JP2977124B2 - Circuit board, manufacturing method thereof, and bump type contact head using the circuit board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board having a bump pattern with a very small variation in height projected on at least one surface, and a method of manufacturing the same. A circuit board on which a highly reliable conductive structure is formed between an input / output terminal and a conductive circuit, and on which a semiconductor element can be mounted at a high density, and a bump obtained by using the circuit board Type contact head, including an LSI, a liquid crystal panel,
When inspecting the presence or absence of a failure point in a wiring circuit of a circuit component such as AB or PDP, even if the circuit component has a fine pitch, it can sufficiently cope with it, and the pitch accuracy between test terminals is high. The present invention also relates to a bump-type contact head having excellent high-frequency characteristics and a method for manufacturing them at low cost with high productivity.

[0002]

[0003]

2. Description of the Related Art Semiconductor device packages incorporated in various electronic devices such as computers, portable communication devices, and liquid crystal panels usually include a semiconductor device such as a bare chip mounted on a circuit board on which a predetermined pattern of a conductive circuit is formed. Is 1
In general, a semiconductor element is mounted by mounting a plurality of semiconductor elements and conducting between the element and an input / output terminal of a conductor circuit, and the whole is resin-molded.

As for the mounting of the semiconductor element, a method of die-bonding the semiconductor element to the circuit board and wire-bonding the input / output terminal of the circuit board to the terminal (land portion) of the semiconductor element, and a method of connecting a flip chip to the input / output of the circuit board. For example, a method of connecting the terminals using solder, a method of directly connecting the input / output terminals of the circuit board and the lead terminals of the semiconductor element by solder, and the like have been implemented.

[0005] The semiconductor element package manufactured in this manner is mounted on a motherboard (mounting board) on which conductor circuits of a predetermined pattern are wired and incorporated into an actual machine. In this case, the area ratio of one semiconductor element package to the motherboard is usually about 1/10 to 1/5, and therefore, a plurality of semiconductor element packages are mounted on the motherboard.

Conventionally, a wire bonding method has been partially applied to mounting on a motherboard, but recently, in order to meet the demand for high-density mounting, cream solder is pattern-printed on a land portion of the motherboard. A method has been widely adopted in which terminals (lead terminals and ball grid arrays) of a semiconductor element package are aligned and mounted, and then the whole is passed through a reflow device to perform batch soldering.

In recent years, electronic devices have been reduced in size, speed, and multi-functionality. With this trend, a circuit which enables high-density mounting of semiconductor components even if the overall shape is small. Demands for substrates are increasing. For that purpose, it is preferable that the circuit board is a multilayer circuit board and the formed conductor circuit has a fine pattern. However, conventionally known multilayer circuit boards are usually manufactured by a so-called build-up method, and thus have the following problems.

In the case of manufacturing a multilayer circuit board by the build-up method, first, a conductor circuit functioning as a signal pattern is formed on the surface of the lowermost insulating substrate to manufacture a unit circuit board. An operation of superimposing and integrating another unit circuit board on which a conductor circuit functioning as another signal pattern is formed is sequentially performed, and sequentially assembled from the lower side to the upper side.

In this case, the conductive structure between the upper conductor circuit and the lower conductor circuit is usually formed by drilling a plurality of through holes in a predetermined plane pattern in the thickness direction of the unit circuit board, and forming the through holes on the wall surfaces of the through holes. For example, after conducting electroless plating to impart conductivity, electroplating is performed using the lower conductive circuit as a conductive path, and the plating layer electrically connects the land portions of the upper conductive circuit and the land portions of the lower conductive circuit. Connected.

Therefore, in order to realize high-density mounting, it is necessary to reduce the diameter of the above-mentioned through hole, but as a practical matter, there is a limit to the hole diameter. First, since the through hole is generally formed by drill grinding, the diameter of the through hole cannot be made very small due to the relationship with the drill strength. The hole diameter by drill grinding is usually about 150 to 200 μm. In addition,
100 to 150 even when photolithography is applied
It is about μm.

When a plating layer is formed on the wall surface of the drilled through hole by combining the above-described electroless plating and electroplating, if the thickness of the plating layer is too small,
Since the electrical conduction between the lower conductor circuit and the upper conductor circuit is not in a satisfactory state, the plating layer must have a certain thickness. Although it depends on the type of circuit board, the thickness of the plating layer is usually 20 to 30 μm in order to realize good conduction between the conductor circuits.
m.

Therefore, in a conductive structure using a through hole, a plating layer having a thickness of 15 to 20 μm is generally formed on the wall surface of the through hole having a hole diameter of 150 to 200 μm. Irrespective of the continuity between conductor circuits, having a diameter of 100 to 150 μm
This means that there is a certain degree of dead space. Even in the case of an inner via hole, the hole diameter is, for example, 1
If it is 00 μm, the dead space hole is about 60 to 70 μm. That is, in the case of a conventional through hole or inner via hole, there is a limit in realizing the reduction in the diameter, and moreover, there is no choice but to a useless hole diameter for conduction between the conductor circuits.

When a plating layer is formed on the wall surface of the through hole of each inner layer to be built up, the following operation is usually performed. That is, first, electroless plating is performed over the entire surface of the target inner layer (including the wall surface of the formed through hole and inner via hole) to impart conductivity, and then electroplating is performed thereon to obtain a thin film. Form a plating layer. Next, the surface of the plating layer is covered, for example, a dry film is attached,
Exposure and development are performed to expose only the through-holes, the other parts are masked, and electroplating is performed to form a plating layer of a predetermined thickness on the wall surfaces (and lands) of the through-holes. I do. Then, the dry film is peeled off, and the thin plating layer and the electroless plating on the surface of the exposed inner layer are removed by, for example, soft etching.

Therefore, when manufacturing a multilayer circuit board by building up each inner layer, it is necessary to repeat the above operation for each inner layer, and the manufacturing process is complicated.
Therefore, a long time is required for manufacturing, and the manufacturing cost is unavoidably high. By the way, in the case of the inner via hole, after forming a plating layer on the wall surface of the via hole, for example, a conductive paste is buried in the dead space remaining in the center to form a solid conductive structure between the layers. Have been done.

In this case, it is conceivable to form the solid conductive structure by electrodepositing and filling a conductive material into all the via holes simultaneously by electroplating instead of embedding the conductive paste. In the case of the build-up method, it is necessary to separately provide a conductive path for an input terminal for electroplating from an initial stage in manufacturing, and the manufacturing process is further complicated.

When a mounting substrate such as a semiconductor element package or a circuit board having a bump pattern protruding from its mounting surface, such as a motherboard, is formed by a build-up method, the conductive circuit which has been built up is used. Of these, a bump pattern having a desired height is formed by electrodepositing a material for a bump on a predetermined portion of the uppermost conductive circuit by, for example, an electroplating method.

However, in the actual electroplating, the bump pattern is affected by subtle variations in plating conditions and by the fact that the current flows to the respective bump formation locations are different. Not all of the constituent bumps are formed at the same height, and the height of each bump varies. For example, height 0.
In the case of a bump having a target of 03 mm, the variation in the height is generally about ± 0.003 mm.

If the variation in the height of the bumps becomes large, even if the land portion of the semiconductor element package is positioned and mounted thereon and the reflow process is performed, some bumps may not be connected to the land portion. That is, it is impossible to realize a highly reliable mounting. For this reason, in a circuit board having a bump pattern formed on a mounting surface, it is required to minimize variations in the height of the formed bumps.

Meanwhile, a contact head for inspecting the presence or absence of a fault in a wiring circuit in an LSI, a liquid crystal panel, or the like is also one type of circuit board, which is conventionally formed by embedding a pin probe or an L-shaped needle with an insulating rigid material. Then, these tips are fixed to the head body at a predetermined pitch so that they can contact a predetermined inspection location in the wiring circuit to be inspected, and the other end is soldered with wiring, and a signal at the inspection location is detected therefrom. To use. On the other hand, for example, bumps are formed at predetermined circuit locations on a circuit board having a predetermined circuit pattern by electroplating,
Alternatively, there is a bump type in which a bump is formed by a film forming method used in the field of semiconductors and the bump is operated instead of the above-mentioned pin probe or L-shaped needle.

In recent years, finer circuit patterns in various circuit components to be inspected have become finer, and accordingly, the pitch between inspection locations has become finer. For such fine pitch inspections,
In the case of a pin probe type head, holes for projecting the tip of the pin probe are formed in a staggered pattern at a minute interval on the surface of the head. In the case of a head using an L-shaped needle, the L-shaped needle to be fixed has a hierarchical structure.

However, in the case of these countermeasures described above, in any case, the work of fixing each pin probe or L-shaped needle at a constant pitch, which increases remarkably in accordance with the fine pitch of the inspection location. Is required, and the work of soldering the wiring to each one of them is also necessary. Therefore, a high level of skill and a long working time are required to complete the product, and the obtained head is inevitably used. It will be extremely expensive. Furthermore, even after the pin probe or the L-shaped needle is fixed to the head, it is necessary to confirm the exact position of each tip and to carry out a reworking operation for it. Great care must also be taken to avoid hitting the item.

In the case of a head having L-shaped needles having a hierarchical structure, each L-shaped needle has a length portion arranged in parallel. As the frequency increases, the obtained signal characteristics may be adversely affected and an inspection error may be caused.
On the other hand, in the case of a bump type head, when the bumps are formed by electroplating, variations in the height of the bumps increase as described above. The large variation in the bump height is a fatal problem for a head whose top task is to ensure that all bumps are brought into contact with the inspection location of the wiring circuit.

When a bump is formed by a thin film manufacturing apparatus used in the field of semiconductors, the thin film manufacturing apparatus is very expensive, and the obtained head is also very expensive. And a drive mechanism to move the bumps upward to make contact with the inspection point of the wiring circuit at the time of inspection, and to move the bumps downward after the inspection is completed. Become. Therefore, the obtained head has a complicated mechanism and is expensive.

Further, in a mounting board, even if an attempt is made to mount semiconductor components at a high density on the mounting board, as the number of places where components are mounted increases, the conduction structure of the conventional board becomes as described above. Dead space increases inevitably due to the use of via holes. For this reason, in a mounting board of a certain standard size, a formation position and a width of a bump pattern (or a land) necessary for mounting components are limited, and an effort for high-density mounting is not limited. Will not get. If high-density mounting is intended, it is necessary to further route the signal pattern, and for this reason, the substrate must be further multilayered, which leads to longer signal pattern wiring. As a result, the reliability of the obtained mounting board in terms of electrical characteristics may be reduced.

[0025]

According to the present invention, a bump pattern is formed on at least one surface, and the bump pattern is formed as a mounting surface of a bare chip or a semiconductor element package, thereby forming a substrate or a mother board for a semiconductor element package. It is an object to provide a circuit board that can function.

Further, the present invention provides a circuit board having a very small variation in bump height. Since the diameter of the circuit board is reduced while reliably maintaining a conductive structure between conductor circuits, the present invention provides a bare chip or a semiconductor element package. Provide a circuit board that enables high-density mounting of semiconductor devices, and a circuit board that enables labor saving when mounting components because bare chips and semiconductor element packages can be mounted directly via bumps. The purpose is to do.

Further, the present invention does not carry out the machining process employed when manufacturing a multilayer circuit board by the conventional build-up method, but instead employs a method which can be called a reverse build-up method, and at least one surface is provided with a high level. Since the provision of a method of manufacturing a circuit board on which a bump pattern with small variation in the thickness is formed, and the formation of a conductive circuit and a conductive structure can be performed by an electroplating method with a high current density, It is an object of the present invention to provide a method for manufacturing a circuit board that can be manufactured with high productivity.

Further, according to the present invention, even if the inspection target has a fine pitch, it is possible to easily cope with the fine pitch. It is an object of the present invention to provide a contact head and a method of manufacturing the same .

[0029]

In order to achieve the above-mentioned object, in the present invention, at least one bump is formed on at least one surface of the insulating base material, and at least one surface and / or the inside of the insulating base material is provided. At least one layer of conductive circuit is wired between the bump and the conductive circuit or /
And the circuit board conductive structure is formed between each conductor circuit electrically connecting them, at least the bump, Ri multilayer structure der formed by sequentially electrodeposited at least two electrically conductive material, The conductive structure is electroplated
Circuit board, wherein the formed Rukoto columnar conductor formed integrally is provided by.

In particular, the conductive structure is made of a columnar conductor, and the bump is a two-layer structure in which the outer layer is made of a corrosion-resistant conductive material such as gold, nickel or a nickel alloy, and the inner layer is made of copper. A circuit board is provided. Further, in the present invention, a conductive substrate, a conductor thin layer formed on at least one surface of the conductive substrate, an electrodeposition layer formed on a surface of the conductor thin layer, and embedded in a predetermined portion of the electrodeposition layer And a bump having a multilayer structure formed by sequentially electrodepositing at least two types of conductive materials, a resist portion A formed by covering the electrodeposition layer, and a resist portion A formed by being buried in the resist portion A. A first columnar conductor or a conductor circuit or a land circuit connected to the bumps, and formed so as to be buried in the resist portion A, connected to the conductor circuit or the land circuit, and an end face of which is connected to the resist portion. Step A of manufacturing a member A comprising a second columnar conductor exposed on the surface of A; a member B (1) in which a single-layer conductor circuit is formed on the surface of the resist portion A of the member A Or multi-layer conductor circuit and it Columnar conductors connecting the conductor circuits are formed by embedding a different registration unit B, and member the last conductor circuits are formed on a surface of the resist portion B B
Step B of manufacturing (2); the member B (1) or the member B
(2) a step C of thermocompression bonding the surface on the conductor circuit side to the surface of an insulating base material to produce an integrated product C in which the conductive circuit is embedded in the insulating base material;
After the conductive substrate is peeled off from the substrate, a step D of exposing the conductive thin layer and the electrodeposited layer sequentially to expose bumps is provided.

In particular, the step A is an electroplating method.
To form a conductive thin layer by covering at least one surface of the conductive substrate.
Forming process A₁A resist layer a covering the conductor thin layer;₁
After the formation of an exposure and development process, the resist
Layer a₁Is left only at the place where the bump is to be formed.
Step A of exposing the other surface of the thin body layer_Two; Said conductor thin layer
On the exposed surface of the above, by the electroplating method
Resist layer a left in place₁Electrodeposit a conductive material flush with
A to form an electrodeposition layer_ThreeA place where the bump is to be formed
The resist layer a to be left₁To remove the electrodeposition layer
Then, a bump recess in which the surface of the conductor thin layer is exposed is formed.
Forming process A_FourThe surface of the electrodeposition layer is coated with a resist
Layer a_TwoAfter forming the exposure and development processing, the
Resist layer a_TwoA first communicating with the bump recess;
Hole and the circuit pattern of the land circuit to be formed.
A for forming a flat pattern_Five; Electroplating
The bump recess, the first hole, and the planar pattern.
A first conductive material in a layered form,
A layer different from the first conductive material on the layered body.
In addition, one kind of conductive material is further electrodeposited sequentially, and the bump recesses are formed.
The first hole and the plane pattern by two or more
Filled with a multilayer structure composed of laminated electrical
Step A of collectively forming one columnar conductor and land circuit
₆The resist layer a_TwoTo remove the surface of the electrodeposited layer.
Outgoing process A₇; Before covering the exposed surface of the electrodeposition layer
The resist layer a has a thickness at which the end face of the first columnar conductor is exposed.
_ThreeStep A of Forming₈The resist layer a_ThreeAnd the first
Cover the end surface of the columnar conductor and plate it by electroless plating.
Step A of forming a thin film₉The coating of the plating thin film
Dist layer a_FourAfter forming, exposure and development processing is performed,
The resist layer a_FourThe circuit pattern of the conductor circuit to be formed
Pattern corresponding to the pattern and the land portion circuit
Form a plane pattern of holes communicating with
Step A of exposing the surface of the plating thin film from the pattern
_TenAn electroplating is performed to form a conductive material on the planar pattern.
To the conductor circuit and the land circuit.
A for forming columnar conductors at once₁₁; The resist
Layer a_FourAnd etching the exposed plating thin film
Remove the resist layer a_ThreeA for exposing_{1 Two};Previous
The columnar conductor connected to the conductor circuit and the land circuit;
And the resist layer a_ThreeWith the resist layer a_FiveCovered with
The resist layer a_ThreeAnd the resist layer a_FiveRegis consisting of
After the exposure portion A is formed, exposure and development
Body circuit and the columnar conductor connected to the land circuit
Step A of forming a communicating second hole ₁₃; And electricity
Plating is performed to fill the second hole with a conductive material.
A to form a second columnar conductor₁₄A circuit board comprising
Is provided.

