regarded as a Gaussian beam of β→0). At the same time, the table also lists performance parameters such as the corresponding Snell ratio, side lobe intensity ratio, lateral spot radius ratio, and corresponding focal depth ratio (the ratio of the focal depth before and after adding the phase element). It can be seen that the binary phase element designed by us can significantly prolong the focal depth of focus (2-4 times). At the same time, the size of the lateral light spot is basically unchanged (within 8%). At the same time, the performance parameters such as Snell ratio, side lobe intensity ratio, transverse spot radius ratio and corresponding focal depth ratio of the two optimized structures are given in the case of Gaussian intensity distribution with incident laser field β=1.

图4给出了入射激光场的高斯强度截断比β取不同值时,原始聚焦光斑(未加二元相位元件)的焦深和加入表1中所给出的3区和5区二元相位元件之后的聚焦焦深的变化情况。100表示加入二元相位元件之前的聚焦焦深随β的变化情况;300表示加入所优化的3区二元相位元件之后的聚焦焦深随β的变化情况;500表示加入所优化的5区二元相位元件之后的聚焦焦深随β的变化情况。从中我们可以清楚的看出,随β值的增大,焦深均是在逐步减小。其中,加入二元相位元件之后的聚焦焦深下降得更快,而5区的又比3区的下降得更快,也就说对β值更为敏感。从该图中我们还可以看出,在β<1情况下,3区和5区的二元相位元件的延长焦深还是比较明显;在β>1时,基本上就没有延长焦深的效果,当β=2时,焦深反而被压缩。可见,对于大β值的入射激光场,二元相位元件的归一化半径需要重新优化。Figure 4 shows the depth of focus of the original focused spot (without binary phase element) and the binary phases of zone 3 and zone 5 given in Table 1 when the Gaussian intensity cutoff ratio β of the incident laser field is different. The variation of the depth of focus after the element. 100 represents the variation of focal depth with β before adding binary phase element; 300 represents the variation of focal depth with β after adding optimized 3-zone binary phase element; 500 represents the variation of focal depth with β after adding optimized 5-zone The variation of the depth of focus after the meta-phase element with β. We can clearly see that the depth of focus decreases gradually with the increase of the β value. Among them, after adding the binary phase element, the focal depth of focus drops faster, and the area 5 drops faster than the area 3, that is to say, it is more sensitive to the β value. From this figure, we can also see that in the case of β<1, the depth of focus extension of the binary phase elements in zones 3 and 5 is relatively obvious; when β>1, basically there is no effect of extending the depth of focus , when β=2, the depth of focus is compressed instead. It can be seen that for the incident laser field with a large β value, the normalized radius of the binary phase element needs to be re-optimized.

图5a和b分别为均匀强度分布和高斯强度分布(β=1时)两种情况下,加入二元相位元件前后的纵向焦深和横向焦斑大小的对比,301表示高斯强度分布(β=1时)加入相位元件之前的光强,302表示高斯强度分布(β=1时)加入相位元件之后的光强;303表示均匀强度分布(β→0时)加入相位元件之前的光强,304表示均匀强度分布(β→0时)加入相位元件之后的光强。Figures 5a and b are the comparisons of the longitudinal focal depth and transverse focal spot size before and after adding binary phase elements in the two cases of uniform intensity distribution and Gaussian intensity distribution (when β=1), and 301 represents the Gaussian intensity distribution (β= 1) the light intensity before adding the phase element, 302 represents the light intensity after the Gaussian intensity distribution (when β=1) is added to the phase element; 303 represents the light intensity before the uniform intensity distribution (β→0) before adding the phase element, 304 Indicates the light intensity after adding a phase element with a uniform intensity distribution (when β→0).

这进一步说明了表1中的结果。同时,从图中我们可以看出,相比于均匀强度分布,高斯强度分布的横向焦斑更大,并且纵向焦深更小。因而,在实际光路中,我们应尽可能将光束通过准直扩束为均匀强度分布的平面波,即小β值高斯强度分布。在这种小β值高斯强度分布前提下,相比于3区相位元件,5区具有更好的延长焦深能力。从理论上讲,我们可以通过增加更多的区数,来更进一步的延长焦深,但这样就会带来主斑能量下降较多,也就意味着我们需要进一步提高激光输出功率,而实际的激光工作功率是有限的,也就是说延长焦深也是有一个限度的。本发明中提出的3区和5区二元相位元件,是综合考虑延长焦深和激光功率限度的结果。当然,如果激光器功率足够高,可以采用更多分区的二元相位元件。This further illustrates the results in Table 1. At the same time, we can see from the figure that, compared with the uniform intensity distribution, the lateral focal spot of the Gaussian intensity distribution is larger, and the vertical focal depth is smaller. Therefore, in the actual optical path, we should collimate and expand the beam as much as possible into a plane wave with uniform intensity distribution, that is, a Gaussian intensity distribution with a small β value. Under the premise of such a Gaussian intensity distribution with a small β value, compared with the 3-zone phase element, the 5-zone has a better ability to extend the depth of focus. Theoretically speaking, we can further extend the depth of focus by adding more areas, but this will cause a large drop in the energy of the main spot, which means that we need to further increase the laser output power, and the actual The working power of the laser is limited, that is to say, there is a limit to extending the focal depth. The 3-zone and 5-zone binary phase elements proposed in the present invention are the results of comprehensively considering the extension of the focal depth and the limitation of laser power. Of course, if the laser power is high enough, more partitioned binary phase elements can be used.

