JPS6481396A - Manufacture of metallic base printed board - Google Patents
Manufacture of metallic base printed boardInfo
- Publication number
- JPS6481396A JPS6481396A JP23955187A JP23955187A JPS6481396A JP S6481396 A JPS6481396 A JP S6481396A JP 23955187 A JP23955187 A JP 23955187A JP 23955187 A JP23955187 A JP 23955187A JP S6481396 A JPS6481396 A JP S6481396A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- opening
- plate
- pattern
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
PURPOSE:To form an accurate and miniature pattern and to improve insulating reliability of an opening by coating the surface and opening of a metal plate with resin by fluidizing and dipping, then laminating a metal foil, etching the surface, forming a circuit, and then opening the resin filling hole of the plate. CONSTITUTION:An opened metal plate 5 is treated in a fluidizing and dipping tank of resin powder for forming an insulating layer of epoxy resin, polyamide, etc., the surface and opening 6 are covered with resin to form a resin insulating layer 7. A metal foil made of copper, aluminum, etc., is disposed on the layer 7, laminated, pressure molded and integrated. The obtained laminate is etched to form a circuit pattern 9 of predetermined metal conductor from the foil. After the pattern 9 is formed, holes 6 to be filled with resin of the plate 5 are opened by drills, etc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23955187A JPS6481396A (en) | 1987-09-24 | 1987-09-24 | Manufacture of metallic base printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23955187A JPS6481396A (en) | 1987-09-24 | 1987-09-24 | Manufacture of metallic base printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6481396A true JPS6481396A (en) | 1989-03-27 |
Family
ID=17046490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23955187A Pending JPS6481396A (en) | 1987-09-24 | 1987-09-24 | Manufacture of metallic base printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6481396A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6191367B1 (en) | 1995-03-03 | 2001-02-20 | Mitsubishi Denki Kabushiki Kaisha | Wiring construction body with conductive lines in a resin binder |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5472462A (en) * | 1977-11-22 | 1979-06-09 | Hitachi Chemical Co Ltd | Preparation of substrate for metallic core print plug board |
JPS5789297A (en) * | 1980-11-26 | 1982-06-03 | Fujitsu Ltd | Method of producing metallic core printed board |
-
1987
- 1987-09-24 JP JP23955187A patent/JPS6481396A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5472462A (en) * | 1977-11-22 | 1979-06-09 | Hitachi Chemical Co Ltd | Preparation of substrate for metallic core print plug board |
JPS5789297A (en) * | 1980-11-26 | 1982-06-03 | Fujitsu Ltd | Method of producing metallic core printed board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6191367B1 (en) | 1995-03-03 | 2001-02-20 | Mitsubishi Denki Kabushiki Kaisha | Wiring construction body with conductive lines in a resin binder |
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