JPWO2011081129A1 - Printed circuit board manufacturing method and probe board manufacturing method using the same - Google Patents

Abstract

A flat first insulating base material (1) is formed of a thermoplastic resin, and the first insulating base material (1) is formed by using a transfer method so as to be flush with one surface (3) of the first insulating base material (1). A first manufacturing step of manufacturing a first substrate unit (4) having a single transmission line (2), and a plate-like second insulating substrate (5) formed of a thermoplastic resin, A second substrate unit (8) in which a second transmission line (6) is formed using a transfer method so as to be flush with one surface (7) of the insulating base material (5) of the second substrate. 2 and the first and second substrate units (4, 8) are superposed on one surface (3, 7) of the insulating base (1, 5) and thermocompression bonded, A wiring connection step of electrically connecting the first transmission line (2) and the second transmission line (6) in direct contact with each other.

Description

  The present invention relates to a printed circuit board manufacturing method that can be suitably used in a high-frequency environment and a probe board manufacturing method using the same.

  Conventionally, in the manufacture of printed circuit boards, wiring connections between wiring boards in general high-frequency compatible products include solder ball connection, crimp connection using a flip chip device using Au stud bumps and Au plating bumps, and the like. . Generally, when such a printed circuit board is used as a multilayer printed circuit board, the circuit boards are stacked through an adhesive layer and connected by through-hole plating, filled via plating, or the like.

  On the other hand, conventionally, in the manufacture of probes, when connecting a fine pitch contact substrate and a printed wiring board for connecting a coaxial cable, a solder ball for connection, an Au stud bump, or an Au plating bump is produced on the fine pitch wiring board. . Then, the fine pitch wiring board is thermocompression-bonded on the other board using a flip chip device, and metal bump connection is performed. As a technique similar to such a conventional technique, Patent Document 1 discloses a circuit board and a manufacturing method thereof, a bump contact head using the circuit board, and a semiconductor component mounting module.

  However, conventionally, the fine pitch contact substrate and the coaxial cable connection substrate are manufactured in separate steps, which is troublesome and troublesome. Also, in both the probe board and the general printed board, the solder ball connection has a structure in which the impedance of the connection part is discontinuous, so that the transmission loss of the high frequency signal increases, and the board corresponding to the high frequency signal It is not suitable for connection technology for use in manufacturing. Moreover, since the connection method by the flip chip connection method using Au bumps uses an expensive flip chip connection device, the cost of capital investment increases.

JP-A-9-330995

  The present invention provides a method for manufacturing a printed circuit board that can reduce loss of high-frequency signals with a simple structure and that can be suitably used in a high-frequency environment, and a method for manufacturing a probe board using the printed circuit board.

  In the present invention, the first transmission base is formed by using a transfer method so that the flat first insulating base is formed of a thermoplastic resin and is flush with one surface of the first insulating base. A first manufacturing process for manufacturing the formed first substrate unit and a flat plate-like second insulating base material are formed of a thermoplastic resin and are flush with one surface of the second insulating base material. In this way, the second manufacturing process for manufacturing the second substrate unit in which the second transmission line is formed by using the transfer method, and the first and second substrate units on one surface of the insulating base material A printed circuit board manufacturing method comprising: a wiring connection step of electrically connecting the first transmission line and the second transmission line in direct contact with each other by thermocompression bonding by superimposing the first transmission line and the second transmission line provide.

  Preferably, the first manufacturing process and the second manufacturing process are simultaneously performed by the same manufacturing apparatus.

  Preferably, a through-hole penetrating a contact portion between the first transmission line and the second transmission line is formed on the printed circuit board manufactured by the method for manufacturing a printed circuit board according to claim 1, A plating process is performed on the through hole, and among the plating applied to the through hole, an opening is formed by removing the plating while leaving a through hole portion of the contact portion, and the opening is filled with an insulating material, The second insulating base material is cut out so that the first transmission line other than the contact portion is exposed, and a bump serving as a contact head is formed on the exposed part of the first transmission line.

  Preferably, a plate-shaped reinforcing plate is laminated on the second substrate unit.