表1不同区数下优化的二元相位元件参数Table 1 Optimized binary phase element parameters under different number of zones

Figure GSA00000063397500061
Figure GSA00000063397500061

注:横向焦斑半径比和纵向焦深比都是相对加入相位元件之前的聚焦光场的相应参数的比值。Note: The lateral focal spot radius ratio and longitudinal focal depth ratio are relative to the corresponding parameters of the focused light field before adding the phase element.

二、实施例Two, the embodiment

本发明延长焦深的激光切割头,其包括:准直扩束透镜组2、反射镜3和消像差聚焦透镜5,其特点在于:在所述的消像差聚焦透镜5前加入一个二元相位元件4,该二元相位元件4与消像差透镜5共轴,该二元相位元件4的通光孔径与所述的激光切割头的入射光瞳一致,该二元相位元件4是中心对称的同心圆环的多区结构,该二元相位元件4的相位自内向外依次按区0、π相间分布。The laser cutting head with extended focal depth of the present invention includes: a collimating beam expander lens group 2, a reflector 3 and an aberration-absorbing focusing lens 5, and is characterized in that a two-dimensional lens is added in front of the aberration-absorbing focusing lens 5 A metaphase element 4, the binary phase element 4 is coaxial with the aberration-elimination lens 5, the clear aperture of the binary phase element 4 is consistent with the entrance pupil of the laser cutting head, and the binary phase element 4 is The multi-zone structure of the center-symmetrical concentric rings, the phases of the binary phase element 4 are distributed sequentially according to zone 0 and π from the inside to the outside.

以下以固体Nd:YAG激光切割机为例,针对其工作波长(1064nm),提出一种具体实施方案。如上所述的二元相位元件4采用的是低折射率的熔融石英玻璃(在1064nm波段,n=1.4496),当激光正入射时,这种二元光学元件的反射率为7.2%(假设元件表面为理想平面),可见激光损耗是比较低的。同时,纯熔融石英玻璃的抗损伤阈值很高,对于1064nm的脉冲激光其破坏阈值高达20~40J/cm2。熔融石英在1064nm波长处的折射率为1.4496,于是其Taking the solid Nd:YAG laser cutting machine as an example, a specific implementation plan is proposed for its working wavelength (1064nm). What the above-mentioned binary phase element 4 adopts is the fused silica glass of low refractive index (at 1064nm wavelength band, n=1.4496), and when the laser light is normal incident, the reflectivity of this binary optical element is 7.2% (assuming element The surface is an ideal plane), and the visible laser loss is relatively low. At the same time, the damage threshold of pure fused silica glass is very high, and its damage threshold for 1064nm pulsed laser is as high as 20-40J/cm 2 . The refractive index of fused silica at a wavelength of 1064nm is 1.4496, so its

相位深度为d0=1.064/(2×(1.4496-1))=1.183μm。设固体Nd:YAG激光切割机所发射的1064nm的激光经准直扩束之后的光束束腰半径为5mm,透镜的通光孔径(直径)为10mm,焦距为100mm(NA=0.05)。则我们所优化的三区相位元件的各环半径依次为:1.783mm,4.655mm,5mm。综合考虑相位元件的机械性能、光学性能和成本,其厚度设为1mm。对于熔融石英基底材料,我们可以采用成熟的光刻技术和等离子体刻蚀技术来加工这种二元的相位元件。The phase depth is d 0 =1.064/(2×(1.4496-1))=1.183 μm. Assume that the beam waist radius of the 1064nm laser emitted by the solid Nd:YAG laser cutting machine after collimation and expansion is 5mm, the clear aperture (diameter) of the lens is 10mm, and the focal length is 100mm (NA=0.05). Then the radii of each ring of the three-zone phase element we optimized are: 1.783mm, 4.655mm, 5mm. Considering the mechanical performance, optical performance and cost of the phase element comprehensively, its thickness is set to 1 mm. For fused silica substrate materials, we can use mature photolithography and plasma etching techniques to process this binary phase element.

综上所述,本发明提出了一种简单地利用二元相位元件有效延长焦深的激光切割头,并且以固体Nd:YAG激光切割机为例提出了一种可行的技术路线。这种延长焦深的二元相位元件在激光加工技术中有着广泛的实用价值和良好应用前景。In summary, the present invention proposes a laser cutting head that simply utilizes a binary phase element to effectively extend the focal depth, and a feasible technical route is proposed by taking a solid Nd:YAG laser cutting machine as an example. This binary phase element with extended focal depth has wide practical value and good application prospect in laser processing technology.

Claims (3)

1. laser cutting head that prolongs depth of focus, its formation comprises along laser incident direction collimator and extender set of lenses (2) successively, speculum (3) and anaberration condenser lens (5), it is characterized in that: at described anaberration condenser lens (a 5) binary phase element of preceding adding (4), this binary phase element (4) is coaxial with anaberration lens (5), the clear aperature of this binary phase element (4) is consistent with the entrance pupil of described laser cutting head, this binary phase element (4) is the multi-region structure of centrosymmetric donut, and the phase place of this binary phase element (4) is from inside to outside successively by district 0, π distributes alternately.
2. the laser cutting head of prolongation depth of focus according to claim 1, it is characterized in that described binary phase element (4) is 3 district's binary phase elements, the normalization radius of this 3 district binary phase element of plane wave that uniform strength is distributed is followed successively by: 0,0.3029,0.9167 and 1.
3. the laser cutting head of prolongation depth of focus according to claim 1, it is characterized in that described binary phase element (4) is 5 district's binary phase elements, the normalization radius of this 5 district binary phase element of plane wave that uniform strength is distributed is followed successively by: 0,0.0196,0.3421,0.5523,0.9251 and 1.
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