JPWO2009075207A1 - Transparent material processing method and transparent material processing apparatus - Google Patents

Abstract

A transparent material processing apparatus capable of accurately mass-producing through holes and holes with thin bottoms while utilizing the features of the LIBWE method. Therefore, the transparent material processing apparatus which makes the 1st fluid substance 14 which has an excitation reactivity with respect to a laser contact the back surface of the transparent material 15, and irradiates a laser from the surface of the transparent material 15, and processes it from the back surface of the transparent material 15. 10, the first container 12 containing the first fluid substance 14, the first opening 12 a provided in the first container 12 for bringing the back surface of the transparent material 15 into contact with the first fluid substance 14, A second container 13 that contains a second fluid substance 16 that is not excited to react with the laser and a second container 13 provided in the second container 13 in order to bring the surface of the transparent material 15 into contact with the second fluid substance 16. It is set as the structure provided with 2 opening part 13a.

Description

  The present invention relates to a so-called transparent material processing method in which a fluid substance that is excited to react with a laser is brought into contact with the back surface of a transparent material, and a laser is irradiated from the surface of the transparent material to process the back surface of the transparent material. It relates to the LIBWE method.

  Conventionally, it has been difficult to process a transparent material that hardly absorbs light using a direct laser etching method such as laser ablation or laser melting. For example, the following method is known as a processing technique for quartz glass.

  The multi-step lithography method is a method in which an appropriate resist is formed on a substrate surface, patterned by lithography, and etched using an ion beam, plasma, or hydrofluoric acid. However, since this method is based on a photolithography technique, it requires complicated steps such as resist coating, drying, exposure, development, etching, and peeling, and takes time.

  The ion etching method is a method of performing maskless chemical etching by using a difference in etching rate caused by the ion implantation method. However, this method requires an ion implantation apparatus that can collect light, and is not suitable for mass production because the processable range is small and the time efficiency is low.

  The short wavelength laser method is a method of performing dry etching using a laser that oscillates short wavelength light that can be absorbed by a transparent material. The ultrashort pulse laser method is a method of performing dry etching using an ultrashort pulse laser having a pulse width of picosecond or less. However, the short wavelength laser method and the ultrashort pulse laser method require a high vacuum environment, have low energy efficiency, and are not suitable for mass production.

  The laser-induced plasma method uses a plasma generated from a metal by irradiating a laser with a metal substrate placed behind the glass in a vacuum solution. However, in this method, since it is necessary to simultaneously adjust the laser density of the metal substrate surface and the glass surface, it is difficult to form an image of the mask, and a vacuum environment is required. Further, the metal is coated even in the unirradiated portion, the damage to the sample is great, and a cleaning step with an acid is necessary, which takes time.

  Therefore, in Patent Document 1, for a transparent material that is difficult to directly irradiate with a laser, a fluid material having a large light absorption rate is brought into contact with the back surface of the transparent material, and laser induced back surface wet processing using laser absorption of the fluid material. The method (LIBWE: laser-induced backside wet etching) has been proposed.

  Further, as a modification of Patent Document 1, Patent Document 2 discloses that a transparent material is brought into contact with a fluid substance having a large light absorption, and a laser beam having a specific beam shape is transmitted through a predetermined photomask. An optical element manufacturing method is disclosed in which a predetermined three-dimensional surface microstructure is processed in a transparent material by scanning a laser beam while irradiating from the above.

Patent Document 3 discloses that a workpiece is immersed in a solution in which fine particles are dispersed, and a high-intensity ultrashort pulse laser beam emitted from a high-intensity ultrashort pulse laser is transmitted to the front side of the workpiece. Self-focusing to focus on the position, irradiating the solution with pulses, and controlling the output intensity of the high-intensity ultrashort pulse laser, thereby generating self generated by the nonlinear optical effect of the solution induced by laser light The fine particles that balance the focusing and the diffraction of the laser beam so that the laser beam propagates toward the workpiece in a minute line shape in the solution and float in the solution in the minute line region. A laser-induced machining method is disclosed in which machining is performed by causing a workpiece to collide with the workpiece. This is a processing method by laser excitation, but is different from the above LIBWE method.
Japanese Patent No. 3012926 JP 2004-306134 A JP 2006-68789 A

  By the way, in the market, fine through holes are used as ink nozzles of ink jet printers, and with the widespread use of them, high-efficiency and high-precision processing methods for fine through holes are required. As proposed in Patent Document 1 and Patent Document 2, the LIBWE method is an excellent technique that can simultaneously process a large number of glasses with low energy by utilizing an excitation phenomenon.

  However, Patent Document 1 and Patent Document 2 do not consider opening a through hole. Since a fluid substance (mainly liquid) needs to be in contact with the processing surface, the liquid will flow out when trying to open a through hole. The liquid that has flowed out may cause serious damage to the light source system and drive system of the apparatus. Also, if you attempt to make a through hole or a hole with a thin bottom, the remaining part may be damaged due to the pressure difference between the atmospheric pressure on the front and back of the remaining part and the liquid when the remaining part becomes thin near the end of the penetration. In this case, cracks and chips may occur around the hole.

  An object of this invention is to provide the transparent material processing method and transparent material processing apparatus which can mass-produce a through-hole and a hole with a thin bottom with sufficient precision, utilizing the characteristic of LIBWE method.

  In order to achieve the above object, according to the present invention, a first fluid substance that is excited to react with a laser is brought into contact with the back surface of the first transparent material, and the first transparent material is irradiated with the laser from the surface of the first transparent material. In a transparent material processing method in which processing is performed from the back surface of a transparent material, processing is performed by bringing a second fluid material having no excitation reactivity with respect to the laser or a dummy second transparent material into contact with the surface of the first transparent material. It is characterized by.

  According to this configuration, the first fluid substance is brought into contact with the back surface of the first transparent material, and the second fluid substance is brought into contact with the surface of the first transparent material. When the laser is irradiated toward the first transparent material, there is no change on the surface on the laser incident side of the first transparent material, but the surface of the first transparent material in contact with the first fluid substance is a laser irradiated portion. Etching can be performed selectively only on the surface. According to this configuration, the first fluid substance is brought into contact with the back surface of the first transparent material, and the second transparent material is brought into contact with the surface of the first transparent material. When the laser is irradiated toward the first and second transparent materials, there is no change on the surface of the first transparent material on the laser incident side, but on the surface of the first transparent material in contact with the first fluid substance. Etching can be selectively performed only on the laser irradiated portion.

  In the above transparent material processing method, the second transparent material is preferably a substrate or a gel. Thereby, the 2nd transparent material can be stuck to the 1st transparent material.

