JPWO2012026221A1 - Loop type heat transport equipment - Google Patents

Abstract

An object of the present invention is to provide a loop-type heat transport device that is difficult to flow back, is lightweight, and has high strength. A plurality of evaporator internal flow paths (3) through which the circulating fluid (25) flows from below to above is formed, and is composed of a metal evaporation plate (4) in which a heating element (24) is installed outside. The evaporator (2), the radiator (5) that releases the heat of the circulating fluid, the heat transfer tube (15) that becomes the heat exchanger internal flow path, and the heat transfer tube (15) are located around the The heat transfer tube (15) has a circulating liquid sent out from the two-phase fluid outlet (28) located above the evaporator internal flow path and a storage part (18) in which the vapor of the circulating liquid is stored. A loop-type heat transport device including a heat exchanger (12) for exchanging heat between the circulating fluid inside and the steam in the storage section (18), and an inner surface of the evaporator internal flow passage in contact with the circulating fluid is The evaporation plate (4) is made of a metal different from the metal.

Description

  The present invention relates to a heat transport device, and particularly to a loop heat transport device using a bubble pump that does not require external power.

  In recent years, many electronic devices are used in important facilities related to lifelines such as energy supply facilities, information communication facilities, and traffic facilities. These electronic devices need to be operated stably and reliably, and heat generated from the electronic devices must be efficiently radiated. There are various types of means for dissipating heat, but there is a cooling device that uses a bubble pump that does not require external power as one of the highly efficient and highly reliable heat dissipating means suitable for energy saving and environmental conservation. (For example, refer to Patent Document 1). This cooling device is configured so that the circulating solution for heat exchange circulates in the equipment by utilizing the density difference (buoyancy generated by the density difference) in the circulating solution transport pipe generated by the phase change of the circulating solution for heat exchange. Because it is called loop type heat transport equipment.

  In the loop heat transport device described in Patent Document 1, the apparent density of the gas-liquid two-phase fluid in the gas-liquid two-phase fluid inlet pipe from the heating heat exchanger to the two-phase fluid inlet, and the section The circulating solution for heat exchange is circulated using the density difference with the density of the circulating solution for heat exchange in the circulating solution transport pipe in the same height section. In addition, by repeating this circulation, the high temperature heat transferred from the heating heat exchanger is transported to the sensible heat release heat exchanger and the radiator, and heat is required from the sensible heat release heat exchanger and the radiator. Try to transport heat to another device or low heat source.

  In this loop heat transport device, the heating heat exchanger (evaporator) is made of a block-shaped metal, and a flow path is formed inside the metal block so that the circulating fluid flows in the flow path. Thus, there is a loop heat transport device that has high strength and good heat dissipation characteristics (for example, Patent Document 2).

  Moreover, there exists what was described in patent document 3 as a cooling system in which a structure differs from the loop type heat transport apparatus described in patent document 1 or patent document 2. Patent Document 3 describes a cooling system that transports heat by connecting a heat receiving portion, a bubble pump, a radiator condenser, and a pipe portion in a loop shape. In the cooling system described in Patent Document 3, a pipe-shaped bubble pump is provided above the heat receiving portion. In the cooling system described in Patent Document 3, there is a possibility that the liquid flows backward, and the outlet of the bubble pump is arranged to be higher than the liquid level of the radiator in order to prevent the backward flow.

JP 2005-195226 A International Publication No. 2007/119783 Special table 2007-513506 gazette

  Since the conventional loop heat transport device described in Patent Document 1 is configured with a gas-liquid two-phase fluid feed pipe that feeds and feeds the circulating fluid to and from the heating heat exchanger (evaporator) by piping, There was a problem of low strength. In addition, the cooling system described in Patent Document 3 is not clear about the overall detailed structure, but from the drawing, like the one described in Patent Document 1, the cooling system has a structure mainly composed of pipes and is still strong. There is a problem that is low.

  Furthermore, in patent document 3, there also exists a problem that a liquid flows back more easily than the loop type heat transport apparatus described in patent document 1 or patent document 2. Further, in the loop heat transport device described in Patent Document 1 or Patent Document 2, there is no restriction on the installation position of the radiator, but in the cooling system described in Patent Document 3, the radiator must be installed on the upper part of the device. There is also a restriction that must be done.

  Moreover, since the conventional loop type heat transport device described in Patent Document 2 is made of a block-shaped metal in which a hole is formed in a metal such as copper, the strength is high and the heat dissipation characteristics are good. There was a problem that the weight was large.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a loop type heat transport device that is difficult to reverse flow of liquid, is lightweight, and has high strength.