  Preferably, in the printed circuit board manufacturing method according to claim 1, bumps serving as contact heads are formed on the first transmission line in the first manufacturing process, and the second manufacturing process performs the second process. A concave portion is formed in the transmission line, and a conductive material is introduced into the concave portion, while the second insulating base material is notched to expose the bump in the wiring connection step, and the wiring connection step. The first transmission line and the second transmission line are electrically connected so that the conductive material contacts the first transmission line.

Preferably, a plate-shaped reinforcing plate is laminated on the second substrate unit.
Preferably, the conductor thickness on the back side of the insulating base material of the transmission line of the first substrate unit is thick.

  According to the present invention, the insulating base material of each board unit is formed of a thermoplastic resin, and each transmission line formed on the insulating base material of each board unit using a transfer method is connected to one surface and the surface of the insulating base material. Since it forms so that it may become 1, it can thermocompression-bond by making each transmission line face each other directly and closely_contact | adhere. For this reason, the printed circuit board which connected the transmission line of each board | substrate unit with a simple manufacturing process can be obtained. Further, since the transmission lines are directly connected by thermocompression bonding, no solder balls, Au plating bumps, or stud bumps are interposed between the transmission lines. Thereby, a printed circuit board with good high frequency characteristics can be obtained. In addition, since the insulating base is formed of a thermoplastic resin, it can withstand a total of two presses: a press for performing a transfer method and a press for connecting a transmission line. Furthermore, since the transmission line formed by the transfer method is embedded in the insulating base material, the transmission line can be formed flush with one surface of the insulating base material as described above.

  Further, according to the present invention, since the first board unit manufacturing process and the second board unit manufacturing process are simultaneously performed by the same manufacturing apparatus, both board units can be formed quickly and efficiently, and the printed board manufacturing time can be reduced. It can be shortened. Therefore, the productivity of the printed circuit board is improved.

  In addition, according to the present invention, a through hole is formed in a contact portion between the first transmission line and the second transmission line, and plating processing is performed on the contact portion (so-called through hole plating is formed). The connection can be strengthened and ensured. Moreover, since the bump is formed on the first transmission line exposed by cutting out the second insulating base material, the probe substrate can be manufactured easily and easily.

  Further, according to the present invention, the mechanical rigidity of the probe substrate can be increased, and it is possible to suppress accidental damage.

  In addition, according to the present invention, a conductive material is introduced into the recess, and the first transmission line and the second transmission line are connected so that the conductive material contacts the first transmission line. Connection can be ensured. In addition, since the bump is formed on the first transmission line and the second insulating base material is notched so that the bump is exposed in advance, the probe substrate can be manufactured easily and easily.

  Further, according to the present invention, the mechanical rigidity of the probe substrate can be increased, and it is possible to suppress accidental damage.

  Further, according to the present invention, the contact performance of the probe substrate can be improved, and reliable electrical contact is possible when contacting the object to be measured.

It is the schematic which shows the manufacturing method of the printed circuit board which concerns on this invention in order. It is the schematic which shows the manufacturing method of the printed circuit board which concerns on this invention in order. It is the schematic which shows the manufacturing method of another printed circuit board concerning this invention in order. It is the schematic which shows the manufacturing method of another printed circuit board concerning this invention in order. It is the schematic which shows the manufacturing method of another printed circuit board concerning this invention in order. It is the schematic which shows the manufacturing method of another printed circuit board concerning this invention in order. It is the schematic which shows the manufacturing method of another printed circuit board concerning this invention in order. It is the schematic which shows the manufacturing method of the probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of the probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of the probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of the probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of the probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of the probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of the probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of the probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of another probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of another probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of another probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of another probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of another probe board | substrate which concerns on this invention in order. It is the schematic which shows the manufacturing method of another probe board | substrate which concerns on this invention in order. It is the schematic of the contact probe using the probe board | substrate which concerns on this invention. It is a rear view of the bump part of the contact probe of FIG. It is the schematic of the 1st board | substrate unit of FIG. It is the schematic of the 2nd board | substrate unit of FIG. It is the schematic which shows the connection condition of the 1st and 2nd transmission line of FIG. FIG. 23 is a rear view of a bump portion of a contact probe corresponding to the multi-channel signal of FIG. 22.