  In the above transparent material processing method, the second transparent material may be bonded to the first transparent material using an adhesive having no excitation reactivity with the laser. This eliminates the need for a fixing means for fixing the second transparent material to the transparent material processing apparatus, simplifying the apparatus and simplifying the attaching / detaching operation.

  In the transparent material processing method described above, it is desirable that the first transparent material and the second transparent material are the same material. Thereby, it is not necessary to prepare another material for the second transparent material.

  In the above transparent material processing method, it is desirable that the first fluid substance is a solution and the second fluid substance is the same as the solvent of the first fluid substance. Thereby, there is no possibility of reacting even if the first fluid substance and the second fluid substance are mixed when the through hole is processed.

  As the solvent, water, acetone, ethanol, THF, or the like can be used.

  In the above transparent material processing method, specifically, the first and second fluid substances are accommodated in the first and second containers, respectively, and at least the second container is configured to transmit the laser.

  In the above transparent material processing method, after processing the first transparent material, the first and second fluid substances are accommodated in the third and fourth containers through the first and second paths, respectively. It is desirable. Thereby, replacement | exchange of a 1st transparent material becomes easy.

  Furthermore, before processing the first transparent material, the first and second fluid substances are accommodated in the first and second containers from the third and fourth containers through the first and second paths, respectively. It is desirable. This facilitates the reuse of the first and second fluid substances.

  Moreover, the transparent material processing apparatus using the above-described transparent material processing method brings a fluid substance having an excitation reactivity with a laser into contact with the back surface of the first transparent material, and irradiates the laser from the surface of the first transparent material. Then, in the transparent material processing apparatus for processing from the back surface of the first transparent material, an opening provided in the container for bringing the fluid material into contact with the fluid material and the back surface of the first transparent material in contact with the fluid material And a dummy second transparent material is processed in contact with the surface of the first transparent material.

  In the transparent material processing apparatus, the second transparent material is preferably a substrate or a gel.

  In the transparent material processing apparatus, the second transparent material may be bonded to the first transparent material by using an adhesive having no excitation reactivity to the laser.

  In the transparent material processing apparatus, it is desirable that the first transparent material and the second transparent material are the same material.

  The present invention also provides a transparent material processing in which a first fluid substance that is reactive to a laser is brought into contact with the back surface of a transparent material, and laser is irradiated from the surface of the transparent material to process from the back surface of the transparent material. In the apparatus, a first container containing a first fluid substance, a first opening provided in the first container to bring the back surface of the transparent material into contact with the first fluid substance, and excitation for the laser A second container for containing a non-reactive second fluid substance, and a second opening provided in the second container for bringing the surface of the transparent material into contact with the second fluid substance. And

  According to this configuration, the first fluid substance is brought into contact with the back surface of the transparent material, and the second fluid substance is brought into contact with the surface of the transparent material. Then, when the laser is irradiated from the outside of the second container toward the transparent material, there is no change on the surface on the laser incident side of the transparent material, but on the surface of the transparent material in contact with the first fluid substance, the laser irradiation portion Etching can be performed selectively only on the surface.

  In the transparent material processing apparatus, it is desirable that the first fluid substance is a solution and the second fluid substance is the same as the solvent of the first fluid substance. Thereby, there is no possibility of reacting even if the first fluid substance and the second fluid substance are mixed when the through hole is processed.

  As the solvent, water, acetone, ethanol, THF, or the like can be used.

  In the transparent material processing apparatus, specifically, at least the second container is configured to transmit the laser.

  The transparent material processing apparatus may further include a third container, a fourth container, a first path connecting the first and third containers, and a second path connecting the second and fourth containers. After the processing, it is preferable that the first and second fluid substances are accommodated in the third and fourth containers through the first and second paths, respectively. This facilitates replacement of the transparent material.

  Furthermore, before processing the transparent material, it is preferable that the first and second fluid substances are accommodated in the first and second containers from the third and fourth containers through the first and second paths, respectively. This facilitates the reuse of the first and second fluid substances.

  According to the present invention, since the second fluid substance is brought into contact with the surface of the transparent material, the second fluid substance and the first fluid on the front and back of the remaining meat when the processed part is close to the penetration and the remaining meat becomes thin. Since there is no pressure difference with the active substance, no force is applied to the remaining portion, and there is no breakage, cracking or chipping. Therefore, the machining accuracy can be dramatically improved.

  Further, since the second transparent material is brought into contact with the surface of the first transparent material, the second transparent material holds down the remaining meat even when the remaining thickness becomes thin in the vicinity of the penetration. The remaining portion is not damaged, and neither cracks nor chipping occurs. Therefore, the machining accuracy can be dramatically improved.

  Further, even when the first transparent material penetrates, the second transparent material seals the fluid substance, so that the fluid substance does not flow out. Therefore, damage to the light source system and the drive system can be prevented.

  According to the present invention, the first and second containers can be replaced with new transparent materials by retracting the first and second fluid substances using the third and fourth containers. Since it is not necessary to remove the fluid material from the upper surface, workability is improved and it is suitable for mass production.

It is a typical sectional side view of the transparent material processing apparatus of this invention. It is a sectional side view of the 1st and 2nd container which shows the other installation form of the transparent material of this invention. It is a sectional side view of the 1st and 2nd container of the other form of this invention. It is a sectional side view of the 1st and 2nd container of the other form of this invention. It is a typical sectional side view of the transparent material processing apparatus of other embodiment of this invention. It is a figure of the state which opened the 1st and 2nd valve of FIG. It is the figure which reinject | poured the 1st and 2nd fluid substance into the 1st and 2nd container from the state of FIG. It is a typical sectional side view of the transparent material processing apparatus of other embodiment of this invention. It is the figure which discharged | emitted the 1st and 2nd fluid substance to the 3rd and 4th container from the state of FIG. It is a typical sectional side view of the transparent material processing apparatus of the other form of this invention. It is a sectional side view of the container which shows the other installation form of the transparent material of this invention. It is a typical sectional side view of the transparent material processing apparatus of the other form of this invention. It is a typical sectional side view of the transparent material processing apparatus of the other form of this invention.

