JPS648734U - - Google Patents

Info

Publication number
JPS648734U
JPS648734U JP10255987U JP10255987U JPS648734U JP S648734 U JPS648734 U JP S648734U JP 10255987 U JP10255987 U JP 10255987U JP 10255987 U JP10255987 U JP 10255987U JP S648734 U JPS648734 U JP S648734U
Authority
JP
Japan
Prior art keywords
wired
wiring structure
electrical wiring
conductive particles
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10255987U
Other languages
Japanese (ja)
Other versions
JPH0526747Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987102559U priority Critical patent/JPH0526747Y2/ja
Publication of JPS648734U publication Critical patent/JPS648734U/ja
Application granted granted Critical
Publication of JPH0526747Y2 publication Critical patent/JPH0526747Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Landscapes

  • Multi-Conductor Connections (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例構成図、第２図は本
考案の他の実施例構成図、第３図は従来例の構成
図である。 １……配線基板、２……配線パターン、３……
ＩＣ素子、４……パツシベーシヨン膜、５……導
電粒子、６……熱可塑性樹脂、７……収縮性樹脂
、８……封止材、９……逃げ溝。 FIG. 1 is a block diagram of one embodiment of the present invention, FIG. 2 is a block diagram of another embodiment of the present invention, and FIG. 3 is a block diagram of a conventional example. 1... Wiring board, 2... Wiring pattern, 3...
IC element, 4... Passivation film, 5... Conductive particles, 6... Thermoplastic resin, 7... Shrinkable resin, 8... Sealing material, 9... Relief groove.

Claims (1)

【実用新案登録請求の範囲】 (1) 配線部材と被配線部材との間に導電粒子と
接着剤とを含む連結シートを挟んで加圧接合した
電気配線構造において、前記配線部材と被配線部
材との間に収縮応力を有する押さえ部材を設けた
ことを特徴とする電気配線構造。 (2) 配線部材と被配線部材とのいずれか一方に
導電粒子及び接着剤の一部を逃がす逃がし溝を形
成したことを特徴とする実用新案登録請求の範囲
第１項記載の電気配線構造。[Claims for Utility Model Registration] (1) In an electrical wiring structure in which a wiring member and a wired member are bonded together under pressure with a connecting sheet containing conductive particles and an adhesive sandwiched between the wiring member and the wired member, An electrical wiring structure characterized in that a holding member having shrinkage stress is provided between. (2) The electrical wiring structure according to claim 1 of the utility model registration, characterized in that an escape groove is formed in either the wiring member or the wired member to allow some of the conductive particles and adhesive to escape.
JP1987102559U 1987-07-03 1987-07-03 Expired - Lifetime JPH0526747Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987102559U JPH0526747Y2 (en) 1987-07-03 1987-07-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987102559U JPH0526747Y2 (en) 1987-07-03 1987-07-03

Publications (2)

Publication Number Publication Date
JPS648734U true JPS648734U (en) 1989-01-18
JPH0526747Y2 JPH0526747Y2 (en) 1993-07-07

Family

ID=31332576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987102559U Expired - Lifetime JPH0526747Y2 (en) 1987-07-03 1987-07-03

Country Status (1)

Country Link
JP (1) JPH0526747Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031030A (en) * 2001-07-12 2003-01-31 Sekisui Chem Co Ltd Microparticle alignment conductive connection film, manufacturing method of the microparticle alignment conductive connection film and conductive connection structural body

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279139A (en) * 1985-06-04 1986-12-09 Nec Corp Hybrid integrated circuit device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61279139A (en) * 1985-06-04 1986-12-09 Nec Corp Hybrid integrated circuit device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031030A (en) * 2001-07-12 2003-01-31 Sekisui Chem Co Ltd Microparticle alignment conductive connection film, manufacturing method of the microparticle alignment conductive connection film and conductive connection structural body
JP4669635B2 (en) * 2001-07-12 2011-04-13 積水化学工業株式会社 Method for producing fine particle arrangement conductive connection film

Also Published As

Publication number Publication date
JPH0526747Y2 (en) 1993-07-07

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