JPWO2012029142A1 - Laser processing apparatus and substrate position detection method - Google Patents

Abstract

The laser processing apparatus performs processing so that the camera 39 sequentially images the positioning marks provided on the substrate and the camera 39 continuously moves on the positioning marks without stopping the processing table. A movement command output unit 21 that outputs a movement command to the table, an imaging command output unit 25 that outputs an imaging instruction to the camera 39 when the camera 39 moves onto the positioning mark, and a movement command to the processing table Is output to the substrate processing table using the image processing unit 27 that calculates the position of the positioning mark based on the image of the positioning mark captured by the camera 39 and the position of the positioning mark. The position shift amount calculation unit 29 for calculating the position shift amount and the laser processing position of the substrate are corrected with the position shift amount calculated by the position shift amount calculation unit 29. Comprises a laser processing unit for performing laser processing, the.

Description

  The present invention relates to a laser processing apparatus and a substrate position detection method for calculating a positional deviation amount of a substrate with respect to a processing table.

  As one of apparatuses for processing a workpiece (processing object) such as a printed circuit board, there is a laser processing apparatus (micro laser processing machine) that performs drilling by irradiating the workpiece with laser light. In such a laser processing apparatus, the position of a positioning mark arranged on the workpiece is detected, and position correction (position shift correction) at the time of laser processing is performed based on the detection result. When detecting the position of the positioning mark, for example, an image of the positioning mark is projected using a camera or the like, and the position of the positioning mark is detected by performing image processing on the projected image.

  Since workpieces subjected to laser processing may expand and contract within the workpiece surface, it is necessary to increase the number of positioning marks in order to improve the workpiece positioning accuracy. For example, in the laser processing apparatus described in Patent Document 1, a camera is moved on a positioning mark to perform image processing of the positioning mark. Then, the displacement amount (position) of the positioning mark is detected. By repeating these processes for all the positioning marks, the position detection of all the positioning marks is completed. Thereafter, positional deviation correction is performed.

  Moreover, in the laser processing apparatus described in Patent Document 2, one of the positioning marks is moved below the camera by moving the XY table. Thereafter, the positioning mark is imaged by the camera, and the coordinates of the positioning mark in the imaging area are obtained by the image processing apparatus. Then, based on the coordinates of the current position of the XY table and the coordinates of the positioning mark in the imaging area, the amount of displacement of the positioning mark with respect to the machine origin is obtained. In the laser processing apparatus, the respective shift amounts are obtained for a plurality of positioning marks. Then, the NC device corrects the processing position command value to the substrate during processing based on the deviation amount.

JP 2000-176666 A Japanese Patent Laid-Open No. 10-328863

  However, in the former and latter prior arts, after the camera is moved to the positioning mark and stopped, image acquisition and image processing are performed, and then the camera is moved again to the positioning mark. For this reason, the time required for image processing increases in proportion to the number of positioning marks. As a result, there is a problem that it takes a long time to detect the position of the positioning mark.

  The present invention has been made in view of the above, and an object of the present invention is to obtain a laser processing apparatus and a substrate position detection method capable of detecting a positional deviation of a substrate in a short time.

  In order to solve the above-described problems and achieve the object, the present invention provides a processing table for placing a substrate to be laser processed and moving in a plane parallel to the main surface of the substrate, and on the substrate. An imaging unit that sequentially images the positioning marks used for position detection on the substrate, and the imaging unit continuously moves on the positioning marks without stopping the processing table. A movement instruction unit that outputs a movement command to the processing table, an imaging instruction unit that outputs an imaging instruction to the imaging unit when the imaging unit has moved onto the positioning mark, and the movement Mark position calculation that calculates the position of the positioning mark based on the image of the positioning mark imaged by the imaging unit while the instruction unit outputs a movement command to the processing table. Using the position of the positioning mark calculated by the mark position calculation unit, a positional deviation amount calculation unit that calculates a positional deviation amount of the substrate with respect to the processing table, and a laser processing position of the substrate, And a laser processing unit that performs laser processing while correcting the position with the positional shift amount calculated by the positional shift amount calculation unit.

  According to the present invention, it is possible to detect a substrate displacement in a short time.

FIG. 1 is a diagram showing a configuration of a laser processing apparatus according to an embodiment of the present invention. FIG. 2 is a diagram showing the configuration of the machining control device and the XY table. FIG. 3 is a block diagram illustrating a configuration of a machining position calculation unit according to the embodiment. FIG. 4 is a flowchart showing a procedure for calculating the positional deviation amount of the substrate. FIG. 5 is a diagram illustrating an example of an image obtained by imaging a mark. FIG. 6 is a diagram illustrating an example of a mark arrangement position. FIG. 7 is a diagram illustrating an example of an imaging order of marks. FIG. 8 is a diagram for explaining the difference between the substrate positional deviation amount calculation processing in the embodiment and the conventionally used substrate positional deviation amount calculation processing.

