JPWO2007077691A1 - Photocurable resin composition - Google Patents
Photocurable resin composition Download PDFInfo
- Publication number
- JPWO2007077691A1 JPWO2007077691A1 JP2007552880A JP2007552880A JPWO2007077691A1 JP WO2007077691 A1 JPWO2007077691 A1 JP WO2007077691A1 JP 2007552880 A JP2007552880 A JP 2007552880A JP 2007552880 A JP2007552880 A JP 2007552880A JP WO2007077691 A1 JPWO2007077691 A1 JP WO2007077691A1
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin composition
- photocurable resin
- meth
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 82
- 229920005989 resin Polymers 0.000 claims abstract description 73
- 239000011347 resin Substances 0.000 claims abstract description 73
- 229920001971 elastomer Polymers 0.000 claims abstract description 64
- 239000000203 mixture Substances 0.000 claims abstract description 58
- 239000005060 rubber Substances 0.000 claims abstract description 54
- 239000003999 initiator Substances 0.000 claims abstract description 9
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 6
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 6
- 239000004611 light stabiliser Substances 0.000 claims abstract description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 98
- -1 methyladamantyl group Chemical group 0.000 claims description 79
- 239000000178 monomer Substances 0.000 claims description 32
- 125000000217 alkyl group Chemical group 0.000 claims description 27
- 125000004432 carbon atom Chemical group C* 0.000 claims description 27
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 16
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims description 15
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 13
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 13
- 239000004925 Acrylic resin Substances 0.000 claims description 12
- 229920000178 Acrylic resin Polymers 0.000 claims description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 12
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 9
- 229920001519 homopolymer Polymers 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 8
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 7
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 7
- 230000009477 glass transition Effects 0.000 claims description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 6
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 claims description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 150000002430 hydrocarbons Chemical class 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical group C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 4
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 claims description 4
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 125000003566 oxetanyl group Chemical group 0.000 claims description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 4
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 3
- 125000003277 amino group Chemical group 0.000 claims description 3
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 3
- 125000002091 cationic group Chemical group 0.000 claims description 2
- 229920006295 polythiol Polymers 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 41
- 238000005266 casting Methods 0.000 abstract 1
- 238000006116 polymerization reaction Methods 0.000 description 28
- 239000000047 product Substances 0.000 description 25
- 239000000463 material Substances 0.000 description 21
- 229920005862 polyol Polymers 0.000 description 16
- 150000003254 radicals Chemical class 0.000 description 15
- 239000011572 manganese Substances 0.000 description 13
- 150000003077 polyols Chemical class 0.000 description 13
- 238000005259 measurement Methods 0.000 description 11
- 238000000465 moulding Methods 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 125000003118 aryl group Chemical group 0.000 description 10
- 238000001723 curing Methods 0.000 description 10
- 239000000806 elastomer Substances 0.000 description 10
- 239000004342 Benzoyl peroxide Substances 0.000 description 9
- 235000019400 benzoyl peroxide Nutrition 0.000 description 9
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000009826 distribution Methods 0.000 description 8
- 229920003023 plastic Polymers 0.000 description 8
- 239000004033 plastic Substances 0.000 description 8
- 239000005056 polyisocyanate Substances 0.000 description 8
- 229920001228 polyisocyanate Polymers 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000009864 tensile test Methods 0.000 description 7
- 229920002725 thermoplastic elastomer Polymers 0.000 description 7
- 239000004793 Polystyrene Substances 0.000 description 6
- 150000002148 esters Chemical class 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 6
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 5
- 244000043261 Hevea brasiliensis Species 0.000 description 5
- 239000000470 constituent Substances 0.000 description 5
- 238000010276 construction Methods 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920003052 natural elastomer Polymers 0.000 description 5
- 229920001194 natural rubber Polymers 0.000 description 5
- 150000002978 peroxides Chemical class 0.000 description 5
- 229920005906 polyester polyol Polymers 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 5
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 4
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 4
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 229920000459 Nitrile rubber Polymers 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 235000006708 antioxidants Nutrition 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000010526 radical polymerization reaction Methods 0.000 description 4
- 238000007666 vacuum forming Methods 0.000 description 4
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 230000001747 exhibiting effect Effects 0.000 description 3
- 150000004665 fatty acids Chemical class 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 2
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- BYPFICORERPGJY-UHFFFAOYSA-N 3,4-diisocyanatobicyclo[2.2.1]hept-2-ene Chemical compound C1CC2(N=C=O)C(N=C=O)=CC1C2 BYPFICORERPGJY-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- IAXXETNIOYFMLW-GYSYKLTISA-N [(1r,3r,4r)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@@]2(C)[C@H](OC(=O)C(=C)C)C[C@@H]1C2(C)C IAXXETNIOYFMLW-GYSYKLTISA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 2
- ZQMIGQNCOMNODD-UHFFFAOYSA-N diacetyl peroxide Chemical compound CC(=O)OOC(C)=O ZQMIGQNCOMNODD-UHFFFAOYSA-N 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N hydroquinone methyl ether Natural products COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000006224 matting agent Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000002092 orthoester group Chemical group 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229950000688 phenothiazine Drugs 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000007665 sagging Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 125000003003 spiro group Chemical group 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000010557 suspension polymerization reaction Methods 0.000 description 2
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- YEYCMBWKTZNPDH-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) benzoate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=CC=C1 YEYCMBWKTZNPDH-UHFFFAOYSA-N 0.000 description 1
- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
- KJYSXRBJOSZLEL-UHFFFAOYSA-N (2,4-ditert-butylphenyl) 3,5-ditert-butyl-4-hydroxybenzoate Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OC(=O)C1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 KJYSXRBJOSZLEL-UHFFFAOYSA-N 0.000 description 1
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- HCXVPNKIBYLBIT-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOOC(C)(C)C HCXVPNKIBYLBIT-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- MYOQALXKVOJACM-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy pentaneperoxoate Chemical compound CCCCC(=O)OOOC(C)(C)C MYOQALXKVOJACM-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- ZORJPNCZZRLEDF-UHFFFAOYSA-N (3-methoxy-3-methylbutoxy)carbonyloxy (3-methoxy-3-methylbutyl) carbonate Chemical compound COC(C)(C)CCOC(=O)OOC(=O)OCCC(C)(C)OC ZORJPNCZZRLEDF-UHFFFAOYSA-N 0.000 description 1
- NLBJAOHLJABDAU-UHFFFAOYSA-N (3-methylbenzoyl) 3-methylbenzenecarboperoxoate Chemical compound CC1=CC=CC(C(=O)OOC(=O)C=2C=C(C)C=CC=2)=C1 NLBJAOHLJABDAU-UHFFFAOYSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 1
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 1
- VNQNXQYZMPJLQX-UHFFFAOYSA-N 1,3,5-tris[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CN2C(N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C(=O)N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C2=O)=O)=C1 VNQNXQYZMPJLQX-UHFFFAOYSA-N 0.000 description 1
- XYXJKPCGSGVSBO-UHFFFAOYSA-N 1,3,5-tris[(4-tert-butyl-3-hydroxy-2,6-dimethylphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C)=C1CN1C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C(=O)N(CC=2C(=C(O)C(=CC=2C)C(C)(C)C)C)C1=O XYXJKPCGSGVSBO-UHFFFAOYSA-N 0.000 description 1
- AZYRZNIYJDKRHO-UHFFFAOYSA-N 1,3-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC(C(C)(C)N=C=O)=C1 AZYRZNIYJDKRHO-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- UICXTANXZJJIBC-UHFFFAOYSA-N 1-(1-hydroperoxycyclohexyl)peroxycyclohexan-1-ol Chemical compound C1CCCCC1(O)OOC1(OO)CCCCC1 UICXTANXZJJIBC-UHFFFAOYSA-N 0.000 description 1
- WGYZMNBUZFHYRX-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-ol Chemical compound COCC(C)OCC(C)O WGYZMNBUZFHYRX-UHFFFAOYSA-N 0.000 description 1
- AYMDJPGTQFHDSA-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)-2-ethoxyethane Chemical compound CCOCCOCCOC=C AYMDJPGTQFHDSA-UHFFFAOYSA-N 0.000 description 1
- XSZYESUNPWGWFQ-UHFFFAOYSA-N 1-(2-hydroperoxypropan-2-yl)-4-methylcyclohexane Chemical compound CC1CCC(C(C)(C)OO)CC1 XSZYESUNPWGWFQ-UHFFFAOYSA-N 0.000 description 1
- XUIXZBXRQFZHIT-UHFFFAOYSA-N 1-[1-(1-hydroxypropan-2-yloxy)propan-2-yloxy]-3-methoxypropan-2-ol Chemical compound COCC(O)COC(C)COC(C)CO XUIXZBXRQFZHIT-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- GOAHRBQLKIZLKG-UHFFFAOYSA-N 1-tert-butylperoxybutane Chemical compound CCCCOOC(C)(C)C GOAHRBQLKIZLKG-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VDVUCLWJZJHFAV-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1 VDVUCLWJZJHFAV-UHFFFAOYSA-N 0.000 description 1
- JPOUDZAPLMMUES-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)octane Chemical compound CCCCCCC(C)(OOC(C)(C)C)OOC(C)(C)C JPOUDZAPLMMUES-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- OJRJDENLRJHEJO-UHFFFAOYSA-N 2,4-diethylpentane-1,5-diol Chemical compound CCC(CO)CC(CC)CO OJRJDENLRJHEJO-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 1
- ZZYASVWWDLJXIM-UHFFFAOYSA-N 2,5-di-tert-Butyl-1,4-benzoquinone Chemical compound CC(C)(C)C1=CC(=O)C(C(C)(C)C)=CC1=O ZZYASVWWDLJXIM-UHFFFAOYSA-N 0.000 description 1
- JGBAASVQPMTVHO-UHFFFAOYSA-N 2,5-dihydroperoxy-2,5-dimethylhexane Chemical compound OOC(C)(C)CCC(C)(C)OO JGBAASVQPMTVHO-UHFFFAOYSA-N 0.000 description 1
- QYXHDJJYVDLECA-UHFFFAOYSA-N 2,5-diphenylcyclohexa-2,5-diene-1,4-dione Chemical compound O=C1C=C(C=2C=CC=CC=2)C(=O)C=C1C1=CC=CC=C1 QYXHDJJYVDLECA-UHFFFAOYSA-N 0.000 description 1
- GJDRKHHGPHLVNI-UHFFFAOYSA-N 2,6-ditert-butyl-4-(diethoxyphosphorylmethyl)phenol Chemical compound CCOP(=O)(OCC)CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 GJDRKHHGPHLVNI-UHFFFAOYSA-N 0.000 description 1
- YHYCMHWTYHPIQS-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol Chemical compound COC(O)COCCO YHYCMHWTYHPIQS-UHFFFAOYSA-N 0.000 description 1
- HLIQLHSBZXDKLV-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol Chemical compound OCCOCC(O)OC1=CC=CC=C1 HLIQLHSBZXDKLV-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- IEQWWMKDFZUMMU-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethyl)butanedioic acid Chemical compound OC(=O)CC(C(O)=O)CCOC(=O)C=C IEQWWMKDFZUMMU-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- ZMWRRFHBXARRRT-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4,6-bis(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(N2N=C3C=CC=CC3=N2)=C1O ZMWRRFHBXARRRT-UHFFFAOYSA-N 0.000 description 1
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 description 1
- VQMHSKWEJGIXGA-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-6-dodecyl-4-methylphenol Chemical compound CCCCCCCCCCCCC1=CC(C)=CC(N2N=C3C=CC=CC3=N2)=C1O VQMHSKWEJGIXGA-UHFFFAOYSA-N 0.000 description 1
- OIXNFJTTYAIBNF-UHFFFAOYSA-N 2-(chloromethyl)oxirane;oxirane Chemical compound C1CO1.ClCC1CO1 OIXNFJTTYAIBNF-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- XXHDHAPOSIFMIG-UHFFFAOYSA-N 2-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]-1-phenoxyethanol Chemical compound OCCOCCOCCOCC(O)OC1=CC=CC=C1 XXHDHAPOSIFMIG-UHFFFAOYSA-N 0.000 description 1
- OBFOSROPNNOGQF-UHFFFAOYSA-N 2-[2-[2-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]ethoxy]ethoxy]-1-phenoxyethanol Chemical compound OCCOCCOCCOCCOCCOCC(O)OC1=CC=CC=C1 OBFOSROPNNOGQF-UHFFFAOYSA-N 0.000 description 1
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 1
- SKMNWICOBCDSSQ-UHFFFAOYSA-N 2-[4-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2,6,6-tetramethylpiperidin-1-yl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCN2C(CC(CC2(C)C)OC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(C)C)=C1 SKMNWICOBCDSSQ-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- XKBHBVFIWWDGQX-UHFFFAOYSA-N 2-bromo-3,3,4,4,5,5,5-heptafluoropent-1-ene Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(Br)=C XKBHBVFIWWDGQX-UHFFFAOYSA-N 0.000 description 1
- MCRZWYDXIGCFKO-UHFFFAOYSA-N 2-butylpropanedioic acid Chemical compound CCCCC(C(O)=O)C(O)=O MCRZWYDXIGCFKO-UHFFFAOYSA-N 0.000 description 1
- VGZZAZYCLRYTNQ-UHFFFAOYSA-N 2-ethoxyethoxycarbonyloxy 2-ethoxyethyl carbonate Chemical compound CCOCCOC(=O)OOC(=O)OCCOCC VGZZAZYCLRYTNQ-UHFFFAOYSA-N 0.000 description 1
- TVWGHFVGFWIHFN-UHFFFAOYSA-N 2-hexadecan-2-yl-4,6-dimethylphenol Chemical compound CCCCCCCCCCCCCCC(C)C1=CC(C)=CC(C)=C1O TVWGHFVGFWIHFN-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- DPNXHTDWGGVXID-UHFFFAOYSA-N 2-isocyanatoethyl prop-2-enoate Chemical compound C=CC(=O)OCCN=C=O DPNXHTDWGGVXID-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- UIZWPVOGWBRBLX-UHFFFAOYSA-N 2-methyl-3-(1,2,2,6,6-pentamethylpiperidin-4-yl)prop-2-enoic acid Chemical compound CN1C(C)(C)CC(C=C(C)C(O)=O)CC1(C)C UIZWPVOGWBRBLX-UHFFFAOYSA-N 0.000 description 1
- GAODDBNJCKQQDY-UHFFFAOYSA-N 2-methyl-4,6-bis(octylsulfanylmethyl)phenol Chemical compound CCCCCCCCSCC1=CC(C)=C(O)C(CSCCCCCCCC)=C1 GAODDBNJCKQQDY-UHFFFAOYSA-N 0.000 description 1
- RPBWMJBZQXCSFW-UHFFFAOYSA-N 2-methylpropanoyl 2-methylpropaneperoxoate Chemical compound CC(C)C(=O)OOC(=O)C(C)C RPBWMJBZQXCSFW-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical compound CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- UWRXMIQVSKQAIJ-UHFFFAOYSA-N 2-n-[3-[[4,6-bis[butyl-(1,2,2,6,6-pentamethylpiperidin-4-yl)amino]-1h-triazin-2-yl]-[2-[[4,6-bis[butyl-(1,2,2,6,6-pentamethylpiperidin-4-yl)amino]-1h-triazin-2-yl]-[3-[[4,6-bis[butyl-(1,2,2,6,6-pentamethylpiperidin-4-yl)amino]-1h-triazin-2-yl]amino]propyl Chemical compound C=1C(N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)=NN(NCCCN(CCN(CCCNN2N=C(C=C(N2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N2N=C(C=C(N2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N2N=C(C=C(N2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)N(CCCC)C2CC(C)(C)N(C)C(C)(C)C2)NC=1N(CCCC)C1CC(C)(C)N(C)C(C)(C)C1 UWRXMIQVSKQAIJ-UHFFFAOYSA-N 0.000 description 1
- HXIQYSLFEXIOAV-UHFFFAOYSA-N 2-tert-butyl-4-(5-tert-butyl-4-hydroxy-2-methylphenyl)sulfanyl-5-methylphenol Chemical compound CC1=CC(O)=C(C(C)(C)C)C=C1SC1=CC(C(C)(C)C)=C(O)C=C1C HXIQYSLFEXIOAV-UHFFFAOYSA-N 0.000 description 1
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- KFGFVPMRLOQXNB-UHFFFAOYSA-N 3,5,5-trimethylhexanoyl 3,5,5-trimethylhexaneperoxoate Chemical compound CC(C)(C)CC(C)CC(=O)OOC(=O)CC(C)CC(C)(C)C KFGFVPMRLOQXNB-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- WPMYUUITDBHVQZ-UHFFFAOYSA-M 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=CC(CCC([O-])=O)=CC(C(C)(C)C)=C1O WPMYUUITDBHVQZ-UHFFFAOYSA-M 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- XMIIGOLPHOKFCH-UHFFFAOYSA-N 3-phenylpropionic acid Chemical compound OC(=O)CCC1=CC=CC=C1 XMIIGOLPHOKFCH-UHFFFAOYSA-N 0.000 description 1
- MRBKEAMVRSLQPH-UHFFFAOYSA-N 3-tert-butyl-4-hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1 MRBKEAMVRSLQPH-UHFFFAOYSA-N 0.000 description 1
- JIGUICYYOYEXFS-UHFFFAOYSA-N 3-tert-butylbenzene-1,2-diol Chemical compound CC(C)(C)C1=CC=CC(O)=C1O JIGUICYYOYEXFS-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- QRLSTWVLSWCGBT-UHFFFAOYSA-N 4-((4,6-bis(octylthio)-1,3,5-triazin-2-yl)amino)-2,6-di-tert-butylphenol Chemical class CCCCCCCCSC1=NC(SCCCCCCCC)=NC(NC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=N1 QRLSTWVLSWCGBT-UHFFFAOYSA-N 0.000 description 1
- STEYNUVPFMIUOY-UHFFFAOYSA-N 4-Hydroxy-1-(2-hydroxyethyl)-2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CC(O)CC(C)(C)N1CCO STEYNUVPFMIUOY-UHFFFAOYSA-N 0.000 description 1
- AESQDCMZHBUWPN-UHFFFAOYSA-N 4h-1,3,2-dioxaphosphinine Chemical compound C1OPOC=C1 AESQDCMZHBUWPN-UHFFFAOYSA-N 0.000 description 1
