JPS647532A - Probe for lsi measuring device - Google Patents

Probe for lsi measuring device

Info

Publication number
JPS647532A
JPS647532A JP16373287A JP16373287A JPS647532A JP S647532 A JPS647532 A JP S647532A JP 16373287 A JP16373287 A JP 16373287A JP 16373287 A JP16373287 A JP 16373287A JP S647532 A JPS647532 A JP S647532A
Authority
JP
Japan
Prior art keywords
probe card
probe
measuring device
contact
semiconductor circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16373287A
Other languages
Japanese (ja)
Inventor
Takeshi Kobayashi
Masaru Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP16373287A priority Critical patent/JPS647532A/en
Publication of JPS647532A publication Critical patent/JPS647532A/en
Pending legal-status Critical Current

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  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE:To enable exact measuring data on measured LSI chip to be corrected by providing a probe card with a semiconductor circuit. CONSTITUTION:A probe card 2 is provided with a semiconductor circuit 2 formed as a part of measuring circuit by diffusion process on the surface 2a of silicon substrate, multiple probes 2c in contact with LSI chip to be measured and multiple contacts 2d in contact with outer terminal while 2b, 2c and 2d are connected by wiring 2e. An upper case 3 is composed of a recession 3a to be engaged with the probe card 2 on one side, wiring terminals 3b in contact with respective contacts 2d to be connected to the main body of measuring device on the other side and multiple holes 3c to fix the probe. A lower case 4 with a hole 4d corresponding to the holes 3c of the upper case 3 is fixed to the rear side of probe card 2 to be protected. By such procedures, a semiconductor circuit to correct any trouble due to wiring from the main body of measuring device can be provided on the probe card.
JP16373287A 1987-06-29 1987-06-29 Probe for lsi measuring device Pending JPS647532A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16373287A JPS647532A (en) 1987-06-29 1987-06-29 Probe for lsi measuring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16373287A JPS647532A (en) 1987-06-29 1987-06-29 Probe for lsi measuring device

Publications (1)

Publication Number Publication Date
JPS647532A true JPS647532A (en) 1989-01-11

Family

ID=15779615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16373287A Pending JPS647532A (en) 1987-06-29 1987-06-29 Probe for lsi measuring device

Country Status (1)

Country Link
JP (1) JPS647532A (en)

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