  Hereinafter, a laser processing apparatus and a position detection method according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

Embodiment.
FIG. 1 is a diagram showing a configuration of a laser processing apparatus according to an embodiment of the present invention. The laser processing apparatus 100 is an apparatus that performs laser drilling on a substrate (workpiece) 4 that is a workpiece by irradiating a laser beam L (pulse laser beam). The laser processing apparatus 100 according to the present embodiment performs a process of moving the camera 39 onto the positioning mark and an image process of the positioning mark (a process of calculating the position of the positioning mark) at the same time, thereby 4 is calculated.

  The laser processing apparatus 100 includes a laser oscillator 1 that oscillates laser light L, a laser processing unit 3 that performs laser processing of the substrate 4, and a processing control device 2. The laser oscillator 1 oscillates the laser beam L and sends it to the laser processing unit 3. The laser processing unit 3 includes galvanometer mirrors 35X and 35Y, galvanometer scanners 36X and 36Y, a condenser lens (fθ lens) 34, an XY table (processing table) 30, and a camera 39.

  The galvano scanners 36X and 36Y have a function of moving the irradiation position on the substrate 4 by changing the trajectory of the laser beam L. The galvano scanners 36X and 36Y are two-dimensionally within each processing area set on the substrate 4. To scan. The galvano scanners 36X and 36Y rotate the galvanometer mirrors 35X and 35Y to a predetermined angle in order to scan the laser light L in the XY direction.

  The galvanometer mirrors 35X and 35Y reflect the laser beam L and deflect it at a predetermined angle. The galvanometer mirror 35X deflects the laser beam L in the X direction, and the galvanometer mirror 35Y deflects the laser beam L in the Y direction.

  The condensing lens 34 is a condensing lens having telecentricity. The condensing lens 34 deflects the laser light L in a direction perpendicular to the main surface of the substrate 4 and condenses (irradiates) the laser light L at a processing position (hole position Hx) of the substrate 4.

  The substrate 4 is an object to be processed such as a printed wiring board, and a plurality of holes are formed to form through holes. The substrate 4 has, for example, a three-layer structure of copper foil (conductor layer), resin (insulating layer), and copper foil (conductor layer).

  The XY table 30 places the substrate 4 and moves in the XY plane by driving motors 42X and 42Y described later. As a result, the XY table 30 moves the substrate 4 in the in-plane direction.

  A processing area (scanning area) is a range (scannable area) in which laser processing is possible by the operation of the galvano mechanism (movement of the galvano scanners 36X and 36Y) without moving the XY table 30. In the laser processing apparatus 100, after the XY table 30 is moved in the XY plane, the laser light L is two-dimensionally scanned by the galvano scanners 36X and 36Y. The XY table 30 moves in order so that the center of each processing area is directly below the center of the condenser lens 34 (galvano origin). The galvano mechanism operates so that each hole position Hx set in the processing area becomes an irradiation position of the laser light L in order. The movement between the processing areas by the XY table 30 and the two-dimensional scanning of the laser light L in the processing area by the galvano mechanism are sequentially performed in the substrate 4. Thereby, all hole positions Hx in the substrate 4 are all laser processed.

  The camera (imaging unit) 39 is disposed in the vicinity of a processing head (not shown) that irradiates the substrate 4 with the laser light L. The camera 39 images a plurality of positioning marks (hereinafter referred to as marks 6) provided in advance on the substrate 4, and sends the captured images to the processing control device 2. In the present embodiment, the camera 39 captures an image of the mark 6 while moving the camera 39 on the substrate 4. For this reason, the camera 39 acquires an image in a short time by a shutter function or the like.

  The mark 6 is an alignment mark for correcting a positional shift of the substrate 4 caused by expansion / contraction of the substrate 4 or the like. The position of the camera 39 is fixed, and in the laser processing apparatus 100, the relative position between the camera 39 and the substrate 4 is changed by the XY table 30 moving the position of the substrate 4. In the following, for convenience of explanation, the operation of the laser processing apparatus 100 may be described on the assumption that the relative position between the camera 39 and the substrate 4 changes by moving the position of the camera 39.

  The processing control device 2 is connected to the laser oscillator 1 and the laser processing unit 3 (not shown), and controls the laser oscillator 1 and the laser processing unit 3. The processing control device 2 determines the difference between the actual position of the mark 6 (detection result) and the expected position of the mark 6 with respect to the mechanical origin (reference position on the XY table 30) (theoretical value when there is no positional deviation) The laser processing position (coordinates) of the substrate 4 is corrected based on a positional deviation amount 208) described later. In other words, the processing control device 2 calculates the positional deviation amount 208 based on the detection result of the mark position by the camera 39 and controls the laser processing position of the substrate 4 so as to correct the positional deviation amount 208.