In the present invention, the above-mentioned step B
(1) a step B ₁ of coating the entire surface of the resist layer a ₅ in the member A and forming a plating thin film by electroless plating; a resist layer b ₁ was formed by coating the plating thin film Exposure and development processing to form a planar pattern corresponding to the circuit pattern of the conductor circuit to be formed, and a step B _{2 of} exposing the surface of the plating thin film from the planar pattern; step B ₃ to form a conductor circuit by electrodepositing a conductive material on the exposed surface of the plated thin film; and, the resist layer b ₁ is removed, the resist layer a ₅ of the plating film which is exposed by etching is removed
Exposing step B ₄ ;

In the present invention, the step B (2)
But the member B relative to (1), after forming a resist layer b ₂ to cover the conductive circuit and the resist layer a ₅ performs exposure and development, the resist layer b _2, to the conductor circuit step B ₅ to form a hole communicating; performing electroplating,
A step B ₆ of electrodepositing a conductive material in the hole to form a columnar conductor; a step B ₇ of covering the entire surface of the resist layer b ₂ and forming a plating thin film by an electroless plating method; After forming a resist layer b ₃ by covering the thin film, exposure and development are performed to form a plane pattern corresponding to a circuit pattern of a conductor circuit to be formed on the resist layer b ₃ , and from the plane pattern, performing electroplating, in the plane pattern, step B ₉ to form a conductor circuit by electrodepositing a conductive material; step B ₈ to expose the surface of the plating film and, removing the resist layer b _3, The exposed plating thin film is removed by etching to remove the resist layer b ₂
Step B ₁₀ to expose the; a step of performing at least once the method of manufacturing a circuit board according to claim 8 is provided.

Further, in the present invention, the step A includes the step of conducting
Cover at least one side of the circuit board, by electroplating,
Step A of forming conductor thin layer₁; Covering the conductor thin layer
Resist layer a₁Exposure and development after forming
And the resist layer a₁Only at the place where the bump is to be formed
Exposing the other surface of the conductor thin layer by leaving it behind
A _TwoAn electroplating method on the exposed surface of the conductor thin layer;
The resist layer a remaining at the place where the bump is to be formed₁When
Step A of electrodepositing a conductive material on the same surface to form an electrodeposition layer_Three;
The resist layer a left at the place where the bump is to be formed₁Excluding
Leaving the surface of the conductor thin layer exposed on the electrodeposition layer
A for forming a bump recess_FourA table of the electrodeposited layer;
Resist layer a_TwoExposure and development after forming
By performing a treatment, the resist layer a_TwoThe concave for the bump
A conductor pattern to be formed.
Plane pattern equivalent to the road circuit pattern and required
If necessary, a plane corresponding to the circuit pattern of the land circuit
Step A of forming a pattern_Fifteen; Before electroplating
A first conductive material for the bump recesses and the planar pattern;
Electrodeposited in layers, and then on the formed layered body,
At least one conductive material different from the first conductive material;
Electrodeposition sequentially, as necessary with the bump dent and the conductor circuit
If necessary, two or more conductive materials may be laminated on the land circuit.
And the bumps and conductor circuits
If necessary, the process of forming the land circuit at once
A₁₆A conductor circuit and, if necessary, a land circuit
To form a resist layer a_ThreeExposure and development after forming
The resist layer a_ThreeThe conductor circuit and
If necessary, form a first hole communicating with the land circuit.
Forming process A ₁₇And performing electroplating and
A columnar conductor is formed by electrodepositing a conductive material in the first hole.
Step A₁₈A method for manufacturing a circuit board comprising:

Further, in the present invention, at a predetermined position of the insulating substrate, at least a movable portion whose upper surface can move up and down is formed, and the upper surface of the movable portion is flush with the upper surface of the insulating substrate. A plurality of signal conductors extending to the movable portion are wired on the upper surface or / and inside of the insulating substrate, and at least the distal end thereof is located in the movable portion, and the signal conductor is disposed on the upper surface of the distal end of the signal conductor. The present invention provides a bump-type contact head characterized in that bumps of a multilayer structure formed by sequentially depositing at least two types of conductive materials are provided.

In particular, the movable portion includes a through hole formed in a thickness direction of the insulating substrate, and an elastic member disposed in the through hole, and an upper surface of the elastic member has an upper opening of the through hole. And a through hole formed as a stepped structure in the thickness direction of the insulating substrate such that the movable portion has a thin portion on the upper surface side of the insulating substrate. The planar portion of the upper opening of the through-hole has a quadrangular shape, and at the four corners of the quadrangle, slits extending in the peripheral direction of the insulating substrate are formed at least at the base of the thin portion in the step structure. A bump type contact head is provided, wherein the thin portion has a tongue shape in plan view, and the movable portion has a thin portion on the upper surface side of the insulating substrate. The insulating substrate is formed so as to have a step structure in a thickness direction thereof, and an upper opening has a quadrangular shape in a plan view, and at each of the four corners of the square, a slit extending in a peripheral direction of the insulating substrate has at least the thin portion in the step structure. The thin portion has a tongue-shaped through-hole formed in the base of the portion, and an elastic member disposed in the through-hole, and an upper surface of the elastic member has the upper surface of the through-hole. A bump-type contact head is provided, in which the signal conductor is exposed from the upper opening of the hole and extends to the upper surface of the elastic member.

Further, in the present invention, after the first resist layer is formed by covering the surface of the conductive thin plate, exposure and development are performed, and the conductive thin plate is formed at a position corresponding to the position of the bump to be formed. Exposing the surface; performing an etching process on the exposed surface of the conductive thin plate to form a bump recess on the exposed surface of the conductive thin plate; and then removing the first resist layer; Exposing and developing a second resist layer after covering the surface to expose and develop the surface of the conductive thin plate in a plane pattern corresponding to a signal conductor pattern to be formed; A first conductive material is electrodeposited in a layered manner on the bump recess and the planar pattern, and at least one type of conductive material different from the first conductive material is formed on the formed layered body. A step of electrodepositing the bumps and the plane pattern in a multilayer structure formed by laminating two or more conductive materials to form bumps and signal conductors collectively; the second resist; Removing the layer, and then thermocompression bonding the exposed surface to a surface of the insulating substrate on which the through-hole having an opening of a predetermined shape is formed on the opening side;
And filling a cavity formed by the through hole and the conductive thin plate with an elastic member, and then removing the conductive thin plate by etching to expose the bumps and the upper surfaces of the signal conductors. A method for manufacturing a bump type contact head is provided.

Also, in the present invention, a step of forming at least one surface of the conductive substrate to form a thin conductor layer by electroplating; and forming the first resist layer by coating the thin conductor layer. Exposing and developing the first resist layer to leave only the portion where the bump is to be formed, thereby exposing the other surface of the thin conductor layer; Forming an electrodeposition layer by electrodepositing a conductive material flush with the first resist layer to be left at the place where the bump is to be formed; forming the first resist layer to be left at the place where the bump is to be formed Removing and forming, in the electrodeposition layer, a bump recess in which the surface of the conductor thin layer is exposed; forming a second resist layer by covering the surface of the electrodeposition layer; After performing a development process, the second resist Exposing the surface of the electrodeposition layer with a plane pattern corresponding to the pattern of the signal conductor to be formed; performing electroplating to apply a first conductive material to the bump recesses and the plane pattern in a layered manner. Then, at least one kind of conductive material different from the first conductive material is further electrodeposited on the formed layered body, and the bump recess and the plane pattern are formed by two or more conductive materials. A step of forming bumps and signal conductors in a lump by filling with a multilayer structure formed by laminating materials; after removing the second resist layer, a through hole having an opening of a predetermined shape is formed on the exposed surface thereof; Thermocompression bonding to the surface of the opening side of the formed insulating substrate; after filling the cavity formed by the through hole and the electrodeposition layer with an elastic member, peeling the conductive substrate;
And a step of sequentially exposing and removing the thin conductive layer and the electrodeposited layer to expose the bumps and the signal conductor.

[0039]

[0040]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a circuit board according to the present invention; FIG. 2 is a sectional view taken along the line II-II of FIG. 1 and FIG.
Shows a circuit board M ₁ of the present invention, also, I of FIG. 3 and FIG. 3
Figure 4 is a sectional view taken along the V-IV line shows another circuit board M ₂ of the present invention.

[0041] Then, FIG. 5 is a perspective view showing still another circuit board (multi-chip bump board) M ₃ of the present invention, FIG. 6 is another circuit board (multi-chip bump board) M ₄ of the present invention FIG. These circuit boards M ₁ , M ₂ , M ₃ , and M ₄ are commonly used as insulating base material 1.
A predetermined planar pattern is formed on the surface 1a of the
Is protruding. Then, the circuit boards M ₁ , M ₂ , M
₃ , the land circuit 4 is exposed on the surface 1 a of the insulating base material 1. However, the circuit board M ₄ the land portion circuit is not exposed, is formed in the insulating substrate 1.

When the circuit boards M ₁ and M ₂ are compared, a conductor circuit to be described later is not exposed on the surface 1 a of the insulating base material 1 in the case of the circuit board M ₁ , but in the case of the circuit board M ₂ It has a structure in which a conductor circuit 2a is exposed on the surface 1a of the insulating base material 1. Of these circuit boards, the basic structure can be represented by circuit boards M ₁ and M ₂ . A circuit board (multi-chip bump board) M ₃ is only the number of bump patterns are different as compared with the circuit board M _1, the circuit board M ₁
Can be positioned as a modification of, and the circuit board (multi-chip bump board) M ₄ is the manufacturing method described below, can be obtained by internally provided in a predetermined pattern lands circuit 4 in the insulating substrate 1 .

For this reason, the circuit boards M ₁ and M ₂ will be described in detail _first . First, in the case of the circuit boards M ₁ and M ₂ , in each case, a plurality of (two layers in the figure) conductive circuits 2 a and 2 b are disposed inside the insulating base 1 in the thickness direction of the insulating base 1. It is buried at predetermined intervals. Then, in the case of the circuit board M _1, an insulating substrate 1
The bumps 3 protrude from the front surface 1a and the land circuits 4 are exposed, and the uppermost conductive circuit 2a located on the front side
Is not exposed on the surface 1a, and the bump 3 and the conductor circuit 2
a, land circuit 4 and conductor circuit 2b, each conductor circuit 2a,
Both of the electrodes 2b are electrically connected by columnar conductors 5 ₁ and 5 described later.

In this case, the bump 3 and the uppermost conductive circuit 2
first columnar conductor 5 ₁ for forming a conductive structure of a, in relation to the manufacturing method described later, the size of the cross section is larger than the size of the cross section of the bumps 3. However, each of the other columnar conductors has a small diameter. In the case of the circuit board M _2, the uppermost conductor circuit 2a and the land portion circuit 4
Are exposed on the surface 1a of the insulating base material 1, and the bumps 3 are integrally formed at the tip of the conductor circuit 2a.

The circuit board M ₂ having this structure can be used as a bump type contact head of the present invention described later by forming only one layer of the uppermost conductive circuit 2 a without forming a plurality of conductive circuits. Can be. In each of these circuit boards M ₁ and M ₂ , a predetermined semiconductor component S is mounted at a location of a bump pattern as shown by a virtual line in the figure. In this case, if the semiconductor component S is a bare chip, these circuit boards M ₁ and M ₂ can be used as a mounting board when assembling a semiconductor element package, and the semiconductor element S already assembled In the case of a package, these circuit boards M ₁ and M ₂ can be used as a motherboard.

In the case of the circuit board M ₁ , as shown in FIG. 7, the bump 3 has a multilayer structure (a multilayer structure (Layer 3a, 3b) formed by sequentially depositing different kinds of conductive materials. The land circuit 4 is also a layered body 4 formed by sequentially electrodepositing another kind of conductive material.
The multi-layer structure (a two-layer structure in the figure) is formed by laminating a and 4b. The conductive material of the layered body 3a forming the outer layer portion of the bump 3 and the conductive material of the layered body 4a forming the outer layer portion of the land circuit 4 are both made of the same material. The conductive material of the layered body 3b forming the portion and the conductive material of the layered body 4b forming the inner layer portion in the land circuit 4 are the same.

In this case, since the outer layer portions 3a and 4a function as a barrier layer for an etchant used in a manufacturing method described later, the conductive material constituting the outer layer portions 3a and 4a is a material having corrosion resistance to the etchant. I have. For example, when a material that removes copper by etching is used as the etchant, a preferable example of the conductive material forming the outer layer portions 3a and 4a is nickel alloy such as gold, nickel, and nickel-cobalt.
Also, the inner layer portions 3b and 4b are preferably formed of copper having excellent conductivity.

[0048] In the case of the first columnar conductor 5 _1, since a large cross-section than the bump 3, the outer layer portion 3a near the boundary of the step structure formed between the bump 3 is described above
Is formed, but all other portions are formed of the same conductive material as the inner layer portion 3b. On the other hand, in the case of the circuit board M _2, as shown in FIG. 8, the bumps 3 and conductor circuit 2a which is exposed to the surface 1a of the insulating substrate 1 are both as in the case of the circuit board M ₁ Has a multilayer structure of an outer layer portion 3a (4a) and an inner layer portion 3b (4b). At the same time, the land portion circuit 4 exposed on the surface 1a also has the upper surface described above as the outer layer portion 3a.
It is a layer of the same conductive material as that of (4a), and the portion located thereunder is made of the same material as the above-mentioned inner layer portion 3b (4b).

In the above description of the multilayer structure,
Although the case where the multilayer structure was a two-layer structure was performed,
This multilayer structure is not limited to a two-layer structure,
For example, two or more layered bodies formed by electrodepositing two or more types of conductive materials having different outer layer portions may be used. But,
Even in such a case, as described above, the layer constituting the uppermost layer needs to be a conductive material having corrosion resistance to an etchant used in a process described later.

In these circuit boards M ₁ and M ₂ , the columnar conductors 5 ₁ and 5 were filled with a conductive material by electroplating a hole in a hole formed by a method to be described later. Things. Therefore, for example, when the hole has the same diameter as a conventional through-hole or inner via hole, compared to a conventional conductive structure formed by forming a plating layer on the wall surface of the through-hole or inner via hole, as compared with a conventional structure. The current capacity becomes extremely large. Conversely, even if an attempt is made to secure a current capacity necessary for operating the circuit board, the diameter of the columnar conductor 5 can be reduced as compared with the conventional structures of through holes and inner via holes.

This is because the dead space can be minimized as compared with a conventional conductive structure such as a through hole or an inner via hole, and the distribution of the bumps 3 formed on the surface of the circuit board can be reduced. It is possible to increase the density, and thus to enable high-density mounting of semiconductor components. Further, in the case of the circuit boards M ₁ and M ₂ , conduction between the conductor circuits is established by the columnar conductors 5 described above. There is no need for machining such as forming holes by drill grinding. Therefore, the planar pattern of the conductor circuit can be made finer, which also enables high-density mounting of semiconductor components.