- YJVIKVWFGPLAFS-UHFFFAOYSA-N 9-(2-methylprop-2-enoyloxy)nonyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCOC(=O)C(C)=C YJVIKVWFGPLAFS-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- WMONOXOCMIPNNU-UHFFFAOYSA-N C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O Chemical compound C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O WMONOXOCMIPNNU-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- FEXQDZTYJVXMOS-UHFFFAOYSA-N Isopropyl benzoate Chemical compound CC(C)OC(=O)C1=CC=CC=C1 FEXQDZTYJVXMOS-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 235000019738 Limestone Nutrition 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical group CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- STLLXWLDRUVCHL-UHFFFAOYSA-N [2-[1-[2-hydroxy-3,5-bis(2-methylbutan-2-yl)phenyl]ethyl]-4,6-bis(2-methylbutan-2-yl)phenyl] prop-2-enoate Chemical compound CCC(C)(C)C1=CC(C(C)(C)CC)=CC(C(C)C=2C(=C(C=C(C=2)C(C)(C)CC)C(C)(C)CC)OC(=O)C=C)=C1O STLLXWLDRUVCHL-UHFFFAOYSA-N 0.000 description 1
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- KJVBXWVJBJIKCU-UHFFFAOYSA-N [hydroxy(2-hydroxyethoxy)phosphoryl] prop-2-enoate Chemical compound OCCOP(O)(=O)OC(=O)C=C KJVBXWVJBJIKCU-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Natural products CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229940024548 aluminum oxide Drugs 0.000 description 1
- 238000010539 anionic addition polymerization reaction Methods 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- 125000002511 behenyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 description 1
- CCDWGDHTPAJHOA-UHFFFAOYSA-N benzylsilicon Chemical compound [Si]CC1=CC=CC=C1 CCDWGDHTPAJHOA-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 229940000635 beta-alanine Drugs 0.000 description 1
- OSIVCXJNIBEGCL-UHFFFAOYSA-N bis(2,2,6,6-tetramethyl-1-octoxypiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(OCCCCCCCC)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(OCCCCCCCC)C(C)(C)C1 OSIVCXJNIBEGCL-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229920005557 bromobutyl Polymers 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- OCWYEMOEOGEQAN-UHFFFAOYSA-N bumetrizole Chemical compound CC(C)(C)C1=CC(C)=CC(N2N=C3C=C(Cl)C=CC3=N2)=C1O OCWYEMOEOGEQAN-UHFFFAOYSA-N 0.000 description 1
- WWNGFHNQODFIEX-UHFFFAOYSA-N buta-1,3-diene;methyl 2-methylprop-2-enoate;styrene Chemical compound C=CC=C.COC(=O)C(C)=C.C=CC1=CC=CC=C1 WWNGFHNQODFIEX-UHFFFAOYSA-N 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical class [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- HRYGOPGASPGRAD-UHFFFAOYSA-N carboxyoxy 1,2-dimethoxypropan-2-yl carbonate Chemical compound COCC(C)(OC)OC(=O)OOC(O)=O HRYGOPGASPGRAD-UHFFFAOYSA-N 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 238000012663 cationic photopolymerization Methods 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229920005556 chlorobutyl Polymers 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- XJOBOFWTZOKMOH-UHFFFAOYSA-N decanoyl decaneperoxoate Chemical compound CCCCCCCCCC(=O)OOC(=O)CCCCCCCCC XJOBOFWTZOKMOH-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910052805 deuterium Inorganic materials 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 125000001664 diethylamino group Chemical group [H]C([H])([H])C([H])([H])N(*)C([H])([H])C([H])([H])[H] 0.000 description 1
- POSWICCRDBKBMH-UHFFFAOYSA-N dihydroisophorone Natural products CC1CC(=O)CC(C)(C)C1 POSWICCRDBKBMH-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 1
- YMRYNEIBKUSWAJ-UHFFFAOYSA-N ditert-butyl benzene-1,3-dicarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC(C(=O)OOC(C)(C)C)=C1 YMRYNEIBKUSWAJ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- MCPKSFINULVDNX-UHFFFAOYSA-N drometrizole Chemical compound CC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 MCPKSFINULVDNX-UHFFFAOYSA-N 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920005558 epichlorohydrin rubber Polymers 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- HCPOCMMGKBZWSJ-UHFFFAOYSA-N ethyl 3-hydrazinyl-3-oxopropanoate Chemical compound CCOC(=O)CC(=O)NN HCPOCMMGKBZWSJ-UHFFFAOYSA-N 0.000 description 1
- WUDNUHPRLBTKOJ-UHFFFAOYSA-N ethyl isocyanate Chemical compound CCN=C=O WUDNUHPRLBTKOJ-UHFFFAOYSA-N 0.000 description 1
- 229920006229 ethylene acrylic elastomer Polymers 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 229920005560 fluorosilicone rubber Polymers 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical class O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- QZEJHHGVNNHHSU-UHFFFAOYSA-N hexyl benzenecarboperoxoate Chemical compound CCCCCCOOC(=O)C1=CC=CC=C1 QZEJHHGVNNHHSU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002483 hydrogen compounds Chemical class 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- QZUPTXGVPYNUIT-UHFFFAOYSA-N isophthalamide Chemical compound NC(=O)C1=CC=CC(C(N)=O)=C1 QZUPTXGVPYNUIT-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000006028 limestone Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- FDAKZQLBIFPGSV-UHFFFAOYSA-N n-butyl-2,2,6,6-tetramethylpiperidin-4-amine Chemical compound CCCCNC1CC(C)(C)NC(C)(C)C1 FDAKZQLBIFPGSV-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 238000000655 nuclear magnetic resonance spectrum Methods 0.000 description 1
- 229950002083 octabenzone Drugs 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- NWAHZAIDMVNENC-UHFFFAOYSA-N octahydro-1h-4,7-methanoinden-5-yl methacrylate Chemical compound C12CCCC2C2CC(OC(=O)C(=C)C)C1C2 NWAHZAIDMVNENC-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- OEIJHBUUFURJLI-UHFFFAOYSA-N octane-1,8-diol Chemical compound OCCCCCCCCO OEIJHBUUFURJLI-UHFFFAOYSA-N 0.000 description 1
- SRSFOMHQIATOFV-UHFFFAOYSA-N octanoyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(=O)CCCCCCC SRSFOMHQIATOFV-UHFFFAOYSA-N 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- LGOPTUPXVVNJFH-UHFFFAOYSA-N pentadecanethioic s-acid Chemical compound CCCCCCCCCCCCCCC(O)=S LGOPTUPXVVNJFH-UHFFFAOYSA-N 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000010451 perlite Substances 0.000 description 1
- 235000019362 perlite Nutrition 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 150000007519 polyprotic acids Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 1
- 229940080818 propionamide Drugs 0.000 description 1
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- YPVDWEHVCUBACK-UHFFFAOYSA-N propoxycarbonyloxy propyl carbonate Chemical compound CCCOC(=O)OOC(=O)OCCC YPVDWEHVCUBACK-UHFFFAOYSA-N 0.000 description 1
- 125000006225 propoxyethyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000007342 radical addition reaction Methods 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 235000010356 sorbitol Nutrition 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000004250 tert-Butylhydroquinone Substances 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 235000019281 tert-butylhydroquinone Nutrition 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- LVEOKSIILWWVEO-UHFFFAOYSA-N tetradecyl 3-(3-oxo-3-tetradecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCC LVEOKSIILWWVEO-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920006345 thermoplastic polyamide Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Chemical class 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 150000003712 vitamin E derivatives Chemical class 0.000 description 1
- 239000004636 vulcanized rubber Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
- C08K5/57—Organo-tin compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
光硬化注型成形法に好適な光硬化性樹脂組成物であり、特に振動疲労耐久性に優れた光硬化性樹脂組成物を提供する。(A)光ラジカル重合性樹脂、光ラジカル付加重合性樹脂、及び光カチオン重合性樹脂からなる群から選ばれる少なくとも1つの樹脂と、(B)光重合開始剤と、(C)酸化防止剤又は(D)光安定剤のいずれか又は両方とを含有する光硬化性樹脂組成物であって、当該光硬化性樹脂組成物の硬化体の引張弾性率が1〜30MPaであり、しかも引張破壊伸びが200%以上であることを特徴とする光硬化性樹脂組成物。更に、該光硬化性樹脂組成物は、(E)ゴム組成物を含んでもよい。Provided is a photocurable resin composition suitable for a photocurable casting method, and in particular, a photocurable resin composition excellent in vibration fatigue durability. (A) at least one resin selected from the group consisting of a photoradical polymerizable resin, a photoradical addition polymerizable resin, and a photocationic polymerizable resin, (B) a photopolymerization initiator, and (C) an antioxidant or (D) A photocurable resin composition containing either or both of the light stabilizers, wherein the cured product of the photocurable resin composition has a tensile elastic modulus of 1 to 30 MPa, and a tensile breaking elongation. Is a photocurable resin composition characterized by being 200% or more. Furthermore, the photocurable resin composition may include (E) a rubber composition.
Description
本発明は、紫外線、可視光線等の光照射により硬化可能な光硬化性樹脂組成物および硬化体に関し、さらに詳しくは、振動疲労耐久性に優れた光硬化性樹脂組成物および硬化体に関する。 The present invention relates to a photocurable resin composition and a cured product that can be cured by irradiation with light such as ultraviolet rays and visible light, and more particularly to a photocurable resin composition and a cured product excellent in vibration fatigue durability.
一般に柔軟性、伸縮性、弾性といった、所謂ゴム特性を与える組成物はエラストマーと呼ばれ、その振動に対する疲労耐久性が、他の高分子素材と比較し抜きんでて優れている。したがって、タイヤ等の自動車部材、土木、建築等の構造物用シール部材、Oリング等のパッキング部材、スピーカー等の音響用部材、携帯電話用キーシート等のシート部材、防振材料、各種機構部材等として適用されている。 In general, a composition that imparts so-called rubber properties such as flexibility, stretchability, and elasticity is called an elastomer, and its fatigue durability against vibration is far superior to other polymer materials. Therefore, automobile members such as tires, sealing members for structures such as civil engineering and construction, packing members such as O-rings, acoustic members such as speakers, sheet members such as key sheets for mobile phones, vibration-proof materials, various mechanism members Etc. are applied.
従来のエラストマー(以下、記号Rで示す)としては、天然ゴム、変性天然ゴム、グラフト天然ゴム、環化天然ゴム、塩素化天然ゴム、スチレン−ブタジエンゴム、クロロプレンゴム、アクリロニトリル−ブタジエンゴム、カルボキシル化ニトリルゴム、ニトリルゴム/塩化ビニル樹脂ブレンド、ニトリルゴム/EPDMゴムのブレンド、ブチルゴム、臭素化ブチルゴム、塩素化ブチルゴム、エチレン−酢酸ビニルゴム、アクリルゴム、エチレン−アクリルゴム、クロロスルホン化ポリエチレン、塩素化ポリエチレン、エピクロルヒドリンゴム、エピクロルヒドリン−エチレンオキシドゴム、メチルシリコーンゴム、ビニル−メチルシリコーンゴム、フェニル−メチルシリコーンゴム、フッ化シリコーンゴム等のゴム材料;ポリスチレン系熱可塑性エラストマー、ポリ塩化ビニル系熱可塑性エラストマー、ポリオレフィン系熱可塑性エラストマー、ポリウレタン系熱可塑性エラストマー、ポリエステル系熱可塑性エラストマー、ポリアミド系熱可塑性エラストマー、塩化ビニル系熱可塑性エラストマー、フッ素ゴム系熱可塑性エラストマー、塩素化ポリエチレン系エラストマー等の熱可塑性エラストマー材料が知られている。 Conventional elastomers (hereinafter denoted by symbol R) include natural rubber, modified natural rubber, grafted natural rubber, cyclized natural rubber, chlorinated natural rubber, styrene-butadiene rubber, chloroprene rubber, acrylonitrile-butadiene rubber, carboxylated Nitrile rubber, nitrile rubber / vinyl chloride resin blend, nitrile rubber / EPDM rubber blend, butyl rubber, brominated butyl rubber, chlorinated butyl rubber, ethylene-vinyl acetate rubber, acrylic rubber, ethylene-acrylic rubber, chlorosulfonated polyethylene, chlorinated polyethylene , Rubber materials such as epichlorohydrin rubber, epichlorohydrin-ethylene oxide rubber, methyl silicone rubber, vinyl-methyl silicone rubber, phenyl-methyl silicone rubber, fluorosilicone rubber; polystyrene-based heat Plastic elastomer, Polyvinyl chloride thermoplastic elastomer, Polyolefin thermoplastic elastomer, Polyurethane thermoplastic elastomer, Polyester thermoplastic elastomer, Polyamide thermoplastic elastomer, Vinyl chloride thermoplastic elastomer, Fluoro rubber thermoplastic elastomer, Chlorine Thermoplastic elastomer materials such as fluorinated polyethylene elastomers are known.
一般にエラストマー(R)の成形体を得る方法としては、硬化剤および他の添加剤を配合したエラストマー原料を充分に混練する混練り工程、そして、練り生地を真空成形法、圧空成形法、上型下型を一組とする成形型(以下、上下型という)による加熱加圧成形法、射出成形法等により成形し、加熱、加圧により加硫または硬化させる硬化工程(加硫工程)を経て、目的の成形体が得られている。 In general, as a method for obtaining a molded body of elastomer (R), a kneading step for sufficiently kneading an elastomer raw material containing a curing agent and other additives, and a kneaded dough for a vacuum forming method, a pressure forming method, an upper die After a curing process (vulcanizing process) in which the lower mold is molded by a heating mold and an injection molding process using a molding mold (hereinafter referred to as an upper and lower mold), and vulcanized or cured by heating and pressing. The desired molded body is obtained.
しかしながら、前記の真空成形法、圧空成形法、上下型による加熱加圧成形法などでは、材料の融点付近まで金型温度を上げる必要があり、加熱のために膨大なエネルギーを必要とする。また、金型を冷却して取り出す必要があるので、成形サイクルに長時間費やすことになる。 However, in the vacuum forming method, the pressure forming method, the heat pressing method using the upper and lower molds, etc., it is necessary to raise the mold temperature to near the melting point of the material, and enormous energy is required for heating. Moreover, since it is necessary to cool and take out the metal mold, it takes a long time for the molding cycle.
射出成形法では、溶融した樹脂が温度差のある金型に接触した直後に冷却され流動性が極端に低下するので、薄肉の成形体を得ることが困難であり、加熱、射出、保圧等の工程上、設備も高額となる。また、熱可塑性材料を融点近くまで加熱するので、加熱エネルギーが膨大である。 In the injection molding method, the molten resin is cooled immediately after coming into contact with a mold having a temperature difference, and the fluidity is extremely reduced, so that it is difficult to obtain a thin molded body, such as heating, injection, holding pressure, etc. This makes the equipment expensive. Further, since the thermoplastic material is heated to near the melting point, the heating energy is enormous.
成形材料は、前記の真空成形法、圧空成形法、上下型による加熱加圧成形法などでは、目的の部品寸法より略大きな平面材料を成形した後、部品部分を切り出して使用することとなるため、廃棄物が多く発生し、環境的、経済的に好ましくない。 In the above-mentioned vacuum forming method, pressure forming method, heating and press forming method using upper and lower molds, etc., the molding material is formed by molding a planar material that is substantially larger than the target part size, and then cutting out the part part for use. A lot of waste is generated, which is not preferable environmentally and economically.
真空成形法、圧空成形法、上下型による加熱加圧成形法の上記構成材料は、一般的には均一な厚さの材料であるため、成形後は各部分で同じ厚さとなり、同一材料からは各部分の厚さを変えることが困難である。 The above-mentioned constituent materials of the vacuum forming method, the pressure forming method, and the heat and pressure forming method using the upper and lower molds are generally uniform thickness materials. It is difficult to change the thickness of each part.
加えて、工業的に製造されている厚さは限られており、それ以外の厚さの材料を得ることは、通常困難である。成形時の延伸などの処理により、厚さを変える方法も提案されているが、成形後の内部応力歪みが大きくなる等の問題が発生する。 In addition, the thickness produced industrially is limited, and it is usually difficult to obtain materials with other thicknesses. A method of changing the thickness by a process such as stretching at the time of molding has also been proposed, but problems such as increased internal stress distortion after molding occur.
上記の様な成形法の課題を解決する手段として、上下型中に充填した光硬化性液状物質に、紫外線、可視光線等の光を照射することにより硬化させ、成形体を形成する光硬化注型成形法が特許文献1で提案されている。
より詳しくは、上型、下型よりなる一組の成形型の少なくともいずれか一方を光が透過する材料にて形成し、かつ光照射により硬化可能な樹脂をセットして型を閉じ、光を透過する型の外側から光を照射し、樹脂を硬化させて目的形状の硬化体を得る方法である。この方法により、少ないエネルギーおよび少ない工数で、任意の厚みの成形体を容易かつ安価に製造することが可能となる。 More specifically, at least one of a pair of molds composed of an upper mold and a lower mold is formed of a material that transmits light, and a resin that can be cured by light irradiation is set to close the mold, In this method, light is irradiated from the outside of a transmitting mold and the resin is cured to obtain a cured body having a desired shape. By this method, it is possible to easily and inexpensively produce a molded body having an arbitrary thickness with less energy and less man-hours.
一方で、光硬化可能なエラストマーまたはゴム弾性を示す樹脂組成物としては、特許文献2、特許文献3にシーリング材用として、また、特許文献4に光学的立体造形用として樹脂組成物が開示されている。しかし、上記の光硬化注型成形法に適し、且つ従来のエラストマーに要求されるような振動疲労耐久性を満たす樹脂組成物は知られていなかった。
本発明は、上記公知技術の事情に鑑みてなされたもので、光照射により硬化可能な、光硬化注型成形法に好適な光硬化性樹脂組成物であり、かつ、振動疲労耐久性に優れた光硬化性樹脂組成物および硬化体を提供することを目的とする。 The present invention has been made in view of the circumstances of the above-mentioned known technology, and is a photocurable resin composition suitable for a photo-curing cast molding method that can be cured by light irradiation, and is excellent in vibration fatigue durability. Another object is to provide a photocurable resin composition and a cured product.
すなわち、本発明は、以下の要旨を有する。
1.(A)光ラジカル重合性樹脂、光ラジカル付加重合性樹脂、及び光カチオン重合性樹脂からなる群から選ばれる少なくとも1つの樹脂と、(B)光重合開始剤と、(C)酸化防止剤及び(D)光安定剤のいずれか又は両方とを含有する光硬化性樹脂組成物であって、当該光硬化性樹脂組成物の硬化体の引張弾性率が1〜30MPaであり、しかも引張破壊伸びが200%以上であることを特徴とする光硬化性樹脂組成物。
2.更に(E)ゴム組成物を含有する、上記1に記載の光硬化性樹脂組成物。
3.ゴム組成物が、(メタ)アクリル酸エステル化合物、ビニル系化合物、及びオレフィン系炭化水素化合物からなる群から選ばれる少なくとも一つの単量体からなる共重合体であって、重量平均分子量が500〜50,000の範囲である上記1または2に記載の光硬化性樹脂組成物。That is, the present invention has the following gist.
1. (A) at least one resin selected from the group consisting of a photoradical polymerizable resin, a photoradical addition polymerizable resin, and a photocationic polymerizable resin, (B) a photopolymerization initiator, (C) an antioxidant, and (D) A photocurable resin composition containing either or both of the light stabilizers, wherein the cured product of the photocurable resin composition has a tensile elastic modulus of 1 to 30 MPa, and a tensile breaking elongation. Is a photocurable resin composition characterized by being 200% or more.
2. Furthermore, (E) The photocurable resin composition of said 1 containing a rubber composition.
3. The rubber composition is a copolymer composed of at least one monomer selected from the group consisting of (meth) acrylic acid ester compounds, vinyl compounds, and olefinic hydrocarbon compounds, and has a weight average molecular weight of 500 to 500. 3. The photocurable resin composition according to the above 1 or 2, which is in the range of 50,000.