Explanation of symbols

10, 20, 30, 40, 50, 60 Transparent material processing apparatus 12 1st container 12a 1st opening part 13 2nd container 13a 2nd opening part 14 1st fluid substance 15 1st transparent material 16 2nd fluid substance 21 First path 22 Second path 23 Third container 24 Fourth container 41 Second transparent material 43 Adhesive

  FIG. 1 is a schematic sectional side view of the transparent material processing apparatus of the present invention. The transparent material processing apparatus 10 brings the first fluid substance 14 that is excited to react with the laser into contact with the back surface of the first transparent material 15, and irradiates the laser from the surface of the first transparent material 15 to make the first transparent material. It is an apparatus for processing from the back surface of the material 15. Therefore, the transparent material processing apparatus 10 includes a laser device 11, a first container 12 that contains a first fluid material 14 that is excited to react with the laser, and a back surface of the first transparent material 15 as a first fluid material. 14, a first opening 12 a provided in the first container 12, a second container 13 containing a second fluid substance 16 having no excitation reactivity with the laser, and a first transparent material 15. And a second opening 13a provided in the second container 13 for bringing the surface of the second container into contact with the second fluid substance.

  The first transparent material 15 only needs to be transparent to the laser wavelength used. For example, quartz glass, general glass, calcium fluoride, magnesium fluoride, barium fluoride, lithium fluoride, silicon carbide, alumina, sapphire, crystal, diamond, inorganic materials, polycarbonate resin, acrylic resin, vinyl resin, Examples thereof include plastic materials such as fluororesin, organic glass, organic crystals / solid compounds, and mixtures thereof. The form of the first transparent material 15 may be an arbitrary shape such as a container shape or a tubular shape in addition to the substrate shape shown in FIG. The thickness of the first transparent material 15 can be about 10 μm to several mm.

  The laser device 11 includes a laser light source system 17 that oscillates a laser, and a scanning optical system 18 that adjusts the oscillated laser into a desired shape and also moves the focal point. As lasers, ArF (λ = 193 nm), KrCl (λ = 222 nm), KrF (λ = 248 nm), XeCl (λ = 308 nm), XeF (λ = 351 nm) excimer laser, YAG laser, YVO laser, YLF laser, A fundamental oscillation wavelength light such as a dye laser, a carbon dioxide gas laser, a Kr ion laser, an Ar ion laser, a copper vapor laser, a titanium sapphire laser, and the fundamental oscillation wavelength light converted by a nonlinear optical element or the like can be used. For example, the YAG laser includes a second harmonic (λ = 532 nm), a third harmonic (λ = 355 nm), a fourth harmonic (λ = 266 nm), and the like.

And although the laser intensity for performing etching changes with absorption of the 1st fluid substance with respect to a laser wavelength, 0.01-100 J / cm < ² > / pulse is preferable. More preferably, it is 0.1-10 J / cm < ² > / pulse. If the laser intensity is too weak, etching does not occur, and if it is too strong, the first transparent material 15 is damaged.

  Note that an optical system that cannot be scanned instead of the scanning optical system 18 may be used to scan the first transparent material 15 side during etching. Further, a desired shape may be etched using a photomask or the like.

  The second container 13 only needs to have transparency, that is, laser transparency, at least a portion irradiated with the laser with respect to the laser wavelength to be used. For example, the same material as that which can be used for the first transparent material 15 described above can be used. On the other hand, the first container 12 need not be the same material as the second container, and may be a material that absorbs laser. The thickness of the wall surfaces of the first container 12 and the second container 13 is not particularly limited, but a thickness of several mm is sufficient. The 1st container 12 and the 2nd container 13 can be made into the shape by which the upper surface of the rectangular parallelepiped was open | released, for example, as shown in FIG. A lid may be provided on the opened upper surface to prevent foreign matter from entering. The first fluid substance 14 or the second fluid substance 16 and the first transparent material 15 are replaced from the upper surface.

  The first opening 12a and the second opening 13a are openings that are slightly smaller than the first transparent material 15. In FIG. 1, the two openings 12a and 13a have a rectangular shape with the same size. Moreover, in FIG. 1, the 1st transparent material 15 is being fixed to the inner surface of the 2nd container 13 of the 2nd opening part 13a via the O-ring (not shown). A fixing means such as a screw, clip or clamp may be used for this fixing.

  The first transparent material 15 may be fixed to the inner surface of the first container 12 of the first opening 12a as shown in FIG. 2, or the first container of the first opening 12a as shown in FIG. While fixing to an outer surface via an O-ring, you may fix to the 2nd container outer surface of the 2nd opening part 13a via an O-ring. Moreover, as shown in FIG. 4, the wall surface between the 1st container 12 and the 2nd container 13 may be made into one sheet, and may be shared. That is, the first container 12 and the second container 13 are integrated. In this case, the first opening 12a and the second opening 13a form one opening, and the first transparent material 15 may be fixed to either side of the opening.

  Moreover, the side wall itself of the 1st container 12 or the 2nd container 13 can also be processed. In this case, the first opening 12a or the second opening 13a is used as a wall surface, and the wall surface is processed.

  The first fluid substance 14 may be any substance having a high absorption rate with respect to the laser wavelength used. For example, pyrene in acetone solution, benzyl in acetone solution, pyrene in tetrahydrofuran (THF) solution, rhodamine 6G in ethanol solution, phthalocyanine in ethanol solution such as benzene, toluene, tetrachloride Examples include liquid compounds such as carbon. Also, solutions made by dispersing fine particles of pyranine aqueous solution, naphthalene derivative aqueous solution, organic compound, organic dye, inorganic pigment, or carbon, fine particles or microcrystal such as organic compound, organic dye, inorganic pigment, or carbon powder. The fluid powder made with Furthermore, a fluid material made by mixing two or more of the above-mentioned materials can also be used.

  These substances need to have a high absorptance with respect to the laser wavelength to be used. For example, the depth of 0.1 mm from the interface between the first fluid substance 14 and the first transparent material 15 to the inside of the fluid substance. It is preferable to have an absorption rate of 10% or more. More preferably, it has an absorption rate of 50% or more at a depth of 0.1 mm. If the absorption rate is not sufficiently high, the etching is not sufficiently refined and refined.

  The second fluid substance 16 may be any substance that is transparent to the laser wavelength used. For example, water, acetone, ethanol, THF, or the like mentioned as the solvent for the first fluid substance 14 described above can be used. Since the second fluid substance 16 needs to not chemically react when mixed with the first fluid substance 14, it is desirable to use the same solvent as the solvent of the first fluid substance 14.

  Next, the processing method of the 1st transparent material 15 using said transparent material processing apparatus 10 is demonstrated using FIG. First, the first transparent material 15 is moved from the opened upper surface of the second container 13 into the second container 13 as shown in FIG. 1 and fixed so as to be in close contact with the second opening 13a. Subsequently, the first fluid substance 14 is injected into the first container 12 and the second fluid substance 16 is injected into the second container 13 from the upper surface thereof. Each fluid substance is poured at least above the processing position of the first transparent material 15. Be careful not to mix the bubbles. This is because the bubbles hinder processing.

