CN101797666A - Laser cutting head capable of extending focal depth - Google Patents
Laser cutting head capable of extending focal depth Download PDFInfo
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- CN101797666A CN101797666A CN 201010133087 CN201010133087A CN101797666A CN 101797666 A CN101797666 A CN 101797666A CN 201010133087 CN201010133087 CN 201010133087 CN 201010133087 A CN201010133087 A CN 201010133087A CN 101797666 A CN101797666 A CN 101797666A
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Abstract
The invention relates to a laser cutting head capable of extending focal depth. The laser cutting head comprises collimating and beam-expanding lenses, a reflector and an anastigmatic focusing lens which are arranged sequentially along laser incident direction. The laser cutting head is characterized in that: a biphase element is additionally arranged in front of the anastigmatic focusing lens; the biphase element is coaxial with the anastigmatic focusing lens; the clear aperture of the biphase element is consistent with the entrance pupil of the laser cutting head; the biphase element has a multi-region structure of centrosymmetric concentric rings; and the phase positions of the biphase element are distributed at intervals according to the regions 0 and pi sequentially from the inside to the outside. The laser cutting head has the advantages of increasing the cutting speed and the limiting cutting thickness of a laser cutter, improving the quality of cutting section and having a significant practical value and application prospect for enhancing the cutting speed and the energy utilization ratio of the laser cutter and improving the quality of a cutting section.
Description
Technical field
The present invention relates to laser cutting machine, particularly a kind of laser cutting head that is used for the prolongation depth of focus of laser cutting machine.
Background technology
Since nineteen sixty, laser instrument came out, laser technology had obtained development at full speed.Because high brightness, high directivity, high monochromaticity and the high coherence of laser uniqueness, at the beginning of its invention, just the someone proposes laser is used for materials processing.At present, laser processing technology has developed into a kind of important laser application technique.Compare with traditional machining, the main feature of Laser Processing has: the laser beam energy high concentration, and machining area is little, thereby thermal deformation is little; Crudy height, precision height, speed are fast; Workpiece is not limited by size, shape; Do not need cooling medium, and pollution-free, and noise is little.Through nearly 50 years development, Laser Processing has combined with a plurality of subjects and has formed a plurality of applied technical fields, and main process technology comprises: laser cutting, laser weld, laser marking, laser boring, LASER HEAT TREATMENT, laser fast shaping, laser cladding etc.Wherein, laser cutting has become the current industrial manufacture field and has used maximum laser processings, can account for more than 70% of whole Laser Processing industry.
The main principle of laser cutting is the light field energy that relies on the high concentration of laser, directly workpiece is needed cutting part gasification or fusing, reaches the cutting purpose, that is to say that the high-energy-density of laser is vital factor.Exactly because the high energy density of laser beam that focuses on just can moment workpiece be gasified or fusing, and fuel factor also has little time to transmit towards periphery, thereby can not produce thermal deformation.Also this just high energy density makes that just fly-cutting becomes possibility.And the energy density of decision focussed laser beam is near its light distribution focus, and near this axial focused light distribution focus is only this quality factor that influences laser cutting quality and speed.In field of laser processing, the performance that people weigh a laser cutting machine with near focal spot radius R the focus and depth of focus DOF usually.Current, depth of focus is a bottleneck factor that influences laser cutting speed and cutting thickness longitudinally.Workpiece for relatively thin in the relative laser cutting head fast moving of workpiece process, tends to occur the out of focus phenomenon, especially for the workpiece of some air spots (as curved surface).At this moment, just must improve the work capacity of laser, the utilization rate of laser energy is reduced, also can influence the cutting section quality of workpiece simultaneously.A kind of feasible scheme adds a self-focusing focus servosystem exactly, can increase cost so again.Simultaneously, if the speed of focus servo does not catch up with workpiece movement speed, equally also out of focus can occur, at this moment, focus servo speed has just become a serious bottleneck that improves cutting speed.On the other hand, when cutting thicker workpiece, if the thickness of workpiece has surpassed depth of focus, this will be a challenge greatly so.At this moment, be unsatisfactory only by improving laser output energy.Because on the one hand, the output energy of laser instrument is limited, when laser instrument is in high power, excess load operating state for a long time, its life-span can obviously shorten.Simultaneously, only improve laser output energy, exceeding focal depth range, light distribution is very uneven, and the consequence of bringing like this is that the depth of parallelism of cutting section of workpiece is very poor.In other words, any laser cutting machine all has the thickness of workpiece that cuts of a maximum, and we call this thickness its limit cutting thickness.Obviously, it is big more to focus on depth of focus, and its limit cutting thickness is also big more.