4.ゴム組成物が、(メタ)アクリル酸エステル化合物、ビニル系化合物、及びオレフィン系炭化水素化合物からなる群から選ばれる3種類以上の単量体からなる共重合体であって、前記単量体が、
(イ)ホモポリマーのガラス転移温度が25℃未満であるラジカル重合性単量体を20〜90質量%と、
(ロ)ホモポリマーのガラス転移温度が25℃以上であるラジカル重合性単量体を0.1〜70質量%と、
(ハ)分子内に非ラジカル重合性である反応性基を少なくとも一つ有するラジカル重合性単量体を1〜50質量%と、
を含む上記3に記載の光硬化性樹脂組成物。4). The rubber composition is a copolymer composed of three or more monomers selected from the group consisting of (meth) acrylic acid ester compounds, vinyl compounds, and olefinic hydrocarbon compounds, wherein the monomers are ,
(Ii) 20-90% by mass of a radical polymerizable monomer having a glass transition temperature of less than 25 ° C. of the homopolymer,
(B) 0.1 to 70% by mass of a radical polymerizable monomer having a glass transition temperature of 25 ° C. or higher of the homopolymer;
(C) 1 to 50% by mass of a radically polymerizable monomer having at least one reactive group that is non-radically polymerizable in the molecule;
4. The photocurable resin composition according to 3 above, comprising
5.(イ)成分の単量体が、炭素数が1〜20のアルキル(メタ)アクリレートである上記4に記載の光硬化性樹脂組成物。
6.(イ)成分の単量体が、炭素数が1〜8のアルキル(メタ)アクリレートである上記5に記載の光硬化性樹脂組成物。
7.(ロ)成分の単量体が、メチルメタクリレート、及びスチレンからなる群から選ばれる少なくとも1種を含有する上記4〜6のいずれか一項に記載の光硬化性樹脂組成物。
8.(ハ)成分の単量体が、水酸基、カルボン酸基、グリシジル基、イソシアネート基、アミノ基、及びアルコキシシリル基からなる群から選ばれる一つ以上の基を有する上記4〜7のいずれか一項に記載の光硬化性樹脂組成物。
9.(ハ)成分の単量体が、グリシジル(メタ)アクリレートまたはヒドロキシアルキル(メタ)アクリレートである上記8に記載の光硬化性樹脂組成物。5. (A) The photocurable resin composition according to 4 above, wherein the component monomer is an alkyl (meth) acrylate having 1 to 20 carbon atoms.
6). (A) The photocurable resin composition as described in 5 above, wherein the component monomer is an alkyl (meth) acrylate having 1 to 8 carbon atoms.
7). (B) The photocurable resin composition according to any one of the above 4 to 6, wherein the monomer of the component contains at least one selected from the group consisting of methyl methacrylate and styrene.
8). (C) Any one of the above 4 to 7 wherein the component monomer has one or more groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a glycidyl group, an isocyanate group, an amino group, and an alkoxysilyl group. The photocurable resin composition according to Item.
9. (C) The photocurable resin composition according to 8 above, wherein the monomer of the component is glycidyl (meth) acrylate or hydroxyalkyl (meth) acrylate.
10.ゴム組成物が、分子内に少なくとも1つの芳香族基を有する上記1〜9のいずれか一項に記載の光硬化性樹脂組成物。
11.ゴム組成物の25℃での粘度が、100〜100,000mPa・sの範囲にある、上記1〜10のいずれか一項に記載の光硬化性樹脂組成物。
12.ゴム組成物のガラス転移温度が25℃未満である、上記1〜11のいずれか一項に記載の光硬化性樹脂組成物。
13.光硬化性樹脂組成物中におけるゴム組成物の占める割合が0.01〜30質量%である、上記1〜12のいずれか一項に記載の光硬化性樹脂組成物。
14.光ラジカル重合性樹脂が、アクリル樹脂である上記1〜13のいずれか一項に記載の光硬化性樹脂組成物。
15.アクリル樹脂が、(a−1)分子の末端又は側鎖に1個以上の(メタ)アクリロイル基を有し、分子量が5,000〜100,000のウレタン(メタ)アクリレートオリゴマー1種以上と、(a−2)単官能(メタ)アクリレートとからなる、上記14に記載の光硬化性樹脂組成物。10. The photocurable resin composition according to any one of 1 to 9, wherein the rubber composition has at least one aromatic group in the molecule.
11. The photocurable resin composition as described in any one of said 1-10 whose viscosity in 25 degreeC of a rubber composition exists in the range of 100-100,000 mPa * s.
12 The photocurable resin composition according to any one of 1 to 11 above, wherein the rubber composition has a glass transition temperature of less than 25 ° C.
13. The photocurable resin composition according to any one of 1 to 12, wherein a ratio of the rubber composition in the photocurable resin composition is 0.01 to 30% by mass.
14 The photocurable resin composition according to any one of 1 to 13 above, wherein the photoradical polymerizable resin is an acrylic resin.
15. The acrylic resin (a-1) has one or more (meth) acryloyl groups at the end or side chain of the molecule, and one or more urethane (meth) acrylate oligomers having a molecular weight of 5,000 to 100,000; (A-2) The photocurable resin composition according to the above 14, comprising a monofunctional (meth) acrylate.
16.(a−2)単官能(メタ)アクリレートが、下記式〔1〕または〔2〕で表される単官能(メタ)アクリレートである上記15に記載の光硬化性樹脂組成物。
17.(a−2)単官能(メタ)アクリレートが、当該ホモポリマーのガラス転移温度が20℃以上である、上記15または16に記載の光硬化性樹脂組成物。
18.光ラジカル付加重合性樹脂が、分子内に2つ以上の炭素−炭素不飽和二重結合を有するポリエン化合物と、分子内に2つ以上のメルカプト基を有するポリチオール化合物とからなる、上記1〜13のいずれか一項に記載の光硬化性樹脂組成物。
19.光カチオン重合性樹脂が、分子内にエポキシ基、オキセタニル基またはビニルエーテル基を有する上記1〜13のいずれか一項に記載の光硬化性樹脂組成物。
20.硬化収縮率が10%以下である、上記1〜19のいずれか一項に記載の光硬化性樹脂組成物。
21.上記1〜20のいずれか一項に記載の光硬化性樹脂組成物からなる硬化体。17. (A-2) The photocurable resin composition according to 15 or 16 above, wherein the monofunctional (meth) acrylate has a glass transition temperature of the homopolymer of 20 ° C. or higher.
18. 1 to 13 above, wherein the photoradical addition polymerizable resin comprises a polyene compound having two or more carbon-carbon unsaturated double bonds in the molecule and a polythiol compound having two or more mercapto groups in the molecule. The photocurable resin composition as described in any one of these.
19. 14. The photocurable resin composition according to any one of 1 to 13, wherein the photocationically polymerizable resin has an epoxy group, an oxetanyl group, or a vinyl ether group in the molecule.
20. 20. The photocurable resin composition according to any one of 1 to 19 above, which has a curing shrinkage rate of 10% or less.
21. The hardening body which consists of a photocurable resin composition as described in any one of said 1-20.
本発明の光硬化性樹脂組成物は、紫外線または可視光線等の光照射により瞬時に硬化し、しかもその硬化体は振動疲労耐久性に優れるという特性を有している。したがって、タイヤ等の自動車部材、土木、建築等の構造物用シール部材、Oリング等のパッキング部材、スピーカー等の音響用、携帯電話用キーシート等のシート部材、部材、防振材料、各種機構部材等に好適に使用できる。また、本発明の光硬化性樹脂組成物は、その優れた疲労特性から土木、建築等の構造用シーリング剤、金属、マグネット、セラミックス、ガラス、プラスチック用の接着剤にも適用できる。 The photocurable resin composition of the present invention has characteristics that it is instantly cured by irradiation with light such as ultraviolet rays or visible light, and the cured product has excellent vibration fatigue durability. Therefore, automobile members such as tires, sealing members for structures such as civil engineering and construction, packing members such as O-rings, acoustic members such as speakers, sheet members such as key sheets for mobile phones, members, vibration-proof materials, various mechanisms It can be suitably used for members and the like. Moreover, the photocurable resin composition of the present invention can also be applied to structural and structural sealants for civil engineering and construction, and adhesives for metals, magnets, ceramics, glass and plastics due to its excellent fatigue properties.
本明細書において「分子量」とは、特に説明がない場合、重量平均分子量を意味する。
本明細書において「Tg」とは、特に説明がない場合、ガラス転移温度を意味する。
本明細書において「アルキル基」とは、特に説明がない場合、直鎖、分岐および環状飽和炭化水素基を意味する。In the present specification, “molecular weight” means a weight average molecular weight unless otherwise specified.
In this specification, “Tg” means a glass transition temperature unless otherwise specified.
In the present specification, the “alkyl group” means a linear, branched and cyclic saturated hydrocarbon group unless otherwise specified.
本発明の光硬化性樹脂組成物に於いては、(A)成分である、光の照射を受けて硬化体を形成する光硬化性樹脂が含有される。ここでいう光とは、紫外線、可視光線等に代表される活性エネルギー線をいい、本発明の光硬化性樹脂組成物に於いては、光硬化性樹脂としては、光ラジカル重合性樹脂、光ラジカル付加重合性樹脂、及び光カチオン重合性樹脂からなる群から選ばれる少なくとも1つの樹脂を用いることができる。このうち、光ラジカル重合性樹脂が、材料選択性が豊富なアクリル樹脂を含有することから好ましく選択される。 In the photocurable resin composition of this invention, the photocurable resin which receives the irradiation of light and forms a hardening body which is (A) component is contained. The term “light” as used herein refers to an active energy ray typified by ultraviolet rays and visible rays. In the photocurable resin composition of the present invention, the photocurable resin includes a photo-radical polymerizable resin, a light At least one resin selected from the group consisting of radical addition polymerizable resins and photocationic polymerizable resins can be used. Of these, the radical photopolymerizable resin is preferably selected because it contains an acrylic resin rich in material selectivity.
光ラジカル付加重合性樹脂としては、ラジカル発生によりチオール基が炭素−炭素不飽和結合へ付加するエン・チオール反応が公知として知られている。特に分子内に少なくとも2個以上のチオール基を有する化合物と分子内に2個以上の炭素−炭素不飽和結合を有する化合物とからなるエン・チオール樹脂が光硬化性に優れるという理由で好ましい。 As the photoradical addition polymerizable resin, an ene-thiol reaction in which a thiol group is added to a carbon-carbon unsaturated bond by radical generation is known as known. In particular, an ene-thiol resin composed of a compound having at least two or more thiol groups in the molecule and a compound having two or more carbon-carbon unsaturated bonds in the molecule is preferable because of excellent photocurability.
光カチオン重合性樹脂としては、分子内にエポキシ基を有する樹脂、オキセタニル基を有する樹脂、ビニルエーテル基を有する樹脂、スピロオルソエステル基を有する樹脂、ビシクロオルソエステル基を有する樹脂、スピロオルソカーボネート基を有する樹脂等が挙げられる。このうちエポキシ基、オキセタニル基またはビニルエーテル基を有する樹脂が光硬化性および材料選択の豊富さという理由で好ましい。 Examples of the cationic photopolymerizable resin include resins having an epoxy group in the molecule, resins having an oxetanyl group, resins having a vinyl ether group, resins having a spiro ortho ester group, resins having a bicyclo ortho ester group, and spiro ortho carbonate groups. And the like. Of these, a resin having an epoxy group, an oxetanyl group or a vinyl ether group is preferable because of photocurability and abundant selection of materials.
光ラジカル重合性樹脂としては、アクリル樹脂、スチレン樹脂、ビニル樹脂、不飽和ポリエステル、ポリオレフィン等が挙げられ、このうちアクリル樹脂が光硬化性および材料選択の豊富さという理由で好ましい。 Examples of the photo-radical polymerizable resin include acrylic resins, styrene resins, vinyl resins, unsaturated polyesters, polyolefins, etc. Among them, acrylic resins are preferable because of their photocurability and abundant material selection.
アクリル樹脂としては、ポリ(メタ)アクリレート、(メタ)アクリレートモノマー、(メタ)アクリレートダイマー、ポリエステル(メタ)アクリレート、ウレタン(メタ)アクリレート、エポキシ(メタ)アクリレート、ポリオレフィン(メタ)アクリレート、シリコーン(メタ)アクリレート等が例示される。本発明の目的を達成するにあたっては、ウレタン(メタ)アクリレートと(メタ)アクリレートモノマーとからなる樹脂組成物が好ましい。特に好ましくは、(a−1)分子の末端又は側鎖に1個以上の(メタ)アクリロイル基を有し、分子量が5,000〜100,000のウレタン(メタ)アクリレートオリゴマーの1種以上と(a−2)単官能(メタ)アクリレートとからなる樹脂組成物である。 Acrylic resins include poly (meth) acrylate, (meth) acrylate monomer, (meth) acrylate dimer, polyester (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, polyolefin (meth) acrylate, silicone (meth) ) Acrylate and the like. In achieving the object of the present invention, a resin composition comprising urethane (meth) acrylate and (meth) acrylate monomer is preferred. Particularly preferably, (a-1) one or more urethane (meth) acrylate oligomers having one or more (meth) acryloyl groups at the end or side chain of the molecule and having a molecular weight of 5,000 to 100,000; (A-2) A resin composition comprising monofunctional (meth) acrylate.
前記(a−1)成分である、ウレタン(メタ)アクリレートオリゴマーは、ポリオール化合物(以後、Xで表す)と有機ポリイソシアネート化合物(以後、Yで表す)とヒドロキシ(メタ)アクリレート(以後、Zで表す)とを反応させてなる、ウレタン(メタ)アクリレートオリゴマーをいう。 The urethane (meth) acrylate oligomer as the component (a-1) is composed of a polyol compound (hereinafter represented by X), an organic polyisocyanate compound (hereinafter represented by Y), and a hydroxy (meth) acrylate (hereinafter represented by Z). Represents a urethane (meth) acrylate oligomer.
かかるポリオール化合物(X)としては、例えば、エチレングリコール、ジエチレングリコール、トリエチレングリコール、テトラエチレングリコール、ポリエチレングリコール、プロピレングリコール、ジプロピレングリコール、ポリプロピレングリコール、ブチレングリコール、1,4−ブタンジオール、ポリブチレングリコール、1,5−ペンタンジオール、1,6−ヘキサンジオール、1,8−オクタンジオール、1,9−ノナンジオール、3−メチル−1,5−ペンタンジオール、2,4−ジエチル−1,5−ペンタンジオール、2,2−ブチルエチル−1,3−プロパンジオール、ネオペンチルグリコール、シクロヘキサンジメタノール、水素添加ビスフェノールA、ポリカプロラクトン、トリメチロールエタン、トリメチロールプロパン、ポリトリメチロールプロパン、ペンタエリスリトール、ポリペンタエリスリトール、ソルビトール、マンニトール、グリセリン、ポリグリセリン、ポリテトラメチレングリコール等の多価アルコール;ポリエチレンオキサイド、ポリプロピレンオキサイド、エチレンオキサイド/プロピレンオキサイドのブロック又はランダム共重合の少なくとも1種の構造を有するポリエーテルポリオール;該多価アルコール又はポリエーテルポリオールと無水マレイン酸、マレイン酸、フマール酸、無水イタコン酸、イタコン酸、アジピン酸、イソフタル酸等の多塩基酸との縮合物であるポリエステルポリオール;カプロラクトン変性ポリテトラメチレンポリオール等のカプロラクトン変性ポリオール;ポリオレフィン系ポリオール;ポリカーボネート系ポリオール;水添ポリブタジエンポリオール等のポリブタジエン系ポリオール;ポリジメチルシロキサンポリオール等のシリコーンポリオール等が挙げられる。特に好ましくは、ポリエーテルポリオール、ポリエステルポリオールである。 Examples of the polyol compound (X) include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, polypropylene glycol, butylene glycol, 1,4-butanediol, and polybutylene glycol. 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 3-methyl-1,5-pentanediol, 2,4-diethyl-1,5- Pentanediol, 2,2-butylethyl-1,3-propanediol, neopentyl glycol, cyclohexanedimethanol, hydrogenated bisphenol A, polycaprolactone, trimethylolethane, trimethylo Polyhydric alcohols such as propane, polytrimethylolpropane, pentaerythritol, polypentaerythritol, sorbitol, mannitol, glycerin, polyglycerin, polytetramethylene glycol; polyethylene oxide, polypropylene oxide, ethylene oxide / propylene oxide block or random copolymerization A polyether polyol having at least one structure of: a polyhydric alcohol or polyether polyol and a polybasic acid such as maleic anhydride, maleic acid, fumaric acid, itaconic anhydride, itaconic acid, adipic acid, and isophthalic acid Polyester polyol that is a condensate; caprolactone-modified polyol such as caprolactone-modified polytetramethylene polyol; polyolefin-based polyol; Boneto polyol; polybutadiene polyols such as hydrogenated polybutadiene polyol; silicone polyols such as polydimethylsiloxane polyols and the like. Particularly preferred are polyether polyols and polyester polyols.
中でも特に、分子量が200〜10,000であることが好ましく、好ましくは500〜8,000、更に好ましくは1,000〜6,000である。かかる分子量が200以上ならば好適な振動疲労耐久性を得ることができるし、10,000以内であれば硬化性が低下することもなく、好ましい。 Especially, it is preferable that molecular weight is 200-10,000, Preferably it is 500-8,000, More preferably, it is 1,000-6,000. If the molecular weight is 200 or more, suitable vibration fatigue durability can be obtained, and if it is 10,000 or less, the curability does not deteriorate, which is preferable.
有機ポリイソシアネート化合物(Y)としては、特に限定されることなく、例えば芳香族系、脂肪族系、環式脂肪族系、脂環式系等のポリイソシアネートが挙げられる。中でもトリレンジイソシアネート(TDI)、ジフェニルメタンジイソシアネート(MDI)、水添化ジフェニルメタンジイソシアネート(H−MDI)、ポリフェニルメタンポリイソシアネート(クルードMDI)、変性ジフェニルメタンジイソシアネート(変性MDI)、水添化キシリレンジイソシアネート(H−XDI)、キシリレンジイソシアネート(XDI)、ヘキサメチレンジイソシアネート(HMDI)、トリメチルヘキサメチレンジイソシアネート(TMXDI)、テトラメチルキシリレンジイソシアネート(m−TMXDI)、イソホロンジイソシアネート(IPDI)、ノルボルネンジイソシアネート(NBDI)、1,3−ビス(イソシアナトメチル)シクロヘキサン(H6XDI)等のポリイソシアネート或いはこれらポリイソシアネートの三量体化合物、これらポリイソシアネートとポリオールの反応生成物等が好適に用いられる。中でも水添化キシリレンジイソシアネート(H−XDI)、イソホロンジイソシアネート(IPDI)が好ましい。該ポリイソシアネート化合物(Y)の分子量は500以下が好ましい。500以下であればジオールとの反応性が低下することもない。 The organic polyisocyanate compound (Y) is not particularly limited, and examples thereof include aromatic, aliphatic, cycloaliphatic, and alicyclic polyisocyanates. Among them, tolylene diisocyanate (TDI), diphenylmethane diisocyanate (MDI), hydrogenated diphenylmethane diisocyanate (H-MDI), polyphenylmethane polyisocyanate (crude MDI), modified diphenylmethane diisocyanate (modified MDI), hydrogenated xylylene diisocyanate ( H-XDI), xylylene diisocyanate (XDI), hexamethylene diisocyanate (HMDI), trimethylhexamethylene diisocyanate (TMXDI), tetramethylxylylene diisocyanate (m-TMXDI), isophorone diisocyanate (IPDI), norbornene diisocyanate (NBDI), Polyisocyanate such as 1,3-bis (isocyanatomethyl) cyclohexane (H6XDI) or Trimer compounds of Luo polyisocyanates, reaction products of these polyisocyanates with polyols are preferably used. Of these, hydrogenated xylylene diisocyanate (H-XDI) and isophorone diisocyanate (IPDI) are preferred. The molecular weight of the polyisocyanate compound (Y) is preferably 500 or less. If it is 500 or less, the reactivity with a diol will not fall.