  When laser processing the substrate 4, the processing control device 2 instructs the laser oscillator 1 and the laser processing unit 3 on the laser processing conditions set in the processing program. Further, the processing control device 2 calculates a positional deviation amount 208 within the surface of the substrate 4 based on the detection position of the mark 6 before laser processing the substrate 4. The processing control apparatus 2 of the present embodiment moves the camera 39 on the mark 6 in order without stopping the movement of the camera 39 (XY table 30) when the mark 6 is imaged. Then, the processing control device 2 captures an image of the mark 6 by the camera 39 when the camera 39 comes on the mark 6 while moving the camera 39 in the XY plane. Thereby, the processing control apparatus 2 performs simultaneously the movement process of the camera 39 and the image process using the captured image of the mark 6 (a process for calculating the position of the mark 6).

  The machining control device 2 is configured by a computer or the like, and controls the laser oscillator 1 and the laser machining unit 3 by NC (Numerical Control) control or the like. The processing control device 2 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. When the processing control device 2 controls the laser oscillator 1 or the laser processing unit 3, the CPU reads out a processing program stored in the ROM by an input from an input unit (not shown) by the user, and the RAM. The program is expanded in the program storage area and various processes are executed. Various data generated during this processing is temporarily stored in a data storage area formed in the RAM. Thereby, the processing control device 2 controls the laser oscillator 1 and the laser processing unit 3.

  Next, the configuration of the machining control device 2 and the XY table 30 will be described. FIG. 2 is a diagram showing the configuration of the machining control device and the XY table. The machining control device 2 is connected to servo amplifiers 41X and 41Y, and the servo amplifiers 41X and 41Y are connected to motors 42X and 42Y, respectively. The motors 42X and 42Y are connected to the encoders 43X and 43Y, respectively, and to the XY table 30.

  The machining control device 2 outputs a control signal (X direction control command) for controlling the position of the XY table 30 in the X direction to the servo amplifier 41X. Further, the machining control device 2 outputs a control signal (Y direction control command) for controlling the position in the Y direction of the XY table 30 to the servo amplifier 41Y. The servo amplifiers 41X and 41Y amplify the X direction control command and the Y direction control command sent from the machining control device 2, respectively, and send them to the motors 42X and 42Y.

  The motor 42X moves the XY table 30 to a position (X coordinate) according to the X direction control command in the XY plane (in a plane parallel to the main surface of the substrate 4). The motor 42Y moves the XY table 30 to a position (Y coordinate) corresponding to the Y direction control command in the XY plane.

  The XY table 30 includes a linear scale 40X that detects a position (coordinates) in the X direction of the XY table 30, and a linear scale 40Y that detects a position in the Y direction of the XY table 30. The linear scales 40X and 40Y send the detected position in the XY plane of the XY table 30 (hereinafter referred to as the table position 101) to the machining control device 2. The table position 101 is information indicating the relative position of the XY table 30 with respect to the camera 39.

  The linear scales 40X and 40Y may be arranged in the vicinity of the XY table 30, or may be arranged at a different position from the XY table 30 and configured differently from the XY table 30.

  The encoders 43X and 43Y are connected to the motors 42X and 42Y and the machining control device 2. The encoder 43X detects the state of the motor 42X (operation state according to the X direction control command) and sends the detection result to the machining control device 2. Further, the encoder 43Y detects the state of the motor 42Y (operation state according to the Y direction control command) and sends the detection result to the machining control device 2.

  The camera 39 captures the mark 6 arranged on the substrate 4 and sends the captured image to the processing control device 2. The machining control device 2 has a machining position calculation unit 20. Based on the image of the mark 6 captured by the camera 39, the table position 101 measured by the linear scales 40X and 40Y, and the like, the processing position calculation unit 20 determines the position of the substrate 4 (coordinates in the XY plane) (hereinafter referred to as substrate coordinates). 201). The processing position calculation unit 20 uses the correspondence between the moving speed of the XY table 30 and the positional deviation amount G of the substrate 4 accompanying the movement of the XY table 30 (substrate positional deviation information 151 described later), and the substrate coordinates 201. Correct.

  The processing position calculation unit 20 causes the camera 39 to capture the image of the mark 6 when the substrate coordinates 202 after correcting the substrate coordinates 201 become the coordinates of the mark 6, and based on the captured image, the mark 6 Coordinates (mark coordinates 205 described later) are calculated. The processing position calculation unit 20 uses the correspondence relationship between the moving speed of the XY table 30 and the time required for the mark 6 to be actually imaged after the imaging command for the mark 6 is output, to determine the mark coordinates 205. to correct. The machining position calculation unit 20 calculates the difference between the mark coordinates 206 obtained by correcting the mark coordinates 205 and the coordinates of the mark 6 on the machining program (mark position information 152 described later) as a positional deviation amount 208 of the substrate 4. Calculate as The processing position calculation unit 20 calculates the positional deviation amount 208 of the substrate 4 for each mark 6. The processing control device 2 corrects the laser processing position on the substrate 4 based on the positional deviation amount 208 of the substrate 4 calculated by the processing position calculation unit 20.