  As shown in FIG. 1, first, a first transmission line 2 is formed on a first connection surface 3 that is one surface of a flat plate-like first insulating base material 1 by using a transfer method. The first transmission line 2 is embedded in the first insulating substrate 1 and is formed to be flush with the first connection surface 3. In order to be able to embed the first transmission line 2, the first insulating substrate 1 is made of a thermoplastic resin. In other words, the first transmission line 2 is pressed and embedded in the first insulating base material 1 made of this thermoplastic resin. Thereby, the first substrate unit 4 is manufactured.

  On the other hand, the second transmission line 6 is formed on the second connection surface 7 which is one surface of the flat plate-like second insulating base material 5 by using a transfer method. The second transmission line 6 is embedded in the second insulating substrate 5 and is formed to be flush with the second connection surface 7. In order to be able to embed the second transmission line 6, the second insulating substrate 5 is made of a thermoplastic resin. That is, the second transmission line 6 is pressed and embedded in the second insulating base material 5 made of this thermoplastic resin. Thereby, the second substrate unit 8 is manufactured.

  In addition, the 1st board | substrate unit manufacturing process for manufacturing the 1st board | substrate unit 4 mentioned above and the 2nd board | substrate unit manufacturing process for manufacturing the 2nd board | substrate unit 8 are simultaneously performed with the same manufacturing apparatus. It can be carried out. That is, by making the both insulating bases 1 and 5 and the two transmission lines 2 and 6 the same material, they can be simultaneously manufactured by the same manufacturing apparatus. Thereby, both board | substrate units 4 and 8 can be manufactured rapidly and efficiently, and the manufacturing time of the printed circuit board 9 (refer FIG. 2) finally manufactured can be shortened. Therefore, the productivity of the printed circuit board 9 is improved.

  Next, as shown in FIG. 2, the first substrate unit 4 and the second substrate unit 8 are connected. In this connection, the first transmission line 2 and the second transmission line 6 formed on both board units 4 and 8 are superposed and thermocompression bonded so that they are in direct contact with each other. The pressing operation of the first substrate unit 4 to the second substrate unit 8 at this time is performed in an environment of 300 ° C., for example. In this manner, the wiring connection process for connecting the wirings of the first transmission line 2 and the second transmission line 6 is completed, and the printed circuit board 9 is manufactured. The transmission lines 2 and 6 are conductor circuits using, for example, copper.

  During the production of the printed circuit board 9, the pressing operation for both insulating bases 1, 5 is performed twice. That is, a press when embedding the transmission lines 2 and 6 by a transfer method and a press at the time of thermocompression bonding in the wiring connection process. By forming the insulating bases 1 and 5 from a thermoplastic resin, it is possible to withstand a total of two presses. Further, as described above, the insulating bases 1 and 5 are formed of a thermoplastic resin, thereby embedding the transmission lines 2 and 6 in the insulating bases 1 and 5 and forming both connection surfaces 3 and 7 flush with each other. Therefore, it is possible to realize a good connection using thermocompression bonding by bringing both the substrate units 4 and 8 into close contact with each other. Since this connection does not involve a connection medium such as a solder ball, Au plating bump, or stud bump, a printed circuit board with good high-frequency characteristics can be obtained. At this time, it is preferable to use a thermoplastic resin having a low dielectric constant of a high frequency signal and good high frequency characteristics. As described above, the printed circuit board 9 to which the transmission lines 2 and 6 of the circuit board units 4 and 8 are connected can be obtained by a simple manufacturing process.

With reference to FIGS. 3 to 7, another method for manufacturing a printed circuit board according to the present invention will be described in order.
As shown in FIG. 3, three substrate units 23, 24, and 25 manufactured by the same material and manufacturing method as the first substrate unit 4 and the second substrate unit 8 described above are prepared. Among these, the gold plating pad 26 is previously provided in the place which the transmission lines 26 and 27 which oppose should contact. And as shown in FIG. 4, these are laminated | stacked and integrated. This lamination is performed in the same manner as the connection of the first and second substrate units 4 and 8 described above. At this time, the substrate unit 25 is on the support plate 27 in order to perform stable thermocompression bonding. In FIG. 4 and subsequent figures, the gold plating pad 26 connected by crimping is omitted.