  In the present invention, a plurality of evaporator internal flow paths through which circulating fluid flows from below to above are formed, a metal evaporation plate having a heating element installed outside, and a position below the evaporator internal flow path An evaporator composed of an evaporator header pipe to which a preheating liquid inlet is connected, a radiator having a high temperature liquid inlet, an internal flow path, and a low temperature liquid outlet for the circulating liquid and releasing the heat of the circulating liquid And a heat exchanger inlet header having a cryogenic liquid inlet into which the circulating liquid discharged from the cryogenic liquid outlet of the radiator is sent, and preheating in which the circulating liquid is sent to the evaporator header pipe through the preheating liquid channel A heat exchanger outlet header having a liquid outlet, a heat exchanger tube serving as a heat exchanger internal channel connecting the heat exchanger inlet header and the heat exchanger outlet header, and an evaporator located around the heat exchanger tube Circulating fluid delivered from the two-phase fluid outlet located above the internal flow path and A heat exchanger that has a storage portion in which the steam of the circulating fluid is stored and exchanges heat between the circulating fluid in the heat transfer tube and the steam in the storage portion, and the circulating fluid is sent out from the storage portion A loop-type heat transport device having a high-temperature liquid flow path that connects a high-temperature liquid delivery port and a high-temperature liquid feed port of a radiator, and the inner surface of the evaporator internal flow path that is in contact with the circulating liquid is a metal of the evaporation plate It is made of a different metal.

  According to the present invention, it is possible to provide a loop-type heat transport device that is free from circulating fluid, is lightweight, and has high strength.

It is sectional drawing which shows the structure of the loop type heat transport apparatus by Embodiment 1 of this invention. It is sectional drawing in the AA cross section of FIG. 1 which shows the structure of the loop type heat transport apparatus by Embodiment 1 of this invention. It is sectional drawing in the BB cross section of FIG. 1 which shows the structure of the loop type heat transport apparatus by Embodiment 1 of this invention. It is a partial expanded sectional view which expands and shows the part of the evaporation pipe | tube 3 of FIG. 3 which shows the structure of the loop type heat transport apparatus by Embodiment 1 of this invention. It is sectional drawing which shows the structure of the loop type heat transport apparatus by Embodiment 2 of this invention. It is sectional drawing in the AA cross section of FIG. 5 which shows the structure of the loop type heat transport apparatus by Embodiment 2 of this invention. It is sectional drawing which shows the structure of the loop type heat transport apparatus by Embodiment 3 of this invention. It is sectional drawing in the AA cross section of FIG. 7 which shows the structure of the loop type heat transport apparatus by Embodiment 3 of this invention. It is sectional drawing which shows the structure of the principal part of the loop type heat transport apparatus by Embodiment 4 of this invention. It is a schematic diagram explaining the effect of the loop type heat transport apparatus by Embodiment 4 of this invention. It is a partial expanded sectional view which shows the structure of the principal part of the loop type heat transport apparatus by Embodiment 5 of this invention. It is sectional drawing which shows the structure before the partial assembly of the loop type heat transport apparatus by Embodiment 6 of this invention. It is sectional drawing which shows the structure after the assembly of the loop type heat transport apparatus by Embodiment 6 of this invention. It is sectional drawing which shows the structure of the loop type heat transport apparatus by Embodiment 7 of this invention. It is sectional drawing in the AA cross section of FIG. 14 which shows the structure of the loop type heat transport apparatus by Embodiment 7 of this invention. It is sectional drawing which shows the structure of the principal part of the loop type heat transport apparatus by Embodiment 8 of this invention. It is sectional drawing which shows another structure of the principal part of the loop type heat transport apparatus by Embodiment 8 of this invention. It is sectional drawing which shows another structure of the principal part of the loop type heat transport apparatus by Embodiment 8 of this invention. It is sectional drawing which shows another structure of the principal part of the loop type heat transport apparatus by Embodiment 8 of this invention.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a configuration of a loop heat transport device according to Embodiment 1 of the present invention, FIG. 2 is a cross-sectional view taken along the line AA shown in FIG. 1, and FIG. It is sectional drawing in a -B cross section. The loop heat transport device 1 has an evaporator 2, a radiator 5, and a heat exchanger 12, each of which is connected by a pipe so that the flow path is in a loop shape, and the circulating liquid 25 circulates inside. It is configured to transport heat.

  As shown in FIG. 3, the evaporator 2 has an evaporation pipe 3 serving as an evaporator internal flow path inside the evaporation plate 4. As shown in the partially enlarged view of FIG. The evaporation tube 3 is joined to the evaporation plate 4 using a brazing filler metal or the like. In the first embodiment, the same number of holes as the number of the evaporation tubes 3 are formed in the evaporation plate 4, and the evaporation tubes 3 are inserted and joined by the fixing material 29. Any configuration that can be fixed is acceptable. The preheating liquid inlet 22 which is the lower end of the evaporation pipe 3 is joined to the evaporator header pipe 23 provided with the same number of holes as the number of the evaporation pipes 3 by using brazing, welding or the like. A plurality of heating elements 24 are provided on the outer surface of the evaporation plate 4.