The most significant feature of the circuit board manufacturing method of the present invention is that a bump is first formed, and a plurality of layers of conductive circuits are sequentially formed under the bump via the above-described columnar conductor. It is in. In that case, the circuit board of the present invention is manufactured by proceeding the above-described steps A, B, C, and D in this order. In step A, the bump, the first columnar conductor, and the uppermost layer A member A described later in which a conductor circuit or / and a land portion circuit are embedded in a resist portion is manufactured, and a member B described later in which a further conductor circuit and a columnar conductor are added to the member A in step B
(1) or B (2) is manufactured, and in Step C, an integrated product C in which the member B (1) or B (2) is integrated with an insulating substrate is manufactured. The circuit board is manufactured.

In this case, the circuit board M ₁ can be manufactured by configuring the step A as the above-described steps A ₁ to A _14.
1 Step A ₁₅ step A ₅ and later in-process A _14-step A ₁₈
It is possible to manufacture a circuit board M ₂ by substituting the. First, the manufacturing method of the circuit board M _1.

First, the member A is manufactured as follows. Hereinafter, each step will be described sequentially. Step A ₁ : As shown in FIG. 9, a conductive thin layer 7 having a thickness of about 2 to 3 μm is formed by plating copper on one surface 6 a of a conductive substrate 6 such as a stainless steel plate by a normal electroplating method. To form Note that the conductive substrate may be a copper plate.

Step A ₂ : Next, the surface 7a of the conductor thin layer 7
The coated to form a resist layer a ₁ (FIG. 10). The resist layer for the formation of a ₁ is, for example, to use the known dry film, also formed by printing a liquid resist. Then, the resist layer a ₁ in thickness is set to a thickness such that substantially the same as the height to be formed bumps.

[0056] Then, by performing exposure and development process in the resist layer a _1, the resist layer of the bump to be formed location leaves, and removing the resist layer a ₁ otherwise, 11
As indicated, to expose the surface 7a of the conductor thin layer 7 at a location where the resist layer is removed a _1. Step A ₃ : Then, electroplating is performed in a state where the conductive substrate 6 is set to the negative pole, and the exposed surface 7 a of the conductive thin layer 7 is
Leaving to electrodeposited a predetermined conductive material so that the resist layer a ₁ and flush to form a electrodeposit layer 8 are (Fig. 12).

The conductive material used at this time is not particularly limited, and examples thereof include copper, silver, aluminum, and gold. Usually, copper is preferred. Step A _4: Then, the resist layer is removed a ₁ that are left on the bump formation planned location. As a result, as shown in FIG. 13, bump recesses 3A in which the surface 7a of the conductor thin layer 7 is exposed are formed in the electrodeposition layer 8 in a predetermined plane pattern.

Step A ₅ : Next, the surface 8 a of the electrodeposition layer 8
In the resist layer a ₂ is formed with a thickness which is substantially the same as the height of the first columnar conductor to be formed, is subjected to exposure and development processes on it, as shown in FIG. 14, communicating with the bump recess 3A a first hole 5A ₁ to simultaneously form a planar pattern 4A corresponding to the circuit pattern of the land portion circuits to be formed on the resist layer a _2.

The first hole 5A formed at this time is
The cross-sectional shape of ₁ is larger than the cross-sectional shape of the bump recess 3A. Therefore, the first hole 5A ₁ and bump recess 3A has become one of the cavity as a whole. The bottom surface of the conductor thin layer 7 is provided at the bottom of the bump recess 3A.
a and the side walls 8b of the electrodeposition layer 8 are exposed.
From A, the surface 8a of the electrodeposition layer 8 is exposed. Further, since the cross-sectional shape of the first hole 5A ₁ is it greater than the bump recess 3A communicates, dents bumps 3A and the first hole 5
Cavity consisting of A ₁ Metropolitan has no stepped structure, in the boundary portion, so that the part of the surface 8c of the electrodeposit layer 8 is exposed to the first hole 5A _1. In this regard the formation of the resist layer a ₂ in Step A _5, it may be used a liquid resist, usually, the dry film is used.

[0060] Incidentally, in this step A _5, in the case of forming a resist layer a ₂ in permanent resist, performing the step A ₇ and step A ₈ to be described later is not always necessary. Step A ₆ : Next, the whole is immersed in a predetermined plating bath, and electroplating is performed in a state where the conductive substrate 6 has a negative polarity.

The electroplating at that time is performed at least twice by changing the plating bath. That is, when the electrodeposition layer 8 is made of copper, in the first electroplating, a step D to be described later is performed like gold, nickel, and a nickel-cobalt alloy.
The electrodeposition of the first conductive material having corrosion resistance so as not to be eroded by the used etchant is performed during the etching process performed in the step (1). In this first electroplating, the bump for indentation 3A and the in cavity consisting of the first hole 5A ₁ Tokyo,
The first conductive material is electrodeposited in a layered manner on the exposed surface 7a of the conductor thin layer 7, the side wall 8b of the electrodeposition layer 8, and the partial surface 8c of the electrodeposition layer 8 at the step. Also, the plane pattern 4
Similar electrodeposition proceeds in A.

Then, subsequent to the above-described first electroplating, further electroplating is performed, and another conductive material is electrodeposited on the layered body formed of the first conductive material. . The conductive material to be electrodeposited at this time may be any material as long as it has excellent conductivity, for example, copper,
Aluminum is a preferred material.

In this electroplating process, the bump recess 3
A a cavity comprising a first hole 5A ₁ Tokyo, and, in the plane pattern 4A, first of all, the first conductive material is deposited in layers resistant to corrosion by the etchant used in the step D, further thereon Additional conductive materials are deposited, resulting in the cavity and planar pattern being filled with these conductive materials.

[0064] Thus, in the at the end of step A _6, as shown in FIG. 15, some of the bump recess 3A layered body (outer layer) 3a and the layered body (the inner portion) 3b is laminated The bump 3 is formed in a state in which the two-layer structure is filled, and the plane pattern 4A also includes a layer body (outer layer portion) 4a made of the same material as the layer body 3a and the layer body 3b.
A two-layer structure formed by laminating layered bodies (inner layers) 4b made of the same material as the above is formed as the land part circuit 4. Then, in the first hole 5A ₁ is stepped portion near the layered body 3a
Consists, the lower the first columnar conductor 5 ₁ a two-layer structure made of the same material as all layered body 3b is formed together.

In this electroplating process, the first hole 5A
₁ has a larger cross-sectional shape than the bump recess 3A, so that when the respective conductive materials are electrodeposited, deposition on the bump recess and then deposition on the first hole proceeds smoothly. In the course of this electroplating, when applying ultrasonic vibration to the plating bath, also the first holes 5A ₁ and bump dent 3A is a small shape, is possible to reliably penetrate the plating bath therein can also because gas generated in the process of electroplating promptly removed from the first hole 5A ₁ and bump dent 3A, it is possible to perform highly reliable plating.

The conductive paths during the electroplating are the conductive substrate 6 having a large area, the conductive thin layer 7 and the electrodeposited layer 8. Therefore, a large current can flow and the current density at the time of electroplating can be increased. As a result, the bump recess 3A and the first hole 5A ₁ and the plane patterns 4A is filled with a conductive material in a short time. This step A ₆
In the above, the electroplating is not limited to being performed twice, but may be performed twice or more as necessary. However, even in that case, in the first electroplating, it is necessary to electrodeposit the corrosion-resistant first conductive material as described above in a layered manner.

Step A ₇ : Depression 3A for bump and first hole 5
A ₁ and when the plane pattern 4A is filled with the multilayer structure of conductive material, i.e. the entire plated surface resist layer a ₂
And stop electroplating as they become flush with, and then removing the resist layer a _2. As a result, as shown in FIG. 16, the surface 8a of the electrodeposition layer 8 is exposed, and a bump 3 made of a multilayered structure of a conductive material filled in the bump recess and a bump from the bump are formed at predetermined locations. set to a first columnar conductor 5 ₁ state is integrally formed, at the same time the land portion circuit 4 consisting of a multilayer structure of conductive material is formed.

[0068] Step A _8: Next, as shown in FIG. 17, to cover the exposed surface 8a of the electrodeposit layer 8, the surface of the first columnar conductor 5 ₁ of the cross section and the land portion circuit 4 is exposed forming a resist layer a ₃ with a thickness such. Specifically, for example, a liquid resist is applied, and exposure and development are performed to form an insulating layer.

[0069] Step A _9: After the surface roughening of the resist layer a _3, there, for example, by performing electroless plating of copper, as shown in FIG. 18, the resist layer a ₃ and the first columnar conductors 5 ₁ and covers the surface of the land portion circuit 4 to form a plating film 9. Step A ₁₀ : Next, the surface of the plating thin film 9 is coated to form a resist layer a ₄ having a thickness substantially equal to the thickness of the conductor circuit to be formed. A plane pattern 2A corresponding to the circuit pattern of the conductor circuit and a plane pattern 5A ₁ ′ corresponding to a columnar conductor to be electrically connected to the land circuit 4 are simultaneously formed.

As a result, as shown in FIG. 19, the planar patterns 2A and 5A ₁ ′ of the conductor circuits and the columnar conductors are formed on the surface of the plating thin film 9 in a predetermined planar pattern. Means that the surface 9a of the plating thin film 9 is exposed. Regarding the formation of the resist layer a ₄ in this step may be carried out using any of dry film and liquid resist.

Step A ₁₁ : Then, electroplating is performed in a state where the conductive substrate 6 is set to the negative pole, and the plane pattern 2A,
On the surface 9a of the plating thin film 9 exposed from the plane pattern 5A ₁ ′, a conductive material having excellent conductivity such as copper is applied, for example.
As shown in FIG. 20, wear to electrodeposition as a conductor circuit 2a so as to be flush with the surface of the resist layer a _4.

Step A ₁₂ : Then, after the resist layer a ₄ is removed to expose the surface 9 a of the plating thin film 9, only the exposed surface is removed by, for example, soft etching. As a result, as shown in FIG. 21, exposed surface of the resist layer a _3, there, columnar conductors 5 ₁ connected to the conductor circuit 2a and the land portion circuit 4 'is formed.

Step A ₁₃ : Then, as shown in FIG. 22, the exposed surface of the resist layer a ₃ and the entirety of the conductor circuit 2 a and the columnar conductor 5 ₁ ′ are covered to form a resist layer a ₅ . The time of formation of the resist layer a _5, the dry film may be either a liquid resist, and preferably to the use of a liquid resist.

Therefore, the already formed resist layer a ₃ and the resist layer a ₅ are integrated to form a resist portion A which is one insulating layer, in which the conductor circuit 2 is formed.
a and the columnar conductor 5 ₁ ′ are buried. in this case,
The thickness of the resist layer a ₅ at the location of the conductor circuit 2a and the columnar conductors 5 ₁ 'is set second columnar conductor to be formed to a thickness such that the height substantially the same (see below).

[0075] After that, by performing the exposure and development to the resist layer a _5, as shown in FIG. 23, the conductor circuit 2a and the resist layer a ₅ second hole 5A ₂ communicating with the columnar conductors 5 ₁ ' Formed. Therefore, the end surface of the conductor circuit 2a of the surface and the columnar conductor 5 ₁ 'is exposed from these second holes 5A _2. Step A _14: Finally, the conductive substrate 6 by performing electroplating while the negative electrode, conductive material on the surfaces of the second holes 5A ₂ conductor circuit exposed from 2a and the columnar conductor 5 ₁ ' the electrodeposited, second to form a columnar conductor 5 ₂ is filled into the second hole 5A _2, and ends the process a. In this case, second columnar conductor 5 ₂ which conduct the land portion circuit 4 is formed in a state that together with columnar conductors 5 ₁ 'that has already been formed.

At the time when the above step A is completed, FIG.
As shown in, the bump 3 is located in the electrodeposit layer 8, the first columnar conductor 5 ₁ and the land portion circuit 4 and the conductor circuit 2a and the second columnar conductor 5 ₂ resist layer a _3, a registration unit consisting ₅ is embedded in the a, on the surface of the resist layer a _5, member a to the end surface of the second columnar conductor 5 ₂ is exposed to form a predetermined pattern is produced.

Therefore, in this member A, the bump 3-the first columnar conductor 5 ₁ -the plating thin film 9-the conductor circuit 2
and between a- second columnar conductor 5 _2, respectively conducting structure land portion circuit 4 plating film 9 second columnar conductor 5 ₂ is formed. Next, by performing the following step B on the obtained member A, another conductor circuit is added to the member A.

In this case, the step B is the same as the step B (1)
Or be configured with any of the steps B (2), in the case of adopting the step B (1) comprising the step B ₁ ~ Step B ₄ to be described later, two conductors, as shown in FIGS. 1 and 2 can be produced an intermediate member B (1) of the circuit board M ₁ the circuit is embedded, the step comprising the step B ₅ ~ step B ₁₀ B (2)
The when employed, can be produced an intermediate member B (2) of the circuit board M ₁ three or more conductor circuit is embedded.

First, the step B (1) will be described. Step B ₁ : First, as shown in FIG.
In performing electroless plating on the surface of the resist layer a ₅ of the manufactured member A, to form a plating film 10 that covers the entire surface.

Step B ₂ : Next, a resist layer b ₁ is formed by covering the surface 10 a of the plating thin film 10, and is subjected to exposure and development treatments to form a plane corresponding to a circuit pattern of a conductor circuit to be formed. The pattern 2B is formed. As a result, as shown in FIG.
a, a conductor circuit pattern 2B is formed in a predetermined plane pattern, and the surface 10a of the plating thin film 10 is formed therefrom.
Is exposed. Regarding the formation of the resist layer b ₁ at this time, it may be used either dry film, liquid resist.

Step B ₃ : Next, electroplating is performed by using the conductive substrate 6 as a negative electrode, and a conductive material having excellent conductivity such as copper is coated on the exposed surface 10 a of the plating thin film 10 with the resist layer b. wear to electricity at a thickness such that ₁ flush. As a result, as shown in FIG. 27, the conductor circuit 2b is formed on the plane pattern 2B.

Step B ₄ : Then, the resist layer b ₁ is removed. As a result, as shown in FIG. 28, the resist layer b ₁
Was present on the surface 10a of the plating thin film 10.
Is exposed. Then, the exposed plating thin film 10
Is removed by, for example, soft etching.

[0083] As a result, as shown in FIG. 29, member B of the conductor circuit 2b to form a predetermined plane pattern on the surface of the resist layer a ₅ is formed (1) is produced. This member B (1), the bump 3 a first columnar conductor 5 ₁ - plating film 9 conductor circuits 2a- second columnar conductor 5 ₂ - and between the plating film 10 the conductor circuit 2b, the land portion circuit 4 - plating film 9 second columnar conductor 5 ₂ - each conducting structure between the plating film 10 the conductor circuit 2b is formed.

[0084] When to this member B (1), if then performed step C, the circuit board M ₁ obtained is made to those two conductor circuits embedded therein, which further embedded a number of conductor circuits Then, the member B (1) may be subjected to the step B (2) described below. Step B _5: First, as shown in FIG. 30, to cover the whole of the conductor circuit 2b and the resist layer a ₅ of the member B (1) to form a resist layer b _2. In addition, this resist layer b ₂
Although it can be formed using either a dry film or a liquid resist, it is preferable to use a liquid resist.

Therefore, the resist layers a ₃ ,
wherein the a ₅ the resist layer b ₂ form one of the insulating layers here integrally, in this, a state in which the conductor circuit 2a, and a land portion circuit 4 and the conductor circuit 2b are embedded. And in this case, the resist layer b ₂ in thickness at the location that buried conductor circuit 2b is then formed to be columnar conductor (to be described later)
The thickness is set so as to be substantially the same as the height.