  Then, the support plate 27 is removed as shown in FIG. Thereafter, the substrate units 23, 24, and 25 are drilled to form through holes 28 that penetrate the substrate units 23, 24, and 25. Then, as shown in FIG. 6, the through hole 28 is plated to form a through hole plating 29. Thereby, what is called an interlayer connection which connects the conductor 30 of the board | substrate unit 23 and the conductor 31 of the board | substrate unit 25 is made. Then, as shown in FIG. 7, a circuit is formed at a position other than the through-hole plating 29. Specifically, a hole is formed in the conductor 30 and the conductor 31 to form a circuit. Thereafter, a multilayer flexible printed wiring board is completed through processes such as solder resist. FIG. 7 shows a so-called flex-rigid board in which the protruding part of the board unit 24 is flexible and the laminated part is rigid. The manufacturing method according to the present invention can be applied to such a flex-rigid board or a general laminated type printed board, and various effects when using thermocompression bonding can be obtained for each.

The probe substrate manufacturing method according to the present invention will be described in order with reference to FIGS.
As shown in FIG. 8, the first substrate unit 4 and the second substrate unit 8 are manufactured. A first conductor circuit 10 is formed on the surface of the first insulating substrate 1 opposite to the surface on which the first transmission line 2 is formed. Similarly, the 2nd conductor circuit 11 is formed in the surface on the opposite side to the surface in which the 2nd transmission line 6 of the 2nd insulating base material 5 is formed. Other structures, functions, and effects are the same as in the example of FIG. Next, as shown in FIG. 9, a through hole 12 is formed in the second substrate unit 8. The through hole 12 is provided at a portion corresponding to a portion where a bump is formed on the probe substrate, that is, a portion corresponding to an arbitrary portion of the first transmission line 2 when both the substrate units 4 and 8 are connected.

  Next, as shown in FIG. 10, both substrate units 4 and 8 are connected using thermocompression bonding with a high-temperature (for example, about 300 ° C.) press. At this time, the reinforcing plate 13 is laminated on the second conductive circuit 11 side of the second substrate unit 8. The reinforcing plate 13 is made of, for example, a highly rigid material such as metal, glass epoxy such as FR-4, or the like. In general, since the substrate units 4 and 8 made of thermoplastic resin are thin in the process of manufacturing the probe substrate, the reinforcing plate 13 is laminated to increase the mechanical rigidity of the probe substrate and prevent it from being damaged accidentally. The The reinforcing plate 13 may be provided with a stripline circuit (not shown). Other configurations, operations, and effects are the same as in the example of FIG.

  Next, as shown in FIG. 11, the through hole 14 is formed so as to penetrate the contact portion between the first transmission line 2 and the second transmission line 6. The through hole 14 is formed by drilling with a router or the like. Then, as shown in FIG. 12, the through hole 14 is plated to form a through hole plating 15. At this time, the conductor thickness of the conductor circuit 10 can be increased by performing through-hole plating. Moreover, the spring property can be reinforced by plating the conductor circuit 10 with nickel or nickel cobalt alloy. Then, as shown in FIG. 13, the first substrate unit 4, the second substrate unit 8, and the reinforcing plate 13 are punched. This drilling process is performed by removing the through-hole plating 15 (forming the opening 22), leaving a portion penetrating the contact portion between the first transmission line 2 and the second transmission line 6. Thereby, since the 1st transmission line 2 and the 2nd transmission line 6 are connected through the through-hole plating in the contact part which overlapped, connection is strengthened and it becomes reliable. That is, in addition to press connection by thermocompression bonding, connection by through-hole plating is also performed.