  Next, the configuration of the machining position calculation unit 20 will be described. FIG. 3 is a block diagram illustrating a configuration of a machining position calculation unit according to the embodiment. The processing position calculation unit 20 includes a movement command output unit 21, a speed calculation unit 22, a table position input unit 23, a substrate position calculation unit 24, an imaging command output unit 25, an image input unit 26, an image processing unit 27, and a coordinate correction unit 28. , A positional deviation amount calculation unit 29, a substrate positional deviation information storage unit M1, a machining program storage unit M2, and an imaging required time storage unit M3.

  The substrate misalignment information storage unit M1 is a memory that stores substrate misalignment information 151 indicating a correspondence relationship between the moving speed of the XY table 30 and the misalignment amount G of the substrate 4 accompanying the movement of the XY table 30. . The substrate position deviation information 151 is read by the substrate position calculation unit 24.

  The processing program storage unit M2 is a memory or the like that stores a processing program used for laser processing or misalignment detection of the substrate 4. The machining program stored in the machining program storage unit M2 includes mark position information 152 indicating the position of the mark 6 (coordinates in the substrate 4). The mark position information 152 is read by the movement command output unit 21 and the imaging command output unit 25.

  The imaging required time storage unit M3 is a memory that stores, as imaging required time information 153, the time required for the camera 39 to capture the image of the mark 6 after the imaging command for the mark 6 is output. The required imaging time information 153 is read by the coordinate correction unit 28.

  The movement command output unit 21 controls the servo amplifiers 41X and 41Y based on the origin coordinates of the substrate 4 with respect to the reference position on the XY table 30 and the mark position information 152 (X direction control command, Y direction control command). ) Is output. The X direction control command and the Y direction control command are information for instructing the movement amount in the X direction and the movement amount in the Y direction, respectively.

  The movement command output unit 21 outputs a control command to the servo amplifiers 41X and 41Y so that the camera 39 sequentially passes over the mark 6 with respect to each mark 6 arranged on the substrate 4. The movement command output unit 21 also sends a control command to be output to the servo amplifiers 41X and 41Y to the speed calculation unit 22.

  The speed calculation unit 22 calculates the movement speed of the XY table 30 based on the control command output from the movement command output unit 21. The speed calculation unit 22 sends the calculated movement speed to the substrate position calculation unit 24 and the coordinate correction unit 28 as the table movement speed Tv. The table position input unit 23 inputs the position (table position 101) of the XY table 30 sent from the linear scales 40X and 40Y and sends it to the substrate position calculation unit 24.

  The substrate position calculation unit 24 calculates the substrate coordinates 201 based on the table position 101 from the table position input unit 23 that changes every moment and the origin coordinates of the substrate 4 with respect to the reference position on the XY table 30. The substrate 4 and the XY table 30 are rigid. For this reason, there is a displacement (substrate) between the actual relative position between the camera 39 and the substrate 4 and the substrate coordinates 201 calculated based on the table position 101 detected by the linear scales 40X and 40Y. 4). In this embodiment, in order to calculate the positional deviation amount Gv, the substrate coordinates 201 are corrected based on the substrate positional deviation information 151 in the substrate positional deviation information storage unit M1, and the substrate coordinates 202 are calculated.

  The substrate position calculation unit 24 calculates the position deviation amount Gv of the substrate 4 corresponding to the movement speed of the XY table 30 based on the table movement speed Tv and the substrate position deviation information 151. The substrate position calculation unit 24 calculates the substrate coordinates 202 by adding the calculated displacement amount Gv of the substrate 4 to the substrate coordinates 201. The substrate position calculation unit 24 sends the calculated substrate coordinates 202 to the imaging command output unit 25 as the position of the substrate 4.

  The imaging command output unit 25 outputs an imaging command to the camera 39 based on the mark position information 152 and the position of the substrate 4 calculated by the substrate position calculation unit 24. The imaging command output unit 25 outputs an imaging command to the camera 39 at the timing when the camera 39 reaches the mark 6.

  The image input unit 26 inputs an image of the mark 6 captured by the camera 39 and sends it to the image processing unit 27. The image processing unit 27 calculates the position of the center of gravity of the mark 6 based on the image of the mark 6. The image processing unit 27 sends the calculated barycentric position as the mark coordinates 205 to the coordinate correction unit 28.

  The coordinate correction unit 28 corrects the mark coordinates 205 based on the required imaging time information 153 and the table moving speed Tv from the speed calculation unit 22, thereby calculating the mark coordinates 206. Specifically, the coordinate correction unit 28 calculates the positional deviation amount of the mark coordinates 205 according to the moving speed of the XY table 30 based on the imaging required time information 153 and the table moving speed Tv. The coordinate correction unit 28 calculates the mark coordinates 206 by adding the calculated displacement amount to the mark coordinates 205. The coordinate correction unit 28 calculates a mark coordinate 206 for each mark 6. The coordinate correction unit 28 sends the calculated mark coordinates 206 to the positional deviation amount calculation unit 29.