ヒドロキシ(メタ)アクリレート(Z)としては、例えば、2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、2−ヒドロキシブチル(メタ)アクリレート、2−ヒドロキシエチルアクリロイルホスフェート、4−ブチルヒドロキシ(メタ)アクリレート、2−(メタ)アクリロイロキシエチル−2−ヒドロキシプロピルフタレート、グリセリンジ(メタ)アクリレート、2−ヒドロキシ−3−アクリロイロキシプロピル(メタ)アクリレート、カプロラクトン変性2−ヒドロキシエチル(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、カプロラクトン変性2−ヒドロキシエチル(メタ)アクリレート等が挙げられる。中でも2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、2−ヒドロキシブチル(メタ)アクリレートが好適に用いられる。 Examples of the hydroxy (meth) acrylate (Z) include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-hydroxyethyl acryloyl phosphate, and 4-butyl. Hydroxy (meth) acrylate, 2- (meth) acryloyloxyethyl-2-hydroxypropyl phthalate, glycerin di (meth) acrylate, 2-hydroxy-3-acryloyloxypropyl (meth) acrylate, caprolactone modified 2-hydroxyethyl (Meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, caprolactone-modified 2-hydroxyethyl (meth) acrylate, etc. . Of these, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate are preferably used.
前記ウレタン(メタ)アクリレートオリゴマーにおいて、分子中の(メタ)アクリロイル基の数は、分子の末端又は側鎖に1個以上6個以下、より好ましくは2個以上4個以下の(メタ)アクリロイル基を有するものが好ましい。(メタ)アクリロイル基がない場合、前記(B)成分である単官能(メタ)アクリレートと共重合できず、6個より多い場合は、得られる成形体が硬くなりすぎて、優れた振動疲労耐久性が得られないことがある。 In the urethane (meth) acrylate oligomer, the number of (meth) acryloyl groups in the molecule is 1 or more and 6 or less, more preferably 2 or more and 4 or less (meth) acryloyl groups at the end or side chain of the molecule. Those having the following are preferred. When there is no (meth) acryloyl group, it cannot be copolymerized with the monofunctional (meth) acrylate as the component (B), and when there are more than six, the resulting molded product becomes too hard and has excellent vibration fatigue durability. Sexuality may not be obtained.
前記ウレタン(メタ)アクリレートオリゴマーの分子量は、5,000以上100,000以下、より好ましくは10,000以上50,000以下が選択される。分子量が5,000以上ならば、得られる成形体が硬くなりすぎることもなく、100,000以下であれば、硬化性が悪くなることもなく、振動疲労耐久性に優れる硬化体を得ることができる。 The molecular weight of the urethane (meth) acrylate oligomer is selected from 5,000 to 100,000, more preferably from 10,000 to 50,000. If the molecular weight is 5,000 or more, the resulting molded product will not be too hard, and if it is 100,000 or less, the curability will not be deteriorated and a cured product having excellent vibration fatigue durability can be obtained. it can.
前記(a−2)成分である単官能(メタ)アクリレートは、分子内に1つの(メタ)アクリロイル基を含有するものであれば特に限定されない。中でも、下記式〔1〕または〔2〕で表される単官能(メタ)アクリレートを含有する樹脂組成物は振動疲労耐久性の優れた硬化体を得ることができるため特に好ましい。
nは1〜12の整数であり、好ましくは、1〜10である。The monofunctional (meth) acrylate as the component (a-2) is not particularly limited as long as it contains one (meth) acryloyl group in the molecule. Among these, a resin composition containing a monofunctional (meth) acrylate represented by the following formula [1] or [2] is particularly preferable because a cured product having excellent vibration fatigue durability can be obtained.
n is an integer of 1 to 12, preferably 1 to 10.
具体的には、メチル(メタ)アクリレート、エチル(メタ)アクリレート、プロピル(メタ)アクリレート、n−ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、tert−ブチル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、イソデシル(メタ)アクリレート、ラウリル(メタ)アクリレート、ステアリル(メタ)アクリレート、イソステアリル(メタ)アクリレート、トリデシル(メタ)アクリレート、ベヘニル(メタ)アクリレート、メトキシエチル(メタ)アクリレート、エトキシエチル(メタ)アクリレート、プロピオキシエチル(メタ)アクリレート、ブトキシエチル(メタ)アクリレート、メトキシジエチレングリコール(メタ)アクリレート、メトキシトリエチレングリコール(メタ)アクリレート、メトキシテトラエチレン(メタ)アクリレート、フェノキシエチル(メタ)アクリレート、フェノキシジエチレングリコール(メタ)アクリレート、フェノキシテトラエチレングリコール(メタ)アクリレート、フェノキシヘキサエチレングリコール(メタ)アクリレート、メトキシジプロピレングリコール(メタ)アクリレート、メトキシトリプロピレングリコール(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、tert−ブチルシクロヘキシル(メタ)アクリレート、ベンジル(メタ)アクリレート、フェノキシエチル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート、ボルニル(メタ)アクリレート、イソボルニル(メタ)アクリレート、2−メチル−2−アダマンチル(メタ)アクリレート、アリル(メタ)アクリレート等が例示できる。尚、アクリレートとメタクリレートとではメタクリレートの方がより好適な振動疲労耐久性に優れた硬化体を与える。
Specifically, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, 2-ethylhexyl (meta ) Acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate, tridecyl (meth) acrylate, behenyl (meth) acrylate, methoxyethyl (meth) acrylate, ethoxyethyl ( (Meth) acrylate, propoxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, methoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meta) Acrylate, methoxytetraethylene (meth) acrylate, phenoxyethyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxytetraethylene glycol (meth) acrylate, phenoxyhexaethylene glycol (meth) acrylate, methoxydipropylene glycol (meth) acrylate , Methoxytripropylene glycol (meth) acrylate, cyclohexyl (meth) acrylate, tert-butylcyclohexyl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (Meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate 2-methyl-2-adamantyl (meth) acrylate, allyl (meth) acrylate and the like. Incidentally, with acrylate and methacrylate, methacrylate provides a cured body with better vibration fatigue durability.
(a−2)単官能(メタ)アクリレートは、当該ホモポリマーのTgが20℃以上の単官能(メタ)アクリレートであることが好ましい。さらに好ましくはTgが50℃以上、特に好ましくは80℃以上である。Tgが20℃以上であれば、得られる硬化体が柔軟すぎたり、硬化性が悪くなったりすることもない。尚、本発明の光硬化性樹脂組成物のTgは測定方法に特に制限はないが、DSCや動的粘弾性等の公知の方法で測定され、好ましくはDSCが用いられる。 (A-2) The monofunctional (meth) acrylate is preferably a monofunctional (meth) acrylate having a homopolymer Tg of 20 ° C. or higher. More preferably, Tg is 50 ° C. or more, and particularly preferably 80 ° C. or more. If Tg is 20 ° C. or higher, the obtained cured product will not be too flexible and the curability will not deteriorate. In addition, although Tg of the photocurable resin composition of this invention does not have a restriction | limiting in particular in a measuring method, It measures by well-known methods, such as DSC and dynamic viscoelasticity, Preferably DSC is used.
本発明の光硬化性樹脂組成物に於いて、(a−1)成分と(a−2)成分の配合比は、(a−1)成分と(a−2)成分の合計に対し、(a−1)成分を5〜95質量%、特に好ましくは20〜85質量%含有する組成物とするとき、光照射により得られる硬化物は、優れた振動疲労耐久性を有するので特に好ましい。 In the photocurable resin composition of the present invention, the blending ratio of the component (a-1) to the component (a-2) is (total of the component (a-1) and the component (a-2) ( When a composition containing the component a-1) is contained in an amount of 5 to 95% by mass, particularly preferably 20 to 85% by mass, a cured product obtained by light irradiation is particularly preferable because it has excellent vibration fatigue durability.
(B)成分である光重合開始剤は、紫外線重合開始剤や可視光重合開始剤等があるが、どちらも制限無く用いられる。光ラジカル重合開始剤としては、ベンゾイン系、ベンゾフェノン系、アセトフェノン系、アシルホスフィンオキサイド系、チオキサントン系、メタロセン系、キノン系等がある。光カチオン重合開始剤としては、ヨードニウム塩化合物、スルフォニウム塩化合物、ホスフォニウム塩化合物、ピリジニウム塩化合物、鉄−アレーン錯体化合物等が挙げられる。 The photopolymerization initiator as the component (B) includes an ultraviolet polymerization initiator and a visible light polymerization initiator, and both are used without limitation. Examples of the photo radical polymerization initiator include benzoin, benzophenone, acetophenone, acylphosphine oxide, thioxanthone, metallocene, and quinone. Examples of the cationic photopolymerization initiator include iodonium salt compounds, sulfonium salt compounds, phosphonium salt compounds, pyridinium salt compounds, and iron-arene complex compounds.
本発明に於いて、光重合開始剤としては、特に限定されずに公知のものが使用できる。例えば、ベンゾフェノン、4−フェニルベンゾフェノン、ベンゾイル安息香酸、2,2−ジエトキシアセトフェノン、ビスジエチルアミノベンゾフェノン、ベンジル,ベンゾイン、ベンゾイルイソプロピルエーテル、ベンジルジメチルケタール、1−ヒドロキシシクロヘキシルフェニルケトン、チオキサントン、1−(4−イソプロピルフェニル)2−ヒドロキシ−2−メチルプロパン−1−オン、1−(4−(2−ヒドロキシエトキシ)−フェニル)−2−ヒドロキシ−2−メチル−1−プロパン−1−オン、2−ヒドロキシ−2−メチル−1−フェニルプロパン−1−オン、カンファーキノン、2,4,6−トリメチルベンゾイルジフェニルホスフィンオキサイド、ビス(2,4,6−トリメチルベンゾイル)−フェニルホスフィンオキサイド、2−メチル−1−(4−(メチルチオ)フェニル)−2−モルフォリノプロパン−1−オン、2−ベンジル−2-ジメチルアミノ−1−(4−モルフォリノフェニル)−1−ブタノン−1、ビス(2,6−ジメトキシベンゾイル)−2,4,4−トリメチル−ペンチルホスフィンオキサイド等が挙げられる。 In the present invention, the photopolymerization initiator is not particularly limited, and known ones can be used. For example, benzophenone, 4-phenylbenzophenone, benzoylbenzoic acid, 2,2-diethoxyacetophenone, bisdiethylaminobenzophenone, benzyl, benzoin, benzoylisopropyl ether, benzyldimethyl ketal, 1-hydroxycyclohexyl phenyl ketone, thioxanthone, 1- (4 -Isopropylphenyl) 2-hydroxy-2-methylpropan-1-one, 1- (4- (2-hydroxyethoxy) -phenyl) -2-hydroxy-2-methyl-1-propan-1-one, 2- Hydroxy-2-methyl-1-phenylpropan-1-one, camphorquinone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxy Id, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone- 1, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide and the like.
(C)成分である酸化防止剤としては、例えば、β−ナフトキノン、2−メトキシ−1,4−ノフトキノン、メチルハイドロキノン、ハイドロキノン、ハイドロキノンモノメチルエーテル、モノ−tert−ブチルハイドロキノン、2,5−ジ−tert−ブチルハイドロキノン、p−ベンゾキノン、2,5−ジフェニル−p−ベンゾキノン、2,5−ジ−tert−ブチル−p−ベンゾキノン等のキノン系化合物;フェノチアジン、2,2−メチレン−ビス(4−メチル−6−tert−ブチルフェノール)、カテコール、tert−ブチルカテコール、2−ブチル−4−ヒドロキシアニソール、2,6−ジ−tert−ブチル−p−クレゾール、2−tert−ブチル−6−(3−tert−ブチル−2−ヒドロキシ−5−メチルベンジル)−4−メチルフェニルアクリレート、2−〔1−(2−ヒドロキシ−3,5−ジ−tert−ペンチルフェニル)エチル〕−4,6−ジ−tert−ペンチルフェニルアクリレート、4,4′−ブチリデンビス(6−tert−ブチル−3−メチルフェノール)、4,4′−チオビス(6−tert−ブチル−3−メチルフェノール)、3,9−ビス〔2−〔3−(3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニロキシ〕−1,1−ジメチルエチル〕−2,4,8,10−テトラオキサスピロ〔5,5〕ウンデカン、ペンタエリスリトールテトラキス〔3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート〕、チオジエチレンビス〔3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート〕、オクタデシル−3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート、N,N′−ヘキサン−1,6−ジイルビス〔3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオンアミド〕、ベンゼンプロパン酸,3,5−ビス(1,1−ジメチルエチル)−4−ヒドロキシ,C7−C9側鎖アルキルエステル、2,4−ジメチル−6−(1−メチルペンタデシル)フェノール、ジエチル〔〔3,5−ビス(1,1−ジメチルエチル)−4−ヒドロキシフェニル〕メチル〕フォスフォネート、3,3′,3″,5,5′,5″−ヘキサ−tert−ブチル−a,a′,a″−(メシチレン−2,4,6−トリル)トリ−p−クレゾール、カルシウムジエチルビス〔〔3,5−ビス(1,1−ジメチルエチル)−4−ヒドロキシフェニル〕メチル〕フォスフォネート、4,6−ビス(オクチルチオメチル)−o−クレゾール、エチレンビス(オキシエチレン)ビス〔3−(5−tert−ブチル−4−ヒドロキシ−m−トリル)プロピオネート〕、ヘキサメチレンビス〔3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート、1,3,5−トリス(3,5−ジ−tert−ブチル−4−ヒドロキシベンジル)−1,3,5−トリアジン−2,4,6(1H,3H,5H)−トリオン、1,3,5−トリス〔(4−tert−ブチル−3−ヒドロキシ−2,6−キシリル)メチル〕−1,3,5−トリアジン−2,4,6(1H,3H,5H)−トリオン、N−フェニルベンゼンアミンと2,4,6−トリメチルペンテンとの反応生成物、2,6−ジ−tert−ブチル−4−(4,6−ビス(オクチルチオ)−1,3,5−トリアジン−2−イルアミノ)フェノール、ピクリン酸、クエン酸等のフェノール類;トリス(2,4−ジ−tert−ブチルフェニル)フォスファイト、トリス〔2−〔〔2,4,8,10−テトラ−tert−ブチルジベンゾ〔d,f〕〔1,3,2〕ジオキサフォスフェフィン−6−イル〕オキシ〕エチル〕アミン、ビス(2,4−ジ−tert−ブチルフェニル)ペンタエリスリートールジフォスファイト、ビス〔2,4−ビス(1,1−ジメチルエチル)−6−メチルフェニル〕エチルエステル亜リン酸、テトラキス(2,4−ジ−tert−ブチルフェニル)〔1,1−ビスフェニル〕−4,4‘−ジイルビスホスフォナイト、6−〔3−(3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル)プロポキシ〕−2,4,8,10−テトラ−tert−ブチルジベンズ〔d、f〕〔1,3,2〕ジオキサフォスフェフィン等のリン系化合物;ジラウリル3,3′−チオジプロピオネート、ジミリスチル3,3′−チオジプロピオネート、ジステアリル3,3’−チオジプロピオネート、ペンタエリスリチルテトラキス(3−ラウリルチオプロピオネート)、2−メルカプトベンズイミダゾール等のイオウ系化合物;フェノチアジン等のアミン系化合物;ラクトン系化合物;ビタミンE系化合物等が挙げられる。中でもフェノール系化合物が好適である。 Examples of the antioxidant as component (C) include β-naphthoquinone, 2-methoxy-1,4-noftquinone, methyl hydroquinone, hydroquinone, hydroquinone monomethyl ether, mono-tert-butyl hydroquinone, 2,5-di- quinone compounds such as tert-butylhydroquinone, p-benzoquinone, 2,5-diphenyl-p-benzoquinone, 2,5-di-tert-butyl-p-benzoquinone; phenothiazine, 2,2-methylene-bis (4- Methyl-6-tert-butylphenol), catechol, tert-butylcatechol, 2-butyl-4-hydroxyanisole, 2,6-di-tert-butyl-p-cresol, 2-tert-butyl-6- (3- tert-Butyl-2-hydroxy-5-methylbenz ) -4-methylphenyl acrylate, 2- [1- (2-hydroxy-3,5-di-tert-pentylphenyl) ethyl] -4,6-di-tert-pentylphenyl acrylate, 4,4'-butylidenebis (6-tert-butyl-3-methylphenol), 4,4'-thiobis (6-tert-butyl-3-methylphenol), 3,9-bis [2- [3- (3-tert-butyl- 4-hydroxy-5-methylphenyl) propionyloxy] -1,1-dimethylethyl] -2,4,8,10-tetraoxaspiro [5,5] undecane, pentaerythritol tetrakis [3- (3,5 -Di-tert-butyl-4-hydroxyphenyl) propionate], thiodiethylenebis [3- (3,5-di-tert-butyl-4-hydride) Loxyphenyl) propionate], octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, N, N′-hexane-1,6-diylbis [3- (3,5-di-) tert-butyl-4-hydroxyphenyl) propionamide], benzenepropanoic acid, 3,5-bis (1,1-dimethylethyl) -4-hydroxy, C7-C9 side chain alkyl ester, 2,4-dimethyl-6 -(1-methylpentadecyl) phenol, diethyl [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] phosphonate, 3,3 ', 3 ", 5,5' , 5 "-hexa-tert-butyl-a, a ', a"-(mesitylene-2,4,6-tolyl) tri-p-cresol, calcium diethylbis [3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] phosphonate, 4,6-bis (octylthiomethyl) -o-cresol, ethylenebis (oxyethylene) bis [3 -(5-tert-butyl-4-hydroxy-m-tolyl) propionate], hexamethylenebis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate, 1,3,5-tris (3,5-di-tert-butyl-4-hydroxybenzyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, 1,3,5-tris [(4 -Tert-butyl-3-hydroxy-2,6-xylyl) methyl] -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, N-phenylbenze Reaction product of amine and 2,4,6-trimethylpentene, 2,6-di-tert-butyl-4- (4,6-bis (octylthio) -1,3,5-triazin-2-ylamino) Phenols such as phenol, picric acid, citric acid; tris (2,4-di-tert-butylphenyl) phosphite, tris [2-[[2,4,8,10-tetra-tert-butyldibenzo [d , F] [1,3,2] dioxaphosphine-6-yl] oxy] ethyl] amine, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis [2 , 4-Bis (1,1-dimethylethyl) -6-methylphenyl] ethyl ester phosphorous acid, tetrakis (2,4-di-tert-butylphenyl) [1,1-bispheny L] -4,4′-diylbisphosphonite, 6- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propoxy] -2,4,8,10-tetra-tert- Phosphorus compounds such as butyl dibenz [d, f] [1,3,2] dioxaphosphine; dilauryl 3,3′-thiodipropionate, dimyristyl 3,3′-thiodipropionate, distearyl 3, 3'-thiodipropionate, pentaerythrityltetrakis (3-laurylthiopropionate), sulfur compounds such as 2-mercaptobenzimidazole; amine compounds such as phenothiazine; lactone compounds; vitamin E compounds Can be mentioned. Of these, phenol compounds are preferred.