  The radiator 5 is connected between a radiator inlet header 7 having a high-temperature liquid inlet 6 and a radiator outlet header 9 having a low-temperature liquid outlet 10 by a radiator internal channel 8. A plurality of radiating fins 11 are provided between them. Note that the radiator 5 is not limited to the shape shown in FIG. 1, and it is sufficient that the heat of the circulating fluid 25 can be released to the outside, and the shape, size, and structure are not particularly limited.

  The heat exchanger 12 is a cylindrical container in which the heat exchanger inlet header 14, the housing portion 18, and the heat exchanger outlet header 17 are joined. The heat exchanger inlet header 14 and the heat exchanger outlet header 17 exchange heat. They are connected by a plurality of heat transfer tubes 15 that serve as internal flow paths.

  The heat exchanger inlet header 14 has a cryogenic liquid inlet 13 and is joined to the cryogenic liquid outlet 10 of the radiator 5. The heat exchanger outlet header 17 has a preheating liquid delivery port 16, and is joined to the evaporator header pipe 23 via the preheating liquid channel 21. The container 18 has a high temperature liquid delivery port 19 and is connected to the high temperature liquid delivery port 6 of the radiator via a high temperature liquid flow path 20. In addition, the evaporator 2 is disposed below the storage unit 18, and the same number of holes as the number of the evaporation tubes 3 are provided below the storage unit 18, and joined to the two-phase fluid delivery port 28 above the evaporation tube 3. The In addition, brazing, welding, etc. are used as a joining method. An attachment plate 27 is provided between the radiator 5 and the heat exchanger 12 and can be attached to a predetermined location.

  The operating principle is shown below. The inside of the loop heat transport device is evacuated and filled with a circulating fluid 25. In the evaporator 2, the circulating fluid 25 flowing through the evaporation pipe 3 is heated by the heat generated in the heating element 24 to increase the temperature, and a part of the circulating fluid 25 becomes the steam 26, and the high-temperature circulating fluid 25 and the steam 26 are heated. A gas-liquid two-phase fluid is generated (see FIG. 2). In the evaporation pipe 3, the gas-liquid two-phase fluid is raised by the buoyancy generated from the difference between the apparent density of the gas-liquid two-phase fluid and the density of the circulating fluid 25, and the gas-liquid two-phase fluid exchanges heat from the two-phase fluid delivery port 28. It is fed into the container 18 of the container 12.

  Inside the accommodating portion 18, the low-temperature circulating liquid 25 sent from the radiator 5 into the heat transfer tube 15 and the steam 26 outside the heat transfer tube 15 exchange heat through the wall of the heat transfer tube 15, and the steam 26 is condensed. The phase is changed to a liquid and becomes a liquid single phase together with the high-temperature circulating liquid 25 and is sent out from the high-temperature liquid outlet 19.

  The high-temperature circulating liquid 25 passes through the high-temperature liquid flow path 20 and is sent from the high-temperature liquid inlet 6 to the radiator inlet header 7 of the radiator 5. The radiator inlet header 7 has a function of distributing the high-temperature circulating fluid 25 to the radiator internal flow path. The distributed high-temperature circulating fluid 25 flows through the plurality of radiator internal flow paths 8 and releases heat from the radiation fins 11 to become a low-temperature circulating fluid 25 and merges at the radiator outlet header 9, It is delivered from the liquid delivery port 10.

  The low-temperature circulating liquid 25 is sent from the low-temperature liquid inlet 13 to the heat exchanger inlet header 14 of the heat exchanger 12 and distributed to the heat transfer tubes 15. In the heat transfer tube 15, as described above, the low-temperature circulating fluid 25 exchanges heat between the steam 26 in the housing portion 18 and the wall surface of the heat transfer tube 15, and the circulating fluid 25 flowing through the heat transfer tube 15 is heated. The heated circulating fluid 25 joins at the heat exchanger outlet header 17 and is sent out from the preheating liquid outlet 16.

  The circulating fluid 25 delivered from the heat exchanger outlet header 17 flows through the preheating liquid channel 21 and flows into the evaporator header pipe 23. The evaporator header pipe 23 has a function of distributing the circulating liquid 25 to the evaporation pipe 3. The circulating fluid 25 is fed from the preheated liquid feed port 22 to the evaporation pipe 3 to form a series of loops.