  The positional deviation amount calculation unit 29 calculates the difference between the mark coordinates 206 and the ideal coordinates of the mark 6 calculated based on the processing program (mark position information 152) as the positional deviation amount 208 of the substrate 4. The positional deviation amount calculation unit 29 calculates the positional deviation amount 208 for each mark 6. The positional deviation amount calculation unit 29 stores the calculated positional deviation amount 208 in the machining program storage unit M2.

  Next, a processing procedure of the positional deviation amount calculation processing (mark position detection processing) of the substrate 4 by the laser processing apparatus 100 will be described. FIG. 4 is a flowchart showing a processing procedure for calculating the amount of positional deviation of the substrate by the laser processing apparatus.

  After the substrate 4 to be laser processed is placed on the XY table 30 of the laser processing apparatus 100, the processing position calculation unit 20 starts a calculation process of the positional deviation amount (deviation amount from the ideal value) of the substrate 4. .

  The movement command output unit 21 reads the mark position information 152 in the machining program from the machining program storage unit M2. The movement command output unit 21 outputs a control command to the servo amplifiers 41X and 41Y based on the mark position information 152. In the present embodiment, a control command is sent to the servo amplifiers 41X and 41Y so that the movement of the camera 39 passes through the mark 6 in order without stopping regardless of the operation of the camera 39 or the image processing by the image processing unit 27. Is output. As a result, the camera 39 moves in order without stopping on the mark 6. The movement command output unit 21 also sends a control command to be output to the servo amplifiers 41X and 41Y to the speed calculation unit 22.

  The speed calculation unit 22 calculates the movement speed of the XY table 30 based on the control command output from the movement command output unit 21. The speed calculation unit 22 sends the calculated movement speed to the substrate position calculation unit 24 as the table movement speed Tv.

  When the XY table 30 moves, the linear scales 40X and 40Y detect the position of the XY table 30 and send it to the table position input unit 23. The table position input unit 23 inputs the position of the XY table 30 sent from the linear scales 40X and 40Y as the table position 101 and sends it to the substrate position calculation unit 24.

  The substrate position calculation unit 24 calculates the substrate coordinates 201 based on the table position 101 from the table position input unit 23 that changes from moment to moment. Further, the substrate position calculation unit 24 calculates a position deviation amount Gv of the substrate 4 corresponding to the movement speed of the XY table 30 based on the table movement speed Tv and the substrate position deviation information 151. The substrate position calculation unit 24 calculates a substrate coordinate 202 that is a relative position between the camera 39 and the substrate 4 by adding the calculated displacement amount Gv of the substrate 4 to the substrate coordinate 201. Thereby, the substrate position calculation unit 24 can calculate the accurate position of the substrate 4 even with respect to the mark 6 of the corner portion where the XY table 30 moves simultaneously in the X direction and the Y direction. The substrate position calculation unit 24 sends the calculated substrate coordinates 202 to the imaging command output unit 25 as the position of the substrate 4.

  The imaging command output unit 25 calculates the distance to the position (imaging position) of the mark 6 based on the mark position information 152 and the substrate coordinates 202 calculated by the substrate position calculation unit 24 (step S10).

  The imaging command output unit 25 determines whether or not the camera 39 has reached the mark position (step S20). The imaging command output unit 25 determines that the camera 39 has reached the mark position when the substrate coordinates 202 are the same as the coordinates of the mark 6.

  If the imaging command output unit 25 determines that the camera 39 has not reached the mark position (No at Step S20), it continues to calculate the distance to the imaging position of the mark 6 (Step S10). When the imaging command output unit 25 determines that the camera 39 has reached the mark position (Yes in step S20), the imaging command output unit 25 outputs an imaging command to the camera 39. Thereby, the camera 39 images the mark 6 (step S30). Since the camera 39 captures the mark 6 while moving, the camera 39 captures the mark 6 using a sufficient amount of light (illumination) that can capture the mark 6.

  The camera 39 sends the captured image to the image input unit 26. The image input unit 26 inputs an image of the mark 6 captured by the camera 39 and sends it to the image processing unit 27. The image processing unit 27 performs image processing on the image sent from the image input unit 26 (step S40). Specifically, the image processing unit 27 calculates the feature amount of the mark 6 (for example, the gravity center position of the mark 6) based on the image of the mark 6. The image processing unit 27 sends the calculated barycentric position as the mark coordinates 205 to the coordinate correction unit 28.

  The coordinate correcting unit 28 calculates the mark position by correcting the image processing result (step S50). Specifically, the coordinate correction unit 28 corrects the mark coordinates 205 based on the required imaging time information 153 and the table moving speed Tv, thereby calculating the mark coordinates 206 as the mark position.

  In order to calculate the mark coordinates 206, the coordinate correction unit 28 calculates the amount of displacement of the mark coordinates 205 according to the moving speed of the XY table 30 based on the required imaging time information 153 and the table moving speed Tv. . Then, the mark coordinate 206 is calculated by adding the calculated displacement amount to the mark coordinate 205.