[0086] Then, by performing the exposure and development on the resist layer b _2, as shown in FIG. 31, to form holes 5B ₁ communicating with the conductor circuit 2b on the resist layer b _2. Therefore,
This hole 5B ₁ is the surface of the conductor circuit 2b is exposed. Step B ₆ : Then, electroplating is performed using the conductive substrate 6 as a negative pole, and the conductor circuit 2 b exposed from the hole 5 B ₁
And electrodepositing a conductive material on the surface, to fill the conductive material into the said holes 5B _1. As a result, as shown in FIG. 32, it is formed in a state where the columnar conductors 5 ₃ integrated with the conductor circuit 2b is exposed to the surface on the resist layer b _2.

Step B ₇ : Then, the entire surface of the resist layer b ₂ is covered, and a plating thin film 11 is formed by an electroless plating method (FIG. 33). Step B ₈ : Next, a resist layer b ₃ is formed by covering the surface 11 a of the plating thin film 11, and is subjected to exposure and development processing to form a circuit pattern of a conductor circuit to be formed below the conductor circuit 2 b. A corresponding planar pattern 2C is formed. As a result, as shown in FIG. 34, the surface 11a of the plating thin film 11 is exposed from the formed planar pattern 2C. Regarding the formation of the resist layer b _3, the dry film may be used either liquid resist.

Step B ₉ : Then, electroplating is performed by setting the conductive substrate 6 to the negative pole, and a conductive material such as copper is applied to the exposed surface 11 a of the plating thin film 11 by the thickness of the remaining resist layer b _3. To wear. As a result, as shown in FIG. 35, a conductor circuit 2c is formed on the surface 11a of the plating thin film 11 in a predetermined planar pattern.

Step B ₁₀ : Next, the resist layer b ₃ is removed. As a result, as shown in FIG. 36, the surface 11a of the plating film 11 is exposed in a location of the resist layer b ₃ is removed. Next, the exposed plating thin film is removed by, for example, soft etching. As a result, as shown in FIG. 37, member B of conductive circuit 2c at a predetermined plane pattern on the surface of the resist layer b ₂ is formed (2) is produced.

In the member B (2), the resist layers a ₃ and a ₅
Two conductor circuit 2a in, 2b are embedded, the conductor circuit 2c is formed on the surface of the resist layer b _2. In that case, a new conductor circuit 2b and the new columnar conductor ₃ that is added to the member A is embedded in the resist portion B composed of a resist layer b _2. Then, the bump 3-the first columnar conductor 5
₁ - Plating film 9 conductor circuits 2a- second columnar conductor 5 ₂ -
Plating film 10 the conductor circuit 2b- columnar conductor 5 ₃ - and between the plating film 11 the conductor circuit 2c, the land portion circuit 4 plating film 9 second columnar conductor 5 ₂ - plated thin film 10 the conductor circuit 2b- columnar conductor 5 ₃ - plating film 11 conductive circuit 2
Each of the conductive structures is formed between c.

When a conductor circuit is further added to the conductor circuit 2c, the method described with reference to FIGS. 30 to 37 may be repeated a desired number of times. As described above, when the step B is completed, in both the step B (1) and the step B (2), the intermediate member having the predetermined conductor circuit formed on the surface of the last formed resist layer is manufactured. Is done.

Then, the step C is applied to the intermediate member. This will be described using the case of the member B (1) shown in FIG. 29 as an example. That is, as shown in FIG. 38, an insulating substrate 12 is prepared, and one surface 12a thereof is
The surface of the member B (1) on which the conductor circuit 2b is formed is thermocompression-bonded. As a result, the conductor circuit 2b is embedded in the insulating substrate 12, and as shown in FIG. 39, an integrated product C in which the member B (1) and the insulating substrate 12 are integrated is manufactured.

It is preferable that the insulating substrate 12 used at this time is a material that is in a semi-cured state at normal temperature and softens when heated. An example is Brigreg. The reason is because when the pattern of the conductor circuit 2b is formed in a state of protruding on the surface of the resist layer a _5, that here the insulating substrate 12 is crimped, the conductor circuit 2
This is because the pattern b can be buried in the upper surface 12a of the insulating substrate 12 having plasticity at that time, and the substrate is thermally cured and fixed thereafter.

However, even when the insulating substrate 12 is made of a rigid material, for example, an uncured epoxy resin is formed on the surface of the member B (1) on which the pattern of the conductor circuit 2b is formed. Forming a layer to form a conductor circuit 2b
And the member B (1) and the insulating substrate 12 can be integrated with each other by thermocompression bonding of the rigid insulating substrate 12.

In this case, at the time when both are pressed, the layer made of, for example, epoxy resin is in an uncured and soft state, so that the pattern of the conductor circuit 2b can be buried here, and at the same time, the layer is insulated. It is bonded to the upper surface 12a of the substrate 12. Then, when the layer is thermoset, the pattern of the conductor circuit 2b is integrated with the insulating substrate 12 while being buried in the thermoset layer.

The insulating substrate used in this step C may be any substrate as long as it is electrically insulating. For example, a glass epoxy resin substrate, a flexible printed substrate,
Examples include resin substrates and sheets made of epoxy resin, polyimide, polyester, urethane resin, and phenol resin, and ceramic plates. Among them, as described above, a prepreg made of a soft glass epoxy resin is preferable because the pattern of the conductor circuit 2b is buried at the time of thermocompression bonding. Further, the above-described insulating substrate may be formed to have an appropriate thickness by laminating a plurality of prepregs, for example.

Next, step D is applied to the integrated product C thus manufactured. That is, in step D, first, the conductive substrate 6 is peeled off. The surface of the obtained member is covered with the conductor thin layer 7 as shown in FIG. Next, the conductor thin layer 7 and the electrodeposition layer 8 located thereunder are sequentially etched and removed. As a result, FIG.
As shown in 1, the conductor circuit 2a, 2b are both are embedded in the resist layer a ₃ and the resist layer a ₅ and made of an insulating substrate 12. insulating substrate 1, the surface of the resist layer a ₃ only the bump 3 is projected, and the circuit board M ₁ of the land portion circuit 4 is exposed is produced.

When the conductor thin layer 7 and the electrodeposition layer 8 are removed by etching, the surface of the bump 3 and the surface of the land circuit 4 come into contact with the etchant. However, the outer layer 3 of the bump 3
a and the outer layer portion 4a of the land portion circuit 4, as described above,
All of the above-mentioned first materials having corrosion resistance to etchants
Since the bumps and land circuits are formed by this conductive material, there is no problem that the etchant erodes the bumps and land circuits.

Since all the bumps 3 are multi-layered structures filled in the bump recesses having the same depth formed in the electrodeposited layer 8 having a predetermined thickness, the height of the bumps 3 is not larger than that of the bumps. It is equivalent to the depth of the recess, and the variation in height is extremely small. Next, a method for manufacturing the circuit board M _2. In this manufacturing method, except that changing the process described below the aforementioned step A, other steps, namely, step B, step C, step D proceeds as in the case of the circuit board M _1.

Accordingly, the circuit board M_TwoIn process A for manufacturing
A description will be given with reference to the drawings. First, the circuit board M₁Made of
Step A in the same way as during fabrication₁~ Step A_FourIs advanced, and FIG.
As shown in the figure, the bump formation on the surface 7a of the conductor thin layer 7
Resist layer a in place ₁On the other surface after leaving
An electrodeposition layer is formed by electroplating, and then the resist
Layer a₁Is removed, as shown in FIG.
A bump recess 3A is formed in the electrodeposition layer 8 and a conductor thin film is formed therefrom.
The surface 7a of the layer 7 is exposed.

[0102] In this step, the resist layer a ₁ is liquid resist may be formed using any of dry film. Thereafter, by sequentially advancing the following steps A ₁₅ ~ Step A _18, member A is manufactured. Step A ₁₅ : A resist layer a ₂ is formed by covering the surface 8 a of the electrodeposition layer 8, and the resist layer a ₂ is exposed and developed, and
As shown at 4, a planar pattern 2A corresponding to the circuit pattern of the conductor circuit to be formed is formed in a state of communicating with the bump recess 3A, and at the same time, a planar pattern corresponding to the circuit pattern of the land circuit to be formed. 4A is formed.
Therefore, the surface 8a of the electrodeposition layer 8 is exposed from the plane pattern 2A and the plane pattern 4A, and the bump recess 3 is formed.
From A, the surface 7a of the conductor thin layer 7 and the side wall 8b of the electrodeposition layer 8 are exposed.

[0102] Incidentally, in this step, usually a dry film is used in the formation of the resist layer a _2. Step A ₁₆ : Then, in the same manner as in step A ₆ during the manufacture of the circuit board M ₁ , the whole is immersed in a plating bath, and electroplating is performed at least twice with the conductive substrate 6 being a negative electrode, and different types are obtained. A multilayer structure of conductive material is formed.

At the time when this electroplating is completed, FIG.
As shown in FIG. 5, the planar pattern 4A of the land circuit is filled with a two-layer structure of a layered body 4a of a first conductive material having corrosion resistance and a layered body 4b of another conductive material.
Is formed. Then, in the bump recess 3A and the plane pattern 2A of the conductor circuit, the first electroplating is performed by the first electroplating. A layered body (outer layer portion) 3a is formed by electrodeposition on the layered body 7a, and another conductive material is electrodeposited on the layered body 3a by the next electroplating to form a layered body (inner layer portion) 3b. Here, the bump 3 and the conductor circuit 2a, which are a two-layer structure of these layered bodies, are collectively formed.

[0104] Step A _17: Then, as shown in FIG. 46, the resist layer a ₃ is formed by coating the conductor circuit 2a and the land portion circuit 4, is subjected to exposure and development processes herein, each conductor the first hole 5A ₁ which communicates with the circuit 2a (or land portion circuit 4) is formed in the resist layer a _3. Thus, the surface of the conductor circuit 2a (or land portion circuit 4) is exposed from the first hole 5A _1. The thickness of the resist layer a ₃ at this time is set to be substantially equal to the height of the columnar conductor to be formed the same, also in the formation of the resist layer a _3, dry film, using any of the liquid resist Good.

[0105] Step A _18: Finally, perform electroplating with the conductive substrate 6 to the negative pole, the conductive material collector to the surface of the conductor circuit 2a exposed from the first hole 5A ₁ (or land portion circuit 4) wear and form a columnar conductor is filled into the first hole 5A _1. As a result, as shown in FIG. 47, the surface of the resist layer a ₃ is the member A to the end surface of the first columnar conductor 5 ₁ is exposed to form a predetermined pattern is produced. In this member A, the bump 3-conductor circuit 2a
- conducting structure is formed between the first columnar conductor 5 _1.

Thereafter, the above-described steps B, C, and D are sequentially performed on the member A, so that the conductor circuit 2a and the land circuit 4, which are expressed in a predetermined plane pattern on the surface of the insulating base material, Then, a circuit board M ₂ (FIG. 3) having the bumps 3 protruding from the tip surface of the conductor circuit 2a is manufactured. In the case of manufacturing the circuit board M ₄ shown in FIG. 6, that is, a circuit board in which the land circuit is not exposed on the surface 1 a of the insulating base material 1, in manufacturing the circuit board M ₁ ,
When carrying out the step A ₅ (FIG. 14), the plane pattern 4A corresponding to the circuit pattern of the land circuit is not formed, but the plane pattern 4A is formed in a subsequent step, for example, the step B. Then, a conductive material may be electrodeposited to form a land circuit, and the land circuit may be provided in the resist so as to be connected to the exposed bump pattern.

The above description is directed to the case where a circuit board for single-sided mounting is manufactured. If necessary, a circuit board for double-sided mounting can be manufactured as follows. That is, the member B obtained at the time of manufacturing the circuit board M ₁
The case where (1) and the member B (2) are used will be described below as an example. That is, as shown in FIG. 48, the surfaces of the member B (1) and the member B (2) on the side of the conductor circuit are first thermocompression-bonded to one side of the insulating substrate 12, and the members B (1) and B (2) and the insulating substrate 12 are integrated. Next, the conductive substrates on both sides of the integrated body are peeled off, and the thin conductor layer and the electrodeposition layer are sequentially removed by etching. Then, through holes (not shown) are formed to form a circuit for double-sided mounting as shown in FIG. board M ₅ is obtained.

Further, after applying a conventional subtractive method or additive method to the member shown in FIG. 39 to build up another conductor circuit, the conductive substrate 6 is peeled off, The target circuit board for double-sided mounting can also be obtained by sequentially removing the thin layer 7 and the electrodeposition layer 8 by etching. Further, without using the insulating substrate 12 as shown in FIG. 48, for example, a predetermined conductor circuit and a columnar conductor are sequentially laminated using permanent resist on the surface of the member B (1) on the side of the conductor circuit 2b. Finally, a predetermined conductor circuit or land circuit may be formed to form a double-sided circuit board.

Further, it can be manufactured as follows. That is, first, as shown in FIG. 50, for example, the adhesive layer 1 is formed on one surface of the member B (2) on the conductor circuit 2c side.
The film 13 on which 3a is formed is attached. Next, the film 13 and the adhesive layer 13a are subjected to, for example, laser processing, machining, or the like to form hole patterns for columnar conductors in the film, and electroplating is performed thereon to form columnar conductors. After electroless plating, after forming a predetermined circuit pattern on the surface by a general method, for example, a subtractive method or an additive method,
A conductive material is electrodeposited by electroplating with the conductive substrate 6 having a negative polarity, the conductive substrate 6 is peeled off, and the thin conductive layer 7 and the electrodeposited layer 8 are sequentially removed. As a result, as shown in FIG.
It is possible to obtain a double-sided mounting circuit board M ₆ for the land portion circuit is formed on the lower surface 1b.

Further, when forming the conductor circuit 2c of the member B (2) shown in FIG. 37, a columnar conductor is formed instead of the conductor circuit 2c, and a thermosetting soft resin sheet is placed thereon. The column conductor is pierced into this resin sheet by hot pressing to protrude to the opposite surface. subjected to electrolytic plating and then by forming a predetermined circuit pattern in the above-described general method, it is also possible to produce a double-sided mounting circuit board M _6.

According to the method of the present invention, as shown in FIG. 52, the heat sink 14 is formed at the position of the bump 3 connecting the semiconductor component, and the surface 1a of the insulating base 1 is formed.
It can be obtained a circuit board M ₇ to the pattern of the ground line circuit 15 is exposed to. For example, in the process shown in FIGS. 14 to 16, when the land circuit 4 is formed, the heat sink 14 is simultaneously formed, and in the subsequent processes, when the conductor circuit and the columnar conductor are formed, At the same time, a solid pillar made of a conductive material is formed by an electroplating method and used as a heat transfer path 16, and the heat transfer path 16 is formed so as to be exposed to the other surface 1b of the insulating base material 1. I just need. In this case, since the bump 3, the heat sink 14, and the land circuit 4 are all formed simultaneously by at least two times of electroplating, the heat sink 14 also has a multilayer structure made of a conductive material.

As shown in FIG. 52, a solid heat transfer path 16 is formed halfway, and then a conductor film portion 16c having a thickness of about 100 μm is further formed. Hole 1 reaching the conductor film 16c by machining
6a, a conductive material is plated on the wall surface by the same electroplating method, for example, to a thickness of about 10 to 30 μm to form a plating layer 16b. It is preferable because it can be performed.