  As a result, the first fluid substance 14 is brought into contact with the back surface of the first transparent material 15, and the second fluid substance 16 is brought into contact with the surface of the first transparent material 15. Next, laser irradiation is performed from the outside of the second container 13 toward the first transparent material 15. That is, the laser is irradiated from the surface of the first transparent material 15. The laser is focused on the contact surface between the back surface of the first transparent material 15 and the first fluid substance 14.

  The incident angle of the laser with respect to the 1st transparent material 15 can be set arbitrarily, and the laser should just reach | attain the contact surface of the 1st fluid substance 14 and the 1st transparent material 15. Further, it is optional to irradiate a single laser beam or a plurality of laser beams simultaneously or successively, and at least one laser beam passes through the first transparent material 15 and the first fluid substance 14 and the first laser beam. The contact surface with 1 transparent material 15 may be irradiated. Therefore, as described above, it can be performed by an arbitrary method such as a method of condensing a laser with a lens and directly irradiating it, or a method of irradiating through a photomask.

  When the laser is irradiated in this way, there is no change on the surface on the laser incident side of the first transparent material 15, but only the laser irradiated portion is on the surface of the first transparent material 15 in contact with the first fluid substance 14. Etching can be performed selectively. In addition, a clear etching pattern having a line width of several μm can be formed by laser irradiation through the mask pattern. In addition, the etched portion is not chemically degraded or damaged. The etching rate depends on the laser intensity, and the etching process can be precisely controlled. In addition, since the etching depth increases in proportion to the number of laser pulses, the etching depth can be precisely controlled.

  The working temperature is not particularly limited as long as the fluidity of the first fluid substance 14 is maintained. Furthermore, means for improving the stability of etching, for example, a method of circulating the first fluid substance 14 or a method of stirring may be used.

  In the above embodiment, an example is shown in which the first transparent material 15 is supported vertically and processed by a horizontal laser. However, the first transparent material 15 is supported horizontally and the incident light is irradiated from the vertical direction. It can also be implemented by a method. In that case, since it is desirable to continuously remove bubbles generated by laser ablation, the first fluid substance 14 formed on the back surface of the first transparent material 15 is circulated or stirred, It is desirable to eliminate the influence of bubbles by a technique such as spraying the first fluid substance 14 on the back surface of the transparent material 15.

  According to the transparent material processing apparatus 10 and the processing method described above, etching can be performed in one step compared to the need for a multi-step process by a multi-step lithography method. Moreover, a vacuum atmosphere is unnecessary. In addition, damage to the unirradiated portion can be avoided as compared with the laser induced plasma method. Moreover, either a method of condensing the laser directly or a method of irradiating through a mask is possible. Moreover, energy efficiency is good because of the low laser intensity, and the target range of materials that can be etched is widened. Further, because of the low laser intensity, pattern-like etching can be performed through a mask, and the accuracy of the etching pattern is 10 μm or less. In addition, since the etching rate can be controlled and the chemical composition of the etched surface is not changed, the processing method of the present invention is a method that can be miniaturized, refined, and improved in quality, and at a very low cost. It is a method that is rich in mass productivity.

  In addition, with the transparent material processing apparatus 10 and the processing method described above, through holes and holes with thin bottoms can be mass-produced with high accuracy. Also in this case, as described above, etching is performed from the back surface of the first transparent material 15, and if the etching is continued until it penetrates, a through hole is obtained, and if etching is finished immediately before the penetration, a thin hole at the bottom is obtained. it can.

  In this etching process, when the second fluidic substance 16 is not used as in the prior art, when the remaining meat becomes thin in the vicinity of penetration, the pressure difference between the atmospheric pressure on the front and back of the remaining meat and the first fluidic substance 14 May cause damage to the remaining portion, and if it is damaged, cracks and chipping may occur around the hole. This becomes more prominent as the diameter of the through hole or the hole with a thin bottom increases.

  In contrast, when the second fluid substance 16 is in contact with the surface of the first transparent material 15 as in the present invention, the second fluidity on the front and back of the remaining meat is reduced when the remaining meat is thinned near the penetration. Since there is no pressure difference between the substance 16 and the first fluid substance 14, no force is applied to the remaining portion, and no breakage, cracks or chips occur.

  Thus, when processing a through hole or a hole having a thin bottom, the processing accuracy can be dramatically improved by bringing the second fluid substance 16 into contact with the surface of the first transparent material 15. In addition, the shape of the through hole or the hole with a thin bottom can be processed into an arbitrary shape such as a circle, an ellipse, or a polygon. In addition, when the shape of the through hole or the thin hole at the bottom is a circle, the diameter can be processed if it is 0.01 mm or more, and can be optimally processed up to about 0.1 mm. Since holes of this size can be processed in large quantities with high accuracy, it can be used, for example, for processing inkjet nozzles.

  Next, another embodiment of the transparent material processing apparatus of the present invention will be described. FIG. 5 is a schematic sectional side view of a transparent material processing apparatus according to another embodiment of the present invention. The transparent material processing apparatus 20 is different from the transparent material processing apparatus 10 in FIG. 1 in that the first path 21 connected to the first container 12, the second path 22 connected to the second container 13, and the first path 21 are connected. That is, a third container 23 and a fourth container 24 connected to the second path 22 are provided.

  In FIG. 5, holes that are the first paths 21 are formed on the bottom surface of the first container 12, and holes that are the second paths 22 are formed on the bottom surface of the second container 13. The third container 23 is positioned below the first path 21, and the fourth container 24 is positioned below the second path 22. Further, a first valve 25 is provided on the upper surface of the first path 21, and a second valve 26 is provided on the upper surface of the second path 22. The first container 12 and the second container 13 may use the forms as shown in FIGS.

  In addition, the 1st path | route 21 and the 2nd path | route 22 may use a pipe | tube, in that case, a pipe | tube may be connected to the bottom face of the 1st container 12 and the 2nd container 13, and the 1st container 12 and the 1st path | route. You may connect to the side surface near the bottom face of the two containers 13.

  The third container 23 is slightly larger than the first container 12, and the upper surface thereof is opened. Similarly, the 4th container 24 is one size larger than the 2nd container 13, and the upper surface is open | released. Moreover, the wall surface 27 between the 3rd container 23 and the 4th container 24 is made into one sheet, and is shared. That is, the third container 23 and the fourth container 24 are integrated. The wall surface 27 can be folded up and down, and for example, a bellows resin can be used. The upper end of the wall surface 27 is fixed between the first path 21 and the second path 22 and in close contact with the bottom surface of the first container 12 or the second container 13. The third container 23 and the fourth container 24 are not particularly limited as long as the third container 23 and the fourth container 24 are made of a material that is not deteriorated by the first fluid substance 14 and the second fluid substance 16.