  FIG. 5 is a diagram illustrating an example of an image obtained by imaging a mark. In the mark 6, the central portion 81 of the image 8 and the center of gravity 61 of the mark 6 do not always overlap due to expansion / contraction of the substrate 4. In the present embodiment, the amount of positional deviation between the center 81 that is the center of the field of view of the camera 39 and the center of gravity 61 of the mark 6 is calculated as the mark coordinates 205. Further, the positional deviation amount 205 is corrected based on the required imaging time information 153, and thereby the mark coordinates 206 are calculated.

  Here, the arrangement position of the mark 6 and the imaging order of the mark 6 will be described. FIG. 6 is a diagram illustrating an example of a mark arrangement position. FIG. 7 is a diagram illustrating an example of an imaging order of marks. 6 and 7 show the substrate 4 as viewed from above.

  As shown in FIG. 6, the mark 6 is formed in the vicinity of four vertices on the substrate 4, in the vicinity of the peripheral portion of the processed hole region (processed hole pattern) 5 in which the processed hole is formed (outside the processed hole region) Keep it. FIG. 6 shows a case where a plurality of processed hole regions 5 are set on the substrate 4 and four marks 6 are arranged in the vicinity of the peripheral portion of each processed hole region 5.

  FIG. 7 shows a case where the mark 6 is imaged in the order of the marks 61 to 68. For example, after the mark 61 arranged in the vicinity of the upper left vertex on the substrate 4 is imaged, the mark 62 arranged in the vicinity of the first processing region 5 closest to the mark 61 is imaged. Further, a mark 63, a mark 64, and a mark 65 arranged around the first processed hole region 5 are picked up in order.

  Next, a mark 66, a mark 67, and a mark 68 arranged in the vicinity of the second processed hole region 5 arranged next to the first processed hole region 5 are sequentially imaged. The marks 6 are picked up in order according to a predetermined order in which the moving distance of the camera 39 is shortened.

  The coordinate correction unit 28 calculates a mark coordinate 206 for each mark 6. The coordinate correction unit 28 sends the calculated mark coordinates 206 to the positional deviation amount calculation unit 29. The positional deviation amount calculation unit 29 calculates the difference between the mark coordinates 206 and the coordinates of the mark 6 on the machining program (mark positional information 152) as the positional deviation amount 208 of the substrate 4. The positional deviation amount calculation unit 29 stores the calculated positional deviation amount 208 in the machining program storage unit M2.

  The imaging command output unit 25 determines whether an imaging command has been output to the cameras 39 for all the marks 6 based on the mark position information 152 and the substrate coordinates 202 calculated by the substrate position calculation unit 24. To do. In other words, it is determined whether or not all the marks 6 have been imaged (step S60).

  If the imaging command output unit 25 does not output an imaging command to all the marks 6 to the camera 39 (No in step S60), the imaging command output unit 25 performs the processing of steps S10 to S50 for the next mark 6. The imaging command output unit 25 repeats the processing of steps S <b> 10 to S <b> 50 until imaging commands are output to the camera 39 for all the marks 6.

  When the imaging command output unit 25 outputs an imaging command to all the marks 6 to the camera 39 (step S60, Yes), the laser processing apparatus 100 ends the imaging process for the marks 6. Thereby, all the marks 6 set in each processed hole region 5 are imaged by the camera 39. Since the marks 6 are arranged at various positions on the substrate 4, the processing position calculation unit 20 calculates the positional displacement amount 208 of the substrate 4 on each mark 6, whereby the positional displacement amount 208 on the substrate 4. It is possible to calculate the in-plane distribution.

  As described above, in the present embodiment, the output processing of the movement command to the XY table 30 and the image processing of the mark 6 are performed independently. In other words, the operation of the movement command output unit 21 (movement of the XY table 30) and the operation of the image processing unit 27 are made independent of each other.

  Here, the difference between the positional deviation amount calculation processing of the substrate 4 in the present embodiment and the positional deviation amount calculation processing of the substrate 4 used conventionally will be described. FIG. 8 is a diagram for explaining the difference between the substrate positional deviation amount calculation processing in the embodiment and the conventionally used substrate positional deviation amount calculation processing.

  As shown in FIG. 8 (1), conventionally, after the movement 71 of the XY table 30, the movement of the XY table 30 is stopped 72 and then the image processing 73 of the mark 6 is performed. Conventionally, when calculating the positional deviation amount of the substrate 4, the movement 71, the stop 72, and the image processing 73 are repeated in order. For this reason, the stop 72 of the XY table 30 and the image processing 73 of the mark 6 are performed between the movement 71 and the movement 71 of the XY table 30. For this reason, the processing for calculating the positional deviation amount of the substrate 4 requires the time for the stop 72 and the image processing 73 as many times as the number of the marks 6. Therefore, when the number of marks 6 increases, the stop 72 increases and productivity decreases.

  On the other hand, in the present embodiment, as shown in (2) of FIG. 8, the movement 71 of the XY table 30 is continuously performed without stopping the XY table 30. Further, the image processing 73 of the mark 6 is performed while moving the XY table 30. In other words, the mark image acquisition and image processing (feature amount extraction) are performed while moving the XY table 30. As described above, in the present embodiment, the task of the movement 71 and the task of the image processing 73 are separated, so that the image processing 73 can be executed during the movement 71.

