JPS6481326A - Semiconductor chip carrier - Google Patents

Semiconductor chip carrier

Info

Publication number
JPS6481326A
JPS6481326A JP24002187A JP24002187A JPS6481326A JP S6481326 A JPS6481326 A JP S6481326A JP 24002187 A JP24002187 A JP 24002187A JP 24002187 A JP24002187 A JP 24002187A JP S6481326 A JPS6481326 A JP S6481326A
Authority
JP
Japan
Prior art keywords
heat dissipation
semiconductor element
element mounting
ceramic material
mounting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24002187A
Other languages
Japanese (ja)
Inventor
Kazuyoshi Kamimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP24002187A priority Critical patent/JPS6481326A/en
Publication of JPS6481326A publication Critical patent/JPS6481326A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To increase heat dissipation effects and to improve reliability of a semiconductor device by forming a semiconductor element mounting device with one of metallic leads for connection to external circuits. CONSTITUTION:Thin conductive layers 2A, 2B, and 2C which are approximately 12mum thick are formed upon a ceramic material 1, metallic leads 3A and 3B which are approximately 0.2mm thick are brazed thereupon, while the metallic lead 3B is formed to be integrated with an element mounting part 5 upon which to mount a semiconductor element 6. The area of the metallic lead 3B gets increased at the element mounting part. The semiconductor element 6 is mounted at the element mounting part 5. Heat generated at the time of operating the element is radiated as shown by arrow 20B to the ceramic material 1 after being spread over to the metallic lead 3B which is a good conductor, whereby a heat dissipation area at the time of heat dissipation into the ceramic material 1 is increased and the heat dissipation effects are accordingly increased. Therefore the quantity of heat to be accumulated in the semiconductor element 6 is greatly reduced.
JP24002187A 1987-09-24 1987-09-24 Semiconductor chip carrier Pending JPS6481326A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24002187A JPS6481326A (en) 1987-09-24 1987-09-24 Semiconductor chip carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24002187A JPS6481326A (en) 1987-09-24 1987-09-24 Semiconductor chip carrier

Publications (1)

Publication Number Publication Date
JPS6481326A true JPS6481326A (en) 1989-03-27

Family

ID=17053286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24002187A Pending JPS6481326A (en) 1987-09-24 1987-09-24 Semiconductor chip carrier

Country Status (1)

Country Link
JP (1) JPS6481326A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006137213A (en) * 2004-11-10 2006-06-01 Mazda Motor Corp Arrangement structure of fuel tank for vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006137213A (en) * 2004-11-10 2006-06-01 Mazda Motor Corp Arrangement structure of fuel tank for vehicle

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