  The first valve 25 only needs to move or block the first fluid substance 14 between the first container 12 and the third container 23 through the first path 21. Similarly, the second valve 26 It is sufficient if the second fluid substance 16 can be moved between the second container 13 and the fourth container 24 through the two paths 22 or can be damped. For example, an electromagnetic valve or the like can be used. In FIG. 5, the first valve 25 and the second valve 26 are provided so as to cover the upper surface of the first path 21 or the upper surface of the second path 22, respectively, but the positions thereof are not particularly limited, and the first path 21 or the second path 22 may be provided in or on the lower surface. Note that other damming means such as a cock may be used instead of the valve.

  Next, the processing method of the 1st transparent material 15 using said transparent material processing apparatus 20 is demonstrated using FIGS. First, the first transparent material 15 is moved from the opened upper surface of the second container 13 into the second container 13 as shown in FIG. 5 and fixed so as to be in close contact with the second opening 13a. Subsequently, the first fluid substance 14 is injected into the first container 12 and the second fluid substance 16 is injected into the second container 13 from the upper surface thereof. At this time, the first valve 25 and the second valve 26 are closed. Each fluid substance is poured at least above the processing position of the first transparent material 15.

  Next, laser irradiation is performed from the outside of the second container 13 toward the first transparent material 15. Since this is the same as the method described in FIG. 1, the description thereof is omitted here. When the processing is completed, the laser irradiation is stopped, the first valve 25 is opened as shown in FIG. 6, and the first fluid substance 14 in the first container 12 falls to the third container 23 through the first path 21. To be accommodated. Similarly, the second fluid substance 16 in the second container 13 is dropped and accommodated in the fourth container 24 through the second path 22. Thereafter, the first transparent material 15 is taken out.

  When processing a new first transparent material 15 continuously, the first transparent material 15 is similarly attached in this state. Then, with the first valve 25 and the second valve 26 opened as shown in FIG. 7, the third container 23 and the fourth container 24 are gradually and slowly lifted so that the fluid substance does not spill out. As a result, the first fluidic substance 14 and the second fluidic substance 16 pass through the first container 21 and the second container 13 from the third container 23 and the fourth container 24 through the first path 21 and the second path 22, respectively. Is housed. When the first fluid substance 14 and the second fluid substance 16 have sufficiently moved to the first container 12 and the second container 13, the first valve 25 and the second valve 26 are closed, and the third container 23 and the fourth container The container 24 is moved downward and returned to the position shown in FIG. Then, it processes by laser irradiation.

  As described above, since the third container 23 and the fourth container 24 are used, it is not necessary to remove the fluid substance from the upper surfaces of the first container 12 and the second container 13 in order to replace with a new transparent material. It is suitable for mass production.

  Further, the first fluid substance 14 can be circulated by moving the first fluid substance 14 to the third container 23 and returning it to the first container 12 again. When processing a transparent substrate having a large area, The influence of the deterioration of the first fluid substance 14 in the vicinity of the etching that can occur can be reduced. Therefore, the etching accuracy can be maintained and the reproducibility of the etching can be improved.

  In addition, said transparent material processing apparatus 20 is good also as a form like the transparent material processing apparatus 30 shown in FIG. The transparent material processing apparatus 30 omits the first valve 25 and the second valve 26 from the transparent material processing apparatus 20, and at least the portion irradiated with the laser on the side surface 24a of the fourth container 24 corresponds to the laser wavelength used. It is set as the structure which has transparency.

  According to this configuration, laser irradiation can be performed in a state where the first and second containers 12 and 13 and the third and fourth containers 23 and 24 are overlapped as shown in FIG. And when replacing | exchanging the 1st transparent material 15, the 1st and 2nd containers 12 and 13 are lifted like FIG. As a result, the first and second fluid substances 14 and 16 move to the third and fourth containers 23 and 24 through the first and second paths 21 and 22, respectively, so that the first transparent material 15 can be easily replaced. Can do. And the 1st valve 25 and the 2nd valve 26 become unnecessary.

  In the present invention, when the through hole is processed, it is considered that the first and second fluid substances 14 and 16 are mixed with each other through the through hole. However, the concentration of the first fluid substance 14 is slightly reduced due to the slight mixing. However, since the absorption rate of the laser hardly changes, it can be reused sufficiently. On the other hand, even if the first fluid substance 16 is mixed to some extent with the second fluid substance 14 and the second fluid substance has a concentration of several percent, it is far from the concentration that reacts with the laser, and the focal point of the laser is also made of the transparent material. Since it is on the back surface, the surface of the transparent material is not processed by the laser even if the second fluid substance 16 is reused. Therefore, when processing a through-hole, the 1st fluid substance 14 and the 2nd fluid substance 16 can be reused many times, and it is economical.

  Next, still another embodiment of the transparent material processing apparatus of the present invention will be described. FIG. 10 is a schematic sectional side view of the transparent material processing apparatus of the present invention. The transparent material processing apparatus 40 brings the first fluid substance 14 that is excited to react with the laser into contact with the back surface of the first transparent material 15, and irradiates the laser from the surface of the first transparent material 15 to make the first transparent material. It is an apparatus for processing from the back surface of the material 15. Therefore, the transparent material processing apparatus 40 includes the laser device 11, the first container 12 that contains the first fluid material 14 that is excited to react with the laser, and the back surface of the first transparent material 15 as the first fluid material. 14 is provided with a first opening 12 a provided in the first container 12 for contacting with the first container 12.

  The second transparent material 41 is in contact with the surface of the first transparent material 15 in close contact. When the first transparent material 15 is processed, the second transparent material 41 prevents the damage that occurs when the processed portion is close to penetrate and the remaining thickness becomes thin, and the first fluid substance 14 that occurs when the processed portion penetrates. It is a dummy material that is held down to prevent the outflow of water.

  The second transparent material 41 only needs to be transparent to the laser wavelength used. For example, the materials and gels exemplified for the first transparent material 15 can be used. Examples of the gel include alpha gel (manufactured by Geltech Co., Ltd.) mainly composed of silicone. The form of the second transparent material 41 is in close contact with the first transparent material 15, so long as the form is in line with the form of the first transparent material 15, in addition to the substrate shape shown in FIG. Any shape may be used. And what is necessary is just the magnitude | size which covers a process part at least. Moreover, the thickness of the second transparent material 41 can be about 10 μm to several mm. If the first transparent material 15 itself is used as the second transparent material 41, the second transparent material 41 used as a dummy can be used later as the first transparent material 15 without waste.