(D)成分である光安定剤としては、例えば、ビス(2,2,6,6−テトラメチル−4−ピペリジル)セバケート、ビス(1,2,2,6,6−ペンタメチル−4−ピペリジル)セバケート、4−ベンゾイルオキシ−2,2,6,6−テトラメチルピペリジン、1−〔2−〔3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオニルオキシ〕エチル〕−4−〔3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオニルオキシ〕−2,2,6,6−テトラメチルピペリジン、1,2,2,6,6−ペンタメチル−4−ピペリジニル−メタアクリレート、ビス(1,2,2,6,6−ペンタメチル−4−ピペリジニル)〔〔3,5−ビス(1,1−ジメチルエチル)−4−ヒドロキシフェニル〕メチル〕ブチルマロネート、デカン二酸ビス(2,2,6,6−テトラメチル−1(オクチルオキシ)−4−ピペリジニル)エステル,1,1−ジメチルエチルヒドロペルオキシドとオクタンの反応生成物、N,N′,N″,N″′−テトラキス−(4,6−ビス−(ブチル−(N−メチル−2,2,6,6−テトラメチルピペリジン−4−イル)アミノ)−トリアジン−2−イル)−4,7−ジアザデカン−1,10−ジアミン、ジブチルアミン・1,3,5−トリアジン・N,N′−ビス(2,2,6,6−テトラメチル−4−ピペリジル−1,6−ヘキサメチレンジアミンとN−(2,2,6,6−テトラメチル−4−ピペリジル)ブチルアミンの重縮合物、ポリ〔〔6−(1,1,3,3−テトラメチルブチル)アミノ−1,3,5−トリアジン−2,4−ジイル〕〔(2,2,6,6−テトラメチル−4−ピペリジル)イミノ〕ヘキサメチレン〔(2,2,6,6−テトラメチル−4−ピペリジル)イミノ〕〕、コハク酸ジメチルと4−ヒドロキシ−2,2,6,6−テトラメチル−1−ピペリジンエタノールの重合物、2,2,4,4−テトラメチル−20−(β−ラウリルオキシカルボニル)エチル−7−オキサ−3,20−ジアザジスピロ〔5・1・11・2〕ヘネイコサン−21−オン、β−アラニン,N,−(2,2,6,6−テトラメチル−4−ピペリジニル)−ドデシルエステル/テトラデシルエステル、N−アセチル−3−ドデシル−1−(2,2,6,6−テトラメチル−4−ピペリジニル)ピロリジン−2,5−ジオン、2,2,4,4−テトラメチル−7−オキサ−3,20−ジアザジスピロ〔5,1,11,2〕ヘネイコサン−21−オン、2,2,4,4−テトラメチル−21−オキサ−3,20−ジアザジシクロ−〔5,1,11,2〕−ヘネイコサン−20−プロパン酸ドデシルエステル/テトラデシルエステル、プロパンジオイックアシッド,〔(4−メトキシフェニル)−メチレン〕−ビス(1,2,2,6,6−ペンタメチル−4−ピペリジニル)エステル、2,2,6,6−テトラメチル−4−ピペリジノールの高級脂肪酸エステル、1,3−ベンゼンジカルボキシアミド,N,N′−ビス(2,2,6,6−テトラメチル−4−ピペリジニル)等のヒンダートアミン系;オクタベンゾン等のベンゾフェノン系化合物;2−(2H−ベンゾトリアゾール−2−イル)−4−(1,1,3,3−テトラメチルブチル)フェノール、2−(2−ヒドロキシ−5−メチルフェニル)ベンゾトリアゾール、2−〔2−ヒドロキシ−3−(3,4,5,6−テトラヒドロフタルイミド−メチル)−5−メチルフェニル〕ベンゾトリアゾール、2−(3−tert−ブチル−2−ヒドロキシ−5−メチルフェニル)−5−クロロベンゾトリアゾール、2−(2−ヒドロキシ−3,5−ジ−tert−ペンチルフェニル)ベンゾトリアゾール、メチル3−(3−(2H−ベンゾトリアゾール−2−イル)−5−tert−ブチル−4−ヒドロキシフェニル)プロピオネートとポリエチレングリコールの反応生成物、2−(2H−ベンゾトリアゾール−2−イル)−6−ドデシル−4−メチルフェノール等のベンゾトリアゾール系化合物;2,4−ジ−tert−ブチルフェニル−3,5−ジ−tert−ブチル−4−ヒドロキシベンゾエート等のベンゾエート系化合物;2−(4,6−ジフェニル−1,3,5−トリアジン−2−イル)−5−〔(ヘキシル)オキシ〕フェノール等のトリアジン系化合物等が挙げられる。特に好ましくは、ヒンダートアミン系化合物である。 Examples of the light stabilizer as component (D) include bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate and bis (1,2,2,6,6-pentamethyl-4-piperidyl). ) Sebacate, 4-benzoyloxy-2,2,6,6-tetramethylpiperidine, 1- [2- [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] ethyl]- 4- [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] -2,2,6,6-tetramethylpiperidine, 1,2,2,6,6-pentamethyl-4 -Piperidinyl-methacrylate, bis (1,2,2,6,6-pentamethyl-4-piperidinyl) [[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methy Butyl malonate, decanedioic acid bis (2,2,6,6-tetramethyl-1 (octyloxy) -4-piperidinyl) ester, reaction product of 1,1-dimethylethyl hydroperoxide and octane, N, N ', N ", N"'-tetrakis- (4,6-bis- (butyl- (N-methyl-2,2,6,6-tetramethylpiperidin-4-yl) amino) -triazine-2- Yl) -4,7-diazadecane-1,10-diamine, dibutylamine, 1,3,5-triazine, N, N′-bis (2,2,6,6-tetramethyl-4-piperidyl-1, 6-hexamethylenediamine and N- (2,2,6,6-tetramethyl-4-piperidyl) butylamine polycondensate, poly [[6- (1,1,3,3-tetramethylbutyl) amino- 1,3,5-G Azine-2,4-diyl] [(2,2,6,6-tetramethyl-4-piperidyl) imino] hexamethylene [(2,2,6,6-tetramethyl-4-piperidyl) imino]], Polymer of dimethyl succinate and 4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol, 2,2,4,4-tetramethyl-20- (β-lauryloxycarbonyl) ethyl-7 -Oxa-3,20-diazadispiro [5 · 1 · 11 · 2] heneicosan-21-one, β-alanine, N,-(2,2,6,6-tetramethyl-4-piperidinyl) -dodecyl ester / Tetradecyl ester, N-acetyl-3-dodecyl-1- (2,2,6,6-tetramethyl-4-piperidinyl) pyrrolidine-2,5-dione, 2,2,4,4-tetramethyl- -Oxa-3,20-diazadispiro [5,1,11,2] heneicosane-21-one, 2,2,4,4-tetramethyl-21-oxa-3,20-diazadicyclo- [5,1,11 , 2] -Heneicosane-20-propanoic acid dodecyl ester / tetradecyl ester, propanedioic acid, [(4-methoxyphenyl) -methylene] -bis (1,2,2,6,6-pentamethyl-4-piperidinyl ) Ester, higher fatty acid ester of 2,2,6,6-tetramethyl-4-piperidinol, 1,3-benzenedicarboxamide, N, N′-bis (2,2,6,6-tetramethyl-4 Hindered amines such as -piperidinyl); benzophenone compounds such as octabenzone; 2- (2H-benzotriazol-2-yl) -4- (1 , 1,3,3-tetramethylbutyl) phenol, 2- (2-hydroxy-5-methylphenyl) benzotriazole, 2- [2-hydroxy-3- (3,4,5,6-tetrahydrophthalimide-methyl) ) -5-methylphenyl] benzotriazole, 2- (3-tert-butyl-2-hydroxy-5-methylphenyl) -5-chlorobenzotriazole, 2- (2-hydroxy-3,5-di-tert- Pentylphenyl) benzotriazole, methyl 3- (3- (2H-benzotriazol-2-yl) -5-tert-butyl-4-hydroxyphenyl) propionate and polyethylene glycol reaction product, 2- (2H-benzotriazole -2-yl) -6-dodecyl-4-methylphenol and other benzotriazole compounds Benzoate compounds such as 2,4-di-tert-butylphenyl-3,5-di-tert-butyl-4-hydroxybenzoate; 2- (4,6-diphenyl-1,3,5-triazine-2; -Il) -5-[(hexyl) oxy] phenol and other triazine compounds. Particularly preferred are hindered amine compounds.
本発明の光硬化性樹脂組成物に於いて、(A)〜(D)成分の合計量を100質量%とするときに、(A)成分が好ましくは85.00〜99.99質量%、特に好ましくは90.0〜99.9質量%含有される。(B)成分は、好ましくは0.01〜15質量%、特に好ましくは0.1〜10質量%含有される。(C)成分および(D)成分の合計を好ましくは0.01〜5質量%、特に好ましくは0.05〜3質量%含有される。(C)成分および(D)成分は、(C)成分/(D)成分の含有比率が好ましくは0/10〜10/0、特に好ましくは1/9〜9/1である。(A)〜(D)成分の含有量がかかる範囲の場合、本発明の光硬化性樹脂組成物から得られる硬化物は、優れた振動疲労耐久性を有するので好ましい。 In the photocurable resin composition of the present invention, when the total amount of the components (A) to (D) is 100% by mass, the component (A) is preferably 85.00 to 99.99% by mass, The content is particularly preferably 90.0 to 99.9% by mass. (B) component becomes like this. Preferably it is 0.01-15 mass%, Most preferably, 0.1-10 mass% is contained. The total of component (C) and component (D) is preferably 0.01 to 5% by mass, particularly preferably 0.05 to 3% by mass. Component (C) and component (D) preferably have a content ratio of component (C) / component (D) of 0/10 to 10/0, particularly preferably 1/9 to 9/1. When the content of the components (A) to (D) is within such a range, a cured product obtained from the photocurable resin composition of the present invention is preferable because it has excellent vibration fatigue durability.
さらに、本発明の光硬化性樹脂組成物は、前記光硬化性樹脂に加えて、(B)光重合開始剤と、(C)酸化防止剤及び(D)光安定剤のいずれか又は両方とを含有し、当該光硬化性樹脂組成物の硬化体は、JIS K7113(プラスチックの引張試験方法)に準拠して引張試験測定を実施したとき、引張弾性率が1〜30MPa、好ましくは1.5〜28.5MPaであり、かつ引張破壊伸びが200%以上、好ましくは201〜1500%である優れた振動疲労耐久性を示すことを特徴とする。硬化体の引張弾性率が1MPa以上であれば、得られる硬化体が柔らかすぎて形状を保持できないという問題を生じることもない。また、硬化体の引張弾性率が30MPa以下で、しかも引張破壊伸びが200%以上であれば、優れた振動疲労耐久性が得られ、発明の効果が確実に得ることができる。 Furthermore, in addition to the photocurable resin, the photocurable resin composition of the present invention includes (B) a photopolymerization initiator, (C) an antioxidant, and (D) one or both of a light stabilizer. The cured product of the photocurable resin composition has a tensile modulus of 1 to 30 MPa, preferably 1.5 when a tensile test measurement is performed in accordance with JIS K7113 (plastic tensile test method). It is characterized by exhibiting excellent vibration fatigue durability of ˜28.5 MPa and a tensile fracture elongation of 200% or more, preferably 201 to 1500%. When the tensile elastic modulus of the cured body is 1 MPa or more, there is no problem that the obtained cured body is too soft to hold the shape. If the tensile modulus of the cured product is 30 MPa or less and the tensile elongation at break is 200% or more, excellent vibration fatigue durability can be obtained, and the effects of the invention can be obtained with certainty.
さらに、本発明の光硬化性樹脂組成物において、(E)成分であるゴム組成物を少なくとも1種類以上含むことが、優れた振動疲労耐久性を得るために好ましい。
ゴム組成物としては、前記のエラストマー(R)が例示できるが、その中でも光硬化性樹脂への相溶性の面から特に好ましくは、(メタ)アクリル酸エステル化合物、ビニル系化合物、及びオレフィン系炭化水素化合物からなる群から選ばれる少なくとも一つの単量体からなる共重合体であるゴム組成物が好ましい。Furthermore, in the photocurable resin composition of the present invention, it is preferable to include at least one rubber composition as the component (E) in order to obtain excellent vibration fatigue durability.
As the rubber composition, the elastomer (R) can be exemplified, and among them, the (meth) acrylic acid ester compound, the vinyl compound, and the olefin carbonization are particularly preferable from the viewpoint of compatibility with the photocurable resin. A rubber composition which is a copolymer comprising at least one monomer selected from the group consisting of hydrogen compounds is preferred.
ゴム組成物の分子量は、好ましくは500〜50,000、特に好ましくは750〜20,000、さらに好ましくは1,000〜10,000の範囲である。分子量が500以上で、光硬化性樹脂は充分な振動疲労耐久性を得ることができ、50,000以下であれば、光硬化性樹脂との相溶性にも優れるので好ましい。
ゴム組成物の分子量分布(重量平均分子量をMw、数平均分子量をMnとしたときのMw/Mn)は1.0以上5.0以下、特に好ましくは1.1以上3.0以下であることが、光硬化性樹脂に相溶し、且つ優れた振動疲労耐久性を与えるため好ましい。The molecular weight of the rubber composition is preferably in the range of 500 to 50,000, particularly preferably 750 to 20,000, and more preferably 1,000 to 10,000. When the molecular weight is 500 or more, the photocurable resin can obtain sufficient vibration fatigue durability, and when it is 50,000 or less, the compatibility with the photocurable resin is excellent, which is preferable.
The molecular weight distribution of the rubber composition (Mw / Mn when the weight average molecular weight is Mw and the number average molecular weight is Mn) is 1.0 to 5.0, particularly preferably 1.1 to 3.0. Is preferable because it is compatible with the photocurable resin and gives excellent vibration fatigue durability.
ゴム組成物を構成する単量体としては、(イ)ホモポリマーのTgが25℃未満であるラジカル重合性単量体、(ロ)ホモポリマーのTgが25℃以上であるラジカル重合性単量体、及び(ハ)分子内に非ラジカル重合性である反応性基を少なくとも一つ有するラジカル重合性単量体、を含むときに、ゴム組成物が、光硬化性樹脂との相溶性が良く、優れた振動疲労耐久性を与えるため特に好ましい。 As the monomer constituting the rubber composition, (a) a radical polymerizable monomer having a Tg of the homopolymer of less than 25 ° C., and (b) a radical polymerizable monomer having a Tg of the homopolymer of 25 ° C. or more. And (c) a radically polymerizable monomer having at least one reactive group that is non-radically polymerizable in the molecule, the rubber composition has good compatibility with the photocurable resin. It is particularly preferable because it provides excellent vibration fatigue durability.
(イ)成分の単量体は、ゴム組成物に柔軟性を与える。ゴム組成物中に占める(イ)成分の割合は20〜90質量%が好ましく、特に好ましくは30〜80質量%である。
(イ)成分としては、炭素数1〜20のアルキル(メタ)アクリレート〔例えば、ブチルアクリレート、n−ブチルメタクリレート、エチルアクリレート、n−オクチルアクリレート、および2−エチルヘキシル(メタ)アクリレート〕、ジエンモノマー〔例えば、ブタジエン、イソプレン〕、ビニルアセテートモノマー等が挙げられる。柔軟性且つ光および熱劣化に対しての安定性を得るためには、炭素数1〜20のアルキル(メタ)アクリレートが好ましく、特に好ましくは炭素数1〜8のアルキル(メタ)アクリレートである。(A) The monomer of the component gives flexibility to the rubber composition. The proportion of the component (A) in the rubber composition is preferably 20 to 90% by mass, particularly preferably 30 to 80% by mass.
(A) As a component, C1-C20 alkyl (meth) acrylate [For example, butyl acrylate, n-butyl methacrylate, ethyl acrylate, n-octyl acrylate, and 2-ethylhexyl (meth) acrylate], diene monomer [ For example, butadiene, isoprene], vinyl acetate monomer and the like. In order to obtain flexibility and stability against light and heat deterioration, an alkyl (meth) acrylate having 1 to 20 carbon atoms is preferable, and an alkyl (meth) acrylate having 1 to 8 carbon atoms is particularly preferable.
(ロ)成分の単量体は、光硬化性樹脂への相溶性を与える。ゴム組成物中に占める(ロ)成分の割合は、0.1〜70質量%が好ましく、特に好ましくは1〜60質量%である。(ロ)成分としては、メチルメタクリレート、エチルメタクリレート、t−ブチルメタクリレート、シクロヘキシルメタクリレート、イソボルニル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート等の(メタ)アクリル酸エステル、(メタ)アクリロニトリル、または、スチレン等のビニル芳香族化合物等が例示できる。相溶性と共重合性のバランスの面から、メチルメタクリレート、スチレンが特に好ましい。 The component (b) monomer provides compatibility with the photocurable resin. The proportion of the component (b) in the rubber composition is preferably 0.1 to 70% by mass, particularly preferably 1 to 60% by mass. As the component (b), methyl methacrylate, ethyl methacrylate, t-butyl methacrylate, cyclohexyl methacrylate, isobornyl (meth) acrylate, (meth) acrylic ester such as dicyclopentanyl (meth) acrylate, (meth) acrylonitrile, or And vinyl aromatic compounds such as styrene. Methyl methacrylate and styrene are particularly preferred from the viewpoint of the balance between compatibility and copolymerization.
(ハ)成分の単量体は、光硬化性樹脂との架橋性、またはゴム組成物同士に架橋性を与える。反応性基としては、非ラジカル重合性であることが好ましい。ラジカル重合性であると、ゴム組成物のラジカル重合と同時に反応してしまうためである。非ラジカル重合性の反応基としては水酸基、カルボン酸基、グリシジル基、イソシアネート基、アミノ基、及びアルコキシシリル基等が挙げられる。ゴム組成物中に占める(ハ)成分の割合は、1〜50質量%が好ましく、特に好ましくは5〜40質量%であることが好ましい。
(ハ)成分としては、2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、グリシジル(メタ)アクリレート、(メタ)アクリル酸、2−(メタ)アクリロイロキシエチルコハク酸、2−(メタ)アクリロイルオキシエチルイソシアネート、1,1−(ビス(メタ)アクリロイルオキシメチル)エチルイソシアネート、ジエチルアミノ(メタ)アクリレート、ジメチルアミノ(メタ)アクリレート、3−(メタ)アクリロイロキシプロピルトリメトキシシラン、3−(メタ)アクリロイロキシプロピルトリエトキシシラン等が例示できる。光硬化性樹脂との反応性において特に好ましくは、2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート等のヒドロキシアルキル(メタ)アクリレート、グリシジル(メタ)アクリレートである。The monomer of component (c) provides crosslinkability with the photocurable resin or crosslinkability between the rubber compositions. The reactive group is preferably non-radical polymerizable. It is because it reacts simultaneously with radical polymerization of a rubber composition as it is radically polymerizable. Examples of the non-radical polymerizable reactive group include a hydroxyl group, a carboxylic acid group, a glycidyl group, an isocyanate group, an amino group, and an alkoxysilyl group. The proportion of the component (c) in the rubber composition is preferably 1 to 50% by mass, particularly preferably 5 to 40% by mass.