  With the above configuration, the vapor 26 of the gas-liquid two-phase fluid of the circulating liquid 25 delivered from the two-phase fluid outlet 28 is heat-exchanged through the wall of the heat transfer tube 15 in the accommodating portion 18 of the heat exchanger 12. Since it becomes a liquid, the pressure inside the container 18 (around the two-phase fluid delivery port 28 of the evaporation pipe 3) is kept low, and the circulating liquid 25 is difficult to flow back to the evaporation pipe 3.

  As the circulating liquid 25, it is preferable to use a fluid having a high thermal conductivity and specific heat and a good thermal property or a fluid having a small viscosity coefficient and a good fluidity. A fluid having a large ratio of the liquid density to the gas density is preferable, and a fluid composed of a single component such as distilled water, alcohol or liquid metal, or a multi-component fluid such as an antifreeze liquid or an alcohol aqueous solution is used. When a multi-component fluid is used, there are components that are vaporized and components that are not vaporized, but the liquid component produced by condensing the vapor 26 in the container 18 is agitated and mixed in the container 18, and the circulating fluid 25 is sent out from the high temperature liquid outlet 19.

  In the conventional loop-type heat transport device disclosed in Patent Document 2, the evaporator is composed of a block-shaped metal body with holes drilled. The entire evaporator, which is a block-shaped metal body, needs to be made of copper in order to suppress the generation of non-condensable gas when using circulating liquids containing water such as distilled water and antifreeze liquid, which increases the weight. It was. However, in the loop heat transport device 1 according to the first embodiment, the evaporator 2 is configured by the evaporation pipe 3 that is in contact with the circulating liquid 25 and the evaporation plate 4 that is not in contact with the circulating liquid 25. By using only the evaporating tube 3 in contact with copper and the evaporating plate 4 occupying much of the weight as a light metal such as aluminum, the entire evaporator 2 can be reduced in weight. Further, the evaporation pipe 3 may be made of a metal pipe other than copper, such as aluminum, and the inner surface may be plated with copper.

  In addition, as a material of the components of the loop heat transport device, a metal having good thermal conductivity is preferable. As described above, in the first embodiment, the evaporation plate 4 is made of aluminum and the others are made of copper. When the circulating liquid 25 containing water such as distilled water or antifreeze is used, the generation of non-condensable gas can be suppressed by making the wetted part copper, and deterioration of cooling performance can be prevented. In addition, you may improve corrosion resistance by plating the outer surface of the components comprised with aluminum.

  Moreover, it is good also considering the material of all the components of the loop type heat transport apparatus 1 as aluminum. At this time, when the circulating fluid 25 containing water such as distilled water or antifreeze is used as the circulating fluid 25, the generation of non-condensable gas is suppressed by copper-plating the wetted surface of the aluminum part, thereby reducing the cooling performance. Can be prevented. By making all the parts aluminum, it is possible to significantly reduce the weight as compared with the case of using copper parts. Further, the evaporation plate 4 is made of an aluminum plate without providing the evaporation tube 3, a through hole is formed in the aluminum plate, and the inner surface of the through hole is plated with copper, thereby allowing the through hole itself to flow inside the evaporator. It is good.

  As described above, it is preferable to form the inner surface of the evaporator internal flow passage in contact with the circulating fluid 25 with a metal that is unlikely to corrode with respect to the circulating fluid 25. When the circulating liquid 25 is a liquid containing water such as distilled water or antifreeze liquid, it is preferable to select a metal having a higher standard electrode potential (smaller ionization tendency) than hydrogen as a metal that hardly corrodes. The evaporation plate 4 is preferably made of a light metal, that is, a metal material having a density lower than that of the metal forming the inner surface that contacts the circulating fluid 25 of the evaporator internal flow path.

  The heating element 24 may be provided on both sides of the evaporation plate 4 as shown in FIGS. 2 and 3, or may be provided on one side. In the first embodiment, since the tubular evaporation tube 3 is arranged inside the evaporation plate 4, even if the heating element 24 is provided on both sides, the heat of the heating element 24 can be efficiently transferred to the circulating fluid 25. It is possible to cool a plurality of heating elements at the same time.

  When a plurality of heating elements are provided, a heating element 240 that needs to be cooled more efficiently, such as a heating element that generates a large amount of heat or a heating element that requires a lower temperature, is shown in the center of the cross-sectional view of FIG. It may be provided in the vicinity. That is, in FIG. 3, the heating element 240 installed near the center is a heating element that requires higher efficiency cooling than the heating element 24 installed in the vicinity. Since the flow characteristic of the evaporator tube 3 is good near the center of the evaporator 2, it is possible to improve the heat dissipation characteristics by arranging the heating element 240 that requires high-efficiency cooling near the center.