  Next, as shown in FIG. 14, the resin 16 that is an insulating material is filled (embedded) in the opening 22 (see FIG. 13) that has been drilled. As shown in FIG. 15, the first transmission line 2 at the position where the through hole 12 (see FIG. 9) is provided, that is, the first transmission line other than the contact portion between the first transmission line 2 and the second transmission line 6. The second insulating substrate 5 (reinforcing material 13, second conductor circuit 11, first insulating substrate 1, first conductor circuit 10 if necessary) so that one transmission line 2 is exposed. Cut out. Then, bumps 17 serving as contact heads are formed on the exposed portions. Thereby, the probe board | substrate 18 is manufactured easily and easily.

  The probe substrate manufactured by the method for manufacturing a probe substrate according to the present invention described above has good high frequency characteristics and is suitable for use in a high frequency environment. A probe substrate in which a transmission line is formed by a transfer method and a bump is formed on the transmission line is well known, but a portion (second transmission line 6) to be relayed with a coaxial cable is manufactured by the transfer method in order to cope with high frequencies. Was structurally difficult. However, in the present invention, the insulating bases 1 and 5 are formed of a thermoplastic resin, the transmission lines 2 and 6 are formed flush with the surface, and are brought into close contact with each other so as to be connected by thermocompression bonding. Good characteristics.

  The effect of the method for manufacturing a probe substrate according to the present invention will be described below although there is a description overlapping therewith. By using thermoplastic resin as the base material for transfer circuit boards (transmission lines), unlike ordinary thermosetting resins, a fine pitch contact board and a coaxial cable connection board are directly bonded and thermocompression bonded (prepreg, etc.) The probe board can be manufactured in a lump. Moreover, by using through-hole plating, conductive paste (described later), spot welding (described later) to the wiring connection portion of the transfer circuit board, it becomes possible to reduce the bump formation process and flip chip process used conventionally, It becomes possible to easily manufacture a probe substrate only with a conventional printed wiring board manufacturing technique. In addition, these can be expected to improve mass production and significantly reduce costs.

With reference to FIGS. 16 to 21, another method for manufacturing a probe substrate according to the present invention will be described in order. In addition, about what has the same effect | action and effect, the same code | symbol as what was mentioned above is attached | subjected and demonstrated.
As shown in FIG. 16, the first substrate unit 4 and the second substrate unit 8 are manufactured. At this time, bumps 17 serving as contact heads are formed on the first transmission line 2. In this example, the reinforcing material 13 is laminated at this point. Other structures, functions, and effects are the same as in the example of FIG. Next, as shown in FIG. 17, a recess 19 is formed in the second transmission line 6. Further, in the second insulating base material 5 and the second conductor circuit 11, a notch 20 is formed at a location corresponding to the portion where the bump 17 is formed. Then, as shown in FIG. 18, the conductive material 21 is introduced into the recess 19. The conductive material may be a conductive paste or a metal by spot welding.

  And as shown in FIG. 19, both the board | substrate units 4 and 8 are thermocompression-bonded by a press. At this time, the connectivity between the first transmission line 2 and the second transmission line 6 is enhanced by the conductive material 21. That is, thermocompression bonding is performed so that the conductive material 21 contacts the first transmission line 2. Thereby, the electrical or mechanical connection between both transmission lines can be ensured. The other operations and effects during pressing are the same as in the example of FIG. Then, as shown in FIG. 20, the reinforcing portion 13 is punched with a router or the like so that the bumps 17 are exposed to the outside. Furthermore, as shown in FIG. 21, in order to adjust the outer shape of the probe substrate 18, the second insulating base material 5, the reinforcing material 13, the second conductor circuit 11, the first insulating base material 1, and the first conductor Cut out circuit 10. Thereby, the probe board | substrate 18 is manufactured easily and easily.

  As shown in FIG. 22, the contact probe 32 of this example is one in which two coaxial cables 33 are connected. These coaxial cables 33 are connected to the second transmission line 6 described above. Corresponding to these coaxial cables 33, bumps 17 are formed at the tips of the contact probes 32, respectively. In FIG. 23, the signal line connected to the bump 17 is the first transmission line 2 described above. Among the transmission lines 2, two central portions of the wiring portion are signal lines 2b and two at both ends are ground lines 2a, and the contact probe 32 is a probe substrate corresponding to a differential signal. The bumps 17 are in contact with the object to be inspected to realize electrical contact.