[0113] transmission case of the circuit board M _7, when a semiconductor component for example die-bonded to the bump 3, the heat generation of the semiconductor component, the heat transfer path 16 conductor layer portion of the middle heat sink 14 solid 16c- a plating layer 16b it can be radiated from the surface 1b of the circuit board M ₇ by allowed to. Also,
The ground line circuit 15 may be formed as a predetermined pattern at the same time when the land circuit 4 is formed in the steps shown in FIGS. In that case, the ground line circuit 15 also becomes a multilayer structure made of a conductive material. And
In the subsequent steps, when the conductor circuit and the columnar conductor are formed, the signal conductor 15a and the signal ground 15b may be simultaneously formed in a predetermined pattern.

[0114] Thus, by providing the ground line circuit 15 in the circuit board M ₇ to the substrate surface, so that the EMS countermeasures have been taken. In particular, when the circuit board is a multi-chip bump board M ₃ as shown in FIG. 5, since the surface of the component mounting side only bumps are projected, a signal conductor circuit to the rest of the surface points It is not necessary to form the ground line circuit 15 over the remaining surface portions.
Electromagnetic wave countermeasures are taken together with the signal conductor 15a and the signal ground 15b embedded in the insulating base material 1.

This is useful because it is possible to reduce the number of assembly steps as compared with the current method of countermeasures against electromagnetic waves of a multi-chip bump board, which is a method of fixing a mounted circuit board to a frame or a case. It is. Next, a bump-type contact head of the present invention using the above-described circuit board and a method of manufacturing the same will be described in detail with reference to the drawings.

[0116] Figure 53 is a perspective view showing an example C ₁ of the present invention the head, 54 is a sectional view taken along the Y ₁ -Y ₁ line in FIG. 53. In this head C _1, the predetermined position of the insulating substrate 17 in which the disk-shaped (central in the figure), the insulating substrate 17
Through hole 1 penetrating from upper surface 17a to lower surface 17b of
8 is formed, and an upper opening 18A of an appropriate shape (square in the figure) is formed in the upper part. The through hole 18 is filled with an elastic member 19, and the upper surface 19 of the elastic member 19 is filled.
a is flush with the upper surface 17 a of the insulating substrate 17.

Therefore, when a predetermined upward force is applied to the elastic member 19 from below to above, the elastic member 19 is deformed and its upper surface 19a bulges upward.
When the upward force is released, the upper surface 19a of the elastic member 19 is restored to the original position, and the upper surface 1a of the insulating substrate 17 is restored.
It returns to the flush state with 7a. That is, the elastic member 19 functions as a movable portion E in which at least the upper surface 19a can move up and down.

On the upper surface 17a of the insulating substrate 17, a signal conductor 20 having a predetermined width and a predetermined length, and a ground line 2 for reducing the generation of noise when high-frequency input to the signal conductor 20 is performed.
0 'are wired at a predetermined pitch, and these signal conductors 20
The signal conductor 20 is extended from the upper surface 17a of the insulating substrate to the upper surface 19a of the elastic member 19 by a predetermined length, and the signal conductor 20 is disposed on the top surface 20b of the distal end of the extending portion 20a. A bump 21 having a predetermined height is protruded.

[0119] In this head C _1, the signal conductor 20
As shown in FIG. 54, all of the portion except for the upper surface 20c is buried in the insulating substrate 17 and the elastic member 19, and only the upper surface 20c is formed between the upper surface 17a of the insulating substrate 17 and the elastic member 19. It is wired so as to be exposed flush with the upper surface 19a. An end 20 d located at the other end of the signal conductor 20 is connected to a terminal of a signal processing device (not shown) as a terminal of the signal conductor 20.

The extending portion 20a of the signal conductor 20 is wired on the upper surface 19a of the elastic member 19 in parallel with each other by about 2 to 3 mm. It is wired to. By adopting such a wiring form, the upper surface 1 of the insulating substrate 17
7a, it is possible to provide a pattern (line) serving as the ground line 20 'between the signal conductors 20, whereby the extending portion 20 of the signal conductor located at the movable portion E is provided.
a can be reduced to about 2 to 3 mm so that the input and output signals at the time of inspection become high frequency.
The error of the obtained inspection signal is significantly smaller than that of the conventional L-shaped needle head, and the high-frequency characteristics of the head are excellent.

When the upper surface 19a of the elastic member 19 is bulged upward, the extension portion 20a of the signal conductor 20 wired on the upper surface 19a of the elastic member 19 and the upper surface 20b of the distal end are formed. The bump 21 moves upward.
Then, the bump 21 functions as a connection terminal by contacting a predetermined inspection location, and an inspection signal can be extracted therefrom. Then, when the upward force on the elastic member is released, the upper surface of the elastic member is restored to the original position, whereby the bump moves downward and the contact state with the inspection location is released.

[0122] Also, in the case of the head C _1, the elastic member 1
The large number of bumps 21 arranged on the upper surface 19a of the 9 have a feature that each of the bumps 21 has a high degree of freedom of independently moving up and down without restricting each other. For example, in FIG. 55, even if the bump 21 (2) moves up and down as shown by the arrow, the effect of the up and down movement on the periphery is absorbed by the elasticity of the elastic member 19, and the adjacent bump 21 (1) ), 21 (3) is greatly reduced. Therefore, even if the bumps 21 (2) move up and down, the bumps 21 (1) and 21 (3) are less likely to move up and down together with the bumps.

This means that, even if the inspection location has a height variation, each bump can freely move up and down independently in accordance with the height variation. In that case, it means that it can be moved up and down without adversely affecting adjacent bumps, which is a feature not seen in the conventional head.

The head C ₁ is disposed at a predetermined position of the wiring circuit to be inspected, and is moved by an elastic member 1 by push-up means described later.
The bump 21 is brought into contact with the inspection location by elastically pushing up the upper surface 19a of the bump 9 to bulge it, and is used for actual use. After the inspection, the elastic member 19 is restored to the original state, thereby releasing the contact of the bump 21 to the inspection location.

Further, the bump 21 is lifted up by a predetermined amount in the upper opening 18A of the through hole 18 by previously disposing the lifting means under the elastic member 19 so that an upward force is applied. Then, the head may be manufactured in advance, and the head may be set as it is on a measuring device and used for actual use. As the pushing means, FIG.
As shown in (1), a sealed air chamber 22 formed below the elastic member 19 can be cited. Specifically, the insulating substrate 1
A closed space having a predetermined volume may be formed in the lower portion of the airbag 7, and compressed air may be press-fitted therein. Alternatively, for example, a balloon bag may be housed in the closed space and compressed air may be press-fitted into the balloon bag. You may.

When the closed air chamber 22 is pressurized, the elastic member 19 is deformed by its own elasticity and swells upward, thereby extending the signal conductor extending portion 20a.
And the bump 21 moves upward. Usually, a measure is taken such that the bump 21 moves upward by about 200 to 300 μm. When the pressurized state inside the sealed air chamber 22 is released, the elastic member 19 restores its original state by its own elasticity, and the bump 2
The contact between 1 and the inspection location is released.

FIG. 57 is a sectional view showing another lifting means. In this case, the head C ₁ shown in FIG. 53, disposed on the the through hole 23a of the mother board 23 having a through hole 23a having a predetermined diameter, the other end of the signal conductor 20 is wired to the motherboard 23 Connected to circuit terminals. Then, below the through-hole 23a, a plurality of push-up pins 24a are fixed with a push-up jig 24 standing in contact with the lower surface of the elastic member 19, and the elastic member 19 is fixed by the push-up pins 24a. It is swollen upward by about 200 to 300 μm. In addition, it is preferable that the push-up pins 24a are arranged so that bump rows arranged at a predetermined pitch on the upper surface of the elastic member 19 can be pushed together.

When the push-up means is operated, the upper surface 19a of the elastic member 19 moves up and down, and accordingly, the extending portion 20 of the signal conductor buried in the upper surface.
“a” makes a bending movement in the vertical direction with the boundary between the elastic member 19 and the insulating substrate 17, that is, the position of the edge 18 a of the insulating substrate forming the four sides of the upper opening 18 A of the through hole 18 as a fulcrum. Therefore, a force is exerted on the extending portion 20 a of the signal conductor buried in the elastic member 19 so as to separate from the elastic member 19.

[0129] However, in the case of the head C _1, since the signal conductor 20 is a portion excluding the upper surface 20c are embedded in the upper surface of all the insulating substrate and the elastic member, even when subjected to the bending motion, the extending portion 20a Since the other three surfaces are secured by the elastic member 19, the situation of peeling from the elastic member 19 is greatly suppressed. Thus, for head of the present invention structure, the signal conductors as in the case of the head C ₁ 2
It is useful for practical use to bury 0 in the upper surfaces of the insulating substrate and the elastic member.

Further, when the signal conductor 20 is embedded as described above, the following effects can be obtained. That is, the environmental temperature at the time of actual use of the head C ₁ is typically 70
Since the temperature is about 80 ° C., the temperature at the contact point between the bump 21 and the inspection point and around the signal conductor increases during the actual use process. Then, as the temperature rises, the insulating substrate, the elastic member, the signal conductor, and the bump thermally expand to a specific length according to their respective thermal expansion coefficients. Peeling can also occur.

[0131] However, in the case of the head C _1, for example, a glass epoxy resin substrate was used as the insulating substrate 17, in the case of using a variety of rubber materials as the elastic member, thermal expansion coefficient than the rubber material toward the glass epoxy resin substrate Since it is small, the thermal expansion of the rubber material is suppressed by the glass epoxy resin substrate located around the rubber material. Therefore, the thermal expansion in the pitch direction of the signal conductor (metal having the largest thermal expansion coefficient) embedded in the elastic member is suppressed, and the thermal change of the pitch accuracy is suppressed.

[0132] Figure 58 is a sectional view showing another head Example C ₂ of the present invention. The head C ₂ has a through hole 2 penetrating the insulating substrate 17 in the thickness direction at the other end of the signal conductor 4 embedded in the upper surfaces of the insulating substrate 17 and the elastic member 19.
5 is provided, and the inner wall thereof is provided with conductivity by a known method, whereby the signal conductor 20 is drawn out to the lower surface 17b of the insulating substrate 17, and another bump 21 'is formed on the lead-out land.
It has a protruding structure. In addition, this bump 21 '
For example, if solder is selected as a bump material, even if there are a large number of bumps 21 'to be formed, they can be formed simultaneously by a batch soldering process.

[0133] The head C _2, as shown in FIG. 59, on a predetermined diameter through hole 23a is formed in which the motherboard 23 and Sabuboto the predetermined terminal of the (not shown), the bump 21 'is in contact the head C ₂ directly mounted to, further, for example, communicate a predetermined input signal to the signal conductor 20 and the bump 5 in a state of fixing the head C ₂ to the motherboard 23 by the pressing jig 26, such as screws Can be used for actual use.

Since the head C ₂ can be used as described above, for example, even when the inspection model is changed and the head needs to be replaced, the fixing by the holding jig 26 is released to remove the head C ₂ . It has the advantage that it can be removed from the motherboard 23 and replaced with another head. Figure 60 is a sectional view showing another head Example C _3.

[0135] In the case of the head C _3, the cross-sectional shape of the through-hole 18 formed in the thickness direction of the insulating substrate 17, the direction of the upper opening 18A is in stepped structure such that diameter than the lower opening 18B except for the has the same structure as the head C ₁ described above. That is, since the through hole 18 having the step structure as described above is formed, the insulating substrate 17 is formed.
Has a thin portion 17c which is thinner than the entire thickness, and has a structure in which elastic deformation in the vertical direction is more likely to occur than other portions.

By filling the through hole 19 with the elastic member 19, the thin portion 17c and the elastic member 1 are filled.
9, a movable portion E is formed. Elastic member 19
Is bulged upward, the extension 20a of the signal conductor 20
The bump 21 and the bump 21 receive the upward pushing force by the upper surface 19a of the elastic member 19, and can receive the upward pushing force from the thin portion 17c located above the stepped portion 18b. because there, the vertical movement of the bump 21 than in the case of the head C ₁ proceeds smoothly.

[0137] With respect to the head C _3, to form a closed air chamber, as shown in FIG. 56 in the lower portion of the elastic member, it is preferable to structure as shown in FIG. 61 to FIG 63. 61 to 63, FIG. 61 shows the head C ₃
Is a perspective view showing the FIG. 62 is a partially enlarged view showing a region of the circle Y ₂ in FIG. 61, FIG. 63 is a sectional view taken along the Y ₃ -Y ₃ line in FIG. 61.

[0138] In the case of the head C _3, the plan view shape of the upper opening 18A of the through-holes 18 have become square, the four corners thereof, FIG. 61, as shown in FIG. 62, the length and predetermined width The slit 27 having the following shape is formed in the direction of the peripheral edge of the insulating substrate 17 up to the base of the thin portion 17c. Through-hole 18 in the head C _3, as shown in FIG. 63
As shown in FIG. 60, the sectional shape has a step structure as shown in FIG. 60, and the upper surface 19a of the filled elastic member 19 is flush with the upper surface of the insulating substrate 17 in the upper opening 18A. The lower part is provided with a lifting means such as a sealed air chamber 22 at the lower part.

Therefore, the edge 18a of the upper opening 18A
In, of the insulating substrate 17, the portion of the length l ₁ shown in FIGS. 62 and 63, located on the step portion 18b as a thin-walled portion 17c, as the tongue portion of this part is the insulating substrate 17 Is formed. The signal conductor 20 wired on the insulating substrate 17 passes through the upper surface of the tongue piece portion (thin portion) 17c and extends to the upper surface 19a of the elastic member 19, and a bump 21 is protruded from the tip thereof. I have.

[0140] When the head C ₃ of this structure, the stepped portion 18
tongue portion 17c of the insulating substrate located on the b is capable of resiliently move up and down because it is thin, point (a thin portion which is remote from the edge 18a of the upper opening 18A by a length l ₁ With the base P as a fulcrum, the edge 18a can make an arc movement as shown by an arrow p in FIG. 63, and the tongue portion (thin portion) 17c exerts a leaf spring action as a whole. That is, the interior of the closed air chamber 22 is pressurized to make the elastic member 19
Is bulged upward, the upper surface 19a of the elastic member also bulges upward, the extending portion 20a of the signal conductor is pushed upward, and the tongue piece portion (thin portion: the length in FIGS. 62 and 63) is increased. is l ₁ portion) 17c also pushed up upwardly, extending portion 20a of the signal conductors 20 also pushed it is up upwards accordingly.

Therefore, the degree of vertical movement of the bumps 21 is not only determined by the bulging and restoring of the upper surface 19a of the elastic member 19, but also the warpage of the tongue portion (thin portion) 17c of the insulating substrate 17 The tongue piece (thin portion) 1 is defined by rising and restoring.
As compared with the case where 7c does not exist, the adjusting effect on the vertical movement of the bump 21 is improved. For example, even when the height of the bump 21 varies, the tongue piece portion (thin portion) 17
By appropriately selecting the length l ₁ and thickness of c and adjusting the degree of warpage, all of the bumps 21 can be reliably brought into contact with the inspection location.

Since the tongue piece portion (thin portion) 17c is thin as a whole and is very easily bent, not only the above-mentioned circular motion p but also FIG.
As shown by, independent vertical movement is possible at any point Q in the side direction of the edge 18a. Therefore, for example, even if there are large irregularities in the inspection location,
Four tongue pieces (thin parts) corresponding to the irregularities
17c can be independently elastically deformed both in the side direction and in the vertical direction, so that all of the bumps 21 can be reliably brought into contact with the inspection location. It should be noted that the bumps 21 can be sufficiently brought into contact with the inspection location only by the vertical movement of the elastic member 19 with respect to small irregularities at the inspection location.