As the component (c), 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate, (meth) acrylic acid, 2- (meth) acryloyloxyethyl succinic acid, 2 -(Meth) acryloyloxyethyl isocyanate, 1,1- (bis (meth) acryloyloxymethyl) ethyl isocyanate, diethylamino (meth) acrylate, dimethylamino (meth) acrylate, 3- (meth) acryloyloxypropyltrimethoxysilane , 3- (meth) acryloyloxypropyltriethoxysilane and the like. Particularly preferred in terms of reactivity with the photocurable resin are hydroxyalkyl (meth) acrylates such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate, and glycidyl (meth) acrylate.
ゴム組成物の重合方法としては、ラジカル重合およびアニオン重合等公知の方法を用いることができる。 As a polymerization method of the rubber composition, known methods such as radical polymerization and anionic polymerization can be used.
ラジカル重合としては、塊状重合、懸濁重合、塊状-懸濁重合、溶液重合、乳化重合、連続重合等、公知の方法を用いることができる。また、必要に応じてラジカル発生剤を用いることができる。 As the radical polymerization, known methods such as bulk polymerization, suspension polymerization, bulk-suspension polymerization, solution polymerization, emulsion polymerization, and continuous polymerization can be used. Moreover, a radical generator can be used as needed.
ラジカル重合で用いられる溶媒、重合温度等の重合条件は、特に限定されるものではない。重合は無溶媒または各種の溶剤中で行うことができる。無溶媒で重合することが重合速度が高く、生産性が向上するので好ましい。 The polymerization conditions such as the solvent used in the radical polymerization and the polymerization temperature are not particularly limited. The polymerization can be carried out without solvent or in various solvents. Polymerization without solvent is preferable because the polymerization rate is high and productivity is improved.
重合温度は50〜500℃の温度範囲とすることが、高い重合速度及び重合速度の制御が容易な点から好ましく、特に好ましい重合温度は100〜400℃である。 The polymerization temperature is preferably in the temperature range of 50 to 500 ° C. from the viewpoint of high polymerization rate and easy control of the polymerization rate, and particularly preferred polymerization temperature is 100 to 400 ° C.
ラジカル発生剤としては、種々の化合物を用いることができるが、好ましくは、重合温度条件下で、ラジカルを発生しうるパーオキサイドが挙げられる。パーオキサイドとしては、限定はされないが、例えば、ベンゾイルパーオキサイド、アセチルパーオキサイド、イソブチロイルパーオキサイド、オクタノイルパーオキサイド、デカノイルパーオキサイド、ラウロイルパーオキサイド、3、5、5−トリメチルヘキサノイルパーオキサイド、2,4−ジクロロベンゾイルパーオキサイド、m−トルオイルパーオキサイド等のジアシルパーオキサイド類;ジ−t−ブチルパーオキサイド、t−ブチルクミルパーオキサイド、ジ−クミルパーオキサイド、α、α’−ビス(t−ブチルパーオキシイソプロピル)ベンゼン、2、5−ジメチル−2、5−ジ(t−ブチルパーオキシ)ヘキサン、2、5−ジメチル−2、5ージ(t−ブチルパーオキシ)ヘキシン−3等のジアルキルパーオキサイド類;2、2−ビス(t−ブチルパーオキシ)ブタン、2、2−ビス(t−ブチルパーオキシ)オクタン、1、1−ビス(t−ブチルパーオキシ)3、3、5−トリメチルシクロヘキサン、n−ブチル−4、4−ビス(t−ブチルパーオキシ)バリレート等のパーオキシケタール類;ジ−イソプロピルパーオキシジカーボネート、ジ−2−エチルヘキシルパーオキシジカーボネート、ジ−n−プロピルパーオキシジカーボネート、ジ−3−メトキシブチルパーオキシジカーボネート、ジ−2−エトキシエチルパーオキシジカーボネート、ジ−メトキシイソプロピルパーオキシジカーボネート、ジ(3−メチル−3−メトキシブチル)パーオキシジカーボネート、ビス(4−t−ブチルシクロヘキシル)パーオキシジカーボネート等のパーオキシカーボネート類;t−ブチルパーオキシアセテート、t−ブチルパーオキシイソブチレート、t−ブチルパーオキシピパレート、t−ブチルパーオキシネオデカノエート、クミルパーオキシネオデカノエート、t−ブチルパーオキシ2ーエチルヘキサノエート、t−ブチルパーオキシ3、5、5ートリメチルヘキサノエート、t−ブチルパーオキシラウレート、t−ブチルパーオキシベンゾエート、ジーt−ブチルジパーオキシイソフタレート、2、5ージメチルー2、5ージ(ベンゾイルパーオキシ)ヘキサン、t−ブチルパーオキシイソプロピルカーボネート等のパーオキシエステル類;アセチルアセトンパーオキサイド、メチルエチルケトンパーオキサイド、シクロヘキサノンパーオキサイド、3、3、5ートリメチルシクロヘキサノンパーオキサイド、メチルシクロヘキサノンパーオキサイド等のケトンパーオキサイド類;クメンハイドロパーオキサイド、ジーイソプロピルベンゼンハイドロパーオキサイド、p−メンタンハイドロパーオキサイド、2、5ージメチルヘキサン2、5ージハイドロパーオキサイド、1、1、3、3ーテトラメチルブチルハイドロパーオキサイド等のハイドロパーオキサイド類;2塩基酸のポリアシルパーオキサイド類;2塩基酸とポリオールとのポリパーオキシエステル類が挙げられる。この中では、ベンゾイルパーオキサイドが好ましく用いられる。 As the radical generator, various compounds can be used, and preferably, a peroxide capable of generating a radical under polymerization temperature conditions is used. Examples of the peroxide include, but are not limited to, benzoyl peroxide, acetyl peroxide, isobutyroyl peroxide, octanoyl peroxide, decanoyl peroxide, lauroyl peroxide, 3,5,5-trimethylhexanoyl peroxide. Diacyl peroxides such as oxide, 2,4-dichlorobenzoyl peroxide, m-toluoyl peroxide; di-t-butyl peroxide, t-butyl cumyl peroxide, di-cumyl peroxide, α, α′- Bis (t-butylperoxyisopropyl) benzene, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne -3 etc. dialkyl peroxides; 2 2-bis (t-butylperoxy) butane, 2,2-bis (t-butylperoxy) octane, 1,1-bis (t-butylperoxy) 3,3,5-trimethylcyclohexane, n- Peroxyketals such as butyl-4,4-bis (t-butylperoxy) valerate; di-isopropyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, di-n-propyl peroxydicarbonate, Di-3-methoxybutyl peroxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, di-methoxyisopropyl peroxydicarbonate, di (3-methyl-3-methoxybutyl) peroxydicarbonate, bis (4 Peroxycarbons such as -t-butylcyclohexyl) peroxydicarbonate T-butyl peroxyacetate, t-butyl peroxyisobutyrate, t-butyl peroxypiparate, t-butyl peroxyneodecanoate, cumylperoxyneodecanoate, t-butylper Oxy-2-ethylhexanoate, t-butylperoxy 3,5,5-trimethylhexanoate, t-butylperoxylaurate, t-butylperoxybenzoate, di-t-butyldiperoxyisophthalate, 2 Peroxyesters such as 5-dimethyl-2,5-di (benzoylperoxy) hexane, t-butylperoxyisopropyl carbonate; acetylacetone peroxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, 3, 3, 5-trimethylcyclohexanone Ketone peroxides such as oxide and methylcyclohexanone peroxide; cumene hydroperoxide, diisopropylbenzene hydroperoxide, p-menthane hydroperoxide, 2,5-dimethylhexane 2,5-dihydroperoxide, 1, 1 Hydroperoxides such as 3,3-tetramethylbutyl hydroperoxide; polyacyl peroxides of dibasic acids; polyperoxy esters of dibasic acids and polyols. Of these, benzoyl peroxide is preferably used.
また、パーオキサイドの代わりにラジカル発生性アゾ化合物等もラジカル発生剤として用いることが出来る。ラジカル発生性アゾ化合物としては、例えばアゾビスイソブチロニトリル等が挙げられる。 Further, a radical-generating azo compound or the like can be used as a radical generator instead of peroxide. Examples of the radical-generating azo compound include azobisisobutyronitrile.
分子量を調整する等の目的で、必要に応じて、溶媒、ラジカルキャッピング剤、重合加速剤、連鎖移動剤、反応停止剤等を併用することができる。 For the purpose of adjusting the molecular weight, a solvent, a radical capping agent, a polymerization accelerator, a chain transfer agent, a reaction terminator and the like can be used in combination as necessary.
ゴム組成物は分子内に少なくとも1つの芳香族基を有するポリマー鎖を含有することが、光硬化性樹脂との相溶性に優れ、且つ優れた振動疲労耐久性を与えるため好ましい。芳香族基は、主鎖、側鎖、鎖末端のいずれであっても構わないが、特に鎖末端が芳香族基であると相溶性に優れ、優れた振動疲労耐久性を与えるために好ましい。分子内に少なくとも1つの芳香族基を有するポリマー鎖のゴム組成物中に占める割合は、1質量%以上が好ましく、特に好ましくは10質量%以上、更に好ましくは50質量%以上である。1質量%以上であれば、光硬化性樹脂との相溶性を損なわずに振動疲労耐久性を与えることができる。なお、上記ポリマー鎖のゴム組成物中に占める割合は好ましくは99.99質量%以下、特に好ましくは99.9質量%以下である。 The rubber composition preferably contains a polymer chain having at least one aromatic group in the molecule because it is excellent in compatibility with the photocurable resin and gives excellent vibration fatigue durability. The aromatic group may be any of a main chain, a side chain, and a chain end. In particular, an aromatic group at the chain end is preferable because of excellent compatibility and excellent vibration fatigue durability. The proportion of the polymer chain having at least one aromatic group in the molecule in the rubber composition is preferably 1% by mass or more, particularly preferably 10% by mass or more, and further preferably 50% by mass or more. If it is 1 mass% or more, vibration fatigue durability can be provided without impairing the compatibility with the photocurable resin. The proportion of the polymer chain in the rubber composition is preferably 99.99% by mass or less, particularly preferably 99.9% by mass or less.
芳香族基を分子内に導入する手段としては、(1)スチレン等の芳香族基を有するラジカル重合性単量体の使用により導入する方法、(2)ベンゾイルパーオキサイド等の芳香族基を有するラジカル発生剤の使用により導入する方法、(3)トルエン、キシレン等の芳香族溶媒の使用により導入する方法、(4)ベンゼンチオール、チオフェノール等の芳香族チオール等の芳香族基を有する連鎖移動剤の使用により導入する方法、等が例示できる。 As means for introducing an aromatic group into the molecule, (1) a method of introducing by using a radical polymerizable monomer having an aromatic group such as styrene, and (2) an aromatic group such as benzoyl peroxide. A method of introducing by using a radical generator, (3) a method of introducing by using an aromatic solvent such as toluene or xylene, and (4) a chain transfer having an aromatic group such as an aromatic thiol such as benzenethiol or thiophenol. Examples thereof include a method of introduction by use of an agent.
ゴム組成物のTgは、光硬化性樹脂に優れた振動疲労耐久性を与えるために、25℃未満であることが好ましい。より好ましくは0℃未満であり、更により好ましくは−20℃未満である。 The Tg of the rubber composition is preferably less than 25 ° C. in order to give excellent vibration fatigue durability to the photocurable resin. More preferably, it is less than 0 degreeC, More preferably, it is less than -20 degreeC.
ゴム組成物の25℃での粘度は、100〜100,000mPa・sの範囲であることが好ましい。100mPa・s以上で、充分な振動疲労耐久性を与えることができ、100,000mPa・s以下で光硬化性樹脂との相溶性が得られ、さらに光硬化性樹脂自体が増粘することがなく、好ましい。尚、粘度の測定方法に特に制限はないが、B型粘度計、E型粘度計、レオメーター等の公知の粘度計を用いて測定できる。 The viscosity at 25 ° C. of the rubber composition is preferably in the range of 100 to 100,000 mPa · s. Sufficient vibration fatigue durability can be imparted at 100 mPa · s or more, compatibility with a photocurable resin can be obtained at 100,000 mPa · s or less, and the photocurable resin itself does not thicken. ,preferable. In addition, there is no restriction | limiting in particular in the measuring method of a viscosity, However, It can measure using well-known viscometers, such as a B-type viscosity meter, an E-type viscosity meter, and a rheometer.
光硬化性樹脂組成物中におけるゴム組成物の占める割合は0.01〜70質量%が好ましく、より好ましくは0.05〜50質量%が好ましく、特に好ましくは0.1〜30質量%である。0.01質量%より少ないと充分な振動疲労耐久性が得られず、70質量%より多いと、得られる光硬化性樹脂が柔軟すぎ、さらに、硬化性が低下するためである。 The proportion of the rubber composition in the photocurable resin composition is preferably 0.01 to 70% by mass, more preferably 0.05 to 50% by mass, and particularly preferably 0.1 to 30% by mass. . When the amount is less than 0.01% by mass, sufficient vibration fatigue durability cannot be obtained. When the amount is more than 70% by mass, the resulting photocurable resin is too flexible and further the curability is lowered.
さらに、本発明のゴム組成物を含む光硬化性樹脂組成物の硬化体は、JIS K7113(プラスチックの引張試験方法)に準拠して引張試験測定を実施したとき、引張弾性率が1〜30MPaであり、しかも引張破壊伸びが200%以上である優れた振動疲労耐久性を示すことを特徴とする。硬化体の引張弾性率が1MPa以上であれば、得られる硬化体が柔らかすぎて形状を保持できないという問題を生じることもない。また、硬化体の引張弾性率が30MPa以下で、しかも引張破壊伸びが200%以上であれば、優れた振動疲労耐久性が得られ、発明の効果が確実に得ることができる。 Furthermore, the cured product of the photocurable resin composition containing the rubber composition of the present invention has a tensile modulus of 1 to 30 MPa when a tensile test measurement is performed in accordance with JIS K7113 (plastic tensile test method). Furthermore, it is characterized by exhibiting excellent vibration fatigue durability having a tensile fracture elongation of 200% or more. When the tensile elastic modulus of the cured body is 1 MPa or more, there is no problem that the obtained cured body is too soft to hold the shape. If the tensile modulus of the cured product is 30 MPa or less and the tensile elongation at break is 200% or more, excellent vibration fatigue durability can be obtained, and the effects of the invention can be obtained with certainty.
本発明に於いては、必要に応じて、本発明の効果を阻害しない範囲において、顔料(チタン白、シアニンブルー、ウォッチングレッド、ベンガラ、カーボンブラック、アニリンブラック、マンガンブルー、鉄黒、ウルトラマリンブルー、ハンザレッド、クロームイエロー、クロームグリーン等)、無機充填剤(炭酸カルシウム、カオリン、クレー、タルク、マイカ、硫酸バリウム、リトポン、石コウ、ステアリン酸亜鉛、パーライト、石英、石英ガラス、溶融シリカ、球状シリカ等のシリカ粉等、球状アルミナ、破砕アルミナ、酸化マグネシウム、酸化ベリリウム、酸化チタン等の酸化物類、窒化ホウ素、窒化ケイ素、窒化アルミニウム等の窒化物類、炭化ケイ素等の炭化物類、水酸化アルミニウム、水酸化マグネシウム等の水酸化物類、銅、銀、鉄、アルミニウム、ニッケル、チタン等の金属類や合金類、ダイヤモンド、カーボン等の炭素系材料等)、熱可塑性樹脂および熱硬化性樹脂(高密度、中密度、低密度の各種ポリエチレン、ポリプロピレン、ポリブテン、ポリペンテン等の単独重合体、エチレン−プロピレン共重合体、ナイロン−6、ナイロン−6,6等のポリアミド系樹脂、塩化ビニル系樹脂、ニトロセルロース系樹脂、塩化ビニリデン系樹脂、アクリル系樹脂、アクリルアミド系樹脂、スチレン系樹脂、ビニルエステル系樹脂、ポリエステル系樹脂、シリコーン系樹脂、フッ素系樹脂、アクリルゴム、ウレタンゴムなどの各種エラストマー樹脂、メタクリル酸メチル−ブタジエン−スチレン系グラフト共重合体やアクリロニトリル−ブタジエン−スチレン系グラフト共重合体などのグラフト共重合体等)、補強剤(ガラス繊維、炭素繊維等)、垂れ止め剤(水添ヒマシ油、微粒子無水硅酸等)、艶消し剤(微粉シリカ、パラフィンワックス等)、研削剤(ステアリン酸亜鉛等)、内部離型剤(ステアリン酸等の脂肪酸、ステアリン酸カルシウムの脂肪酸金属塩、ステアリン酸アマイド等の脂肪酸アミド、脂肪酸エステル、ポリオレフィンワックス、パラフィンワックス等)を配合することも可能である。 In the present invention, if necessary, pigments (titanium white, cyanine blue, watching red, bengara, carbon black, aniline black, manganese blue, iron black, ultramarine blue are used as long as the effects of the present invention are not impaired. , Hansa Red, Chrome Yellow, Chrome Green, etc.), inorganic fillers (calcium carbonate, kaolin, clay, talc, mica, barium sulfate, lithopone, limestone, zinc stearate, perlite, quartz, quartz glass, fused silica, spherical Silica powder such as silica, spherical alumina, crushed alumina, oxides such as magnesium oxide, beryllium oxide and titanium oxide, nitrides such as boron nitride, silicon nitride and aluminum nitride, carbides such as silicon carbide, hydroxide Hydroxides such as aluminum and magnesium hydroxide, copper Metals and alloys such as silver, iron, aluminum, nickel and titanium, carbon-based materials such as diamond and carbon), thermoplastic resins and thermosetting resins (high density, medium density, low density polyethylene, polypropylene , Homopolymers such as polybutene and polypentene, ethylene-propylene copolymers, polyamide resins such as nylon-6 and nylon-6, 6, vinyl chloride resins, nitrocellulose resins, vinylidene chloride resins, acrylic resins Acrylamide resins, styrene resins, vinyl ester resins, polyester resins, silicone resins, fluorine resins, acrylic rubber, urethane rubber and other elastomer resins, methyl methacrylate-butadiene-styrene graft copolymers, Acrylonitrile-butadiene-styrene graph Graft copolymers such as copolymers), reinforcing agents (glass fibers, carbon fibers, etc.), anti-sagging agents (hydrogenated castor oil, fine succinic anhydride, etc.), matting agents (fine silica, paraffin wax, etc.) , Abrasives (zinc stearate, etc.), internal mold release agents (fatty acids such as stearic acid, fatty acid metal salts of calcium stearate, fatty acid amides such as stearic acid amide, fatty acid esters, polyolefin wax, paraffin wax, etc.) Is also possible.