We know that the numerical aperture of depth of focus and condenser lens is closely related.In low numerical aperture scope (NA＜0.5), the relation between depth of focus DOF and the numerical aperture NA can be write as DOF ∝ λ/NA
2, that is to say square being inversely proportional to of the numerical aperture of depth of focus and condenser lens.Prolong depth of focus, just must reduce numerical aperture, and numerical aperture reduces, focal beam spot will increase, and energy density descends, and is unfavorable for laser cutting.Also be to say, simple reduction numerical aperture be a kind of be the method that cost prolongs depth of focus to reduce focal beam spot resolution ratio and focussed laser beam energy density.
For these reasons, prolong depth of focus and do not reduce the optical field distribution of focal beam spot lateral resolution, promptly, improve the speed of laser cutting and improve the cutting section quality very helping guaranteeing to prolong depth of focus under the enough big prerequisite of the burnt district of focussed laser beam energy density.
Summary of the invention
The objective of the invention is to propose a kind of laser cutting head that is used for the prolongation depth of focus of laser cutting machine, this prolongs the laser cutting head of depth of focus, can significantly improve laser beam and focus on depth of focus, simultaneously can also keep horizontal focal spot constant substantially, to improving the cutting speed and the limit cutting thickness of laser cutting machine, it is very favourable to improve the cutting section quality.
Technical solution of the present invention is as follows:
A kind of laser cutting head that prolongs depth of focus, its formation comprises along laser incident direction collimator and extender set of lenses, speculum and anaberration condenser lens successively, its characteristics are: add a binary phase element before described anaberration condenser lens, this binary phase element and described anaberration lens are coaxial, the clear aperature of this binary phase element is consistent with the entrance pupil of described laser cutting head, the multi-region structure that this binary phase element is centrosymmetric donut, the phase place of this multi-region distribute alternately by district 0, π from inside to outside successively.
Described binary phase element is 3 district's binary phase elements, and the normalization radius of this 3 district binary phase element of plane wave that uniform strength is distributed is followed successively by: 0,0.3029,0.9167 and 1.
Described binary phase element is 5 district's binary phase elements, and the normalization radius of this 5 district binary phase element of plane wave that uniform strength is distributed is followed successively by: 0,0.0196,0.3421,0.5523,0.9251 and 1.
Technique effect of the present invention
The present invention adds the binary diffractive optical element of a pure phase position modulation in the laser cutting machine focused light passages, reached the depth of focus that prolongs focused beam, do not increase simultaneously the transverse focusing spot size, improve focusing on the inhomogeneity technique effect of the vertical energy density distribution of light field.This focusing light field of uniform more energy density distribution in the vertical, working (machining) efficiency and crudy for improving utilization ratio of laser energy, raising laser cutting machine have important practical value and application prospect.
Description of drawings
Fig. 1 is the laser cutting machine light path schematic diagram that the present invention prolongs depth of focus.Its light path according to numbering is successively: the 1-laser instrument; 2 collimator and extender set of lenses; 3 speculums; 4 binary phase elements; 5 anaberration condenser lenses; 6 processing works two dimension mobile platform.
Fig. 2 is a focussed laser beam physical model schematic diagram in the laser cutting head.
The typical 3 district's binary phase elements of Fig. 3 (a); (b) typical 5 district's binary phase elements.
The focusing depth of focus that Fig. 4 adds before and after the binary phase element blocks variation than β with Gaussian intensity profile.
(β → 0 and β=1) adds phase elements front and back, 3 district vertically (a) and the laterally light distribution of (b) under two kinds of situations of Fig. 5.
