JPS6481949A - Agent for peeling photoresist - Google Patents

Agent for peeling photoresist

Info

Publication number
JPS6481949A
JPS6481949A JP23896287A JP23896287A JPS6481949A JP S6481949 A JPS6481949 A JP S6481949A JP 23896287 A JP23896287 A JP 23896287A JP 23896287 A JP23896287 A JP 23896287A JP S6481949 A JPS6481949 A JP S6481949A
Authority
JP
Japan
Prior art keywords
peeling
agent
water
power
aminoalcohols
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23896287A
Other languages
English (en)
Other versions
JPH0769618B2 (ja
Inventor
Katsuo Matsumoto
Kazuyuki Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP62238962A priority Critical patent/JPH0769618B2/ja
Publication of JPS6481949A publication Critical patent/JPS6481949A/ja
Publication of JPH0769618B2 publication Critical patent/JPH0769618B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP62238962A 1987-09-25 1987-09-25 フオトレジスト用剥離剤 Expired - Lifetime JPH0769618B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62238962A JPH0769618B2 (ja) 1987-09-25 1987-09-25 フオトレジスト用剥離剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62238962A JPH0769618B2 (ja) 1987-09-25 1987-09-25 フオトレジスト用剥離剤

Publications (2)

Publication Number Publication Date
JPS6481949A true JPS6481949A (en) 1989-03-28
JPH0769618B2 JPH0769618B2 (ja) 1995-07-31

Family

ID=17037884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62238962A Expired - Lifetime JPH0769618B2 (ja) 1987-09-25 1987-09-25 フオトレジスト用剥離剤

Country Status (1)

Country Link
JP (1) JPH0769618B2 (ja)

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399203A (en) * 1992-04-20 1995-03-21 Mitsubishi Kasei Corporation Method for cleaning oil-deposited material
US5507978A (en) * 1995-05-08 1996-04-16 Ocg Microelectronic Materials, Inc. Novolak containing photoresist stripper composition
US5545353A (en) * 1995-05-08 1996-08-13 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
US5561105A (en) * 1995-05-08 1996-10-01 Ocg Microelectronic Materials, Inc. Chelating reagent containing photoresist stripper composition
US5597678A (en) * 1994-04-18 1997-01-28 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
US5612304A (en) * 1995-07-07 1997-03-18 Olin Microelectronic Chemicals, Inc. Redox reagent-containing post-etch residue cleaning composition
US5648324A (en) * 1996-01-23 1997-07-15 Ocg Microelectronic Materials, Inc. Photoresist stripping composition
US5665688A (en) * 1996-01-23 1997-09-09 Olin Microelectronics Chemicals, Inc. Photoresist stripping composition
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US6372050B2 (en) 1997-05-05 2002-04-16 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6413923B2 (en) 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6454868B1 (en) * 2000-04-17 2002-09-24 Electrochemicals Inc. Permanganate desmear process for printed wiring boards
US6458517B2 (en) 1999-03-31 2002-10-01 Sharp Kabushiki Kaisha Photoresist stripping composition and process for stripping photoresist
WO2003003124A1 (fr) * 2001-06-29 2003-01-09 Mitsubishi Gas Chemical Company, Inc. Composition de decapage de photoresine
US6638694B2 (en) 1999-02-25 2003-10-28 Mitsubishi Gas Chemical Company, Inc Resist stripping agent and process of producing semiconductor devices using the same
JP2006195437A (ja) * 2004-12-13 2006-07-27 Sekisui Chem Co Ltd レジスト除去方法及びレジスト除去装置
US7135445B2 (en) 2001-12-04 2006-11-14 Ekc Technology, Inc. Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials
JP2006324358A (ja) * 2005-05-17 2006-11-30 Sekisui Chem Co Ltd レジスト除去方法及びレジスト除去装置
WO2006132008A1 (ja) * 2005-06-07 2006-12-14 Toagosei Co., Ltd. 有機被膜剥離剤、該剥離剤を用いた有機被膜の除去方法および除去装置
WO2008152907A1 (ja) * 2007-06-12 2008-12-18 Toagosei Co., Ltd. 導電性高分子上のレジスト膜の剥離剤、レジスト膜の剥離方法、および、パターニングした導電性高分子を有する基板
WO2010058778A1 (ja) 2008-11-19 2010-05-27 東亞合成株式会社 パターニングされた導電性高分子膜を有する基板の製造方法及びパターニングされた導電性高分子膜を有する基板
JP2023018721A (ja) * 2021-07-28 2023-02-09 ナトコ株式会社 塗膜剥離剤

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7384900B2 (en) * 2003-08-27 2008-06-10 Lg Display Co., Ltd. Composition and method for removing copper-compatible resist

