JPS6477916A - Manufacture of capacitor - Google Patents
Manufacture of capacitorInfo
- Publication number
- JPS6477916A JPS6477916A JP62235209A JP23520987A JPS6477916A JP S6477916 A JPS6477916 A JP S6477916A JP 62235209 A JP62235209 A JP 62235209A JP 23520987 A JP23520987 A JP 23520987A JP S6477916 A JPS6477916 A JP S6477916A
- Authority
- JP
- Japan
- Prior art keywords
- spraying metallic
- metallic electrodes
- intervals
- shaped
- sections
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
PURPOSE:To improve workability and reliability on soldering by continuously forming protruding sections in a specific height on the surface of a spraying metallic electrode used as an external electrode in the direction of the thickness of an element at specific intervals by means of a cutting blade. CONSTITUTION:A chip type film capacitor element 1 has cut surfaces 3 and spraying metallic electrodes 2. Protruding sections in height (t) (50-100mum) are shaped to the surfaces of the spraying metallic electrodes 2 at intervals P (0.5-2.0mm). A long sized element 4 has the cut surfaces 3 and the spraying metallic electrodes 2. There are green surfaces 7 in the spraying metallic electrodes 2, and the surfaces 6 obtained by cutting the surfaces 7 by turning an end mill 5 are acquired. The depth and intervals of irregular surfaces shaped to the cut surfaces 6 are determined by the height and intervals of blades and the number of revolution, etc., of the end mill 5. Accordingly, oxide films formed through a heating process are removed by cutting the surfaces of the spraying metallic electrodes 2, and low heat capacity sections are shaped by forming continuous irregular sections in the direction of the thickness of the element to the surfaces, and the surface tension of solder is utilized, thus improving solderability at the time of mounting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62235209A JPH0770425B2 (en) | 1987-09-18 | 1987-09-18 | Capacitor manufacturing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62235209A JPH0770425B2 (en) | 1987-09-18 | 1987-09-18 | Capacitor manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6477916A true JPS6477916A (en) | 1989-03-23 |
JPH0770425B2 JPH0770425B2 (en) | 1995-07-31 |
Family
ID=16982695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62235209A Expired - Lifetime JPH0770425B2 (en) | 1987-09-18 | 1987-09-18 | Capacitor manufacturing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0770425B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0888144A (en) * | 1994-09-14 | 1996-04-02 | Nitsuko Corp | Chip-shaped film capacitor |
JP2002252124A (en) * | 2001-02-22 | 2002-09-06 | Matsushita Electric Ind Co Ltd | Chip-type electronic component and its manufacturing method |
JP2009503911A (en) * | 2005-08-05 | 2009-01-29 | エスビー エレクトロニクス,インコーポレイテッド | Capacitor and method resistant to heat-induced damage |
JP2011204705A (en) * | 2010-03-24 | 2011-10-13 | Murata Mfg Co Ltd | Laminated ceramic electronic component and method of manufacturing the same |
CN102592826A (en) * | 2011-01-05 | 2012-07-18 | 株式会社村田制作所 | Laminate type electronic component and manufacturing method therefor |
WO2021256410A1 (en) * | 2020-06-16 | 2021-12-23 | 株式会社村田製作所 | Electronic component and method for manufacturing electronic component |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101422938B1 (en) * | 2012-12-04 | 2014-07-23 | 삼성전기주식회사 | Embedded multilayer capacitor and method of manufacturing thereof, print circuit board having embedded multilayer capacitor |
KR101452079B1 (en) * | 2012-12-28 | 2014-10-16 | 삼성전기주식회사 | Embedded multilayer capacitor and print circuit board having embedded multilayer capacitor |
KR101462767B1 (en) * | 2013-03-14 | 2014-11-20 | 삼성전기주식회사 | Embedded multilayer capacitor and print circuit board having embedded multilayer capacitor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57148838U (en) * | 1981-03-12 | 1982-09-18 |
-
1987
- 1987-09-18 JP JP62235209A patent/JPH0770425B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57148838U (en) * | 1981-03-12 | 1982-09-18 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0888144A (en) * | 1994-09-14 | 1996-04-02 | Nitsuko Corp | Chip-shaped film capacitor |
JP2002252124A (en) * | 2001-02-22 | 2002-09-06 | Matsushita Electric Ind Co Ltd | Chip-type electronic component and its manufacturing method |
JP2009503911A (en) * | 2005-08-05 | 2009-01-29 | エスビー エレクトロニクス,インコーポレイテッド | Capacitor and method resistant to heat-induced damage |
JP2011204705A (en) * | 2010-03-24 | 2011-10-13 | Murata Mfg Co Ltd | Laminated ceramic electronic component and method of manufacturing the same |
CN102592826A (en) * | 2011-01-05 | 2012-07-18 | 株式会社村田制作所 | Laminate type electronic component and manufacturing method therefor |
WO2021256410A1 (en) * | 2020-06-16 | 2021-12-23 | 株式会社村田製作所 | Electronic component and method for manufacturing electronic component |
Also Published As
Publication number | Publication date |
---|---|
JPH0770425B2 (en) | 1995-07-31 |
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