JPS649735A - Phenol-resin copper-clad laminated board - Google Patents
Phenol-resin copper-clad laminated boardInfo
- Publication number
- JPS649735A JPS649735A JP16397887A JP16397887A JPS649735A JP S649735 A JPS649735 A JP S649735A JP 16397887 A JP16397887 A JP 16397887A JP 16397887 A JP16397887 A JP 16397887A JP S649735 A JPS649735 A JP S649735A
- Authority
- JP
- Japan
- Prior art keywords
- phenol
- laminated board
- impregnated
- resin
- fluoroplastics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To obtain a phenol-resin copper-clad laminated board, in which moisture resistance and other laminated-board characteristics coexist in a balanced manner, by superposing a prepreg, in which a paper base material previously impregnated with fluoroplastics is coated and impregnated with a phenol resin, and copper foil and heating and pressure-molding them. CONSTITUTION:A paper base material is impregnated previously with fluoroplastics. Said paper base material is coated and impregnated with a phenol resin, thus manufacturing a prepreg. Said prepreg and copper foil are superposed through a conventional method, and heated and pressure laminate-molded and unified, thus preparing a laminated board. Accordingly, hydrophilic groups in base paper are pretreated before impregnation with fluoroplastics, and changed into hydrophobic properties, a phenol-resin copper-clad laminated board, which has excellent moisture resistance in cooperation with the moisture resistance of fluoroplastic themselves and does not damage other characteristics, is acquired.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16397887A JPH07112726B2 (en) | 1987-07-02 | 1987-07-02 | Phenol resin copper clad laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16397887A JPH07112726B2 (en) | 1987-07-02 | 1987-07-02 | Phenol resin copper clad laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS649735A true JPS649735A (en) | 1989-01-13 |
JPH07112726B2 JPH07112726B2 (en) | 1995-12-06 |
Family
ID=15784430
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16397887A Expired - Lifetime JPH07112726B2 (en) | 1987-07-02 | 1987-07-02 | Phenol resin copper clad laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH07112726B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0470334A (en) * | 1990-07-02 | 1992-03-05 | Oji Paper Co Ltd | Laminated sheet composed of sheet like pulp base material |
-
1987
- 1987-07-02 JP JP16397887A patent/JPH07112726B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0470334A (en) * | 1990-07-02 | 1992-03-05 | Oji Paper Co Ltd | Laminated sheet composed of sheet like pulp base material |
Also Published As
Publication number | Publication date |
---|---|
JPH07112726B2 (en) | 1995-12-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4772509A (en) | Printed circuit board base material | |
US4314002A (en) | Insulating laminates comprising alternating fiber reinforced resin layers and unreinforced resin layers | |
KR850003344A (en) | Manufacturing method of laminated board | |
KR830008626A (en) | Method of manufacturing planar heating element | |
EP0844272A3 (en) | Prepreg for laminate and process for producing printed wiring-board using the same | |
US4675235A (en) | Laminated synthetic mica articles | |
EP0295816A3 (en) | Resin-impregnated fabrics laminated to metal foil | |
JPS649735A (en) | Phenol-resin copper-clad laminated board | |
JPS6040215A (en) | Preparation of prepreg | |
ATE128598T1 (en) | METHOD FOR PRODUCING A MULTI-LAYER CIRCUIT BOARD. | |
JPS5292288A (en) | Manufacture of copper-clad laminate of unsaturated polyester resin | |
JPS644628A (en) | Copper-clad epoxy resin laminate | |
JPS63153107A (en) | Production of prepreg | |
GB1328048A (en) | Process for preparing internally plasticized phenolic resins | |
JPS5610425A (en) | Manufacture of laminated board | |
JPS5649735A (en) | Production of laminated sheet | |
JPS6221024Y2 (en) | ||
JPS6461231A (en) | Laminated sheet | |
JPH0368557B2 (en) | ||
JPS6478833A (en) | Manufacture of paper base laminate | |
JPS5659847A (en) | Production of laminated board | |
JPS57100137A (en) | Manufacturing of synthetic resin laminated sheet | |
JPH04142338A (en) | Preparation of laminated sheet | |
JPS59202853A (en) | Continuous manufacture of laminated board | |
JPS589755B2 (en) | New copper clad laminate |