Embodiment 2. FIG.
FIG. 5 is a cross-sectional view showing a configuration of a loop heat transport device according to Embodiment 2 of the present invention. 6 is a cross-sectional view taken along the line AA of FIG. 5 and 6, the same reference numerals as those in FIGS. 1 and 2 indicate the same or corresponding parts. As shown in FIGS. 5 and 6, in the loop heat transport device 1 according to the fifth embodiment, the two-phase fluid delivery port 28 of the evaporation tube 3 has a protruding height h from the lower surface of the housing portion 18 of 3 mm or more. It is arranged to be.

  When the height h is small, the two-phase fluid delivery port 28 of the evaporation pipe 3 is filled with the circulating fluid 25, so that the flow resistance of the two-phase fluid of the circulating fluid 25 delivered to the storage unit 18 is large and the circulating flow rate is reduced. However, the heat dissipation characteristics deteriorate.

  By setting the protrusion height h shown in FIG. 5 to 3 mm or more, the outer peripheral portion of the evaporation pipe 3 on the lower surface of the housing portion 18 becomes a high-temperature circulating fluid passage 34, and the two-phase fluid delivery port 28 of the evaporation pipe 3 is the circulating fluid 25. In other words, the flow resistance of the two-phase fluid of the circulating fluid 25 sent from the evaporation pipe 3 to the accommodating portion 18 is reduced, the circulation flow rate is improved, and the heat dissipation characteristics are improved. In particular, in the present loop heat transport device 1, since a plurality of the evaporation pipes 3 are arranged in parallel, by providing the high-temperature circulating liquid dedicated passage 34, until the high-temperature circulating liquid 25 reaches the high-temperature liquid flow path 20. Is not easily disturbed by the gas-liquid two-phase fluid of the circulating fluid 25 ejected from the evaporation pipe 3, and the circulating flow rate is improved. In addition, backflow from the evaporator tube 3 can be suppressed when the amount of heat generated is extremely small or where the heating element 24 is not attached. Furthermore, if h is increased, even when the main body is inclined, the two-phase fluid delivery port 28 is not filled with the circulating fluid 25 and the circulating flow rate does not decrease, so that the heat radiation characteristics are improved.

  As described above, by setting the protrusion height h of the evaporation tube 3 to the accommodating portion 18 to be 3 mm or more, the heat dissipation characteristics are improved, and the loop heat transport device can be reduced in size and weight.

Embodiment 3 FIG.
FIG. 7 is a cross-sectional view showing the configuration of the loop heat transport device according to the third embodiment. FIG. 8 is a cross-sectional view taken along the line AA of FIG. 7 and 8, the same reference numerals as those in FIGS. 1 and 2 denote the same or corresponding parts. As shown in FIGS. 7 and 8, guides 35 are provided on both sides of the two-phase fluid delivery port 28 of the evaporation pipe 3, and the space that does not include the two-phase fluid delivery port 28 in the space separated by the guide 35 is hot. It was formed as a circulating fluid dedicated passage 34.

  According to such a configuration, most of the circulating fluid 25 condensed by the heat transfer tube 15 from the jetted circulating fluid 25 and the steam 26 flows through the high-temperature circulating fluid dedicated passage 34 formed by the storage portion 18 and the guide 35. . For this reason, the circulating fluid 25 flowing on the two-phase fluid delivery port 28 is reduced, the flow resistance is small, and the heat dissipation characteristics can be improved.

  As described above, by providing the guide 35, the heat dissipation characteristics are improved as in the second embodiment, and the loop heat transport device can be reduced in size and reduced in weight.

Embodiment 4 FIG.
FIG. 9 is a cross-sectional view showing a configuration of a main part of the loop heat transport device according to the fourth embodiment, which corresponds to FIG. 2 in the first embodiment. 9, the same reference numerals as those in FIG. 2 denote the same or corresponding parts. As shown in FIG. 9, in the heat transfer tube 15 of the loop heat transport device according to the fourth embodiment, the gap s between adjacent heat transfer tubes 15 in the accommodating portion 18 of the heat exchanger 12 is 3 mm or more. Has been placed. When the gap s is small, the condensate formed on the outside of the adjacent heat transfer tube 15 is connected, and a condensate bridge that prevents the movement of the vapor 26 is formed around the heat transfer tube 15. Therefore, the heat exchange area where the steam 26 and the heat transfer tube 15 are in contact with each other is reduced, and the heat dissipation characteristics are deteriorated.

  As an example, in FIG. 10, copper pipes 151 having a diameter of 16 mm are arranged in parallel with a gap s = 3 mm (FIG. 10A) and 2 mm (FIG. 10B), and an antifreeze aqueous solution (ethylene glycol 50) is placed in the gap. %) Is a schematic view of the result of observing the liquid bridge formed. When the gap is 3 mm, a liquid bridge 251 having a short side (about 25 mm) is formed as shown in FIG. On the other hand, in the gap of 2 mm, a long side liquid bridge 252 is formed as shown in FIG. Therefore, the liquid bridge is hardly formed by setting the gap s to 3 mm or more.