本発明において、(A)〜(D)成分の合計量、又は(A)〜(E)成分の合計量を100質量%とするときに、顔料の配合量は、0.0001〜50質量%、無機充填剤の配合量は0.0001〜50質量%、レベリング剤の配合量は0.0001〜5質量%、熱可塑性樹脂および熱硬化性樹脂の配合量は0.01〜30質量%、垂れ止め剤の配合量は0.01〜5質量%、艶消し剤の配合量は0.001〜10質量%、研削剤の配合量は0.01〜5質量%、内部離型剤の配合量は0.001〜20質量%の範囲より適宜選択される。 In the present invention, when the total amount of the components (A) to (D) or the total amount of the components (A) to (E) is 100% by mass, the blending amount of the pigment is 0.0001 to 50% by mass. The compounding amount of the inorganic filler is 0.0001 to 50% by mass, the compounding amount of the leveling agent is 0.0001 to 5% by mass, the compounding amount of the thermoplastic resin and the thermosetting resin is 0.01 to 30% by mass, The blending amount of the anti-sagging agent is 0.01 to 5% by mass, the blending amount of the matting agent is 0.001 to 10% by mass, the blending amount of the abrasive is 0.01 to 5% by mass, and the blending of the internal release agent The amount is appropriately selected from the range of 0.001 to 20% by mass.
また、上記の成分以外にも、消泡剤、難燃剤、帯電防止剤、可塑剤、熱重合開始剤、シランカップリング剤、密着性付与剤等を併用することも可能である。 In addition to the above components, an antifoaming agent, a flame retardant, an antistatic agent, a plasticizer, a thermal polymerization initiator, a silane coupling agent, an adhesiveness imparting agent, and the like can be used in combination.
以上の様にして得られる本発明の光硬化性樹脂組成物に、光照射をすることにより、瞬時に硬化し、振動疲労耐久性に優れた硬化体を得ることができる。 By irradiating the photocurable resin composition of the present invention obtained as described above with light, a cured product excellent in vibration fatigue durability can be obtained instantaneously.
また、本発明の光硬化性樹脂組成物の成形体を成形する場合、その手段は種々の方法を採用することができる。特に好ましくは、(1)上型、下型よりなる一組の成形型の少なくともいずれか一方を光が透過する材料にて形成し、硬化前の該光硬化性樹脂組成物を所定量滴下する。次に上型と下型を圧着して、型閉じし、光を透過する材料からなる型の外側から光を照射し、樹脂を硬化させて目的の硬化体を得る方法、(2)上型、下型よりなる一組の成形型の少なくともいずれか一方を光が透過する材料にて形成し、次に上型と下型を圧着して、型閉じし、次に型に予め形成しておいた注入口より、硬化前の該光硬化性樹脂組成物を所定量注入する。そして、光を透過する材料からなる型の外側から光を照射し、樹脂を硬化させて目的の硬化体を得る方法、である。 Moreover, when shape | molding the molded object of the photocurable resin composition of this invention, the method can employ | adopt various methods. Particularly preferably, (1) at least one of a pair of molds consisting of an upper mold and a lower mold is formed of a material that transmits light, and a predetermined amount of the photocurable resin composition before curing is dropped. . Next, the upper mold and the lower mold are pressure-bonded, the mold is closed, light is irradiated from the outside of the mold made of a material that transmits light, and the resin is cured to obtain a desired cured body. (2) Upper mold And forming at least one of a set of molds composed of a lower mold with a material that transmits light, then crimping the upper mold and the lower mold, closing the mold, and then pre-forming the mold A predetermined amount of the photo-curable resin composition before curing is injected from the injection port. And it is the method of irradiating light from the outer side of the type | mold which consists of a material which permeate | transmits light, and hardening a resin and obtaining the target hardening body.
光を透過する型に用いられる材料としては、例えば石英、石英ガラス、硼珪酸ガラス、ソーダガラス等のガラス材料、アクリル樹脂、ポリカーボネート樹脂、ポリスチレン樹脂、ポリエステル樹脂、ポリエチレン樹脂、ポリプロピレン樹脂、フッ素樹脂、セルロース樹脂、スチレン−ブタジエン共重合体、メタクリル酸メチル−スチレン共重合体等の樹脂材料が例示できるが、これらに限定されない。特に好ましくは、ポリメタクリル酸メチル等のアクリル樹脂である。 Examples of materials used for the mold that transmits light include glass materials such as quartz, quartz glass, borosilicate glass, and soda glass, acrylic resin, polycarbonate resin, polystyrene resin, polyester resin, polyethylene resin, polypropylene resin, fluororesin, Although resin materials, such as a cellulose resin, a styrene-butadiene copolymer, and a methyl methacrylate-styrene copolymer, can be illustrated, it is not limited to these. Particularly preferred is an acrylic resin such as polymethyl methacrylate.
光源としてはハロゲンランプ、メタルハライドランプ、ハイパワーメタルハライドランプ(インジウム等を含有する)、低圧水銀ランプ、高圧水銀ランプ、超高圧水銀ランプ、キセノンランプ、キセノンエキシマランプ、キセノンフラッシュランプ等が挙げられるが特に限定されない。 Examples of the light source include halogen lamps, metal halide lamps, high power metal halide lamps (containing indium, etc.), low pressure mercury lamps, high pressure mercury lamps, ultrahigh pressure mercury lamps, xenon lamps, xenon excimer lamps, xenon flash lamps, etc. It is not limited.
各々放射波長、エネルギー分布が異なるため、上記光源は光重合開始剤の反応波長などにより選択される。また、自然光(太陽光)も反応開始光源になり得る。 Since the emission wavelength and energy distribution are different, the light source is selected depending on the reaction wavelength of the photopolymerization initiator. Natural light (sunlight) can also be a reaction initiation light source.
上記光源は、直接照射、反射鏡等により集光照射、ファイバー等による集光照射をすることができ、低波長カットフィルター、熱線カットフィルター、コールドミラー等も用いることもできる。 The light source can be directly irradiated, focused with a reflecting mirror or the like, or focused with a fiber or the like, and a low wavelength cut filter, a heat ray cut filter, a cold mirror, or the like can also be used.
また、上記の成形方法により本発明の光硬化性樹脂組成物を成形する場合、樹脂組成物の硬化収縮率は10%以下であることが好ましい。10%を越えると、硬化収縮により、型精度と硬化物に差が生じるため目的形状の硬化体が得られ難いためである。 Moreover, when shape | molding the photocurable resin composition of this invention with said shaping | molding method, it is preferable that the cure shrinkage rate of a resin composition is 10% or less. If it exceeds 10%, a difference in mold accuracy and a cured product occurs due to curing shrinkage, so that it is difficult to obtain a cured product having a desired shape.
また、光硬化性樹脂組成物の粘度は、25℃で100〜100,000mPa・s、特に好ましくは、3,000〜90,000mPa・sであることが好ましい。100mPa・s未満であると、液漏れ等を起こし目的の形状の成型体が得られないことがある。100,000mPa・sを越えると、充填しにくく、また、型を押し上げてしまう等、目的の形状の硬化体が得られなくなることがあるためである。 The viscosity of the photocurable resin composition is preferably 100 to 100,000 mPa · s at 25 ° C., particularly preferably 3,000 to 90,000 mPa · s. If it is less than 100 mPa · s, liquid leakage or the like may occur, and a molded product having a desired shape may not be obtained. This is because if it exceeds 100,000 mPa · s, it is difficult to fill and a cured product having a desired shape may not be obtained, such as pushing up the mold.
以下に実施例および比較例を用いて本発明をより詳細に説明するが、本発明はこれらの実施例により限定されるものではない。尚、実施例および比較例において示すデータは、下記方法に従って測定した。 Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to these Examples. In addition, the data shown in an Example and a comparative example were measured in accordance with the following method.
組成物の分子量および分子量分布は、GPC法により、標準ポリスチレンで検量線を作成することで、次の条件で測定した。
溶媒(移動相):THF、
脱気装置:ERMA社製ERC−3310、
ポンプ:日本分光社製PU−980、
サンプル注入量:100μl(試料液濃度1mg/ml)、
流速:1.0ml/min、
送液圧力:39kg/cm2、
オートサンプラ:東ソー社製AS−8020、
カラムオーブン:日立製作所社製L−5030、
設定温度:40℃、
カラム構成:東ソー社製TSKguardcolumnMP(×L)6.0mmID×4.0cm 1本、および東ソー社製TSK−GEL MULTIPORE HXL−M 7.8mmID×30.0cm2本、計3本、
検出器:RI 日立製作所社製L−3350、
データ処理:SIC480データステーション。The molecular weight and molecular weight distribution of the composition were measured under the following conditions by preparing a calibration curve with standard polystyrene by the GPC method.
Solvent (mobile phase): THF,
Deaeration device: ERC-3310 manufactured by ERMA,
Pump: PU-980 manufactured by JASCO,
Sample injection volume: 100 μl (sample solution concentration 1 mg / ml),
Flow rate: 1.0 ml / min,
Liquid feeding pressure: 39 kg / cm 2 ,
Autosampler: AS-8020 manufactured by Tosoh Corporation
Column oven: Hitachi, Ltd. L-5030,
Set temperature: 40 ° C
Column configuration: Tosoh TSK guard column MP (× L) 6.0 mm ID × 4.0 cm 1 and Tosoh TSK-GEL MULTIPORE HXL-M 7.8 mm ID × 30.0 cm 2 in total, 3 in total
Detector: RI L-3350 manufactured by Hitachi, Ltd.
Data processing: SIC480 data station.
組成物の核磁気共鳴スペクトル(以下、1H−NMRという)は、次の条件で測定した。
測定装置:JOEL社製ECP−300(300MHz)、
溶媒:重水素クロロホルム、
試料濃度:0.48質量%、
積算回数:25,000回。The nuclear magnetic resonance spectrum (hereinafter referred to as 1 H-NMR) of the composition was measured under the following conditions.
Measuring device: ECP-300 (300 MHz) manufactured by JOEL,
Solvent: deuterium chloroform,
Sample concentration: 0.48% by mass
Integration count: 25,000 times.
組成物の粘度の測定は、次の条件で測定した。
粘度計:E型粘度計(コーンプレート型)、
測定温度:25℃。The viscosity of the composition was measured under the following conditions.
Viscometer: E type viscometer (cone plate type),
Measurement temperature: 25 ° C.
〈ゴム組成物の重合例1〜5〉
〈ゴム組成物の重合例1〉
1Lステンレス製オートクレーブを窒素置換した後、n−ブチルアクリレート(以下、nBAという):270g、メチルメタクリレート(以下、MMAという):270g、グリシジルメタクリレート(以下、GMAという):60g、過酸化ベンゾイル(以下、BPOという):13.9gを窒素ガス雰囲気下において仕込み、密封して、オイルバスを用いてバス温度を130℃まで加熱し、200℃で約60分間重合した。その後室温まで急冷して重合反応を停止させた。残留揮発分を240℃、2時間真空下で乾燥することにより、固形分を得た。これをゴム組成物(E−1)とした。収率は92%であり、GPC測定による数平均分子量Mnは1,170、重量平均分子量Mwは2,350であり、分子量分布Mw/Mnは2.01で、25℃粘度が5,000mPa・sであった。また、得られたゴム組成物(E−1)の構成成分の含有割合は1H−NMRスペクトルの積分強度比から算出した結果、nBA:44.7質量%、MMA:45.4質量%、GMA:9.9質量%であることが判った。<Rubber composition polymerization examples 1 to 5>
<Rubber composition polymerization example 1>
After 1L stainless steel autoclave was purged with nitrogen, n-butyl acrylate (hereinafter referred to as nBA): 270 g, methyl methacrylate (hereinafter referred to as MMA): 270 g, glycidyl methacrylate (hereinafter referred to as GMA): 60 g, benzoyl peroxide (hereinafter referred to as “NO”) , BPO): 13.9 g was charged in a nitrogen gas atmosphere, sealed, heated to 130 ° C. using an oil bath, and polymerized at 200 ° C. for about 60 minutes. Thereafter, the polymerization reaction was stopped by quenching to room temperature. The residual volatile matter was dried at 240 ° C. under vacuum for 2 hours to obtain a solid content. This was designated as a rubber composition (E-1). The yield was 92%, the number average molecular weight Mn by GPC measurement was 1,170, the weight average molecular weight Mw was 2,350, the molecular weight distribution Mw / Mn was 2.01, and the viscosity at 25 ° C. was 5,000 mPa · s. Moreover, as a result of calculating the content rate of the structural component of the obtained rubber composition (E-1) from the integrated intensity ratio of the 1 H-NMR spectrum, nBA: 44.7 mass%, MMA: 45.4 mass%, GMA: It was found to be 9.9% by mass.
〈ゴム組成物の重合例2〉
重合例1の仕込みにおいて、nBA:420g、MMA:18g、GMA:162g、BPO:6.95gとした以外は、重合例1と同様にして、ゴム組成物(E−2)を得た。収率は95%であり、GPC測定による数平均分子量Mnは2,000、重量平均分子量Mwは4,710であり、分子量分布Mw/Mnは2.36で、25℃粘度が9,500mPa・sであった。得られたゴム組成物(E−2)の構成成分の含有割合は、1H−NMRスペクトルの結果、nBA:68.6質量%、MMA:3.1質量%、GMA:28.3質量%であることが判った。<Rubber composition polymerization example 2>
A rubber composition (E-2) was obtained in the same manner as in Polymerization Example 1, except that nBA: 420 g, MMA: 18 g, GMA: 162 g, and BPO: 6.95 g were used in Preparation of Polymerization Example 1. The yield was 95%, the number average molecular weight Mn by GPC measurement was 2,000, the weight average molecular weight Mw was 4,710, the molecular weight distribution Mw / Mn was 2.36, and the viscosity at 25 ° C. was 9,500 mPa · s. s. As a result of 1 H-NMR spectrum, the content ratio of the constituent components of the obtained rubber composition (E-2) was nBA: 68.6% by mass, MMA: 3.1% by mass, GMA: 28.3% by mass. It turned out that.
〈ゴム組成物の重合例3〉
重合例1の仕込みにおいて、nBA:480g、スチレン:90g、GMA:30g、BPO:3.475gとした以外は、重合例1と同様にして、ゴム組成物(E−3)を得た。収率は96%であり、GPC測定による数平均分子量Mnは4,500、重量平均分子量Mwは9,900であり、分子量分布Mw/Mnは2.20で、25℃粘度が5,900mPa・sであった。得られたゴム組成物(E−3)の構成成分の含有割合は、1H−NMRスペクトルの結果、nBA:78.4質量%、スチレン:16.1質量%、GMA:5.5質量%であることが判った。<Example 3 of polymerization of rubber composition>
A rubber composition (E-3) was obtained in the same manner as in Polymerization Example 1, except that nBA: 480 g, styrene: 90 g, GMA: 30 g, and BPO: 3.475 g were used in the preparation of Polymerization Example 1. The yield was 96%, the number average molecular weight Mn by GPC measurement was 4,500, the weight average molecular weight Mw was 9,900, the molecular weight distribution Mw / Mn was 2.20, and the viscosity at 25 ° C. was 5,900 mPa · s. As a result of 1 H-NMR spectrum, the content ratio of the constituent components of the obtained rubber composition (E-3) was nBA: 78.4% by mass, styrene: 16.1% by mass, GMA: 5.5% by mass. It turned out that.
〈ゴム組成物の重合例4〉
重合例1の仕込みにおいて、nBA:228g、MMA:240g、スチレン:90g、2−ヒドロキシエチルアクリレート(以下、2−HEAという):12g、BPO:13.9gとした以外は、重合例1と同様にして、ゴム組成物(E−4)を得た。収率は92%であり、GPC測定による数平均分子量Mnは780、重量平均分子量Mwは1,680であり、分子量分布Mw/Mnは2.15、25℃粘度が1,200mPa・sであった。得られたゴム組成物(E−4)の構成成分の含有割合は、1H−NMRスペクトルの結果、nBA:37.3質量%、MMA:38.9質量%、スチレン:19.5質量%、2−HEA:4.3質量%であることが判った。<Rubber composition polymerization example 4>
Polymerization Example 1 was the same as Polymerization Example 1 except that nBA: 228 g, MMA: 240 g, styrene: 90 g, 2-hydroxyethyl acrylate (hereinafter referred to as 2-HEA): 12 g, and BPO: 13.9 g. Thus, a rubber composition (E-4) was obtained. The yield was 92%, the number average molecular weight Mn by GPC measurement was 780, the weight average molecular weight Mw was 1,680, the molecular weight distribution Mw / Mn was 2.15, and the viscosity at 25 ° C. was 1,200 mPa · s. It was. As a result of 1 H-NMR spectrum, the content ratio of the constituent components of the obtained rubber composition (E-4) was nBA: 37.3 mass%, MMA: 38.9 mass%, and styrene: 19.5 mass%. 2-HEA: It was found to be 4.3% by mass.
〈ゴム組成物の重合例5〉
重合例1の仕込みにおいて、2−エチルヘキシルアクリレート(以下、2−EHAという):300g、MMA:30g、GMA:270g、BPO:1.39gとした以外は、重合例1と同様にして、ゴム組成物(E−5)を得た。収率は98%であり、GPC測定による数平均分子量Mnは10,000、重量平均分子量Mwは19,600であり、分子量分布Mw/Mnは1.96、25℃粘度が95,000mPa・sであった。得られたゴム組成物(E−5)の構成成分の含有割合は、1H−NMRスペクトルの結果、2−EHA:49.8質量%、MMA:5.1質量%、GMA:45.1質量%であることが判った。<Example 5 of polymerization of rubber composition>
The rubber composition was the same as in Polymerization Example 1, except that 2-ethylhexyl acrylate (hereinafter referred to as 2-EHA): 300 g, MMA: 30 g, GMA: 270 g, and BPO: 1.39 g were used in the preparation of Polymerization Example 1. A product (E-5) was obtained. The yield was 98%, the number average molecular weight Mn by GPC measurement was 10,000, the weight average molecular weight Mw was 19,600, the molecular weight distribution Mw / Mn was 1.96, and the viscosity at 25 ° C. was 95,000 mPa · s. Met. As a result of 1 H-NMR spectrum, the content ratio of the constituent components of the obtained rubber composition (E-5) was as follows: 2-EHA: 49.8 mass%, MMA: 5.1 mass%, GMA: 45.1 It was found to be mass%.
〈実施例1〜17、および比較例1〜7〉
次いで、表1−1、表1−2、表1−3に示す種類の各成分を表中に示す組成(重量%)で混合して光硬化性樹脂組成物を調製した。
尚、実施例および比較例に記載の配合組成物中の各成分には以下の化合物を選択した。<Examples 1 to 17 and Comparative Examples 1 to 7>
Subsequently, each component of the kind shown in Table 1-1, Table 1-2, and Table 1-3 was mixed with the composition (weight%) shown in the table | surface, and the photocurable resin composition was prepared.
In addition, the following compounds were selected for each component in the composition described in the examples and comparative examples.
