JPS6489351A - Semiconductor package - Google Patents
Semiconductor packageInfo
- Publication number
- JPS6489351A JPS6489351A JP24548287A JP24548287A JPS6489351A JP S6489351 A JPS6489351 A JP S6489351A JP 24548287 A JP24548287 A JP 24548287A JP 24548287 A JP24548287 A JP 24548287A JP S6489351 A JPS6489351 A JP S6489351A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- cap
- substrate
- fins
- wax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To preferably cool generated heat at the normal time even if a thermal load is temporarily increased by sealing wax in a sealed space formed between a cap and a substrate, and further connecting fins between the cap and the substrate. CONSTITUTION:The face of a substrate 2, disposed at opposite side to the face for placing a semiconductor IC chip 1 is thermally connected to a cap 3 with fins 11. With such a configuration, when the chip 1 generates heat, the heat is transferred to the substrate 2. The heat transferred to the substrate 2 is transmitted at one side to the mixture 4 of wax and powder metal, and at the other to the cap 3 through the fins 11. In this case, when the quantity of the generated heat of the chip 1 is abruptly increased, the wax is melted by the heat at that time, the heat is absorbed by the phase change, thereby maintaining the temperature constant. On the other hand, if the generated heat is of the degree not melting the wax, it is transferred to the cap 3 by thermal conduction of the fins 11 and the metal powder, and dissipated through the cap 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62245482A JP2523688B2 (en) | 1987-09-29 | 1987-09-29 | Semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62245482A JP2523688B2 (en) | 1987-09-29 | 1987-09-29 | Semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6489351A true JPS6489351A (en) | 1989-04-03 |
JP2523688B2 JP2523688B2 (en) | 1996-08-14 |
Family
ID=17134314
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62245482A Expired - Lifetime JP2523688B2 (en) | 1987-09-29 | 1987-09-29 | Semiconductor package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2523688B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5844310A (en) * | 1996-08-09 | 1998-12-01 | Hitachi Metals, Ltd. | Heat spreader semiconductor device with heat spreader and method for producing same |
EP1162659A2 (en) * | 2000-06-08 | 2001-12-12 | MERCK PATENT GmbH | Use of PCM in heat sinks for electronic devices |
JP2006220537A (en) * | 2005-02-10 | 2006-08-24 | Three M Innovative Properties Co | Water leakage sensor |
JP2009283861A (en) * | 2008-05-26 | 2009-12-03 | Toyota Central R&D Labs Inc | Semiconductor device |
-
1987
- 1987-09-29 JP JP62245482A patent/JP2523688B2/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5844310A (en) * | 1996-08-09 | 1998-12-01 | Hitachi Metals, Ltd. | Heat spreader semiconductor device with heat spreader and method for producing same |
US6032362A (en) * | 1996-08-09 | 2000-03-07 | Hitachi Metals, Ltd. | Method for producing a heat spreader and semiconductor device with a heat spreader |
EP1162659A2 (en) * | 2000-06-08 | 2001-12-12 | MERCK PATENT GmbH | Use of PCM in heat sinks for electronic devices |
JP2006220537A (en) * | 2005-02-10 | 2006-08-24 | Three M Innovative Properties Co | Water leakage sensor |
JP2009283861A (en) * | 2008-05-26 | 2009-12-03 | Toyota Central R&D Labs Inc | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP2523688B2 (en) | 1996-08-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment |
Free format text: PAYMENT UNTIL: 20080531 Year of fee payment: 12 |