  When the gap s is 3 mm or more as shown in FIG. 9, the condensate easily flows down, and a liquid bridge is hardly formed in the gap between the adjacent heat transfer tubes 15. Thus, since the heat exchange area is expanded, the heat dissipation characteristics are improved, and the loop heat transport device can be reduced in size and reduced in weight.

Embodiment 5 FIG.
FIG. 11 is a partial enlarged cross-sectional view showing a configuration in the vicinity of the evaporation pipe 3 of the loop heat transport device according to the fifth embodiment, which corresponds to FIG. 4 in the first embodiment. 11, the same reference numerals as those in FIG. 4 denote the same or corresponding parts. As shown in FIG. 11, in the loop heat transport device according to the fifth embodiment, fins 33 are provided inside the evaporation pipe 3.

  According to the loop heat transport device configured as described above, by providing the fins 33 inside the evaporation pipe 3, it becomes easy to form bubble nuclei, and boiling is promoted even when the heat is low, and the circulating fluid is circulated appropriately. Is possible. Further, by providing the fins 33 inside the evaporation pipe 3, the heat transfer area is enlarged, the heat resistance of the evaporation part can be reduced, and the cooling performance is improved, so that the loop heat transport device can be reduced in size and reduced in weight. It becomes possible.

Embodiment 6 FIG.
12 and 13 are cross-sectional views showing the configuration of the loop heat transport device according to the sixth embodiment. FIG. 12 shows a state before the radiator 5, the heat exchanger 12, and the high-temperature liquid channel 20 are attached to the attachment plate 27, and FIG. 13 shows a state after the attachment. 12 and 13, the same reference numerals as those in FIG. 1 denote the same or corresponding parts. As shown in FIG. 12 and FIG. 13, in the loop heat transport device according to the sixth embodiment, the pipe 30, through the attachment plate 27, penetrates the high temperature liquid inlet 6 and the low temperature liquid outlet 10 of the radiator 5. 31 is attached, and the high temperature liquid inlet pipe 30 is connected to the high temperature liquid flow path 20 and the low temperature liquid outlet pipe 31 is connected to the low temperature liquid inlet 13 of the heat exchanger inlet header 14.

  According to the loop-type heat transport device configured as described above, the component to which the evaporator 2 and the heat exchanger 12 are joined and the radiator 5 are separately manufactured, and finally the high-temperature liquid inlet pipe 30 is used. And a mounting plate 27 provided with a hole through which the low-temperature liquid delivery pipe 31 passes. After sandwiching the mounting plate 27, the high temperature liquid inlet pipe 30 and the high temperature liquid flow path 20 can be joined by brazing or welding, and the low temperature liquid delivery pipe 31 and the low temperature liquid inlet 13 can be joined by brazing or welding. Therefore, manufacture becomes easy.

  In addition, since the mounting plate 27 is also in contact with the loop heat transport device of FIG. 1, when using a circulating fluid 25 such as an aqueous solution of distilled water or antifreeze, it is necessary to use a copper material for the mounting plate 27. Therefore, there is a problem that the weight increases. Since the attachment plate 27 does not come into contact with the configuration of the sixth embodiment, it is possible to use a light material such as aluminum, and it is possible to reduce the weight of the entire loop heat transport device.

Embodiment 7 FIG.
FIG. 14 is a cross-sectional view showing a configuration of a loop heat transport device according to the seventh embodiment. FIG. 15 is a cross-sectional view taken along the line AA of FIG. 14 and 15, the same reference numerals as those in FIGS. 1 and 2 denote the same or corresponding parts. As shown in FIGS. 14 and 15, in the loop heat transport apparatus according to the seventh embodiment, a fixing member 32 is provided between the evaporator plate 4 and the evaporator header pipe 23. The fixing member 32 is provided so as to support at least the evaporation plate 4. In the loop heat transport device shown in FIG. 1, the evaporator plate 4 of the evaporator 2 is only joined to the outer peripheral surface of the evaporator tube 3 by a fixing material 29 such as solder or brazing material. When a heating element such as a heavy electronic device is attached, there is a problem that the durability and vibration resistance of the evaporator are low.

  In the seventh embodiment, since the fixing member 32 is provided so as to support the evaporation plate 4 at the lower part of the evaporator 2 as well as being joined by the fixing material 29 such as solder or brazing material, the upper surface of the fixing member 32. By fixing the evaporator 2 with this, it is possible to improve durability and vibration resistance. Moreover, it is also possible to fix the loop heat transport device to the floor surface of the box of the device in which the device is installed using the fixing member 32. By improving durability and vibration resistance, it is possible to reduce the thickness of parts and to reduce the weight of loop heat transport equipment.