The specific embodiment
One, theoretical design
1, the foundation of the physical model of laser cutting machine focused light passages
Typical laser cutting machine light path according to numbering is: laser instrument 1 as shown in Figure 1 successively; Collimator and extender set of lenses 2; Speculum 3; Anaberration condenser lens 5; Processing work two dimension mobile platform 6.The focused light passages of the laser after collimator and extender can be reduced to the physical model of Fig. 2.As shown in Figure 2, be the center of circle with the focus of condenser lens, set up rectangular coordinate system, wherein, optical axis is along the z direction of principal axis.Laser beam after collimator and extender can be regarded the plane wave that intensity becomes Gaussian distribution as.The condenser lens numerical aperture that is adopted in the laser cutting generally lower (NA＜0.1), thereby the back court of this condenser lens of its laser beam process can adopt classical scalar diffraction to calculate.Near its normalization Electric Field Distribution focus can be expressed as:
Wherein: r=ρ/R is normalized lateral coordinates, and ρ is the actual coordinate on plane, condenser lens place, and R is the clear aperature of system.U and v are respectively
And L (r) characterizes the lateral amplitude of vibration of light beam and distributes, and is the Gaussian beam of ω for spot radius on the condenser lens lateral separation of optical axis (spot radius is defined as the strength retrogression when going up the 1/e of intensity for axle from), and it can be expressed as
L(r)＝exp(-β
2r
2) (3)
Wherein, β=R/ ω.
In order to characterize the variation that adds light field after the phase element, we defined following parameter: Si Nieer than (S), side lobe intensity than (M), vertically depth of focus and horizontal focal spot radius.Wherein, Si Nieer is defined as the ratio that adds center main lobe intensity and Airy disk center main lobe intensity after the phase element than S; Side lobe intensity is defined as the side lobe intensity maximum in the horizontal light distribution and the ratio of center main lobe intensity than M.And horizontal spot radius is defined as the lateral separation when light intensity is reduced to the 1/e of a last light intensity.In field of laser processing, vertically depth of focus is defined as when the minimum relatively hot spot of spot size (on the focal plane) has increased by 5% the vertically distance between two points of (on the optical axis).In the present invention, we add two other restrictive condition, and promptly in focal depth range, Si Nieer must not be lower than 0.1 than S, and simultaneously, side lobe intensity must not be higher than 1/e than M.So depth of focus just may be defined as
DOF＝2|z
t| (4)
Wherein, z
t=min (z
m, z
s, z
p), and z
m, z
s, z
pSatisfy M (z respectively
m)=1/e, S (z
s)=0.1 and R (z
p)=1.05R (z=0).
2, prolong the optimal design of the binary phase element of depth of focus
Usually optical system is the circle symmetry, thereby general binary phase element also all adopts the circle symmetrical structure.Simultaneously, diadactic structure is easy to processing, also widely adopts.The present invention adopted just this simple in structure, be easy to processing, binary pure phase bit unit.Fig. 3 a and b are respectively the schematic diagrames of the binary phase element in typical 3 districts and 5 districts.Before this binary phase element through particular design is added in condenser lens, promptly constituted prolongation depth of focus cutting head light path of the present invention, as shown in Figure 1.Add binary phase element 4 condenser lens back court afterwards in the cutting head light path, in the physical model of optical field distribution, we can pass through the field intensity distribution thereafter of formula (1) primary Calculation near focal spot.According to this approximate physical model,, optimize the depth of focus (defining) of condenser lens back court then, can obtain prolonging the binary phase element of depth of focus according to formula (4) by changing each normalization geometric radius value of distinguishing of binary phase element.By the normalization field strength distribution formula (1) of focused light passages (add binary phase element after bare headed focused light passages) back court as can be seen, have difference block than Gaussian beam, its normalization back court also is distinguishing.In other words, if the normalization radius of the binary phase element of optimizing at the Gaussian beam of little β value to may being not optimum just under the Gaussian beam situation of big β value, even may not prolong the effect of depth of focus.So for different laser cutting machines (being the Gaussian beam of different beta value), the normalization radius of binary phase element needs to optimize again.
Be that hypothesis incident laser field is under uniform strength distribution (Gaussian beam that can regard β → 0 as) situation shown in the table 1, the optimal solution of 3 districts that obtain of process simulated annealing optimization and the normalization radius in 5 districts.Simultaneously, corresponding Si Nieer ratio, side lobe intensity ratio, horizontal hot spot radius ratio and corresponding depth of focus have also been listed in the table than performance parameters such as (ratios that adds the depth of focus of phase element front and back).Therefrom as can be seen, our designed binary phase element can focus on depth of focus (2～4 times) by significant prolongation.Simultaneously, the size of horizontal hot spot constant substantially (in 8%).Simultaneously, give in the table two kinds optimize structure in the incident laser field be under the Gaussian intensity profile situation of β=1 Si Nieer than, side lobe intensity than, laterally hot spot radius ratio and corresponding depth of focus such as compare at performance parameter.