[0143] Also, in the case of the head C _3, the sealed air chambers 22
The elastic member 19 and the tongue portion (thin portion) 1
It is also possible to make the 7c protrude upward in advance and to make contact with the inspection location, and to use only the inspection location by moving it up and down. Further, in the case of the head having this structure, the bump 2
When 1 is actually used in contact with the inspection location, it is possible to stabilize the contact resistance between the bump 21 and the inspection location.

For example, as shown in FIG. 64, it is assumed that the elastic member 19 is swelled upward and its upper surface 19a is moved upward by a height h as shown by a virtual line. At this time, the tongue piece portion (thin portion) 17c having the length l ₁ is warped upward by performing an arc motion in the p direction with the point P as a fulcrum, and accordingly, the bump 21 is also raised by the height h. Go to At this time, since the bump 21 also makes an arc motion in the p direction, the horizontal position of the bump 21 is shifted from the original position by a distance d as shown by a virtual line. That is, the bump 21 moves horizontally by the distance d in the process of moving upward by the height h.

Therefore, when the bump 21 is in contact with the inspection location, the bump 21 will scratch the inspection location by the distance d while pressing against the inspection location in the above process. Therefore, the electrical contact between the inspection location and the bump 21 is ensured, and even if, for example, a resistance increasing element such as dust or an oxide film is present at the inspection location, the bump 21 causes the bump 21 to have such a resistance. The contact resistance can be stabilized because the resistance increasing element can be removed to make contact with the inspection location.

[0146] Figure 65 is a sectional view showing still another head C ₄ of the present invention. In the case of the heads C _{1 to} C ₃ described above, it is assumed that the insulating substrate 17 and the elastic member 19 are made of different materials. However, in the case of the head C ₄ shown in FIG. Made of the same material.
That is, the material on which the signal conductor 20 is wired is entirely formed of the elastic member 19, the signal conductor 20 is embedded in a predetermined pattern on the upper surface 19a, and the bump 21 is protruded from the upper surface 20b of the tip. .

In the case of this head, the aforementioned heads C ₁ to C ₁
Although no through hole is formed unlike C ₃ , the signal conductor 2
For example, the tops of the signal conductors 20 are wired in a plane pattern as shown in FIG. 53, and the bumps 21 can be moved up and down at all of the wiring locations of the signal conductors 20, at least at the entire locations where the tops are wired. Movable part E is formed.

[0148] In the case of the head C _4, it is possible that the whole when the elastic member 19 in a thin sheet form to freely bent rich in flexibility, and stuck to its lower surface 19b to the base member having a predetermined shape It is possible to increase design flexibility when manufacturing contact heads of various shapes. For example, as shown in FIG. 66, in a state of forming a bump 21 'on the other end of the signal conductor 20, bonded to the sheet of the lower surface 19b of the head C ₄ to rigid base member 28 which surface has a trapezoidal shape for example It can be worn as a contact head.

[0149] Further, it is possible to produce a contact head C ₅ having a structure as shown in FIG. 67 The use of head C ₄ shown in FIG. 65. First, using a thin sheet of resilient member 19 to produce a head C ₄ shown in FIG. 65, point for vertically moving the bump 21, that is, the point should function as a movable portion E to the opening state.

On the other hand, a through hole 29a having a step structure is formed at a position corresponding to the opening of the elastic member 19, and the rigid insulating plate 29 has a whole shape smaller than the sheet shape of the elastic member 19 described above. Prepare And
The lower surface 19b of the sheet of the elastic member 19 is adhered to the surface 29b of the insulating plate 29 to be integrated, and the hollow portion 29 formed is formed.
filled with another elastic member 19A in a, and to the head C ₅ to place closed air chamber 22 thereunder.

[0151] Therefore, in the case of the head C _5, from the peripheral edge of the insulating substrate 29, has become a sheet overhanging structure of the elastic member 19 which is rich in flexibility signal conductor 20 is embedded, another elastic The portion where the member 19A is filled is a movable portion E of the bump 21 which can move up and down.
The head C ₅ can be subjected to to practical use as shown in Figure 68.

That is, another bump 21 ′ is formed on the other end of the signal conductor 20, and the base member 28 is mechanically fixed to the periphery of the back surface 29 c of the insulating substrate 29 using, for example, screws.
Further, another base member 28a is mechanically fixed on the base member 28, and the protruding portion of the sheet of the elastic member 19 is bent so that the back surface 19b is overlapped with the another base member 28a. Then, it is fixed by mechanical means such as screwing, and the bump 21C is connected to a motherboard (not shown) for use.

At this time, the base members 28, 28a
If one of them is made of a soft material, a cushion effect can be obtained, which is preferable. The head C ₅ by using in this way, also becomes unnecessary to drilled through holes in the resilient member 19 for connecting the bump 21 and the bump 21 ',
Also, when exchanging the head due to the change of the inspection model, the head can be exchanged by easily disassembling the base members 28 and 28a.

[0154] Figure 69 is a perspective view showing another head C ₆ of the present invention, FIG 70 is a sectional view taken along the Y ₄ -Y ₄ line in FIG. 69. The head C _6, in the head C ₃ shown in FIG. 60 Figure 63 is a structure in which the through-hole 18 is not filled with the elastic member. That is, the through hole 18 having a step structure is formed in the thickness direction of the insulating substrate 17. The plan view shape of the upper opening 18A of the through hole 18 is square, by the slit 27 is engraved on its four corners, as in the case of the head C _3, the upper surface of the insulating substrate 17 thin (A tongue piece portion) 17c.

The signal conductor 20 is wired close to the periphery of the thin portion (tongue piece portion) 17c, and a bump 21 is provided on the top surface 20b of the signal conductor. Therefore, in the head C ₆ , the thin portion (tongue piece portion) 1 having high flexibility is provided.
7c itself constitutes a movable portion E that allows the bump 21 to move up and down. That is, the thin portion (tongue piece portion) 1
By appropriately adjusting the thickness of 7c, the length of the overhang (the length of the slit 27), and the like, and, for example, disposing a balloon bag or the like in the through-hole (hollow) 18, the balloon bag can be inflated. By contracting, the thin portion (tongue piece portion) 17c moves up and down, and as a result, the bump 21 can be moved up and down.

In the heads C _{1 to} C ₆ listed above, at least the bumps 21 located at the movable portions E have the outer layer portions having corrosion resistance similar to the bumps 3 on the circuit boards M _{1 to} M ₆ described above. It is formed of a multilayer structure made of one conductive material. Next, a method for manufacturing the bump type contact head of the present invention will be described. First, the first manufacturing method is as follows, which will be described with reference to the drawings.

As shown in FIG. 71, a conductive thin plate 30A made of, for example, phosphor bronze and having a thickness of about 100 to 150 μm.
Is prepared, and a known dry film is adhered thereto or a liquid resist is applied to cover the entire surface 30a to form a first resist layer 31A having a predetermined thickness. Next, the resist layer 31A is exposed and developed to form a through hole 31a having a predetermined shape in the resist layer 31A at a location corresponding to a location where a bump is to be formed, as shown in FIG. 72. To expose the surface 30a of the conductive thin plate 30A. Subsequently, an etching process is performed on the surface 30a exposed from the through hole 31a,
After etching only the portion of the surface 30a exposed from the substrate to a predetermined depth, the resist layer 31A is removed.

As a result, as shown in FIG. 73, a bump recess 21a having a predetermined depth is formed in a portion of the surface 30a of the conductive thin plate 30A where a bump is to be formed. Next, after applying a known dry film or applying a liquid resist on the entire surface 30a to form a resist layer 31B having a predetermined thickness, exposure and development are performed, and as shown in FIG. 74, The resist layer 31B corresponding to the pattern of the signal conductor to be formed is removed, and a groove pattern (plane pattern) 31b having a depth reaching the surface 30a of the conductive thin plate 30A is formed to partially cover the surface of the conductive thin plate 30A. Exposure to At the tip of the formed groove pattern 31b, the bump recess 21a is exposed. At this time, the thickness of the resist layer 31B is set to a thickness substantially equal to the thickness of the signal conductor to be formed.

Further, the width of the groove pattern 31b is set to be larger than that of the bump recess 21a located therebelow. Therefore, the cross-sectional shape of the recess formed by the bump recess 21a and the groove pattern 31b has a step structure, and the bottom of the step structure, that is, the portion of the conductive thin plate 30A is exposed in the groove pattern 31b. Next, the whole is immersed in a predetermined plating bath, and electroplating is performed in a state where the conductive thin plate 30A is set to a negative pole.

At this time, the electroplating is performed at least twice by changing the plating bath. That is, in the first electroplating, a first conductive material having corrosion resistance such as gold, nickel, and a nickel-cobalt alloy, which is not eroded by an etchant used in an etching process described later, is performed. In the first electroplating, the first conductive material is electrodeposited in a layered manner on the exposed surface of the conductive thin plate 30A in the recess formed by the bump recess 21a and the groove pattern 31b.

Then, subsequent to the above-described first electroplating, another electroplating is further performed, and another conductive material is coated on the layered body made of the above-described corrosion-resistant conductive material with the resist layer 31B. Electrodeposit so that it is in one state. The conductive material to be electrodeposited at this time may be any material as long as it has excellent conductivity. For example, copper, aluminum and the like can be mentioned as suitable materials.

In this electroplating process, the bump recess 2
In the recess formed by the groove 1a and the groove pattern 31b, first, a first conductive material is deposited in a layer on the bump recess 21a, and another conductive material is further deposited thereon. Will be filled with these conductive materials. Therefore, at the end of electroplating, FIG.
As shown in FIG. 5, the conductive thin plate 30
A bump 21 is formed in a state where a two-layer structure formed by laminating a layered body 21b covering the exposed surface of A and a layered body 21c formed thereon is filled, and the groove pattern is also formed on the conductive thin plate 30A. A two-layer structure comprising a layered body electrodeposited on the exposed surface and another conductive material deposited thereon is formed.

Next, the resist layer 31B is removed. As a result, as shown in FIG. 76, the signal conductor 20 having a predetermined pattern protruding from the surface 30a and the signal conductor 2
The bump 21 buried in the conductive thin plate 30A is formed in a state integrated with the bumps 21.

Next, as shown in FIG. 77, the cross-sectional shape is a stepped structure, the shape in plan view from above is a square, and slits are formed at the four corners of the through hole 18.
The upper surface 17a of the insulating substrate 17 formed from the upper surface 17a to the lower surface 17b and the surface 30a of the conductive thin plate 30A on which the pattern of the signal conductor 20 is formed are bonded by thermocompression. In the pattern of the signal conductor 20, the tip portion where the bump 21 is formed is located at the position of the upper opening 18A of the through hole 18, the remaining portion is buried in the insulating substrate 17, and the through hole 18 itself is It will be present as a cavity.

It is preferable that the insulating substrate 17 used at this time is a material which is in a semi-cured state at normal temperature and softens when heated. An example is Brigreg. The reason is that the pattern of the signal conductor 20 is formed so as to protrude from the surface 30a of the conductive thin plate 30A. This is because the substrate can be buried in the upper surface 17a of the insulating substrate 17 having plasticity, and thereafter the substrate is thermally cured and fixed.

However, even when the insulating substrate 17 is made of a rigid material, for example, as shown in FIG. 78, the pattern of the signal conductor 20 is embedded in the surface 30a of the conductive thin plate 30A. A layer 17A of uncured epoxy resin is formed, in which an upper opening 18A is formed.
Can be integrated by thermocompression bonding a rigid insulating substrate 17 having a through hole 18 having a predetermined shape.

[0167] In this case, at the time when both are pressed, the layer 1
Since 7A is in an uncured and soft state, the pattern of the signal conductor 20 can be buried here, and at the same time, the layer 17A adheres to the upper surface 17a of the insulating substrate 17. When the layer 17A is thermally cured, the pattern of the signal conductor 20 is integrated with the insulating substrate 17 while being buried in the thermally cured layer 17A.

The insulating substrate at this time may be any substrate as long as it is electrically insulating. For example, a glass epoxy resin substrate, a flexible printed substrate, an epoxy resin, a polyimide, a polyester, or a urethane resin may be used. , Resin substrates and sheets made of phenolic resin, etc.
Also, a ceramic plate or the like can be given. Among these, a soft glass epoxy resin prepreg is preferable because the pattern of the signal conductor 20 formed on the conductive thin plate 30A is buried at the time of thermocompression bonding as described above.

The above-mentioned insulating substrate may be formed to have an appropriate thickness by laminating a plurality of prepregs, for example.
After the integration of the conductive thin plate 30A and the insulating substrate 17 is completed, the elastic member 19 is filled in the cavity 18C formed by the conductive thin plate 30A and the through hole 18 of the insulating substrate 17.

For example, as shown in FIG. 79, a predetermined elastic member 19 is disposed on the lower surface 17b of the insulating substrate 17, and the squeegee 3 moves the elastic member 19 in, for example, the direction of arrow q.
In step 2, the cavity 18C may be filled and solidified. Further, as shown in FIG. 80, the lower part of the hollow portion 18C has a closed structure, and a pressure reducing device 33a is disposed therein to reduce the pressure in the closed space.
Is connected to the closed space, and the accommodated elastic member 19 is connected.
May be injected into a closed space by differential pressure and then solidified.

By performing such a filling process, as shown in FIG. 81, the upper surface 19
a comes into contact with the surface 30a of the conductive thin plate 30A, and the step 18
The elastic member 19 is filled with the lower surface of the thin portion (tongue piece portion) 17c of the insulating substrate 17 at b, and the upper end 18A of the through hole 18 with the tip of the signal conductor 20 and the bump 21 embedded therein. You.

As shown in FIG. 63, the elastic member 1
When the closed air chamber 22 is formed in the lower part of
As shown in the above, another insulating substrate 17B having a through hole 22A large enough to enclose the elastic member 19 filled in the cavity 18C is bonded or thermocompression-bonded to the lower surface of the insulating substrate 17. I just need. As the material of the elastic member used at this time, a material having appropriate elasticity even after the cavity is filled and solidified is preferable. For example, fluorine rubber, silicone rubber, acrylic rubber, ethylene-propylene rubber, Materials such as ethylene-vinyl acetate rubber, chloroprene rubber, nitrile rubber, styrene-butadiene rubber, and natural rubber can be used.
Also, liquid rubber such as liquid polybutadiene and liquid silicone, and thermoplastic elastomer such as polystyrene and polybutadiene can be used.

As described above, the embedding of the signal conductor in the elastic member is performed as described above.
The method is not limited to a method in which the elastic member is filled in the hollow portion 18C formed at that time. For example, in the conductive thin plate 30A shown in FIG. The portion may be selectively molded with an elastic member, further solidified, removed from the mold, and integrated with the insulating substrate 17 by thermocompression as shown in FIG.

Finally, after the elastic member 19 filled in the cavity 18C is solidified, the whole is immersed in a predetermined etchant to remove the conductive thin plate 30A by etching. Thus, as shown in FIG. 83, the signal conductor 20 is transferred while being buried on the upper surface 17a of the insulating substrate 17 and the upper surface 19a of the elastic member 19 with only the upper surface thereof being exposed. A head in which the bump 21 protrudes upward is obtained at a predetermined position. Then, the target head can be obtained by coating the upper surface of the exposed signal conductor pattern with, for example, Au by electroplating or electroless plating.

At this time, the outer layer 21b of the bump 21
Since the bump 21 is formed of a conductive material that is not eroded by the etchant to be used and functions as a barrier layer for the etchant, the situation that the bump 21 is etched during the etching process does not occur. The above-described manufacturing method is an example in which a conductive thin plate 30A as shown in FIG. 71 is prepared, and a bump recess and a signal conductor pattern are formed thereon.

