JPS649735A - Phenol-resin copper-clad laminated board - Google Patents

Phenol-resin copper-clad laminated board

Info

Publication number
JPS649735A
JPS649735A JP16397887A JP16397887A JPS649735A JP S649735 A JPS649735 A JP S649735A JP 16397887 A JP16397887 A JP 16397887A JP 16397887 A JP16397887 A JP 16397887A JP S649735 A JPS649735 A JP S649735A
Authority
JP
Japan
Prior art keywords
phenol
laminated board
impregnated
resin
fluoroplastics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16397887A
Other languages
Japanese (ja)
Other versions
JPH07112726B2 (en
Inventor
Tetsuaki Suzuki
Atsushi Kurihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP16397887A priority Critical patent/JPH07112726B2/en
Publication of JPS649735A publication Critical patent/JPS649735A/en
Publication of JPH07112726B2 publication Critical patent/JPH07112726B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a phenol-resin copper-clad laminated board, in which moisture resistance and other laminated-board characteristics coexist in a balanced manner, by superposing a prepreg, in which a paper base material previously impregnated with fluoroplastics is coated and impregnated with a phenol resin, and copper foil and heating and pressure-molding them. CONSTITUTION:A paper base material is impregnated previously with fluoroplastics. Said paper base material is coated and impregnated with a phenol resin, thus manufacturing a prepreg. Said prepreg and copper foil are superposed through a conventional method, and heated and pressure laminate-molded and unified, thus preparing a laminated board. Accordingly, hydrophilic groups in base paper are pretreated before impregnation with fluoroplastics, and changed into hydrophobic properties, a phenol-resin copper-clad laminated board, which has excellent moisture resistance in cooperation with the moisture resistance of fluoroplastic themselves and does not damage other characteristics, is acquired.
JP16397887A 1987-07-02 1987-07-02 Phenol resin copper clad laminate Expired - Lifetime JPH07112726B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16397887A JPH07112726B2 (en) 1987-07-02 1987-07-02 Phenol resin copper clad laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16397887A JPH07112726B2 (en) 1987-07-02 1987-07-02 Phenol resin copper clad laminate

Publications (2)

Publication Number Publication Date
JPS649735A true JPS649735A (en) 1989-01-13
JPH07112726B2 JPH07112726B2 (en) 1995-12-06

Family

ID=15784430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16397887A Expired - Lifetime JPH07112726B2 (en) 1987-07-02 1987-07-02 Phenol resin copper clad laminate

Country Status (1)

Country Link
JP (1) JPH07112726B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470334A (en) * 1990-07-02 1992-03-05 Oji Paper Co Ltd Laminated sheet composed of sheet like pulp base material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0470334A (en) * 1990-07-02 1992-03-05 Oji Paper Co Ltd Laminated sheet composed of sheet like pulp base material

Also Published As

Publication number Publication date
JPH07112726B2 (en) 1995-12-06

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