JPS648630U - - Google Patents
Info
- Publication number
- JPS648630U JPS648630U JP10174087U JP10174087U JPS648630U JP S648630 U JPS648630 U JP S648630U JP 10174087 U JP10174087 U JP 10174087U JP 10174087 U JP10174087 U JP 10174087U JP S648630 U JPS648630 U JP S648630U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- amplifier
- pipe
- pair
- resistance wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012530 fluid Substances 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
Landscapes
- Measuring Volume Flow (AREA)
Description
第１図は本案の測定原理の説明図、第２図は従
来の測定原理の説明図、第３図、第４図は本案の
開発段階での、測定方法の説明図、第５図は第１
図の温度分布図、第６図は第３図の温度分布図、
第７図は第４図の温度分布図である。
１……パイプ、２，４……熱抵抗線、３……ヒ
ータ、５……ヒータ電源、６……ブリツジ回路電
源、７，８……抵抗、９……アンプ、１０……メ
ータ、１１……包囲体、１２……ブリツジ回路、
Ａ……ヒータ３から熱抵抗線４までの長さ、Ｂ…
…ヒータ３から熱抵抗線２までの長さ、Ｔａ……
熱抵抗線４の温度、Ｔｂ……熱抵抗線２の温度、
Ｔｈ……ヒータ３の温度。
Figure 1 is an explanatory diagram of the measurement principle of this proposal, Figure 2 is an explanatory diagram of the conventional measurement principle, Figures 3 and 4 are illustrations of the measurement method at the development stage of this proposal, and Figure 5 is an illustration of the measurement method in the development stage of this proposal. 1
The temperature distribution diagram in Figure 6 is the temperature distribution diagram in Figure 3,
FIG. 7 is a temperature distribution diagram of FIG. 4. 1... Pipe, 2, 4... Heat resistance wire, 3... Heater, 5... Heater power supply, 6... Bridge circuit power supply, 7, 8... Resistor, 9... Amplifier, 10... Meter, 11 ...Envelope, 12...Bridge circuit,
A... Length from heater 3 to heat resistance wire 4, B...
...Length from heater 3 to heat resistance wire 2, Ta...
Temperature of thermal resistance wire 4, Tb...Temperature of thermal resistance wire 2,
Th...Temperature of heater 3.
Claims (1)
、一対の感熱抵抗線を巻回する事により、形成さ
れるブリツジ回路と、上記の一対の感熱抵抗線を
外気と継熱する包囲体と、ブリツジ回路の不平衡
を増幅するアンプと、アンプ出力を表示するメー
タより成る流量計において、上記パイプに熱を供
給するヒータを設けた事を特徴とする流量計。 A bridge circuit is formed by winding a pair of heat-sensitive resistance wires around the outer circumferential surface of a pipe through which a fluid to be measured flows, an enclosure that transfers heat between the pair of heat-sensitive resistance wires and outside air, and A flowmeter comprising an amplifier for amplifying circuit unbalance and a meter for displaying the output of the amplifier, characterized in that a heater is provided for supplying heat to the pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10174087U JPS648630U (en) | 1987-07-03 | 1987-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10174087U JPS648630U (en) | 1987-07-03 | 1987-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS648630U true JPS648630U (en) | 1989-01-18 |
Family
ID=31331012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10174087U Pending JPS648630U (en) | 1987-07-03 | 1987-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS648630U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7264680B2 (en) | 1997-05-09 | 2007-09-04 | Semitool, Inc. | Process and apparatus for treating a workpiece using ozone |
| US7378355B2 (en) | 1997-05-09 | 2008-05-27 | Semitool, Inc. | System and methods for polishing a wafer |
| US7404863B2 (en) | 1997-05-09 | 2008-07-29 | Semitool, Inc. | Methods of thinning a silicon wafer using HF and ozone |
-
1987
- 1987-07-03 JP JP10174087U patent/JPS648630U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7264680B2 (en) | 1997-05-09 | 2007-09-04 | Semitool, Inc. | Process and apparatus for treating a workpiece using ozone |
| US7378355B2 (en) | 1997-05-09 | 2008-05-27 | Semitool, Inc. | System and methods for polishing a wafer |
| US7404863B2 (en) | 1997-05-09 | 2008-07-29 | Semitool, Inc. | Methods of thinning a silicon wafer using HF and ozone |
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