JPS6481396A - Manufacture of metallic base printed board - Google Patents

Manufacture of metallic base printed board

Info

Publication number
JPS6481396A
JPS6481396A JP23955187A JP23955187A JPS6481396A JP S6481396 A JPS6481396 A JP S6481396A JP 23955187 A JP23955187 A JP 23955187A JP 23955187 A JP23955187 A JP 23955187A JP S6481396 A JPS6481396 A JP S6481396A
Authority
JP
Japan
Prior art keywords
resin
opening
plate
pattern
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23955187A
Other languages
Japanese (ja)
Inventor
Munehiko Fukushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP23955187A priority Critical patent/JPS6481396A/en
Publication of JPS6481396A publication Critical patent/JPS6481396A/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

PURPOSE:To form an accurate and miniature pattern and to improve insulating reliability of an opening by coating the surface and opening of a metal plate with resin by fluidizing and dipping, then laminating a metal foil, etching the surface, forming a circuit, and then opening the resin filling hole of the plate. CONSTITUTION:An opened metal plate 5 is treated in a fluidizing and dipping tank of resin powder for forming an insulating layer of epoxy resin, polyamide, etc., the surface and opening 6 are covered with resin to form a resin insulating layer 7. A metal foil made of copper, aluminum, etc., is disposed on the layer 7, laminated, pressure molded and integrated. The obtained laminate is etched to form a circuit pattern 9 of predetermined metal conductor from the foil. After the pattern 9 is formed, holes 6 to be filled with resin of the plate 5 are opened by drills, etc.
JP23955187A 1987-09-24 1987-09-24 Manufacture of metallic base printed board Pending JPS6481396A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23955187A JPS6481396A (en) 1987-09-24 1987-09-24 Manufacture of metallic base printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23955187A JPS6481396A (en) 1987-09-24 1987-09-24 Manufacture of metallic base printed board

Publications (1)

Publication Number Publication Date
JPS6481396A true JPS6481396A (en) 1989-03-27

Family

ID=17046490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23955187A Pending JPS6481396A (en) 1987-09-24 1987-09-24 Manufacture of metallic base printed board

Country Status (1)

Country Link
JP (1) JPS6481396A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6191367B1 (en) 1995-03-03 2001-02-20 Mitsubishi Denki Kabushiki Kaisha Wiring construction body with conductive lines in a resin binder

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472462A (en) * 1977-11-22 1979-06-09 Hitachi Chemical Co Ltd Preparation of substrate for metallic core print plug board
JPS5789297A (en) * 1980-11-26 1982-06-03 Fujitsu Ltd Method of producing metallic core printed board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5472462A (en) * 1977-11-22 1979-06-09 Hitachi Chemical Co Ltd Preparation of substrate for metallic core print plug board
JPS5789297A (en) * 1980-11-26 1982-06-03 Fujitsu Ltd Method of producing metallic core printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6191367B1 (en) 1995-03-03 2001-02-20 Mitsubishi Denki Kabushiki Kaisha Wiring construction body with conductive lines in a resin binder

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