[0176] However, the bump type contact head according to the present invention can also be prepared in the above-described circuit substrate manufacturing method M _2. That is, first, as shown in FIGS. 42 to 45, a plane pattern of the circuit according to step A of the substrate M _2, the bump recess 3A on the electrodeposit layer 8 is formed, the signal conductor in the resist layer a ₂ thereunder (Groove pattern) After forming 2A, the above-described electroplating is performed at least twice to form bumps 3 of a multilayer structure in the bump recesses, and at the same time, to form a conductor circuit 2a of the multilayer structure in the groove pattern. I do.

Then, as shown in FIG. 77, the obtained member is integrated with the insulating substrate, and then the elastic member is filled in the hollow portion of the insulating substrate where the through-hole is formed. Subsequently, the conductor thin layer and the electrodeposition layer located thereunder may be sequentially removed by etching. When manufacturing the head C ₄ shown in FIG. 65, when the integrated process shown in FIG. 77, may be used a sheet made of an elastic member as the insulating substrate 17.

[0178] Furthermore, when manufacturing the head C ₆ shown in FIG. 69, when performing the integrated process shown in FIG. 77,
The signal conductor 20 formed on the front surface 30a of the conductive thin plate 30A is integrated with the upper surface of the thin portion (tongue piece portion) 17c of the insulating substrate 17 and an elastic member is provided in the through hole 18 of the insulating substrate 17. Should not be filled. In the case of the head having the structure of the present invention, as shown in FIG. 84, the planar shape of the upper opening 18A of the through-hole of the insulating substrate 17 is rectangular, and the surface 19a of the elastic member 19 is changed from the rectangular shape.
And a plurality of signal conductors 20
And the ground line 20 'may be arranged in parallel to form a bump 21 at the tip. For a head with this structure,
It is suitable because it can be easily used for inspection of circuit components such as a liquid crystal panel, PDP, and TAB.

[0179]

[0180]

[0181]

[0182]

[0183]

[0184]

[0185]

As is clear from the above description, in the circuit board of the present invention, the bumps projecting from the surface of the circuit board are provided at predetermined positions of the electrodeposited layer having a uniform thickness. It is formed as a multilayer structure having a height equal to the thickness. Therefore, variations in the height of the bumps are extremely small, and the mounting reliability when connecting a semiconductor component to the bumps is extremely high.

The circuit board of the present invention can be manufactured without any machining by combining exposure / development processing applied in the conventional manufacturing of circuit boards with electroless plating and electroplating. Accordingly, the conductive structure between the conductive circuits and between the conductive circuits can be made finer, and high-density mounting of semiconductor components becomes possible. In particular, since the conductor circuits are connected by columnar conductors, their current capacity is larger than that of the conventional through-hole structure, and it is possible to improve the distribution density of bumps and realize high-density mounting of semiconductor components based on them. In addition, since the mounted components can be directly contacted by the bumps, the component mounting can be saved. In addition, since it is unnecessary to make the inner via hole hollow, it is possible to further reduce the diameter of the hole (for example, 30 to 50 μm) as compared with the related art.

Electroplating is performed in any case.
Since the process is performed in a state where the conductive substrate having a large area is set to the negative pole, all the small holes can be filled at once with a conductive material, and productivity is remarkably higher than in the case of through-hole plating. Further, in the bump type contact head of the present invention, the signal conductor extends and is wired to the movable portion which is flush with the insulating substrate, and a bump is formed at the tip thereof. The bump can be brought into contact with the inspection point by pushing up, and the contact of the bump can be released by releasing the pushing up.

In each of the heads of the present invention, only the upper surface of the signal conductor is exposed, and the other portions are buried in the insulating substrate and the elastic member (movable part). It shows a strong resistance to the peeling stress of the signal conductor generated with the above, the reliability in use is high, and the service life is prolonged. If the head C _3, in the state of the insulating substrate because it independent tongue shape thin, which is fractionated in the slit, the tongue portion which independent located upper opening near the through-hole A leaf spring with a high degree of freedom can be exhibited. Therefore, the function of adjusting the vertical movement of the bump is improved.

Further, the head of the present invention has a built-in means for pushing up the elastic member, has a simple overall structure, and does not require a complicated mechanism as in the prior art. In the case of the head of the present invention, the bumps arranged on the upper surface can move up and down independently of each other by the function of the elastic member (movable part). Further, the head of the present invention can be configured such that the signal conductor is led out to the opposite surface through the through hole and a bump is formed on the signal conductor, and the bump is detachably attached to the motherboard for actual use. This has the advantage that the head can be easily replaced with a model change at the time of inspection.

[0190] The head C ₄ is rich in flexibility since the insulating substrate is constituted by an elastic member, it is easy to attach the base member of various shapes, as a head capable of increasing the degree of freedom of design Useful. In addition, all of these heads can be manufactured by combining the exposure / development processing and the electroplating method used in the manufacture of conventional circuit boards, so that many signal conductors and bumps are formed at a fine pitch. However, even if they are performed, they can be collectively formed with high pitch accuracy in accordance with the design standard. Then, the conventional reworking operation is not required. In manufacturing, it is possible to divert equipment and the like that have been conventionally used for manufacturing a printed circuit board, so that the overall manufacturing cost can be significantly reduced as compared with the conventional head manufacturing.

[0191]

[Brief description of the drawings]

1 is a perspective view showing a circuit board M ₁ of the present invention.

FIG. 2 is a cross-sectional view taken along the line II-II of FIG.

3 is a perspective view showing a circuit board M ₂ Another of the present invention.

FIG. 4 is a sectional view taken along line IV-IV in FIG. 3;

5 is a perspective view showing a multi-chip bump board M ₃ is a modification of the circuit board M _1.

6 is a perspective view showing another multi-chip bump board M ₄ of the present invention.

7 is a partial sectional view showing the sectional structure of the vicinity of the upper surface of the circuit board M _1.

8 is a partial sectional view showing the sectional structure of the vicinity of the upper surface of the circuit board M _2.

FIG. 9 is a cross-sectional view showing a state in which a thin conductive layer is formed by covering the surface of a conductive substrate.

10 is a cross-sectional view showing a state of forming a resist layer a ₁ on the surface of the conductive thin layer.

11 is a sectional view showing a state in which allowed leaving the resist layer a ₁ in the bump formation planned location.

FIG. 12 is a cross-sectional view showing a state where an electrodeposition layer is formed on the surface of a thin conductor layer.

FIG. 13 is a cross-sectional view showing a state in which a bump recess is formed in the electrodeposition layer.

[14] resist layer a ₂ is formed, a first hole communicating with the there recess bump is a sectional view showing a state of forming a plane pattern corresponding to the land portion circuit.

FIG. 15 is a cross-sectional view showing a state where bumps, first columnar conductors, and land circuits are formed.

16 is a sectional view showing a state of exposing the surface of the resist layer a ₂ to remove the electrodeposited layer.

17 is a sectional view showing a state where the surface was coated to form a resist layer a ₃ electrodeposition layer.

18 is a sectional view showing a state of forming a plating film by performing resist layer a ₃ surface and the electroless plating on the surface of the end surface and the land portion circuit of the first columnar conductor.

[Figure 19] to form a resist layer a ₄ to plated thin film of FIG. 18, therein, the plane pattern of the same pattern as the conductor circuit to be formed, and is a sectional view showing a state of forming a hole for columnar conductor .

20 is a cross-sectional view showing a state in which a conductive material is electroplated in the plane pattern of FIG. 19 and holes for columnar conductors.

[Figure 21] resist layer a ₄ is removed, then the plating film is removed by etching the resist layer a ₃ is a sectional view showing a state of forming a conductive circuit and the columnar conductor.

FIG. 22 shows a resist layer a covering the conductor circuit and the columnar conductor.
FIG. ₅ is a cross-sectional view showing a state in which ₅ is formed.

23 is a cross-sectional view showing a state of forming a hole in the resist layer a _5.

24 is a cross-sectional view showing a member A in which a hole is filled with a conductive material by an electroplating method to form a columnar conductor.

25 is a cross-sectional view showing a state of forming a plating film with a resist layer a ₅ and an end face of the columnar conductor by coating electroless plating of member A.

[Figure 26] to form a resist layer b ₁ to the plating film, there is a cross-sectional view showing a state of forming a planar pattern of the same pattern as the conductor circuit to be formed.

FIG. 27 is a cross-sectional view showing a state where a conductive material is electroplated on the plane pattern of FIG. 26;

28 is a cross-sectional view showing a state in which the resist layer is removed b _1.

29 is a cross-sectional view showing a resist layer a ₅ member by forming a conductor circuit in B (1).

FIG. 30 shows a resist layer b ₂ covering the conductor circuit of FIG. 29;
FIG. 4 is a cross-sectional view showing a state in which is formed.

31 is a cross-sectional view showing the resist layer b ₂ a state of forming a hole for the columnar conductor.

FIG. 32 is a cross-sectional view showing a state in which the hole of FIG. 31 is filled with a conductive material by an electroplating method to form a columnar conductor.

33 is a cross-sectional view showing a state of forming a plated film by electroless plating on an end surface of the resist layer b ₂ of the surface and the columnar conductor.

[Figure 34] to form a resist layer b ₃ to the plating film in FIG. 33, there, in the same pattern as the conductor circuit to be formed is a cross-sectional view showing a state of forming a planar pattern.

FIG. 35 is a cross-sectional view showing a state where a conductive material is electroplated on the plane pattern of FIG. 34;

36 is a cross-sectional view showing a state in which the resist layer b ₃ is removed.

Is a sectional view showing a member B (2) obtained by forming a conductor circuit in FIG. 37 the resist layer b _2.

FIG. 38 is a cross-sectional view showing a state in which the surface of a member B (1) and an insulating substrate are thermocompression-bonded.

FIG. 39 is a cross-sectional view showing an integrated product C of a member B (1) and an insulating substrate.

FIG. 40 is a cross-sectional view showing a state in which the conductive substrate is separated from the integrated product C.

41 is a cross-sectional view showing a circuit board M ₁ of the present invention.

FIG. 42 is a sectional view showing a state in which allowed leaving the resist layer a ₁ in the bump formation planned location of the conductive thin layer.

FIG. 43 is a cross-sectional view showing a state where a bump depression is formed in the electrodeposition layer.

[Figure 44] to form a resist layer a _2, there is a cross-sectional view showing a conductor circuit which communicates with the recess bump, a state in which a respective planar pattern of land portion circuit.

FIG. 45 is a cross-sectional view showing a state where bumps, conductive circuits, and land circuits are formed by electroplating the planar pattern of FIG. 44;

[Figure 46] After coating the conductor circuits and the land portion circuit and the resist layer a ₂ to form a resist layer a _3, there is a cross-sectional view showing a state of forming a hole for the columnar conductor.

FIG. 47 is a cross-sectional view showing a member A formed by filling a hole for the columnar conductor of FIG. 46 with a conductive material by an electroplating method to form a columnar conductor.

FIG. 48 is a cross-sectional view showing a state where members B (1) and B (2) are thermocompression-bonded to an insulating substrate.

FIG. 49 is a circuit board M for double-sided mounting manufactured by the method of the present invention.
FIG. ₅ is a cross-sectional view showing ₅ .

FIG. 50 is a cross-sectional view showing a state in which a film is attached to member B (2) when manufacturing a circuit board for double-sided mounting.

51 is a perspective view showing a double-sided mounting circuit board example M ₆ produced by using the circuit board of the present invention.

FIG. 52 is a sectional view showing a circuit board M ₇ of the present invention having the heat sink and the heat transfer path.

FIG. 53 is a perspective view showing the head C ₁ of the present invention.

FIG. 54 is a cross-sectional view of FIG. 53 taken along the line Y ₁ -Y ₁ .

FIG. 55 is a partial cross-sectional view showing an arrangement state of bumps on an upper surface of an elastic member.

FIG. 56 is a sectional view showing a state in which the push-up means on the head C ₁ (closed air chamber) is disposed.

FIG. 57 is a sectional view showing a state in which is disposed a separate lifting means to the head C _1.

FIG. 58 is a sectional view showing a head C ₂ of the present invention.

FIG. 59 is a sectional view showing a state of arranging the head C ₂ to the mother board.

FIG. 60 is a sectional view showing a head C ₃ of the present invention.

FIG. 61 is a perspective view showing a preferred example of the head C ₃ of the present invention.

FIG. 62 is a partially enlarged view of a region Y ₂ indicated by a circle in FIG. 61.

FIG. 63 is a partial cross-sectional view along the line Y ₃ -Y _{3 in} FIG. 61;

FIG. 64 is a partial sectional view showing a bump operation in the head C _3.

Is a sectional view showing a head C ₄ in FIG. 65 the present invention.

Figure 66 is a cross-sectional view of the contact head manufactured using the head C ₄ in FIG. 65.

FIG. 67 is a sectional view showing a head C ₅ of the present invention.

FIG. 68 is a sectional view showing a state where the head C ₅ mounted on the motherboard of FIG. 67.

Figure 69 is a perspective view showing a head C ₆ of the present invention.

70 is a cross-sectional view of FIG. 69 taken along the line Y ₄ -Y ₄ .

FIG. 71 is a cross-sectional view showing a state where a first resist layer is formed on a conductive thin plate.

FIG. 72 is a cross-sectional view showing a state where a through hole is formed in the first resist layer.

FIG. 73 is a cross-sectional view showing a state in which a bump recess is formed in a conductive thin plate.

FIG. 74 is a cross-sectional view showing a state where a second resist layer is formed on a conductive thin plate and a pattern corresponding to a groove pattern of a signal conductor to be formed is formed thereon.

FIG. 75 is a cross-sectional view showing a state where a conductive material is electrodeposited in the bump recess and the signal conductor groove pattern.

FIG. 76 is a cross-sectional view showing a state where bumps and signal conductors are formed on the surface of a conductive thin plate.

77 is a cross-sectional view showing a state where the surface of the conductive thin plate of FIG. 76 and an insulating substrate are thermocompression-bonded.

FIG. 78 is a cross-sectional view showing another state in which the conductive thin plate and the insulating substrate are thermocompression-bonded.

79 is a cross-sectional view showing a state in which a cavity formed when the conductive thin plate and the insulating substrate of FIG. 76 are integrated is filled with an elastic member.

FIG. 80 is a cross-sectional view showing another method of filling the elastic member.

FIG. 81 is a cross-sectional view showing a state in which the cavity shown in FIG. 79 is filled with an elastic member.

FIG. 82 is a cross-sectional view showing a state where another insulating substrate is disposed on the member shown in FIG. 81;

FIG. 83 is a cross-sectional view showing a state where the conductive thin plate is peeled and removed.

Figure 84 is a partial plan view showing another contact head C ₇ of the present invention.