When the gaussian intensity that Fig. 4 has provided the incident laser field blocks and gets different value than β, the depth of focus of original focal beam spot (not adding the binary phase element) and add 3 given in the table 1 districts and the situation of change of 5 district's binary phase elements focusing depth of focus afterwards.100 expressions add the situation of change of binary phase element focusing depth of focus before with β; Focusing depth of focus after 3 district's binary phase elements that 300 expression addings are optimized is with the situation of change of β; Focusing depth of focus after 5 district's binary phase elements that 500 expression addings are optimized is with the situation of change of β.Therefrom we can clearly find out, with the increase of β value, depth of focus all is progressively to reduce.Wherein, the focusing depth of focus that adds after the binary phase element descends sooner, and 5 districts than descending of 3 districts faster, also more responsive with regard to saying to the β value.We it can also be seen that from this figure, and under β＜1 situation, the prolongation depth of focus of the binary phase element in 3 districts and 5 districts still is apparent in view; In β＞1 o'clock, the effect that does not just prolong depth of focus basically, when β=2, depth of focus is compressed on the contrary.As seen, for the incident laser field of big β value, the normalization radius of binary phase element needs to optimize again.
Fig. 5 a and b are respectively that uniform strength distributes and two kinds of situations of Gaussian intensity profile (β=1 o'clock) under, add vertical depth of focus of binary phase element front and back and the laterally contrast of focal spot size, 301 expression Gaussian intensity profile (β=1 o'clock) add the light intensity before the phase element, and 302 expression Gaussian intensity profile (β=1 o'clock) add the light intensity after the phase element; 303 expression uniform strengths distribute (β → 0 o'clock) add light intensity before the phase element, 304 expression uniform strengths distribute (β → 0 o'clock) add light intensity after the phase element.
This further illustrates the result in the table 1.Simultaneously, we distribute than uniform strength as can be seen from figure, and the horizontal focal spot of Gaussian intensity profile is bigger, and vertically depth of focus is littler.Thereby in actual light path, we should be the plane wave that uniform strength distributes with light beam by collimator and extender as far as possible, promptly little β value Gaussian intensity profile.Under this little β value Gaussian intensity profile prerequisite, than 3 district's phase elements, 5 districts have better prolongation depth of focus ability.Theoretically, we can be by increasing more district number, further prolong depth of focus, but will bring main spot energy decreases more like this, just mean that also we further improve laser output power by needs, and actual laser work power is limited, that is to say that prolonging depth of focus also has a limit.3 districts that propose among the present invention and 5 district's binary phase elements are to take all factors into consideration the result who prolongs depth of focus and laser power limit.Certainly, if laser power is enough high, can adopt the more binary phase element of multi partition.
Table 1 is the following binary phase component parameters of optimizing of same district number not
Annotate: laterally the focal spot radius ratio all is the relative ratio that adds the relevant parameter of phase element focusing light field before with vertical depth of focus ratio.
Two, embodiment
The present invention prolongs the laser cutting head of depth of focus, it comprises: collimator and extender set of lenses 2, speculum 3 and anaberration condenser lens 5, its characteristics are: add a binary phase element 4 before described anaberration condenser lens 5, this binary phase element 4 is coaxial with anaberration lens 5, the clear aperature of this binary phase element 4 is consistent with the entrance pupil of described laser cutting head, the multi-region structure that this binary phase element 4 is centrosymmetric donuts, the phase place of this binary phase element 4 distribute alternately by district 0, π from inside to outside successively.
Below with solid Nd: the YAG laser cutting machine is an example, at its operation wavelength (1064nm), proposes a kind of specific embodiments.Aforesaid binary phase element 4 adopts is that the fused silica glass of low-refraction is (at the 1064nm wave band, n=1.4496), when laser normal incidence, the reflectivity of this binary optical elements is 7.2% (supposing that element surface is the ideal plane), and the visible laser loss is lower.Simultaneously, the anti-damage threshold of pure fused silica glass is very high, for its damage threshold of pulse laser of 1064nm up to 20～40J/cm
2The refractive index of vitreous silica at 1064nm wavelength place is 1.4496, so its
Phase depth is d
0=1.064/ (2 * (1.4496-1))=1.183 μ m.If solid Nd: the beam waist radius of the laser of the 1064nm that the YAG laser cutting machine is launched after collimator and extender is 5mm, and the clear aperature of lens (diameter) is 10mm, and focal length is 100mm (NA=0.05).The radius that respectively encircles of three district's phase elements that then we optimized is followed successively by: 1.783mm, 4.655mm, 5mm.Take all factors into consideration mechanical performance, optical property and the cost of phase element, its thickness is made as 1mm.For the vitreous silica base material, the phase element that we can adopt ripe photoetching technique and plasma etching technology to process this binary.