The laser intensity for etching varies depending on the absorption of the first fluid substance 14 with respect to the laser wavelength, but is preferably 0.01 to 100 J / cm ² / pulse. More preferably, it is 0.1-10 J / cm < ² > / pulse. If the laser intensity is too weak, etching does not occur, and if it is too strong, the first transparent material 15 is damaged.

  Note that an optical system that cannot be scanned instead of the scanning optical system 18 may be used to scan the first transparent material 15 side during etching. Further, a desired shape may be etched using a photomask or the like.

  The first transparent material 15 is fixed to the outer surface of the first container 12 of the first opening 12a via an O-ring (not shown) or the like. The second transparent material 41 is in close contact with the first transparent material 15. For fixing the first transparent material 15 and the second transparent material 41, a fixing means such as a screw, clip or clamp may be used.

  In addition, you may fix the 1st transparent material 15 and the 2nd transparent material 41 to the inner surface of the 1st opening part 12a like FIG. Moreover, the side wall itself of the first container 12 can be processed. In this case, the first opening 12a is used as a wall surface, and the wall surface is processed.

  Next, the processing method of the 1st transparent material 15 using said transparent material processing apparatus 40 is demonstrated using FIG. First, the first transparent material 15 is fixed so as to be in close contact with the first opening 12a. Subsequently, the second transparent material 41 is fixed so as to be in close contact with the surface side of the first transparent material 15. And the 1st fluid substance 14 is inject | poured into the 1st container 12 from the upper surface. The first fluid substance 14 is poured at least above the processing position of the first transparent material 15. Be careful not to mix the bubbles. This is because the bubbles hinder processing.

  Thus, the first fluid substance 14 is brought into contact with the back surface of the first transparent material 15 and the second transparent material 41 is brought into contact with the surface of the first transparent material 15. Next, laser is irradiated from the surface side of the second transparent material 41. That is, the laser is irradiated from the surface of the first transparent material 15. The laser is focused on the contact surface between the back surface of the first transparent material 15 and the first fluid substance 14.

  The incident angle of the laser with respect to the 1st transparent material 15 and the 2nd transparent material 41 can be set arbitrarily, and the laser should just reach | attain the contact surface of the 1st fluid substance 14 and the 1st transparent material 15. Further, it is optional to irradiate a single laser beam or a plurality of laser beams simultaneously or successively, and at least one laser beam is formed between the first fluid substance 14 and the first transparent material 15. What is necessary is just to irradiate a contact surface. Therefore, as described above, it can be performed by an arbitrary method such as a method of condensing a laser with a lens and directly irradiating it, or a method of irradiating through a photomask.

  When the laser is irradiated in this way, there is no change on the surface on the laser incident side of the first transparent material 15, but only the laser irradiated portion is on the surface of the first transparent material 15 in contact with the first fluid substance 14. Etching can be performed selectively. In addition, a clear etching pattern having a line width of several μm can be formed by laser irradiation through the mask pattern. In addition, the etched portion is not chemically degraded or damaged. The etching rate depends on the laser intensity, and the etching process can be precisely controlled. In addition, since the etching depth increases in proportion to the number of laser pulses, the etching depth can be precisely controlled.

  The working temperature is not particularly limited as long as the fluidity of the first fluid substance 14 is maintained. Furthermore, means for improving the stability of etching, for example, a method of circulating the first fluid substance 14 or a method of stirring may be used.

  In the above embodiment, an example is shown in which the first transparent material 15 is supported vertically and processed by a horizontal laser. However, the first transparent material 15 is supported horizontally and the incident light is irradiated from the vertical direction. It can also be implemented by a method. In that case, since it is desirable to continuously remove bubbles generated by laser ablation, the first fluid substance 14 formed on the back surface of the first transparent material 15 is circulated or stirred, It is desirable to eliminate the influence of bubbles by a technique such as spraying the first fluid substance 14 on the back surface of the transparent material 15.

  A specific example of such a transparent material processing apparatus is shown in FIG. In the transparent material processing apparatus 50 of FIG. 12, the laser is oscillated from the laser light source system 17 in the horizontal direction, reflected at a right angle by the reflecting mirror 42, guided vertically upward, shaped by the scanning optical system 18, and second transparent material 41 is incident from the lower side, passes through the upper side of the first transparent material 15, and is absorbed by the first fluid substance 14.

  Here, the first container 12 'has a shape having an open surface in which one surface of a rectangular parallelepiped is opened. The first fluid substance 14 is exchanged from the open surface, and the end of the open surface is fixed to the first transparent material 15 via an O-ring (not shown) or the like, thereby leaking the first fluid substance 14. The first transparent material 15 is attached to the transparent material processing apparatus 10 with the first transparent material 15 facing downward. Then, the second transparent material 41 is brought into close contact with the first transparent material 15. For fixing the first transparent material 15 and the second transparent material 41, a fixing means such as a screw, clip or clamp may be used.

  A method for processing the first transparent material 15 using the transparent material processing apparatus 50 will be described with reference to FIG. First, the first fluid substance 14 is injected into the first container 12 ′, and the first transparent material 15 and the second transparent material 41 are attached to the open surface of the first container 12 ′. Then, the first container 12 ′ is turned upside down so that the first transparent material 15 and the second transparent material 41 face downward, and attached to a predetermined position above the scanning optical system 18. At this time, care is taken so that bubbles do not mix with the first fluid substance 14. This is because the bubbles hinder processing.

  Thus, the first fluid substance 14 is brought into contact with the back surface of the first transparent material 15. Next, the laser is irradiated from the lower side of the second transparent material 41. That is, the laser is irradiated from the surface of the first transparent material 15. The laser is focused on the contact surface between the back surface of the first transparent material 15 and the first fluid substance 14. Such a transparent material processing apparatus 50 can also realize the processing method of the present invention.

  Alternatively, the second transparent material 41 may be bonded to the first transparent material 15 using an adhesive. FIG. 13 is a schematic sectional side view of the transparent material processing apparatus 60. Of course, this configuration can also be applied to the apparatus shown in FIGS. The transparent material processing device 60 is different from the transparent material processing device 40 of FIG. The fixing means is omitted. In addition, what is necessary is just to provide the adhesive agent 43 in a process part at least.

  As the adhesive 43, it is sufficient that the second transparent material 41 and the first transparent material 15 can be bonded and have transparency with respect to the laser wavelength to be used. Furthermore, it is desirable that separation is easy. For example, hard lock OP (manufactured by Denki Kagaku Kogyo Co., Ltd.) which is an enthiol resin-based UV curable adhesive, hard lock UV (manufactured by Denki Kagaku Kogyo Co., Ltd.) which is an acrylic UV curable adhesive, and polyvinyl butyral resin-based adhesive. An agent or the like can be used. Further, the thickness of the adhesive 43 can be set to several μm to several mm.

  Next, the processing method of the 1st transparent material 15 using said transparent material processing apparatus 60 is demonstrated using FIG. First, the adhesive 43 is applied to the second transparent material 41 or / and the first transparent material 15 to bond the first transparent material 15 and the second transparent material 41. Subsequently, the first transparent material 15 is fixed so as to be in close contact with the first opening 12a. Since subsequent processing methods are the same as those of the transparent material processing apparatus 40 described above, description thereof will be omitted.

  After the processing, the bonded second transparent material 41 and first transparent material 15 are removed from the transparent material processing apparatus 60, and depending on the type of adhesive 43 and the materials of the first and second transparent materials 16 and 17. The second transparent material 41 and the first transparent material 15 are separated by an appropriate method. Examples of the separation method include a method of dissolving the adhesive 43 with an organic solvent, burning the adhesive 43 at a high temperature, and sublimating the adhesive 43 by plasma irradiation.

  In this way, by bonding the second transparent material 41 to the first transparent material 15 using an adhesive, a fixing means for fixing the second transparent material 41 to the transparent material processing apparatus 30 becomes unnecessary, and the apparatus is It can be simplified and attachment / detachment work is also simplified. In addition, since the fixing with the adhesive 43 is more stable than the fixing with a clamp or the like, this is an optimum method when the second transparent material 41 and the first transparent material 15 have a large area.

  According to the above-described transparent material processing apparatuses 40, 50, and 60 and the processing method, etching can be performed in one step as compared with the need for a multi-step process by a multi-step lithography method. Moreover, a vacuum atmosphere is unnecessary. In addition, damage to the unirradiated portion can be avoided as compared with the laser induced plasma method. Moreover, either a method of condensing the laser directly or a method of irradiating through a mask is possible.

  Moreover, energy efficiency is good because of the low laser intensity, and the target range of materials that can be etched is widened. Further, because of the low laser intensity, pattern-like etching can be performed through a mask, and the accuracy of the etching pattern is 10 μm or less. In addition, since the etching rate can be controlled and the chemical composition of the etched surface is not changed, the processing method of the present invention is a method that can be miniaturized, refined, and improved in quality, and at a very low cost. It is a method that is rich in mass productivity.

  In addition, the transparent material processing apparatuses 40, 50, 60 and the processing method described above can mass-produce through holes and holes with thin bottoms with high accuracy. Also in this case, as described above, if the etching is continued from the back surface of the first transparent material 15 and the etching is continued until the second transparent material 41 is partially etched, a through hole is obtained, and the etching is terminated immediately before the penetration. If so, a hole with a thin bottom can be obtained.

  In this etching process, when the second transparent material 41 is not used as in the prior art, when the remaining thickness becomes thin near the penetration, the pressure difference between the atmospheric pressure on the front and back of the remaining thickness and the first fluid substance 14 The remaining portion may be damaged, and if it is damaged, cracks or chips may be generated around the hole. This becomes more prominent as the diameter of the through hole or the hole with a thin bottom increases.

  In contrast to this, when the second transparent material 41 is in contact with the surface of the first transparent material 15 as in the present invention, the second transparent material 41 removes the remaining meat even when the remaining thickness becomes thin immediately before penetration. As a result, the remaining portion is not damaged by the pressure of the first fluid substance 14, and neither cracks nor chipping occurs.

  Moreover, when the 2nd transparent material 41 is not used like the past, if the through-hole is opened, the 1st fluid substance 14 will flow out. And the 1st fluid substance 14 which flowed out has a possibility of giving a serious damage to the light source system and drive system of an apparatus. In contrast, when the second transparent material 41 is in contact with the surface of the first transparent material 15 as in the present invention, even when the first transparent material 15 penetrates, the second transparent material 41 has the through hole. Since it seals, the 1st fluid substance 14 does not flow out.

  Thus, when processing a through hole or a hole with a thin bottom, the processing accuracy can be dramatically improved by bringing the second transparent material 41 into contact with the surface of the first transparent material 15, and the light source system or Damage to the drive system can be prevented. In addition, the shape of the through hole or the hole with a thin bottom can be processed into an arbitrary shape such as a circle, an ellipse, or a polygon. In addition, when the shape of the through hole or the thin hole at the bottom is a circle, the diameter can be processed if it is 0.01 mm or more, and can be optimally processed up to about 0.1 mm. Since holes of this size can be processed in large quantities with high accuracy, it can be used, for example, for processing inkjet nozzles.

  The processing of the through hole according to the present invention can be used for processing of an inkjet nozzle. In addition, the processing of the present invention includes processing of optical elements such as micro lens arrays, diffraction gratings, optical waveguides, light emitting elements, diffraction elements (DOE), phase masks, photonic elements, liquid crystal alignment substrates, DNA chip substrates, Various applications are possible such as preparation of chemical / environmental / bio / medical materials such as reactor reaction vessels, micro analysis cells, sensor substrates, industrial application materials such as micro-marking, and micro electric circuit elements.

To accomplish the above object, contacting the first fluid material is a liquid having an absorption rate to the laser wavelength on the underside of a transparent material, wherein by irradiating a laser from a surface of the transparent material transparent In the transparent material processing method that processes from the back of the material,
A second fluid substance that is a liquid transparent to the laser wavelength is brought into contact with the surface of the transparent material , and the laser is irradiated through the second fluid substance to process from the back surface of the transparent material. And forming a through hole in the transparent material,
Each of the first fluid substance and the second fluid substance is accommodated in a container .

According to this configuration, the first fluid substance is brought into contact with the back surface of the transparent material , and the second fluid substance is brought into contact with the surface of the transparent material . When irradiated with laser toward the transparent material, is not any change in the surface are the laser incident side of the transparent material, only selectively in the laser irradiation part is the surface of a transparent material in contact with the first fluid material etching Can be done .

In the transparent material processing method , water, acetone, ethanol, THF, or the like can be used as the second fluid substance.

In the above transparent material processing method, specifically, the first and second fluid substances are accommodated in the first and second containers, respectively, and at least the second container is configured to transmit the laser.

In the above transparent material processing method, after processing the transparent material, the first and second fluid substances may be accommodated in the third and fourth containers through the first and second paths, respectively. desirable. This facilitates replacement of the transparent material.

