JPS6473730A - Taping of semiconductor device - Google Patents

Taping of semiconductor device

Info

Publication number
JPS6473730A
JPS6473730A JP23181387A JP23181387A JPS6473730A JP S6473730 A JPS6473730 A JP S6473730A JP 23181387 A JP23181387 A JP 23181387A JP 23181387 A JP23181387 A JP 23181387A JP S6473730 A JPS6473730 A JP S6473730A
Authority
JP
Japan
Prior art keywords
frames
honing
masks
packages
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23181387A
Other languages
Japanese (ja)
Inventor
Osamu Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP23181387A priority Critical patent/JPS6473730A/en
Publication of JPS6473730A publication Critical patent/JPS6473730A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To increase the adhesive force of a tape carrier and to avoid the peeling of semiconductor devices by a method wherein, when the semiconductor devices are adhered on the tape carrier and are delivered, the region of part of one surface of the package of each semiconductor device is ready-formed into a rough surface simultaneously with the honing of lead frames utilizing a process for honing the lead frames after a resin molding. CONSTITUTION:ICs are sealed with a resin, whose Si is modified with an epoxy resin and whose stress is reduced, are formed as packages 1 and lead frames 2 being mounted to these are arranged continuously and are arranged in a circular-arc shape between holding tools 7 and 8. Then, both sides of the each package are each covered with masks 5 and 6, a honing fluid (a) consisting of abrasive grains and water is sprayed on the exposed frames 2 from the sides of the masks 6 and the frames 2 are honed. At this time, apertures 9 are each ready-opened in the central parts of the masks 6 and parts, which correspond to an adhesive tape, of the packages 1 are each formed into a rough surface 10 utilizing the apertures 9 simultaneously with the honing of the frames 2. According to such a way, the adhesive tape for transfer can be adhered strongly on the packages 1 using the low-stress resin as well.
JP23181387A 1987-09-16 1987-09-16 Taping of semiconductor device Pending JPS6473730A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23181387A JPS6473730A (en) 1987-09-16 1987-09-16 Taping of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23181387A JPS6473730A (en) 1987-09-16 1987-09-16 Taping of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6473730A true JPS6473730A (en) 1989-03-20

Family

ID=16929424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23181387A Pending JPS6473730A (en) 1987-09-16 1987-09-16 Taping of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6473730A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316288B1 (en) * 1997-03-21 2001-11-13 Seiko Epson Corporation Semiconductor device and methods of manufacturing film camera tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316288B1 (en) * 1997-03-21 2001-11-13 Seiko Epson Corporation Semiconductor device and methods of manufacturing film camera tape
US6627994B2 (en) 1997-03-21 2003-09-30 Seiko Epson Corporation Semiconductor device and film carrier tape

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