(A)成分として、
(A−1)ポリエステルポリオール系ウレタンアクリレート
(日本合成化学工業社製 商品名UV−3000B)
(GPCによるポリスチレン換算の重量平均分子量18000)
(A−2)ポリエーテルポリオール系ウレタンアクリレート
(日本合成化学工業社製 商品名UV−3700B)
(GPCによるポリスチレン換算の重量平均分子量37000)
(A−3)ポリエステルポリオール系ウレタンアクリレート
(根上工業社製 商品名KHP−11)
(GPCによるポリスチレン換算の重量平均分子量25000)
(A−4)ポリエステルポリオール系ウレタンアクリレート
(根上工業社製 商品名SD−7)
(GPCによるポリスチレン換算の重量平均分子量3500)
(A−5)n−ブチルメタクリレート(共栄社化学社製 ライトエステルNB)
(A−6)2−ヒドロキシエチルメタクリレート(共栄社化学社製 ライトエステルHO)
(A−7)イソブチルメタクリレート(共栄社化学社製 ライトエステルIB)
(A−8)tert−ブチルメタクリレート(共栄社化学社製 ライトエステルTB)
(A−9)シクロヘキシルメタクリレート(共栄社化学社製 ライトエステルCH)
(A−10)イソボルニルメタクリレート(共栄社化学社製 ライトエステルIB−X)
(A−11)ジシクロペンタニルメタクリレート(日立化成工業社製 ファンクリルFA−513M)
(A−12)1,9−ノナンジオールジメタクリレート(共栄社化学社製 ライトエステル1,9ND)
(A−13)ポリエチレングリコールジメタクリレート(エチレンオキサイドの繰り返し数=9)(共栄社化学社製 ライトエステル9EG)
(B)成分の光重合開始剤として、
ビス(2,4,6−トリメチルベンゾイル)−フェニルホスフィンオキサイド(チバ・スペシャルティー・ケミカルズ社製 IRGACURE819)
(C)成分の酸化防止剤として、
オクタデシル−3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート(チバ・スペシャルティー・ケミカルズ社製 IRGANOX1076)
(D)成分の光安定剤として
ビス(2,2,6,6−テトラメチル−4−ピペリジル)セバケート(三共ライフテック社製 サノールLS−770)As component (A),
(A-1) Polyester polyol urethane acrylate (trade name UV-3000B manufactured by Nippon Synthetic Chemical Industry Co., Ltd.)
(GPC polystyrene equivalent weight average molecular weight 18000)
(A-2) Polyether polyol urethane acrylate (trade name UV-3700B manufactured by Nippon Synthetic Chemical Industry Co., Ltd.)
(Polystyrene equivalent weight average molecular weight of 37,000 by GPC)
(A-3) Polyester polyol-based urethane acrylate (trade name KHP-11 manufactured by Negami Kogyo Co., Ltd.)
(Weight average molecular weight 25000 in terms of polystyrene by GPC)
(A-4) Polyester polyol urethane acrylate (trade name SD-7, manufactured by Negami Kogyo Co., Ltd.)
(GPC polystyrene equivalent weight average molecular weight 3500)
(A-5) n-butyl methacrylate (Kyoeisha Chemical Co., Ltd. light ester NB)
(A-6) 2-hydroxyethyl methacrylate (Kyoeisha Chemical Co., Ltd. light ester HO)
(A-7) Isobutyl methacrylate (Kyoeisha Chemical Company Light Ester IB)
(A-8) tert-butyl methacrylate (Kyoeisha Chemical Co., Ltd. Light Ester TB)
(A-9) Cyclohexyl methacrylate (Kyoeisha Chemical Co., Ltd. light ester CH)
(A-10) Isobornyl methacrylate (Kyoeisha Chemical Co., Ltd. Light Ester IB-X)
(A-11) Dicyclopentanyl methacrylate (Hankuri FA-513M manufactured by Hitachi Chemical Co., Ltd.)
(A-12) 1,9-nonanediol dimethacrylate (Kyoeisha Chemical Co., Ltd. light ester 1,9ND)
(A-13) Polyethylene glycol dimethacrylate (repetition number of ethylene oxide = 9) (Kyoeisha Chemical Co., Ltd. Light Ester 9EG)
As a photopolymerization initiator of component (B),
Bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (IRGACURE 819, manufactured by Ciba Specialty Chemicals)
As an antioxidant for component (C),
Octadecyl-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate (IRGANOX 1076, manufactured by Ciba Specialty Chemicals)
(D) Bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate (Sanol LS-770 manufactured by Sankyo Lifetech Co., Ltd.) as a light stabilizer for component (D)
各種物性は、次のように測定した。 Various physical properties were measured as follows.
〔硬化体試験片の調製〕
目的の試験片形状を象った、上型、下型よりなる一組のアクリル樹脂製の成形型を用い、硬化前の光硬化性樹脂組成物をセットした下型に必要量滴下した。次に上型を下型に被せて、圧着、型閉じし、型の外側から光を照射し、樹脂を硬化させて目的の硬化体試験片を得た。[Preparation of cured specimen]
Using a set of acrylic resin molds composed of an upper mold and a lower mold, which were modeled on the shape of the target test piece, a required amount was dropped onto the lower mold on which the photocurable resin composition before curing was set. Next, the upper mold was put on the lower mold, pressure-bonded and the mold was closed, and light was irradiated from the outside of the mold to cure the resin, thereby obtaining a desired cured body test piece.
〔光照射条件〕
光照射に際しては、無電極放電ランプ(Dバルブ)を搭載したフュージョン社製硬化装置を用い、光硬化性樹脂への積算照射量が4000mJ/cm2(365nm)となる条件にて硬化させた。[Light irradiation conditions]
In the light irradiation, a curing device manufactured by Fusion Corp. equipped with an electrodeless discharge lamp (D bulb) was used, and curing was performed under the condition that the cumulative irradiation amount to the photocurable resin was 4000 mJ / cm 2 (365 nm).
〔樹脂引張試験〕
JIS K7113(プラスチックの引張試験方法)に準拠し、2(1/2)号ダンベル形状(標点間距離12mm)で1mm厚の試験片を上記の条件で調製し、温度23℃、湿度50%の環境下で、引張速度50mm/minで測定した。引張破壊強さ、引張弾性率、引張破壊伸びの各値については、JIS K7113に準拠して求めた。(Resin tensile test)
In accordance with JIS K7113 (plastic tensile test method), a 2 (1/2) dumbbell shape (distance between gauge points 12 mm) and a 1 mm thick test piece were prepared under the above conditions, and the temperature was 23 ° C. and the humidity was 50%. The measurement was performed at a tensile speed of 50 mm / min. Each value of tensile fracture strength, tensile elastic modulus, and tensile fracture elongation was determined according to JIS K7113.
〔振動疲労耐久試験〕
全長150mm×幅25mm×厚さ1mmの試験片を上記の条件で調製し、JIS K6260(加硫ゴム及び可塑性ゴムのデマチャ屈曲き裂試験方法)を参考にして、予め試験片中央部に約2mmの亀裂を入れた試験片をデマチャ屈曲き裂試験機(上島製作所社製)の上下つかみ具につかみ具間隔75mmで固定し、室温雰囲気下、振幅56mm、300回/分の条件で往復運動をさせた。測定は、屈曲回数が0回(初期)、3,000回、54,000回、144,000回の時点で亀裂幅を測定した。この場合、屈曲回数とは、1往復運動を1回とし、屈曲回数は回数計で読みとった。また亀裂幅の測定はつかみ具間隔を65mmにして測定した。また、評価に関しては、144,000回時点で亀裂幅が25mm(=破断)に至らなかったものを、振動疲労耐久性が良好とした。[Vibration fatigue endurance test]
A test piece having a total length of 150 mm, a width of 25 mm, and a thickness of 1 mm was prepared under the above-described conditions, and about 2 mm was previously provided at the center of the test piece with reference to JIS K6260 (demach bending crack test method for vulcanized rubber and plastic rubber). The test piece with the cracks is fixed to the upper and lower grips of the Demacha flex crack tester (manufactured by Ueshima Seisakusho Co., Ltd.) with a grip spacing of 75 mm, and reciprocating at room temperature with an amplitude of 56 mm and 300 times / minute. I let you. In the measurement, the crack width was measured when the number of bendings was 0 (initial), 3,000, 54,000, and 144,000. In this case, the number of flexing times was one reciprocating motion, and the number of flexing times was read with a counter. The crack width was measured with a gripping tool spacing of 65 mm. Regarding the evaluation, vibration fatigue durability was evaluated as good when the crack width did not reach 25 mm (= break) at 144,000 times.
得られた光硬化性樹脂組成物の硬化体の樹脂引張試験の測定及び振動疲労耐久試験の結果をまとめて表1−1、表1−2、表1−3に示す。 The results of the measurement of the resin tensile test and the vibration fatigue endurance test of the cured product of the obtained photocurable resin composition are shown together in Table 1-1, Table 1-2, and Table 1-3.
本発明の光硬化性樹脂組成物は、紫外線または可視光線等の光照射により極めて短時間に硬化し、その硬化体は振動疲労耐久性に優れるという特性を有している。したがって、タイヤ等の自動車部材、土木、建築等の構造物用シール部材、Oリング等のパッキング部材、スピーカー等の音響用部材、携帯電話用キーシート等のシート部材、防振材料、各種機構部材等に好適に使用可能であり、産業上非常に有用である。また、本発明の光硬化性樹脂組成物は、その優れた耐疲労特性から土木、建築等の構造用シーリング剤、金属、マグネット、セラミックス、ガラス、プラスチック用の接着剤、更には、プラスチックレンズ等の樹脂成形品にも適用できる。
なお、2006年1月6日に出願された日本特許出願2006−001360号及び2006年2月14日に出願された日本特許出願2006−036181号の明細書、特許請求の範囲、及び要約書の全内容をここに引用し、本発明の明細書の開示として、取り入れるものである。The photocurable resin composition of the present invention is cured in an extremely short time by irradiation with light such as ultraviolet rays or visible light, and the cured product has a characteristic that it is excellent in vibration fatigue durability. Therefore, automobile members such as tires, sealing members for structures such as civil engineering and construction, packing members such as O-rings, acoustic members such as speakers, sheet members such as key sheets for mobile phones, vibration-proof materials, various mechanism members Etc., and is very useful industrially. In addition, the photocurable resin composition of the present invention is a structural sealant for civil engineering and construction due to its excellent fatigue resistance characteristics, metal, magnet, ceramics, glass, adhesive for plastic, and plastic lens, etc. It can also be applied to other resin molded products.
The specification, claims and abstract of Japanese Patent Application No. 2006-001360 filed on January 6, 2006 and Japanese Patent Application No. 2006-036181 filed on February 14, 2006 are as follows. The entire contents are hereby incorporated by reference as the disclosure of the specification of the present invention.
Claims (13)
(イ)ホモポリマーのガラス転移温度が25℃未満であるラジカル重合性単量体を20〜90質量%と、
(ロ)ホモポリマーのガラス転移温度が25℃以上であるラジカル重合性単量体を0.1〜70質量%と、
(ハ)分子内に非ラジカル重合性である反応性基を少なくとも一つ有するラジカル重合性単量体を1〜50質量%と、
を含む請求項3に記載の光硬化性樹脂組成物。The rubber composition is a copolymer composed of three or more monomers selected from the group consisting of (meth) acrylic acid ester compounds, vinyl compounds, and olefinic hydrocarbon compounds, wherein the monomers are ,
(Ii) 20-90% by mass of a radical polymerizable monomer having a glass transition temperature of less than 25 ° C. of the homopolymer,
(B) 0.1 to 70% by mass of a radical polymerizable monomer having a glass transition temperature of 25 ° C. or higher of the homopolymer;
(C) 1 to 50% by mass of a radically polymerizable monomer having at least one reactive group that is non-radically polymerizable in the molecule;
The photocurable resin composition of Claim 3 containing this.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007552880A JP5348893B2 (en) | 2006-01-06 | 2006-11-24 | Photocurable resin composition |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006001360 | 2006-01-06 | ||
JP2006001360 | 2006-01-06 | ||
JP2006036181 | 2006-02-14 | ||
JP2006036181 | 2006-02-14 | ||
JP2007552880A JP5348893B2 (en) | 2006-01-06 | 2006-11-24 | Photocurable resin composition |
PCT/JP2006/323491 WO2007077691A1 (en) | 2006-01-06 | 2006-11-24 | Photocurable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2007077691A1 true JPWO2007077691A1 (en) | 2009-06-04 |
JP5348893B2 JP5348893B2 (en) | 2013-11-20 |
Family
ID=38228049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007552880A Expired - Fee Related JP5348893B2 (en) | 2006-01-06 | 2006-11-24 | Photocurable resin composition |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5348893B2 (en) |
CN (1) | CN101356204B (en) |
WO (1) | WO2007077691A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102361899B (en) * | 2009-03-31 | 2013-10-09 | 阿克佐诺贝尔国际涂料股份有限公司 | Radiation curing of coatings |
CN103429629B (en) * | 2011-03-11 | 2016-06-08 | 日立化成株式会社 | Liquid curing resin combination, use the image of said composition to show with manufacture method and the image demonstration device of device |
JP6136095B2 (en) * | 2011-03-28 | 2017-05-31 | 日立化成株式会社 | Photosensitive resin composition, photosensitive film, pattern forming method, hollow structure forming method, and electronic component |
TWI625340B (en) * | 2011-04-15 | 2018-06-01 | Denka Company Ltd | Sclerosing composition |
JP6061728B2 (en) * | 2013-02-27 | 2017-01-18 | 株式会社オートネットワーク技術研究所 | Radical and anion combined photo-curing material |
CN104109328A (en) * | 2014-06-23 | 2014-10-22 | 东莞智维立体成型股份有限公司 | Photocuring wax material used for 3D printing |
CN105017492A (en) * | 2015-07-28 | 2015-11-04 | 孟庆华 | 3D printing material with aldehyde removal property and application thereof |
WO2020137843A1 (en) * | 2018-12-26 | 2020-07-02 | 東洋スチレン株式会社 | Resin composition and molded body |
WO2020170990A1 (en) * | 2019-02-19 | 2020-08-27 | ナガセケムテックス株式会社 | Photocurable resin composition and 3d stereolithography product using same |
WO2021000191A1 (en) * | 2019-06-30 | 2021-01-07 | 瑞声声学科技(深圳)有限公司 | Light-transmitting rubber composition, preparation method, and application in electroacoustic devices |
CN114175181A (en) * | 2019-08-01 | 2022-03-11 | 株式会社自动网络技术研究所 | Wire harness, method for producing wire harness, photocurable composition, and cured product thereof |
CN111463372B (en) * | 2020-05-08 | 2022-11-29 | 浙江道明光电科技有限公司 | Battery packaging film and preparation process thereof |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5345832B2 (en) * | 1972-01-17 | 1978-12-09 | ||
JPS5765714A (en) * | 1980-10-06 | 1982-04-21 | Nippon Synthetic Chem Ind Co Ltd:The | Photocurable resin composition |
JP2538215B2 (en) * | 1986-08-20 | 1996-09-25 | 日本ペイント株式会社 | Photocurable resin composition |
DE3879742D1 (en) * | 1987-04-14 | 1993-05-06 | Ciba Geigy Ag | ADHESIVES. |
JPS6485209A (en) * | 1987-09-25 | 1989-03-30 | Kemitetsuku Kk | Ultraviolet ray curable adhesive composition |
JP3116327B2 (en) * | 1990-04-17 | 2000-12-11 | 日本化薬株式会社 | UV curable resin composition for optical lens and optical lens |
JP3132768B2 (en) * | 1991-09-24 | 2001-02-05 | 日本化薬株式会社 | UV curable transmissive screen resin composition and cured product thereof |
JP3051241B2 (en) * | 1991-12-04 | 2000-06-12 | 日本化薬株式会社 | UV curable transmissive screen resin composition and cured product thereof |
AU659010B2 (en) * | 1992-06-29 | 1995-05-04 | Canon Kabushiki Kaisha | Resin composition for sealing and semiconductor apparatus covered with the sealing resin composition |
JPH0621498A (en) * | 1992-06-29 | 1994-01-28 | Canon Inc | Sealing resin composition and solar cell using the same |
JP3361365B2 (en) * | 1993-08-12 | 2003-01-07 | 日本合成化学工業株式会社 | Urethane-based oligomer, method for producing the same, and active energy ray-curable urethane-based resin composition containing the oligomer as a curable component |
JP3330201B2 (en) * | 1993-08-23 | 2002-09-30 | 日本合成化学工業株式会社 | Urethane oligomer and active energy ray-curable urethane resin composition containing the oligomer as a curable component |
JP3330202B2 (en) * | 1993-08-23 | 2002-09-30 | 日本合成化学工業株式会社 | Urethane oligomer and active energy ray-curable urethane resin composition containing the oligomer as a curable component |
JP3956597B2 (en) * | 2000-09-26 | 2007-08-08 | 三菱化学株式会社 | Photocurable composition and cured product thereof |
JP2003026715A (en) * | 2001-05-11 | 2003-01-29 | Shin Etsu Polymer Co Ltd | Ultraviolet-curing molding material, weatherproof ultraviolet-curing molding material, methods for curing them and articles produced from them |
JP2004277725A (en) * | 2003-02-28 | 2004-10-07 | Mitsubishi Rayon Co Ltd | Photocurable resin composition, photocurable sheet and method for producing molding using the sheet |
JP5037780B2 (en) * | 2003-05-23 | 2012-10-03 | 三菱化学株式会社 | Active energy ray-curable composition and hard coat film |
JP4170861B2 (en) * | 2003-09-04 | 2008-10-22 | 電気化学工業株式会社 | Photocurable resin composition |
JP2005154552A (en) * | 2003-11-25 | 2005-06-16 | Bridgestone Corp | Photocurable sheet and optical information recording medium |
-
2006
- 2006-11-24 JP JP2007552880A patent/JP5348893B2/en not_active Expired - Fee Related
- 2006-11-24 WO PCT/JP2006/323491 patent/WO2007077691A1/en active Application Filing
- 2006-11-24 CN CN2006800503979A patent/CN101356204B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN101356204B (en) | 2012-04-11 |
CN101356204A (en) | 2009-01-28 |
WO2007077691A1 (en) | 2007-07-12 |
JP5348893B2 (en) | 2013-11-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5348893B2 (en) | Photocurable resin composition | |
JP2008127429A (en) | Photo-curable resin composition | |
JP5237565B2 (en) | Photo-curable liquid rubber composition | |
US9303123B2 (en) | Energy-ray-curable elastomer composition, material for gasket, gasket, and hard disk device | |
JP2008038117A (en) | Resin composition and photocurable casting method | |
JP4457960B2 (en) | Active energy ray-curable composition for optical members | |
EP2702112A2 (en) | Curable elastomer compositions with low temperature sealing capability | |
JP2008088354A (en) | Resin composition and cast molding method | |
CN110546224A (en) | Adhesive composition | |
TWI685507B (en) | Modified liquid diene rubber and resin composition containing the modified liquid diene rubber | |
JP2007314715A (en) | Resin composition and photocuring cast molding method | |
JP6729683B2 (en) | Acrylic rubber manufacturing method | |
JP2010144000A (en) | Photocurable resin composition, photocurable moistureproof sealing material for use in electronic paper, electronic paper, and method for manufacturing the same | |
KR20150140856A (en) | Modified liquid diene rubber and production method for same | |
JP5499501B2 (en) | Adhesive composition | |
JP5603130B2 (en) | Manufacturing method of cured product, cured product, sealing material for electronic component, and gasket material for electronic component | |
JP2008195790A (en) | Photocurable liquid rubber composition | |
JP2008195792A (en) | Photocurable liquid resin composition | |
JP2008024862A (en) | Resin composition and method for cast molding | |
EP3957662A1 (en) | Curable resin composition and cured object obtained therefrom | |
JP5890634B2 (en) | Gasket material, gasket and hard disk drive, and method for manufacturing gasket | |
EP4249533A1 (en) | Photocurable resin composition, cured object obtained therefrom, and method for producing three-dimensional object | |
TW201132657A (en) | Active energy line cured-type composition for optical component | |
TWI454533B (en) | Phase-difference film and method for forming same | |
JP3670747B2 (en) | Liquid curable resin composition for optical member preparation |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20090903 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130108 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130308 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130514 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130617 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130723 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130820 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5348893 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |