WO2009075207A1 - Transparent material machining method and transparent material machining apparatus - Google Patents

Transparent material machining method and transparent material machining apparatus Download PDF

Info

Publication number
WO2009075207A1
WO2009075207A1 PCT/JP2008/071931 JP2008071931W WO2009075207A1 WO 2009075207 A1 WO2009075207 A1 WO 2009075207A1 JP 2008071931 W JP2008071931 W JP 2008071931W WO 2009075207 A1 WO2009075207 A1 WO 2009075207A1
Authority
WO
WIPO (PCT)
Prior art keywords
transparent material
material machining
vessel
laser beam
fluid
Prior art date
Application number
PCT/JP2008/071931
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroshi Oshitani
Masahiro Imada
Original Assignee
Konica Minolta Holdings, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Holdings, Inc. filed Critical Konica Minolta Holdings, Inc.
Priority to JP2009522466A priority Critical patent/JP4609592B2/en
Publication of WO2009075207A1 publication Critical patent/WO2009075207A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

A transparent material machining apparatus capable of precisely making through holes and holes with thin bottoms in large numbers by using the feature of the LIBWE technique. The apparatus (10) is used for machining a transparent material (15) from its back surface by bringing a first fluid substance (14) having an excitation reactivity to a laser beam into contact with the back surface of the transparent material (15) and applying a laser beam to the front surface of the transparent material (15). The apparatus (10) has a first vessel (12) for holding the first fluid substance (14), a first opening portion (12a) provided to the first vessel (12) to bring the back surface of the transparent material (15) into contact with the first fluid substance (14), a second vessel (13) for holding a second fluid material (16) not having an excitation reactivity to the laser beam, and a second opening portion (13a) provided to the second vessel (13) to bring the front surface of the transparent material (15) into contact with the second fluid material (16).
PCT/JP2008/071931 2007-12-10 2008-12-03 Transparent material machining method and transparent material machining apparatus WO2009075207A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009522466A JP4609592B2 (en) 2007-12-10 2008-12-03 Transparent material processing method and transparent material processing apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-317928 2007-12-10
JP2007317928 2007-12-10
JP2008028825 2008-02-08
JP2008-028825 2008-02-08

Publications (1)

Publication Number Publication Date
WO2009075207A1 true WO2009075207A1 (en) 2009-06-18

Family

ID=40755451

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071931 WO2009075207A1 (en) 2007-12-10 2008-12-03 Transparent material machining method and transparent material machining apparatus

Country Status (2)

Country Link
JP (1) JP4609592B2 (en)
WO (1) WO2009075207A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178211A (en) * 2015-03-20 2016-10-06 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing device, and substrate processing method
WO2023047813A1 (en) * 2021-09-22 2023-03-30 コマツ産機株式会社 Laser processing device and laser processing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3012926B1 (en) * 1998-09-21 2000-02-28 工業技術院長 Laser micromachining of transparent materials
JP2004042082A (en) * 2002-07-11 2004-02-12 Shinko Electric Ind Co Ltd Laser beam machining method
JP2004306134A (en) * 2003-03-27 2004-11-04 National Institute Of Advanced Industrial & Technology Microfabrication apparatus for transparent material, and optical element forming method using apparatus
JP2006297478A (en) * 2005-03-23 2006-11-02 National Institute Of Advanced Industrial & Technology Method and apparatus of microfabrication by laser for transparent material

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63212085A (en) * 1987-02-27 1988-09-05 Toshiba Corp Laser beam machining and treating method and its device
JPH01113189A (en) * 1987-10-23 1989-05-01 Toshiba Corp Manufacture of ceramic part having fine hole
JP4726157B2 (en) * 2005-02-16 2011-07-20 株式会社リコー Nozzle plate manufacturing method
JP2007175778A (en) * 2007-02-09 2007-07-12 Nippon Sheet Glass Co Ltd Method for processing transparent body by laser

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3012926B1 (en) * 1998-09-21 2000-02-28 工業技術院長 Laser micromachining of transparent materials
JP2004042082A (en) * 2002-07-11 2004-02-12 Shinko Electric Ind Co Ltd Laser beam machining method
JP2004306134A (en) * 2003-03-27 2004-11-04 National Institute Of Advanced Industrial & Technology Microfabrication apparatus for transparent material, and optical element forming method using apparatus
JP2006297478A (en) * 2005-03-23 2006-11-02 National Institute Of Advanced Industrial & Technology Method and apparatus of microfabrication by laser for transparent material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016178211A (en) * 2015-03-20 2016-10-06 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing device, and substrate processing method
WO2023047813A1 (en) * 2021-09-22 2023-03-30 コマツ産機株式会社 Laser processing device and laser processing method

Also Published As

Publication number Publication date
JPWO2009075207A1 (en) 2011-04-28
JP4609592B2 (en) 2011-01-12

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