JPS6484784A - Printed wiring board and manufacture thereof - Google Patents
Printed wiring board and manufacture thereofInfo
- Publication number
- JPS6484784A JPS6484784A JP24325187A JP24325187A JPS6484784A JP S6484784 A JPS6484784 A JP S6484784A JP 24325187 A JP24325187 A JP 24325187A JP 24325187 A JP24325187 A JP 24325187A JP S6484784 A JPS6484784 A JP S6484784A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plated layer
- fiber
- composite plated
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002131 composite material Substances 0.000 abstract 5
- 239000000835 fiber Substances 0.000 abstract 4
- 239000004020 conductor Substances 0.000 abstract 3
- 239000010419 fine particle Substances 0.000 abstract 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 239000007788 liquid Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24325187A JPS6484784A (en) | 1987-09-28 | 1987-09-28 | Printed wiring board and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24325187A JPS6484784A (en) | 1987-09-28 | 1987-09-28 | Printed wiring board and manufacture thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6484784A true JPS6484784A (en) | 1989-03-30 |
| JPH0480556B2 JPH0480556B2 (enExample) | 1992-12-18 |
Family
ID=17101090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24325187A Granted JPS6484784A (en) | 1987-09-28 | 1987-09-28 | Printed wiring board and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6484784A (enExample) |
-
1987
- 1987-09-28 JP JP24325187A patent/JPS6484784A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0480556B2 (enExample) | 1992-12-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3786172A (en) | Printed circuit board method and apparatus | |
| KR870005122A (ko) | 전기도금용 비전도성 기질의 제조 방법, 이에 사용되는 액체분산액 및 이 방법에 의한 인쇄배선기판 | |
| WO1989002212A2 (en) | Improved circuit board material and electroplating bath for the production thereof | |
| KR880004724A (ko) | 금속 기판 및 그 제조 방법 | |
| KR910009125A (ko) | 수지회로기판 및 그 제조방법 | |
| EP0083488A3 (en) | Method of producing printed circuits | |
| KR900004226A (ko) | 관통공에서 전기적 접속하는 가요성 양면 회로 기판 제조방법 | |
| EP0265629A3 (en) | Printed circuit card fabrication process with nickel overplate | |
| KR900003158B1 (ko) | 기판상의 전기회로 형성방법 | |
| GB2090476A (en) | Electrical conductors arranged in multiple layers and preparation thereof | |
| MY101308A (en) | Presensitized circuit material. | |
| JPS6471082A (en) | Circuit board | |
| GB1001634A (en) | Electronic circuit boards | |
| JPS6484784A (en) | Printed wiring board and manufacture thereof | |
| US4068032A (en) | Method of treating conductive elastomers | |
| US3447960A (en) | Method of manufacturing printed circuit boards | |
| GB1220370A (en) | Electrical circuit boards | |
| JPS6489350A (en) | Package for containing semiconductor element | |
| JPS55138864A (en) | Method of fabricating semiconductor assembling substrate | |
| WO1991009511A3 (en) | Electrical conductors of conductive resin | |
| JPS6451691A (en) | Manufacture of printed wiring board | |
| JPS6467995A (en) | Manufacture of printed circuit board with side face electrode | |
| JPS6489392A (en) | Manufacture of printed wiring board | |
| GB1145771A (en) | Electrical circuit boards | |
| Ruhlicke et al. | Nickel/Palladium/Gold--an Effective Layer Composite Material With High Reliability |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 15 Free format text: PAYMENT UNTIL: 20071218 |