JPS6471200A - Cooling device of integrated circuit - Google Patents

Abstract

PURPOSE:To cool an integrated circuit element on a circuit substrate by using a cooling plate and increase cooling capacity surely by providing, at a heat sink, a plurality of recessed parts which opens at the circuit substrate side and providing heat transfer block, which fit to the recessed parts at the circuit substrate. CONSTITUTION:A cooling plate 11 having passages 12 of a cooling medium consists of metal materials having high thermal conductivity and is mounted at the upper side of each small circuit substrate 5. A heat sink 13 consisting of high thermal conductivity metal is interposed between the cooling plate 11 and substrates 5. A plurality of recessed parts 14 which open at the substrate side 5 are prepared at the heat sink 13. A plurality of thermal conductive blocks 15 which fit to respective recessed parts 14 are mounted at the upper end parts of the substrates 5. Then, the heat sink 13 is cooled by the cooling plate 11 and integrated circuit elements 6 located on the substrates 5 are cooled through the blocks 15. In this way, cooling capacity is improved surely.