Embodiment 8 FIG.
16-19 is sectional drawing which shows a part of structure of the loop type heat transport apparatus by this Embodiment 8, and has shown the part of the evaporator 2 and the heat exchanger 12. FIG. 16 to 19, the same reference numerals as those in FIG. 1 denote the same or corresponding parts. As shown in FIGS. 16 to 19, in the loop heat transport device according to the eighth embodiment, a circulating fluid sealing pipe 36 is provided. In the loop type heat transport device shown in FIG. 16, the sealing pipe 36 is disposed in the accommodating portion 18, in FIG. 17, in the heat exchanger inlet header 14, in FIG. 18, in the heat exchanger outlet header 17, and in FIG. 21 is provided.

  According to the loop heat transport device configured as described above, the inside of the loop heat transport device is evacuated from the sealing pipe 36, and an appropriate amount of the circulating fluid 25 is sealed and temporarily operated with a valve or the like temporarily sealed. It can be performed. When the sealing pipe 36 is arranged as shown in FIGS. 17 to 19, the mounting portion of the sealing pipe 36 is a portion filled with the circulating fluid 25, so that the heat dissipation characteristics can be obtained by temporary operation from low heat generation to high heat generation. It is possible to stably operate by adjusting the amount of liquid while confirming and finally sealing off the sealing pipe 36. In addition, the optimum value of the liquid amount can be determined thereby.

  Further, in the loop type heat transport device, the residual gas inside the apparatus, the residual gas contained in the circulating liquid 25, and the non-condensable gas generated inside after circulating liquid 25 injection are stored in the storage unit 18, By providing the sealing pipe 36 at the top of the accommodating portion 18 as in FIG. 16, the internal gas can be evacuated from the sealing pipe 36 after the circulating fluid 25 is sealed. Of course, a sealing pipe 36 for adjusting the liquid amount as shown in FIGS. 17 to 19 and a sealing pipe 36 for evacuating the internal gas as shown in FIG.

1: Loop type heat transport device 2: Evaporator 3: Evaporator tube (evaporator internal flow path) 4: Evaporator plate 5: Radiator 6: High temperature liquid inlet 7: Radiator inlet header 8: Radiator internal flow path 9 : Heater outlet header 10: Cryogenic liquid outlet 11: Radiation fin 12: Heat exchanger 13: Cryogenic liquid inlet 14: Heat exchanger inlet header 15: Heat transfer pipe 16: Preheated liquid outlet 17: Heat exchanger outlet header 18: Container 19: High temperature liquid outlet 20: High temperature liquid flow path 21: Preheated liquid flow path 22: Preheated liquid inlet 23: Evaporator header pipe 24: Heating element 25: Circulating liquid 26: Steam 27: Mounting plate 28 : Two-phase fluid delivery port 29: Fixing material 30: High temperature liquid delivery pipe 31: Low temperature liquid delivery pipe 32: Fixing member 33: Fin 34: High temperature liquid dedicated passage 35: Guide 36: Sealing pipe

In the present invention, a plurality of evaporator internal flow paths through which circulating fluid flows from below to above are formed, a metal evaporation plate having a heating element installed outside, and a position below the evaporator internal flow path An evaporator composed of an evaporator header pipe to which a preheating liquid inlet is connected, a radiator having a high temperature liquid inlet, an internal flow path, and a low temperature liquid outlet for the circulating liquid and releasing the heat of the circulating liquid And a heat exchanger inlet header having a cryogenic liquid inlet into which the circulating liquid discharged from the cryogenic liquid outlet of the radiator is sent, and preheating in which the circulating liquid is sent to the evaporator header pipe through the preheating liquid channel A heat exchanger outlet header having a liquid outlet, a heat exchanger tube serving as a heat exchanger internal channel connecting the heat exchanger inlet header and the heat exchanger outlet header, and an evaporator located around the heat exchanger tube Circulating fluid delivered from the two-phase fluid outlet located above the internal flow path and A heat exchanger that has a storage portion in which the steam of the circulating fluid is stored and exchanges heat between the circulating fluid in the heat transfer tube and the steam in the storage portion, and the circulating fluid is sent out from the storage portion A loop-type heat transport device having a high-temperature liquid flow path connecting a high-temperature liquid delivery port and a high-temperature liquid feed port of a radiator, and a plurality of evaporator internal flow paths are formed inside the evaporation plate Formed by inserting evaporation pipes of materials different from the material of the evaporation plate into the plurality of through holes, respectively, and accommodates the two-phase fluid outlets above the plurality of evaporator internal flow paths, which are one end of the evaporation pipes It protrudes higher than the bottom surface of the part and is disposed at a position lower than the heat transfer tube .