In sum, the present invention proposes a kind of laser cutting head that utilizes the binary phase element effectively to prolong depth of focus simply, and with solid Nd: the YAG laser cutting machine is that example has proposed a kind of feasible technology path.The binary phase element of this prolongation depth of focus has wide practical value and applications well prospect in laser processing technology.
Claims (3)
1. laser cutting head that prolongs depth of focus, its formation comprises along laser incident direction collimator and extender set of lenses (2) successively, speculum (3) and anaberration condenser lens (5), it is characterized in that: at described anaberration condenser lens (a 5) binary phase element of preceding adding (4), this binary phase element (4) is coaxial with anaberration lens (5), the clear aperature of this binary phase element (4) is consistent with the entrance pupil of described laser cutting head, this binary phase element (4) is the multi-region structure of centrosymmetric donut, and the phase place of this binary phase element (4) is from inside to outside successively by district 0, π distributes alternately.
2. the laser cutting head of prolongation depth of focus according to claim 1, it is characterized in that described binary phase element (4) is 3 district's binary phase elements, the normalization radius of this 3 district binary phase element of plane wave that uniform strength is distributed is followed successively by: 0,0.3029,0.9167 and 1.
3. the laser cutting head of prolongation depth of focus according to claim 1, it is characterized in that described binary phase element (4) is 5 district's binary phase elements, the normalization radius of this 5 district binary phase element of plane wave that uniform strength is distributed is followed successively by: 0,0.0196,0.3421,0.5523,0.9251 and 1.
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Cited By (7)
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| CN103091859A (en) * | 2012-12-10 | 2013-05-08 | 中国科学院上海光学精密机械研究所 | Device generating super-resolution light spots and super-long focus depth |
| CN103097073A (en) * | 2010-10-19 | 2013-05-08 | 日产自动车株式会社 | Laser cutting method |
| CN103317232A (en) * | 2013-06-07 | 2013-09-25 | 浙江台州九晨机械科技有限公司 | Phase modulation device for laser cutting system |
| CN103472688A (en) * | 2013-09-18 | 2013-12-25 | 中国科学院上海光学精密机械研究所 | Illumination device of deep ultraviolet projection mask aligner and application method |
| WO2017123963A1 (en) * | 2016-01-14 | 2017-07-20 | Corning Incorporated | Dual-airy-beam systems and methods for processing glass substrates |
| CN110366472A (en) * | 2019-01-30 | 2019-10-22 | 大族激光科技产业集团股份有限公司 | For cutting the laser cutting head and laser cutting device of hard brittle prod |
| CN110837215A (en) * | 2019-11-05 | 2020-02-25 | 中国科学院光电技术研究所 | High-efficiency laser direct-writing photoetching method capable of realizing long-focal-depth and small-focal-spot structure |
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| US9168611B2 (en) | 2010-10-19 | 2015-10-27 | Nissan Motor Co., Ltd. | Laser cutting method |
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| CN109071307B (en) * | 2016-01-14 | 2021-10-22 | 康宁公司 | Dual Airy Beam System and method for processing glass substrates |
| CN110366472A (en) * | 2019-01-30 | 2019-10-22 | 大族激光科技产业集团股份有限公司 | For cutting the laser cutting head and laser cutting device of hard brittle prod |
| US20200238442A1 (en) * | 2019-01-30 | 2020-07-30 | Han's Laser Technology Industry Group Co., Ltd | Laser cutting head for cutting hard, brittle products and laser cutting device thereof |
| CN110837215A (en) * | 2019-11-05 | 2020-02-25 | 中国科学院光电技术研究所 | High-efficiency laser direct-writing photoetching method capable of realizing long-focal-depth and small-focal-spot structure |
| CN110837215B (en) * | 2019-11-05 | 2021-02-26 | 中国科学院光电技术研究所 | High-efficiency laser direct-writing photoetching method capable of realizing long-focal-depth and small-focal-spot structure |
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Application publication date: 20100811 |