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5133442A (ja) * 1974-09-13 1976-03-22 Yamaha Motor Co Ltd Jidonirinshanonenryotankusochi
JPS57165834A (en) * 1981-04-06 1982-10-13 Hitachi Chem Co Ltd Peeling solution for cured film of photopolymerizing composition
JPS6026945A (ja) * 1983-07-25 1985-02-09 ジエイ・テイ・ベ−カ−・ケミカル・カンパニ− ストリツピング組成物及びレジストをストリツピングする方法
JPS6066424A (ja) * 1983-09-22 1985-04-16 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US4617251A (en) * 1985-04-11 1986-10-14 Olin Hunt Specialty Products, Inc. Stripping composition and method of using the same
JPS6249355A (ja) * 1985-08-10 1987-03-04 Nagase Sangyo Kk 剥離剤組成物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5133442A (ja) * 1974-09-13 1976-03-22 Yamaha Motor Co Ltd Jidonirinshanonenryotankusochi
JPS57165834A (en) * 1981-04-06 1982-10-13 Hitachi Chem Co Ltd Peeling solution for cured film of photopolymerizing composition
JPS6026945A (ja) * 1983-07-25 1985-02-09 ジエイ・テイ・ベ−カ−・ケミカル・カンパニ− ストリツピング組成物及びレジストをストリツピングする方法
JPS6066424A (ja) * 1983-09-22 1985-04-16 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
US4617251A (en) * 1985-04-11 1986-10-14 Olin Hunt Specialty Products, Inc. Stripping composition and method of using the same
JPS6249355A (ja) * 1985-08-10 1987-03-04 Nagase Sangyo Kk 剥離剤組成物

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5399203A (en) * 1992-04-20 1995-03-21 Mitsubishi Kasei Corporation Method for cleaning oil-deposited material
US5597678A (en) * 1994-04-18 1997-01-28 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
US5507978A (en) * 1995-05-08 1996-04-16 Ocg Microelectronic Materials, Inc. Novolak containing photoresist stripper composition
US5545353A (en) * 1995-05-08 1996-08-13 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
US5561105A (en) * 1995-05-08 1996-10-01 Ocg Microelectronic Materials, Inc. Chelating reagent containing photoresist stripper composition
US5612304A (en) * 1995-07-07 1997-03-18 Olin Microelectronic Chemicals, Inc. Redox reagent-containing post-etch residue cleaning composition
US5648324A (en) * 1996-01-23 1997-07-15 Ocg Microelectronic Materials, Inc. Photoresist stripping composition
US5665688A (en) * 1996-01-23 1997-09-09 Olin Microelectronics Chemicals, Inc. Photoresist stripping composition
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6020292A (en) * 1996-09-06 2000-02-01 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US6191086B1 (en) 1996-09-06 2001-02-20 Arch Specialty Chemicals, Inc. Cleaning composition and method for removing residues
US6372050B2 (en) 1997-05-05 2002-04-16 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6638694B2 (en) 1999-02-25 2003-10-28 Mitsubishi Gas Chemical Company, Inc Resist stripping agent and process of producing semiconductor devices using the same
US6458517B2 (en) 1999-03-31 2002-10-01 Sharp Kabushiki Kaisha Photoresist stripping composition and process for stripping photoresist
US6413923B2 (en) 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US7001874B2 (en) 1999-11-15 2006-02-21 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US7402552B2 (en) 1999-11-15 2008-07-22 Fujifilm Electronic Materials U.S.A., Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6454868B1 (en) * 2000-04-17 2002-09-24 Electrochemicals Inc. Permanganate desmear process for printed wiring boards
WO2003003124A1 (fr) * 2001-06-29 2003-01-09 Mitsubishi Gas Chemical Company, Inc. Composition de decapage de photoresine
JP2003015320A (ja) * 2001-06-29 2003-01-17 Mitsubishi Gas Chem Co Inc レジスト剥離剤組成物
US7135445B2 (en) 2001-12-04 2006-11-14 Ekc Technology, Inc. Process for the use of bis-choline and tris-choline in the cleaning of quartz-coated polysilicon and other materials
JP2006195437A (ja) * 2004-12-13 2006-07-27 Sekisui Chem Co Ltd レジスト除去方法及びレジスト除去装置
JP2006324358A (ja) * 2005-05-17 2006-11-30 Sekisui Chem Co Ltd レジスト除去方法及びレジスト除去装置
WO2006132008A1 (ja) * 2005-06-07 2006-12-14 Toagosei Co., Ltd. 有機被膜剥離剤、該剥離剤を用いた有機被膜の除去方法および除去装置
WO2008152907A1 (ja) * 2007-06-12 2008-12-18 Toagosei Co., Ltd. 導電性高分子上のレジスト膜の剥離剤、レジスト膜の剥離方法、および、パターニングした導電性高分子を有する基板
JPWO2008152907A1 (ja) * 2007-06-12 2010-08-26 東亞合成株式会社 導電性高分子上のレジスト膜の剥離剤、レジスト膜の剥離方法、および、パターニングした導電性高分子を有する基板
WO2010058778A1 (ja) 2008-11-19 2010-05-27 東亞合成株式会社 パターニングされた導電性高分子膜を有する基板の製造方法及びパターニングされた導電性高分子膜を有する基板
JP2023018721A (ja) * 2021-07-28 2023-02-09 ナトコ株式会社 塗膜剥離剤

Also Published As

Publication number Publication date
JPH0769618B2 (ja) 1995-07-31

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