Claims (18)

A plurality of evaporator internal flow paths through which the circulating liquid flows upward from below, a metal evaporation plate having a heating element installed outside, and a preheating liquid positioned below the evaporator internal flow path An evaporator composed of an evaporator header pipe to which the inlet is connected;
A radiator having a high-temperature liquid inlet, a radiator internal flow path, and a low-temperature liquid outlet of the circulating liquid, and releasing the heat of the circulating liquid;
A heat exchanger inlet header having a cryogenic liquid inlet into which the circulating liquid discharged from the cryogenic liquid outlet of the radiator is sent, and preheating in which the circulating liquid is sent to the evaporator header pipe through a preheating liquid channel A heat exchanger outlet header having a liquid delivery outlet, a heat transfer pipe serving as a heat exchanger internal flow path connecting the heat exchanger inlet header and the heat exchanger outlet header, and located around the heat transfer pipe, A circulating liquid sent out from the two-phase fluid delivery port located above the evaporator internal flow path, and a storage part for storing the vapor of the circulating liquid, and the circulating liquid inside the heat transfer tube and the above A heat exchanger for exchanging heat with the steam in the housing,
A loop type heat transport device comprising a high-temperature liquid flow path for connecting a high-temperature liquid delivery port through which the circulating fluid is delivered from the housing part and a high-temperature liquid delivery port of the radiator,
A loop type heat transport device, wherein an inner surface of the evaporator internal flow passage in contact with the circulating fluid is formed of a metal different from the metal of the evaporation plate.   The said circulating liquid is a liquid containing water, The inner surface which contact | connects the said circulating liquid of the said evaporator internal flow path was formed with the metal with a larger standard electrode potential than hydrogen. Loop type heat transport equipment.   3. The loop heat transport device according to claim 2, wherein the evaporation plate is made of a metal material having a density lower than that of a metal that forms an inner surface of the evaporator internal flow path that contacts the circulating fluid.   The loop according to claim 3, wherein the evaporation plate is an aluminum plate, and the evaporator internal flow path is formed by inserting an evaporation tube into a through hole formed in the evaporation plate. Mold heat transport equipment.   The loop heat transport device according to claim 4, wherein the evaporation tube protrudes into the housing portion.   6. The loop heat transport device according to claim 5, wherein a protruding dimension of the evaporation tube into the housing portion is 3 mm or more.   The loop heat transport device according to any one of claims 4 to 6, wherein the evaporation pipe is a copper pipe.   The loop heat transport device according to any one of claims 4 to 6, wherein an inner surface of the evaporation tube is plated with copper.   The loop-type heat according to claim 3, wherein the evaporation plate is an aluminum plate, and the evaporator internal flow path is formed by copper plating the inner surface of a through hole formed in the aluminum plate. Transport equipment.   The loop heat transport device according to any one of claims 1 to 9, wherein the heating elements are installed on both surfaces of the evaporation plate.   A plurality of the heating elements are installed, and a heating element that needs to be cooled more efficiently among the plurality of heating elements is installed closer to the center of the evaporation plate than the other heating elements. The loop heat transport apparatus according to any one of? 9.   The loop heat transport device according to any one of claims 1 to 9, wherein fins are provided on an inner surface of the evaporator internal flow path.   The cryogenic liquid delivery port and the hot liquid delivery port are arranged on the same side of the radiator, a cryogenic liquid delivery pipe is joined to the cryogenic liquid delivery port, and a hot liquid delivery pipe is connected to the hot liquid delivery port. A mounting plate through which the cryogenic liquid delivery pipe and the hot liquid delivery pipe penetrate is joined, and the cryogenic liquid delivery pipe is joined to the cryogenic liquid inlet of the heat exchanger, and the hot liquid delivery The loop heat transport device according to claim 1, wherein a pipe is joined to the high-temperature liquid flow path.   14. The loop heat transport device according to claim 13, wherein the mounting plate is an aluminum plate.   A guide is provided so as to surround the two-phase fluid delivery port in the housing portion, and a space not including the two-phase fluid delivery port among spaces partitioned by the guide is a dedicated passage for high-temperature liquid. Item 2. A loop heat transport device according to item 1.   The loop heat transport device according to claim 1, further comprising a fixing member that supports the evaporation plate.   The loop heat transport device according to claim 1, wherein a plurality of the heat transfer tubes are provided in parallel, and a gap between adjacent heat transfer tubes among the plurality of heat transfer tubes is set to 3 mm or more.   The loop heat transport device according to claim 1, wherein a sealing pipe for sealing exhaust and circulating fluid from outside is provided in the heat exchanger or the preheating liquid channel.

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