Further, before processing the transparent material, the first and second fluid substances may be accommodated in the first and second containers from the third and fourth containers through the first and second paths, respectively. desirable. This facilitates the reuse of the first and second fluid substances.

Further, according to the present invention, a fluid substance that is a liquid having an absorptance with respect to a laser wavelength is brought into contact with the back surface of the first transparent material, and a laser is irradiated from the surface of the first transparent material to start from the back surface of the first transparent material. In the transparent material processing method, a dummy second transparent material having transparency with respect to the laser wavelength is brought into contact with the surface of the first transparent material, and is covered with the second transparent material of the first transparent material. The portion of the first transparent material is irradiated with the laser through the second transparent material and processed from the back surface of the first transparent material to form a through hole in the first transparent material. According to this configuration, the fluid substance is brought into contact with the back surface of the first transparent material, and the second transparent material is brought into contact with the surface of the first transparent material. When the laser is irradiated toward the first and second transparent materials, there is no change on the surface of the first transparent material on the laser incident side, but the laser irradiation is performed on the surface of the first transparent material in contact with the fluid substance. Etching can be selectively performed only on the portion.

In the above transparent material processing method, the second transparent material is preferably a substrate or a gel. Thereby, the 2nd transparent material can be stuck to the 1st transparent material.

In the above transparent material processing method, the second transparent material may be bonded to the first transparent material using an adhesive having no excitation reactivity with the laser. This eliminates the need for a fixing means for fixing the second transparent material to the transparent material processing apparatus, simplifying the apparatus and simplifying the attaching / detaching operation.

In the transparent material processing method described above, it is desirable that the first transparent material and the second transparent material are the same material. Thereby, it is not necessary to prepare another material for the second transparent material.

Moreover, the transparent material processing apparatus using the above-described transparent material processing method brings a fluid substance, which is a liquid having an absorptance with respect to the laser wavelength, into contact with the back surface of the first transparent material, and from the surface of the first transparent material. In a transparent material processing apparatus for processing from the back surface of the first transparent material by irradiating a laser, the container containing the fluid substance, and a dummy second transparent material having transparency with respect to the laser wavelength , The back surface of the first transparent material is brought into contact with the flowable substance, and the second transparent material is brought into contact with the surface of the first transparent material, and is covered with the second transparent material of the first transparent material. The portion is irradiated with the laser through the second transparent material and processed from the back surface of the first transparent material, and a through hole is formed in the first transparent material .

In the transparent material processing apparatus, the second transparent material may be bonded to the first transparent material using an adhesive having transparency with respect to the laser wavelength .

In the present invention, the first fluid substance that is a liquid having an absorptance with respect to the laser wavelength is brought into contact with the back surface of the transparent material, and the laser is irradiated from the surface of the transparent material to process from the back surface of the transparent material. In the transparent material processing apparatus, the transparent material includes a first container that contains a first fluid substance, and a second container that contains a second fluid substance that is a liquid having transparency with respect to the laser wavelength. The back surface of the transparent material is brought into contact with the first fluid material, the surface of the transparent material is brought into contact with the second fluid material, and the laser is irradiated through the second fluid material. And through holes are formed in the transparent material .

Claims (19)

A transparent material processing method in which a first fluid substance that is excited to react with a laser is brought into contact with the back surface of the first transparent material, and the laser is irradiated from the surface of the first transparent material to process the back surface of the first transparent material. In
A transparent material processing method, characterized in that a second fluid substance or a dummy second transparent material that is not excited to react with the laser is brought into contact with the surface of the first transparent material for processing.   The transparent material processing method according to claim 1, wherein the second transparent material is a substrate or a gel.   The transparent material processing method according to claim 1, wherein the second transparent material is bonded to the first transparent material using an adhesive having no excitation reactivity to the laser.   The transparent material processing method according to claim 1, wherein the first transparent material and the second transparent material are the same material.   The transparent material processing method according to claim 1, wherein the first fluid substance is a solution, and the second fluid substance is the same as the solvent of the first fluid substance.   6. The transparent material processing method according to claim 5, wherein the solvent is water, acetone, ethanol or THF.   The transparent material according to claim 1, wherein the first and second fluid substances are respectively accommodated in first and second containers, and at least the second container transmits the laser. Processing method.   The first and second fluid substances are accommodated in the third and fourth containers through the first and second paths, respectively, after processing the first transparent material. The transparent material processing method in any one of.   Before processing the first transparent material, the first and second fluid substances are accommodated in the first and second containers from the third and fourth containers through the first and second paths, respectively. The transparent material processing method according to claim 8. In a transparent material processing apparatus in which a flowable substance having an excitation reactivity with respect to a laser is brought into contact with the back surface of the first transparent material, and laser is irradiated from the surface of the first transparent material to process from the back surface of the first transparent material,
A container containing the flowable substance;
In order to bring the back surface of the first transparent material into contact with the fluid substance, an opening provided in the container is provided,
A transparent material processing apparatus, wherein a dummy second transparent material is processed in contact with the surface of the first transparent material.   The transparent material processing apparatus according to claim 10, wherein the second transparent material is a substrate or a gel.   The transparent material processing apparatus according to claim 10, wherein the second transparent material is bonded to the first transparent material using an adhesive having no excitation reactivity to the laser.   The transparent material processing apparatus according to claim 10, wherein the first transparent material and the second transparent material are the same material. In a transparent material processing apparatus that contacts a back surface of a transparent material with a first fluid substance that is excited to react with a laser, and irradiates a laser from the surface of the transparent material to process the back surface of the transparent material.
A first container containing a first fluid material;
A first opening provided in the first container for contacting the back surface of the transparent material with the first fluid substance;
A second container containing a second fluid substance that is not excited to react with the laser;
A transparent material processing apparatus, comprising: a second opening provided in the second container for bringing the surface of the transparent material into contact with the second fluid substance.   15. The transparent material processing apparatus according to claim 14, wherein the first fluid substance is a solution, and the second fluid substance is the same as the solvent of the first fluid substance.   The transparent material processing apparatus according to claim 15, wherein the solvent is water, acetone, ethanol, or THF.   The transparent material processing apparatus according to claim 14, wherein at least the second container transmits the laser. A third container;
A fourth container;
A first path connecting the first and third containers;
A second path connecting the second and fourth containers,
The first and second fluid substances are accommodated in the third and fourth containers through the first and second paths, respectively, after the processing of the transparent material. The transparent material processing apparatus as described in.   Before processing the transparent material, the first and second fluid substances are accommodated in the first and second containers from the third and fourth containers through the first and second paths, respectively. Item 19. The transparent material processing apparatus according to Item 18.

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