JPS6474255A - Thermosetting phenolic resin composition - Google Patents

Thermosetting phenolic resin composition

Info

Publication number
JPS6474255A
JPS6474255A JP23042487A JP23042487A JPS6474255A JP S6474255 A JPS6474255 A JP S6474255A JP 23042487 A JP23042487 A JP 23042487A JP 23042487 A JP23042487 A JP 23042487A JP S6474255 A JPS6474255 A JP S6474255A
Authority
JP
Japan
Prior art keywords
phenolic resin
thermosetting phenolic
hcho
hcl
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23042487A
Other languages
Japanese (ja)
Inventor
Yoshiaki Kubota
Shiro Tsubouchi
Yoshiaki Hirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanebo Ltd
Original Assignee
Kanebo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanebo Ltd filed Critical Kanebo Ltd
Priority to JP23042487A priority Critical patent/JPS6474255A/en
Publication of JPS6474255A publication Critical patent/JPS6474255A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)

Abstract

PURPOSE:To obtain the title low-smoking composition excellent in storage stability and adhesiveness, by mixing a specified thermosetting phenolic resin with an epoxy resin and an organic solvent. CONSTITUTION:A phenol is brought into contact with an HCl-HCHO bath having an HCl concentration of 5-28wt.%, an HCHO concentration of 8-25wt.% and a total concentration of HCl and HCHO of 15-40wt.% and kept at a bath ratio >=8 according to the equation to obtain a thermosetting phenolic resin (A) of a weight-average MW (in terms of PS) >=1,000 by GPC and a free phenol content (as measured by liquid chromatography) <=500ppm. Component A is mixed with an epoxy resin (B) and an organic solvent (C) (e.g., methanol) at an A to B weight ratio of 50/50-95/5 and an (A+B) to C weight ratio of 5/95-80/20.
JP23042487A 1987-09-14 1987-09-14 Thermosetting phenolic resin composition Pending JPS6474255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23042487A JPS6474255A (en) 1987-09-14 1987-09-14 Thermosetting phenolic resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23042487A JPS6474255A (en) 1987-09-14 1987-09-14 Thermosetting phenolic resin composition

Publications (1)

Publication Number Publication Date
JPS6474255A true JPS6474255A (en) 1989-03-20

Family

ID=16907676

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23042487A Pending JPS6474255A (en) 1987-09-14 1987-09-14 Thermosetting phenolic resin composition

Country Status (1)

Country Link
JP (1) JPS6474255A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008047700A1 (en) * 2006-10-20 2008-04-24 Air Water Inc. Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008047700A1 (en) * 2006-10-20 2008-04-24 Air Water Inc. Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
US8158095B2 (en) 2006-10-20 2012-04-17 Air Water Inc. Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
US8293860B2 (en) 2006-10-20 2012-10-23 Air Water Inc. Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
US8411415B2 (en) 2006-10-20 2013-04-02 Air Water Inc. Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
US8409756B2 (en) 2006-10-20 2013-04-02 Air Water Inc. Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
US8658120B2 (en) 2006-10-20 2014-02-25 Air Water Inc. Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor

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