JPS6471664A - Polishing method for chip and jig used for said polishing and supplying machine - Google Patents
Polishing method for chip and jig used for said polishing and supplying machineInfo
- Publication number
- JPS6471664A JPS6471664A JP62224956A JP22495687A JPS6471664A JP S6471664 A JPS6471664 A JP S6471664A JP 62224956 A JP62224956 A JP 62224956A JP 22495687 A JP22495687 A JP 22495687A JP S6471664 A JPS6471664 A JP S6471664A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- disk
- transcribing
- jig
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Magnetic Heads (AREA)
Abstract
PURPOSE:To efficiently polish a chip by separating many sheets of chips sheet by sheet by a supplying machine, taking out the chip in a straightening condition to many chip holding parts provided in the circumferential direction of a transcribing jig, under this condition, pressing a disk to a surface of the transcribing jig, transcribing these chips to the disk and holding the chip to be adhesively attached to the disk. CONSTITUTION:Separating chips 50 sheet by sheet on an index table 12 of a supplying machine, the chip 50 is taken out in a straightening condition onto many shallow chip holding parts 17 in the circumferential direction in a transcribing jig 16 by a head 15 of a robot-type take out machine 14. Next pressing a disk, forming an adhesive layer in the surface, to a surface of the transcribing jig 16, the chip 50, straightened on this jig 16, is transcribed (move) being left as placed in the straightened condition on a surface of the disk 18 applying an adhesive agent. Thus setting the disk, transcribing the chip 50, to a pressurizing machine, the chip 50 is adhesively attached firmly to the disk by applying heat and pressing force. Thereafter mounting the disk to a polishing machine, the chip 50 efficiently performs polishing and lapping in good yield rate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62224956A JPS6471664A (en) | 1987-09-08 | 1987-09-08 | Polishing method for chip and jig used for said polishing and supplying machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62224956A JPS6471664A (en) | 1987-09-08 | 1987-09-08 | Polishing method for chip and jig used for said polishing and supplying machine |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4073884A Division JPH0688202B2 (en) | 1992-03-30 | 1992-03-30 | Jig alignment jig |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6471664A true JPS6471664A (en) | 1989-03-16 |
JPH0551429B2 JPH0551429B2 (en) | 1993-08-02 |
Family
ID=16821826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62224956A Granted JPS6471664A (en) | 1987-09-08 | 1987-09-08 | Polishing method for chip and jig used for said polishing and supplying machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6471664A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52147417A (en) * | 1976-06-02 | 1977-12-07 | Shigeo Makita | Jig for magnetic head grinding machine |
JPS60118467A (en) * | 1983-11-30 | 1985-06-25 | Fujimi Kenmazai Kogyo Kk | Semi-conductor wafer attaching method |
JPS61151859U (en) * | 1985-03-11 | 1986-09-19 |
-
1987
- 1987-09-08 JP JP62224956A patent/JPS6471664A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52147417A (en) * | 1976-06-02 | 1977-12-07 | Shigeo Makita | Jig for magnetic head grinding machine |
JPS60118467A (en) * | 1983-11-30 | 1985-06-25 | Fujimi Kenmazai Kogyo Kk | Semi-conductor wafer attaching method |
JPS61151859U (en) * | 1985-03-11 | 1986-09-19 |
Also Published As
Publication number | Publication date |
---|---|
JPH0551429B2 (en) | 1993-08-02 |
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