  For this reason, even if the number of marks 6 for position detection increases, the time required to extract the feature amount of the mark 6 does not increase, and only the time required to move the XY table 30 increases. Accordingly, the processing time of the stop 72 and the image processing 73 can be reduced, and the tact time can be shortened. Thereby, in the present embodiment, it is possible to calculate the amount of positional deviation of the substrate 4 in a shorter time than the conventional method, and it is possible to laser process the substrate 4 without reducing productivity.

  After the positional deviation amount calculation unit 29 stores the positional deviation amounts 208 of all the marks 6 in the machining program storage unit M2, the machining control device 2 starts laser machining of the substrate 4. When performing laser processing on the substrate 4, the processing control device 2 corrects the laser processing position on the substrate 4 based on the positional deviation amount 208 of the substrate 4 calculated by the processing position calculation unit 20.

  Specifically, the movement command output unit 21 reads the machining program and the positional deviation amount 208 from the machining program storage unit M2. Then, the movement command output unit 21 corrects the coordinates of the machining hole Hx set in the machining program based on the positional deviation amount 208 for each position of the machining hole Hx. Then, a movement command corresponding to the coordinates of the corrected machining hole Hx is output to the servo amplifiers 41X and 41Y. Thereby, the laser processing of the processing hole Hx is performed while the coordinates of the processing hole Hx are corrected only by the position corresponding to the positional deviation amount of the substrate 4.

  The calculation of the positional deviation amount of the substrate 4 is performed every time the substrate 4 is placed on the XY table 30. In other words, when laser processing the substrate 4, the substrate 4 is placed on the XY table 30, the amount of positional deviation of the substrate 4 is calculated, and the substrate 4 is laser processed. Then, when laser processing the next substrate 4, the next substrate 4 is placed on the XY table 30, and the positional deviation amount of the next substrate 4 is calculated. Thereby, in the laser processing apparatus 100, the placement of the substrate 4 on the XY table 30, the calculation processing of the positional deviation amount of the substrate 4, and the laser processing on the substrate 4 are repeated.

  Note that the laser processing apparatus 100 may calculate the substrate coordinates 201 without using the linear scales 40X and 40Y. In this case, the substrate coordinates 201 are calculated using deviation information (droop amount) that is the difference between the command values for the motors 42X and 42Y and the actual rotational speeds of the motors 42X and 42Y.

  Specifically, the substrate position calculation unit 24 subtracts the deviation information from the integrated value (total value) of the control command output from the movement command output unit 21, thereby calculating the table position 101. Command values for the motors 42X and 42Y correspond to control commands for the servo amplifiers 41X and 41Y. The actual rotational speeds of the motors 42X and 42Y are detected by the encoders 43X and 43Y. Therefore, the deviation information is the difference between the current value of the control command to the servo amplifiers 41X and 41Y and the rotation speed (current value) detected by the encoders 43X and 43Y. Since the moving speed of the XY table 30 changes according to the control command to the servo amplifiers 41X and 41Y, the deviation information also changes according to the moving speed of the XY table 30. Therefore, the substrate coordinates 201 calculated using the deviation information also change according to the moving speed of the XY table 30.

  When the substrate coordinates 201 are calculated using the linear scales 40X and 40Y, the encoders 43X and 43Y are unnecessary, and when the substrate coordinates 201 are calculated using the deviation information, the linear scales 40X and 40Y are unnecessary. Become.

  Further, the correction from the mark coordinate 205 to the mark coordinate 206 is not limited to the correction using the required imaging time information 153 and the table moving speed Tv. For example, a coordinate correction amount from the mark coordinates 205 to the mark coordinates 206 corresponding to the table moving speed Tv may be stored in a predetermined database or the like in advance. In this case, a coordinate correction amount corresponding to the table moving speed Tv is calculated in advance using the imaging required time information 153 and the table moving speed Tv.

  In addition, the shutter speed of the camera 39 may be included in the imaging required time information 153. Further, the imaging command output unit 25 may output an imaging command to the camera 39 slightly earlier in consideration of the shutter speed of the camera 39. Further, the number of cameras 39 is not limited to one, and a plurality of cameras 39 may be arranged. In this case, a plurality of marks 6 are imaged simultaneously by a plurality of cameras 39. Further, the movement of the substrate 4 (XY table 30) may be a uniform velocity motion or an unequal velocity motion.

  When the movement of the substrate 4 is a constant velocity movement, the correction from the substrate coordinates 201 to the substrate coordinates 202 becomes easy. Further, when the movement of the substrate 4 is a constant velocity movement, the correction from the mark coordinates 205 to the mark coordinates 206 is facilitated.

  Further, the moving speed of the XY table 30 is not limited to being calculated based on a control command to the servo amplifiers 41X and 41Y, but may be obtained by actually directly measuring the moving speed of the XY table 30.