[Explanation of symbols]

a1, a2, a3, a4, a5, b1, b2, b3 Resist 1 Insulating base material 1a, 1b Surface 2a, 2b, 2c of insulating base material 1 Conductor circuit 2A, 2B, 2C Planar pattern for conductor circuit 3 Bump ( 3a, 3b layered body of conductive material 3A recess for bump 4 land circuit 4a, 4b layered body of conductive material 4A plane pattern for land section circuit 5, 51, 51 ', 52, 53 pillar-shaped conductor 5A1, 5A1 ', 5A2, 5B1 Hole for columnar conductor 6 Conductive substrate 6a Surface of conductive substrate 6 7 Conductive thin layer 7a Surface of conductive thin layer 7 8 Electrodeposited layer 8a Surface of electrodeposited layer 8 8b Appears in bump recess 3A Wall surface 8c of electrodeposited layer 8 which was exposed 8c Partial surface of electrodeposited layer 8 exposed in hole 5A1 9, 10, 11 Plating thin film 9a, 10a, 11a Plating thin film surface 12 Insulating substrate 12a Insulating substrate 12 table DESCRIPTION OF SYMBOLS 13 Film 13a Adhesive layer 14 Heat sink 15 Ground line circuit 15a Signal conductor 15b Signal ground 16 Heat transfer path 16a Hole 16b Plating layer 16c Conductive film portion 17 Insulating substrate 17a Upper surface of insulating substrate 17b Lower surface of insulating substrate 17 Uncured Resin 17B Insulating substrate 18 Through hole 18A Upper opening of through hole 18 18B Lower opening of through hole 18 Cavity 18a Upper edge of through hole 18 Elastic member 19a Upper surface of elastic member 19b Lower surface of elastic member 20 Signal conductor 20a Signal Extension portion 20b of conductor 20 Top end surface of extension portion of signal conductor 20 20c Upper surface of signal conductor 20d End portion of signal conductor 20 'Ground line 21, 21 (1), 21 (2), 21 (3), 21 '
Bump 21a Bump recess 21b, 21c Layered body of conductive material 22 Sealed air chamber 23 Mother board 23a Through hole of mother board 23 24 Jig 24a Push-up pin 25 Through hole 26 Holding jig 27 Slit 28, 28a Base member 29 Insulating plate 29a Through holes (hollow portions) formed in insulating plate 29 29b, 29c Surface of insulating plate 29 30A Conductive thin plate 30a Surface of conductive thin plate 30A 31A Resist layer 31a Through hole formed in resist layer 31A 31B Resist layer 31b Plane for signal conductor Pattern 32 Squeegee 33a Decompression device 33b Container for storing elastic member

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Katsuo Aoshima 5-14-15 Ogami, Ayase City, Kanagawa Prefecture Inside Meiko Co., Ltd. (56) References JP-A-1-289274 (JP, A) JP-A-Hei 5-243233 (JP, A) JP-A-6-140733 (JP, A) JP-A-6-347480 (JP, A) JP-A-6-308158 (JP, A) JP-A-3-122371 (JP, A) U) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01L 23/12 G01R 1/06

Claims (22)

(57) [Claims] At least one bump is formed on at least one surface of an insulating base material, and at least one layer of a conductive circuit is wired on at least one surface and / or inside of the insulating base material, between the bump and the conductive circuit or / and the circuit board conduction structure to connect them electrically are formed between each conductor circuit, at least the bump is a multilayer structure formed by successively electrodepositing at least two conductive material Ah is, the conducting structure, posts which are integrally formed by electroplating
Circuit board, wherein the formed Rukoto from Jo conductor. 2. The multilayer structure is a two-layer structure, an outer layer portion of the two-layer structure is made of any one selected from the group consisting of gold, nickel and a nickel alloy, and an inner layer portion is made of copper. 2. The circuit board according to claim 1, comprising: 3. The circuit board according to claim 1, wherein a bump and a land circuit are formed on at least one surface of the insulating base material. 4. The circuit board according to claim 1, wherein a bump, a land circuit, and a conductor circuit are formed on at least one surface of the insulating base material. 5. The circuit board according to claim 1, wherein a ground line circuit and / or a heat sink is formed on a surface of the insulating base on which the bump is formed. 6. The circuit board according to claim 5 , wherein a heat transfer path extending from the heat sink to the other surface and formed on the other surface is formed inside the insulating base material. 7. A conductive substrate, a conductive thin layer formed on at least one surface of the conductive substrate, an electrodeposition layer formed on a surface of the conductive thin layer, and embedded in a predetermined portion of the electrodeposition layer. A multi-layered structure bump formed by sequentially electrodepositing at least two types of conductive materials, a resist portion A formed by covering the electrodeposition layer, and a resist portion A formed by being buried in the resist portion A; A first columnar conductor or a conductor circuit or a land circuit connected to the bump, and formed to be embedded in the resist portion A, and connected to the conductor circuit or the land circuit; Step A of manufacturing a member A comprising a second columnar conductor exposed on the surface; a member B (1) in which a one-layer conductor circuit is formed on the surface of the resist portion A of the member A; Multiple layers of conductor circuits and between them Step B of manufacturing a member B (2) in which a columnar conductor to be connected is buried in another resist portion B and the last conductor circuit is formed on the surface of the resist portion B; 1) or a step C of thermocompression bonding the surface of the member B (2) on the conductor circuit side to the surface of an insulating base material to produce an integrated product C in which the conductive circuit is embedded in the insulating base material;
And a step D of peeling off the conductive substrate from the integrated member C and then sequentially removing the thin conductive layer and the electrodeposited layer by etching to expose bumps. Method. Wherein said step A is, in electroplating, Step A ₁ to form a conductive thin layer to cover at least one surface of the conductive substrate; after forming the resist layer a ₁ to cover the conductive thin layer performing exposure and development, the resist layer step a ₂ a ₁ a and allowed leaving only the bump formation planned location to expose the other surface of the conductive thin layer; the exposed surface of the conductive thin layer, electroplating A step A ₃ of electrodepositing a conductive material flush with the resist layer a ₁ to be left at the place where the bump is to be formed to form an electrodeposition layer; the resist layer a ₁ remaining at the place where the bump is to be formed
Removal of the the electrodeposit layer, Step A ₄ to form a recess bump surface of the conductive thin layer is exposed; After forming the resist layer a ₂ covers the surface of the electrodeposit layer performing exposure and development, the resist layer a _2,
First hole and, Step A ₅ to form a planar pattern corresponding to a circuit pattern to be formed land portion circuit communicating with recess for the bump; performing electroplating, the a recess for the bump first hole And electrodepositing a first conductive material in a layer on the plane pattern,
Next, on the formed layered body, at least one kind of conductive material different from the first conductive material is further electrodeposited sequentially, and the bump recesses, the first holes, and the plane pattern are formed into two. A step A _{6 of} forming a bump, a first columnar conductor and a land circuit collectively by filling with a multilayer structure formed by laminating at least two kinds of conductive materials; removing the resist layer a ₂ and performing the electrodeposition step a ₈ to form a resist layer a ₃ with a thickness of the end surface of coating the exposed surface of the electrodeposited layer and the first columnar conductor is exposed; step a ₇ to expose the surface of the layer the resist layer a Step A of forming a plated thin film by electroless plating by covering the end face of the _third columnar conductor with the first columnar conductor
_9; performing the plating film coating to resist layer a ₄ exposure and development after forming the said resist layer a _4, a plane pattern corresponding to a circuit pattern of the conductor circuit to be formed, and the land Step A ₁₀ of forming a plane pattern of holes communicating with the external circuit and exposing the surface of the plating thin film from the plane pattern; performing electroplating, and electrodepositing a conductive material on the plane pattern to form a conductor circuit. and step a ₁₁ collectively formed the columnar conductor to be connected to the land portion circuit; step of exposing the resist layer a ₄ is removed, the resist layer a ₃ and the plating film which is exposed by etching is removed a _12; said conductor circuit, the columnar conductor and the resist layer a ₃ is connected to the land portion circuit, the resist layer and the resist layer a ₃ is coated with the resist layer a ₅ After forming a resist portion A consisting of ₅ is subjected to exposure and development processes, the conductor circuit, and, step A ₁₃ to form a second hole communicating with the columnar conductor to be connected to the land portion circuit; and electrical method of manufacturing a circuit board according to claim 7 consisting of; performing plating, the second step a ₁₄ to form a second columnar conductor by filling a conductive material into the hole. Wherein said step B (1) is, to cover the entire surface of the resist layer a ₅ of the member A, by electroless plating, Step B ₁ to form a plating film; covering the plating film performing exposure and development after forming the resist layer b ₁ Te, to form a corresponding planar pattern to the circuit pattern of the conductor circuit to be formed, step B to expose a surface of the plated film from the planar pattern
_2; performing electroplating, the plating thin film process B ₃ to form a conductor circuit by electrodepositing a conductive material on the exposed surface; and, the resist layer b ₁ is removed, etching away the plated film exposed method of manufacturing a circuit board according to claim 7 consisting of; step B ₄ to expose the resist layer a ₅ to. Wherein said step B (2) is, the member relative to B (1), the resist layer b ₂ to cover the conductive circuit and the resist layer a ₅
Performing exposure and development after forming the said resist layer b _2, Step B ₅ to form a hole communicating to the conductor circuit; performing electroplating, electrodeposition a conductive material in said hole Step B ₆ of forming a columnar conductor by plating; Step B ₇ of covering the entire surface of the resist layer b ₂ and forming a plating thin film by electroless plating; and forming a resist layer b ₃ by covering the plating thin film was then carried out exposure and development, the resist layer b _3, forms a plane pattern corresponding to a circuit pattern of the conductor circuit to be formed, step B ₈ to expose the surface of the plating film from the planar pattern A step B ₉ of performing electroplating and electrodepositing a conductive material on the plane pattern to form a conductive circuit; and removing the resist layer b ₃ and etching away the exposed plating thin film. Regis Step B ₁₀ to expose the layer b _2; a is a step of performing at least one time, according to claim 7
Method for manufacturing a circuit board. Wherein said step A is coated on at least one side of the conductive substrate, in the electroplating method, Step A ₁ to form a conductive thin layer; forming a resist layer a ₁ to cover the conductive thin layer later by performing exposure and development process, the resist layer a _1, step a ₂ to be brought leaving only the bump formation planned location to expose the other surface of the conductive thin layer; the exposed surface of the conductive thin layer, electrical by plating, step a ₃ to form the resist layer a ₁ and electrodeposited to electrodeposit layer a conductive material flush to left on the bump formation planned locations; resist layer a ₁ to left on the bump formation planned location removal of the the electrodeposit layer, step a ₄ to form a recess bump surface of the conductive thin layer is exposed; After forming the resist layer a ₂ covers the surface of the electrodeposit layer performing exposure and development, the resist layer a _2,
A plane pattern which communicates with the recess for the bump, the plane patterns corresponding to the circuit pattern of the conductor circuit to be formed, and, if necessary step A ₁₅ to form a plane pattern corresponding to a circuit pattern of the land circuit Performing electroplating to electrodeposit a first conductive material on the bump recesses and the planar pattern, and then, on the formed layered body, at least one type of material different from the first conductive material. A conductive material is sequentially electrodeposited, and the bump recess, the conductor circuit and, if necessary, the land circuit are filled with a multilayer structure formed by laminating two or more kinds of conductive materials. the optionally step a ₁₆ collectively formed lands circuit; said optionally conductor circuit and optionally performing exposure and development after forming the resist layer a ₃ and covers the land portion circuit Wherein the resist layer a _3, Step A ₁₇ to form a first hole above if the conductor circuits and the need for communicating the land portion circuit; and, performing electroplating, conductive in said first hole 7. consisting of: step a ₁₈ to form a columnar conductor material electrodeposited
Method for manufacturing a circuit board. 12. A movable portion having at least an upper surface movable up and down at a predetermined position of the insulating substrate, wherein the upper surface of the movable portion is flush with the upper surface of the insulating substrate; / And a plurality of signal conductors extending to the movable portion are wired inside, and at least the tip is located at the movable portion, and at least two types of signal conductors are provided on the upper surface of the tip of the signal conductor. Bas pump type contact head bumps of electrically conductive material are sequentially electrodeposited to made multilayer structure is characterized in that it is projected. 13. The movable portion includes a through hole formed in a thickness direction of the insulating substrate and an elastic member provided in the through hole, and an upper surface of the elastic member is formed from an upper opening of the through hole. The bump-type contact head according to claim 12 , which is exposed. 14. The thin portion of the through-hole formed in a step structure in the thickness direction of the insulating substrate so that the upper surface side of the insulating substrate becomes a thin portion on the upper side of the insulating substrate. The upper opening has a quadrangular shape in plan view, and slits extending in the peripheral direction of the insulating substrate are formed at four corners of the quadrangular shape at least to the base of the thin portion in the step structure, and the thin portion in plan view is formed. Bas pump type contact head according to claim 12 shape which forms a tongue shape. 15. The movable portion is formed so as to have a step structure in a thickness direction of the insulating substrate so that an upper surface side of the insulating substrate becomes a thin portion, and a plan view shape of an upper opening is quadrangular, At the four corners, slits extending in the direction of the peripheral edge of the insulating substrate are engraved at least to the base of the thin portion in the step structure,
The plan view shape of the thin portion has a tongue-shaped through hole, and an elastic member disposed in the through hole, and the upper surface of the elastic member is exposed from an upper opening of the through hole. 13. The bump-type contact head according to claim 12 , wherein the signal conductor is wired up to an upper surface of the elastic member. 16. The bump type contact head according to claim 12 , wherein only the upper surface of the signal conductor is exposed on the upper surfaces of the insulating substrate and the movable portion. 17. The bump-type contact head according to claim 12 , wherein a push-up means for bulging an upper surface of the movable portion upward is provided below the movable portion. 18. The bump-type contact head according to claim 12 , wherein said pushing means is a sealed air chamber. 19. A through-hole is formed in the insulating substrate, the other end of the signal conductor is led out to the other surface of the insulating substrate through the through-hole, and a bump is formed at the tip. The bump-type contact head according to claim 12 , wherein 20. The bump-type contact head according to claim 12 , wherein said insulating substrate is entirely made of an elastic member. 21. A step of forming a first resist layer by covering the surface of a conductive thin plate, and then performing exposure and development treatments to expose the surface of the conductive thin plate at a position corresponding to a position of a bump to be formed. Etching the exposed surface of the conductive thin plate to form a bump dent on the exposed surface of the conductive thin plate and then removing the first resist layer; covering the exposed surface of the conductive thin plate; A step of exposing and developing the surface of the conductive thin plate with a planar pattern corresponding to a signal conductor pattern to be formed after forming a second resist layer; And electrodepositing a first conductive material on the planar pattern in a layered manner, and then further electrodepositing at least one type of conductive material different from the first conductive material on the formed layered body, Previous A step of filling the recesses for bumps and the plane pattern with a multilayer structure formed by laminating two or more types of conductive materials to form bumps and signal conductors at once; after removing the second resist layer, The expression surface,
A step of thermocompression bonding to a surface on the opening side of the insulating substrate in which a through-hole having an opening of a predetermined shape is formed; and, after filling a cavity formed by the through-hole and the conductive thin plate with an elastic member, Etching the conductive thin plate to expose the upper surfaces of the bumps and the signal conductors. 22. A step of forming at least one side of the conductive substrate to form a thin conductor layer by electroplating; forming a first resist layer by coating the thin conductor layer, and then performing an exposure / development process. Performing the first resist layer,
Exposing the other surface of the conductor thin layer by leaving only at the portion where the bump is to be formed; the first resist layer remaining on the portion where the bump is to be formed on the exposed surface of the conductor thin layer by electroplating Forming an electrodeposition layer by electrodepositing a conductive material flush with the surface; removing the first resist layer remaining at the bump formation scheduled portion, and forming a surface of the conductor thin layer on the electrodeposition layer. Forming a bump dent in which is exposed; forming a second resist layer by covering the surface of the electrodeposited layer; and performing exposure and development treatment to form a bump in the second resist layer. Exposing the surface of the electrodeposition layer with a plane pattern corresponding to the pattern of the signal conductor to be formed; performing electroplating to electrodeposit a first conductive material in a layered manner on the bump recesses and the plane pattern; , On the formed layered body, At least one conductive material different from the first conductive material is further electrodeposited sequentially, and the bump recess and the planar pattern are filled with a multilayer structure formed by laminating two or more conductive materials. And collectively forming signal conductors; after removing the second resist layer, the exposed surface is
A step of thermocompression bonding to a surface of the insulating substrate on which the through-hole having an opening of a predetermined shape is formed on the opening side; after filling a cavity formed by the through-hole and the electrodeposition layer with an elastic member, Removing the conductive substrate, and then sequentially etching and removing the conductive thin layer and the electrodeposited layer to expose the bumps and the signal conductors.