JPS64749A - Jig for sealing package and sealing method - Google Patents
Jig for sealing package and sealing methodInfo
- Publication number
- JPS64749A JPS64749A JP15578187A JP15578187A JPS64749A JP S64749 A JPS64749 A JP S64749A JP 15578187 A JP15578187 A JP 15578187A JP 15578187 A JP15578187 A JP 15578187A JP S64749 A JPS64749 A JP S64749A
- Authority
- JP
- Japan
- Prior art keywords
- end sections
- sealing
- guide legs
- jig
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To obtain a jig for sealing a package capable of accurately positioning a sealing material positively by fitting a plurality of guide legs detachably disposed in upright to the periphery of a cavity in a package base on which a semiconductor element is mounted.
CONSTITUTION: A jig 10 for sealing has obliquely inclined four guide legs 11, and the upper end sections of the guide legs 11 are connected mutually by unifying the upper end sections of the guide legs with a quadrangular pyramidal block body 12. The lower end sections 11a of the guide legs 11 are molded to a tapered shape, and abutted to the four corner sections of a package base 1. Since the mutual intervals L1 and L2 of the lower end sections 11a of each guide leg 11 are set so as to be made larger than the intervals of corresponding upper end sections at that time, respective guide leg 11 is inclined at fixed angles. The mutual intervals L1, L2 of the lower end sections 11a of the guide legs 11 are set so as to be made smaller than the length and breadth of a cavity 2 in the package base 1, thus accurately positioning a sealing material positively.
COPYRIGHT: (C)1989,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-155781A JPH01749A (en) | 1987-06-23 | Package sealing jig and sealing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-155781A JPH01749A (en) | 1987-06-23 | Package sealing jig and sealing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS64749A true JPS64749A (en) | 1989-01-05 |
| JPH01749A JPH01749A (en) | 1989-01-05 |
Family
ID=
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100714656B1 (en) * | 2001-04-03 | 2007-05-07 | 세이코 엡슨 가부시키가이샤 | Ink cartridge, ink-jet recording device, and set of ink cartridges |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100714656B1 (en) * | 2001-04-03 | 2007-05-07 | 세이코 엡슨 가부시키가이샤 | Ink cartridge, ink-jet recording device, and set of ink cartridges |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| NO873670D0 (en) | INTEGRATED CIRCUIT FOR USE IN CONNECTION WITH PRODUCTION PROCESSES. | |
| NO881329D0 (en) | PROCEDURE FOR MANUFACTURING A FORMED CELLULAR PLASTIC MATERIALS USED IN METAL CASTING. | |
| DE3876419D1 (en) | DEVICE FOR PRODUCING CONCRETE PARTS. | |
| DE69122598T2 (en) | Integrated structure of a bipolar power transistor and a re-voltage bipolar transistor in an emitter circuit or half-bridge arrangement and the related manufacturing method | |
| JPS64749A (en) | Jig for sealing package and sealing method | |
| DE69027797D1 (en) | MESA production in semiconductor structures | |
| IT8420429A0 (en) | PROCEDURE AND DEVICE FOR PRODUCING COLUMNS, SUBSTANTIALLY CYLINDRICAL AND COLUMNS PRODUCED ACCORDING TO THE SAID PROCEDURE. | |
| DE3064917D1 (en) | Process for producing superficial piling-up defects in semiconductor wafers | |
| DE69031610T2 (en) | Monolithically integrated semiconductor device comprising a control circuit and a power section with vertical current flow, and method for the production thereof | |
| JPS51147255A (en) | Semiconductor device | |
| JPS648150A (en) | Conveying device | |
| ATA127087A (en) | DEVICE FOR THE HORIZONTAL CHANGING AND CLAMPING OF MOLDING TOOLS CONSTRUCTING TWO MOLDED PARTS | |
| JPS5347164A (en) | Washing machine | |
| JPS57116832A (en) | Method and apparatus for holding anchor bolt | |
| JPS5427772A (en) | Production of semiconductor devices | |
| JPS53104171A (en) | Mold for semiconductor device | |
| JPS52102682A (en) | Joint structure between wafer holding jig and jig-operating rod in hea t treatment apparatus | |
| JPS51112279A (en) | Semiconductor device | |
| JPS54111779A (en) | Fixing method of wafer | |
| JPS54131324A (en) | Combination of lateral frame with vertical frame of fence | |
| JPS5335908A (en) | Dc machinery | |
| JPS51123557A (en) | Impurity concentration measurement mask of semiconductor base | |
| JPS5321299A (en) | Preparation of water-soluble epoxy resin | |
| JPS55107935A (en) | Method and jig for manufacturing test piece | |
| JPS556840A (en) | Optical semiconductor device and resin sealing method of the same |