  As described above, according to the embodiment, the image processing (processing for calculating the position of the mark 6) of the image obtained by capturing the mark 6 is performed while performing the movement processing to each mark 6, and thus the image is placed on the XY table 30. It is possible to detect the positional deviation of the substrate 4 that has been performed in a short time.

  In addition, since the substrate coordinates 201 are corrected to the substrate coordinates 202 using the substrate position deviation information 151 and the table moving speed Tv, an accurate position on the substrate 4 can be calculated. Therefore, an image of the mark 6 can be taken at an accurate position on the substrate 4.

  In addition, since the mark coordinate 205 is corrected to the mark coordinate 206 using the imaging required time information 153 and the table moving speed Tv, it is possible to calculate an accurate position of the mark 6. Therefore, it is possible to accurately calculate the positional deviation of the substrate 4.

  When calculating the substrate coordinates 201 using deviation information (droop amount) that is the difference between the command values to the motors 42X and 42Y and the actual rotational speeds of the motors 42X and 42Y, the linear scale 40X is used. , 40Y becomes unnecessary, and the substrate coordinates 201 can be calculated with a simple configuration.

  As described above, the laser processing apparatus and the substrate position detection method according to the present invention are suitable for calculating the amount of positional deviation of the substrate with respect to the processing table.

DESCRIPTION OF SYMBOLS 1 Laser oscillator 2 Processing control apparatus 3 Laser processing part 4 Substrate 5 Processing hole area 6 Mark 20 Processing position calculation part 21 Movement command output part 22 Speed calculation part 23 Table position input part 24 Substrate position calculation part 25 Imaging command output part 26 Image Input unit 27 Image processing unit 28 Coordinate correction unit 29 Position shift amount calculation unit 30 XY table 39 Camera 40X, 40Y Linear scale 43X, 43Y Encoder 100 Laser processing apparatus L Laser beam M1 Substrate position shift information storage unit M2 Processing program storage unit M3 Imaging time storage unit

Claims (6)

A processing table for placing a substrate to be laser processed and moving in a plane parallel to the main surface of the substrate;
An imaging unit that sequentially images the positioning marks provided on the substrate and used for position detection on the substrate;
A movement instructing unit that outputs a movement command to the machining table so that the imaging unit moves sequentially on the positioning mark continuously without stopping the machining table;
An imaging instruction unit that outputs an imaging instruction to the imaging unit when the imaging unit has moved onto the positioning mark; and
A mark position calculation unit that calculates a position of the positioning mark based on an image of the positioning mark imaged by the imaging unit while the movement instruction unit outputs a movement command to the processing table; ,
A positional deviation amount calculation unit that calculates a positional deviation amount of the substrate with respect to the processing table using the position of the positioning mark calculated by the mark position calculation unit;
A laser processing unit that performs laser processing while correcting the position of the laser processing of the substrate with the positional shift amount calculated by the positional shift amount calculation unit;
A laser processing apparatus comprising: A substrate position calculation unit that calculates a relative position between the imaging unit and the substrate based on a position of the processing table;
The substrate position calculation unit calculates a positional deviation amount between the processing table and the substrate, which changes according to the moving speed of the processing table, based on the moving speed of the processing table, and calculates the calculated positional deviation amount. To correct the relative position using
The laser processing apparatus according to claim 1, wherein the imaging instruction unit outputs an imaging instruction to the imaging unit based on the relative position corrected by the substrate position calculation unit. A linear scale for detecting the position of the processing table;
The laser processing apparatus according to claim 2, wherein the substrate position calculation unit calculates the relative position based on the position of the processing table detected by the linear scale. A motor for moving the processing table;
An encoder for detecting the rotational speed of the motor;
Further comprising
The substrate position calculation unit calculates the relative position using a control command to the motor corresponding to a movement command to the processing table, a detection result by the encoder, and an integrated value of the movement command to the processing table. The laser processing apparatus according to claim 2. The position of the positioning mark calculated by the mark position calculation unit based on the time required from when the imaging instruction is output until the positioning mark image is captured and the moving speed of the processing table A position correction unit for correcting
The position displacement amount calculation unit calculates a position displacement amount of the substrate with respect to the processing table using the position of the positioning mark corrected by the position correction unit. The laser processing apparatus as described in one. A processing table for placing a substrate to be laser processed and moving in a plane parallel to the main surface of the substrate, and a positioning mark provided on the substrate and used for position detection on the substrate in order. A laser processing apparatus including an imaging unit for capturing an image, so that the processing table is moved in order on the positioning mark in order without the processing table being stopped. A movement instruction step for outputting
An imaging instruction step of outputting an imaging instruction to the imaging unit when the imaging unit has moved onto the positioning mark;
A mark position calculating step for calculating a position of the positioning mark based on an image of the positioning mark imaged by the imaging unit while a movement command to the processing table is output;
A displacement amount calculation step of calculating a displacement amount of the substrate with respect to the processing table, using the calculated position of the positioning mark;
A substrate position detection method comprising:

Images