  Referring to FIG. 24, the land 2c is formed on the first transmission line 2 (ground line 2a, signal line 2b) formed on the first substrate unit 4 used for the contact probe 32. Yes. On the other hand, referring to FIG. 25, a land 6c is formed in the second transmission line 6 formed in the second substrate unit 8 used for the contact probe 32. These 4 and 8 are overlapped by thermocompression bonding as described above, but when viewed in plan, as shown in FIG. 26, the connecting portion 16 is formed at the overlapping portion of the lands 2c and 6c. Has been.

  In addition, as shown in FIG. 27, two signal lines 2b are arranged, two ground lines 2a are arranged on both sides thereof, and this combination is arranged side by side to repeat a probe board (contacts) corresponding to a multi-channel differential signal. A probe 32) is formed. For example, FIG. 27 shows a probe board corresponding to a 4-channel differential signal.

DESCRIPTION OF SYMBOLS 1 1st insulation base material 2 1st transmission line 3 1st connection surface 4 1st board | substrate unit 5 2nd insulation base material 6 2nd transmission line 7 2nd connection surface 8 2nd board | substrate unit DESCRIPTION OF SYMBOLS 9 Printed circuit board 10 1st conductor circuit 11 2nd conductor circuit 12 Through-hole 13 Reinforcement part 14 Through hole 15 Through-hole plating 16 Resin 17 Bump 18 Probe board 19 Recess 20 Notch part 21 Conductive material 22 Opening part 23 Substrate unit 24 Substrate unit 25 Substrate unit 26 Gold plating pad 27 Support plate 28 Through hole 29 Through hole plating 30 Conductor 31 Conductor 32 Contact probe 33 Coaxial cable

Claims (7)

A flat first insulating base is formed of a thermoplastic resin, and a first transmission line is formed using a transfer method so as to be flush with one surface of the first insulating base. A first manufacturing process for manufacturing the substrate unit of
A second transmission line is formed by using a transfer method so that a flat second insulating base material is formed of a thermoplastic resin and is flush with one surface of the second insulating base material. A second manufacturing process for manufacturing the substrate unit of
The first and second substrate units are superposed and thermocompression bonded on one surface of the insulating base, and the first transmission line and the second transmission line are brought into direct contact with each other for electrical contact. A printed circuit board manufacturing method comprising: a wiring connection step for connecting to a printed circuit board.   The printed circuit board manufacturing method according to claim 1, wherein the first manufacturing process and the second manufacturing process are simultaneously performed by the same manufacturing apparatus. A through hole penetrating a contact portion between the first transmission line and the second transmission line is formed on the printed circuit board manufactured by the method for manufacturing a printed circuit board according to claim 1,
Plating the through hole,
Of the plating applied to the through hole, an opening is formed by removing the plating leaving the through hole portion of the contact portion,
Filling the opening with an insulating material;
Notching the second insulating substrate so that the first transmission line other than the contact portion is exposed;
A method of manufacturing a probe substrate, comprising forming bumps to be contact heads on exposed portions of the first transmission line.   4. The method of manufacturing a probe substrate according to claim 3, wherein a plate-shaped reinforcing plate is laminated on the second substrate unit.   2. The printed circuit board manufacturing method according to claim 1, wherein a bump serving as a contact head is formed on the first transmission line in the first manufacturing step, and the second transmission line is formed on the second manufacturing step. A concave portion is formed and a conductive material is introduced into the concave portion, while the second insulating base material is notched to expose the bump in the subsequent wiring connection step, and the conductive material is removed in the wiring connection step. A method for manufacturing a probe substrate, comprising: electrically connecting the first transmission line and the second transmission line so that the first transmission line is in contact with the first transmission line.   6. The probe substrate manufacturing method according to claim 5, wherein a plate-shaped reinforcing plate is laminated on the second substrate unit.   The method for manufacturing a probe substrate according to claim 1, wherein the conductor thickness on the back side of the insulating base material of the transmission line of the first substrate unit is increased.

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