WO1995017765A3 - Liquid cooled heat sink for cooling electronic components - Google Patents

Liquid cooled heat sink for cooling electronic components Download PDF

Info

Publication number
WO1995017765A3
WO1995017765A3 PCT/US1994/014415 US9414415W WO9517765A3 WO 1995017765 A3 WO1995017765 A3 WO 1995017765A3 US 9414415 W US9414415 W US 9414415W WO 9517765 A3 WO9517765 A3 WO 9517765A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
liquid cooled
cooled heat
fluid
electronic components
Prior art date
Application number
PCT/US1994/014415
Other languages
French (fr)
Other versions
WO1995017765A2 (en
Inventor
Ronald Lavochkin
Original Assignee
Aavid Eng Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Eng Inc filed Critical Aavid Eng Inc
Publication of WO1995017765A2 publication Critical patent/WO1995017765A2/en
Publication of WO1995017765A3 publication Critical patent/WO1995017765A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/22—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • F28F2275/025—Fastening; Joining by using bonding materials; by embedding elements in particular materials by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A liquid cooled heat sink (100) used in cooling electronic components (112) such as semiconductor devices and circuit modules. The heat sink (100) includes channels (104, 106) which contain fluid conduits (114, 116) that have been pressed into the channels (104, 106). The fluid conduits (114, 116) have a planar surface (11) which is substantially coplanar with the surface (118) of the heat sink (100) that contacts the electronic component (112). This structure provides improved heat removal by minimizing the distance for heat conduction between the electronic component (112) and the fluid since the electronic component (112) is effectively resting on the fluid conduit (114, 116). Improved localized heat transfer within the fluid conduits (246, 262) is accomplished by providing the channels with selective contours (244, 266) which are incorporated into the surface of the fluid conduit (246, 262) as it is pressed into place. Methods of manufacturing the liquid cooled heat sink are also disclosed.
PCT/US1994/014415 1993-12-15 1994-12-15 Liquid cooled heat sink for cooling electronic components WO1995017765A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16687193A 1993-12-15 1993-12-15
US08/166,871 1993-12-15

Publications (2)

Publication Number Publication Date
WO1995017765A2 WO1995017765A2 (en) 1995-06-29
WO1995017765A3 true WO1995017765A3 (en) 1995-08-03

Family

ID=22605022

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1994/014415 WO1995017765A2 (en) 1993-12-15 1994-12-15 Liquid cooled heat sink for cooling electronic components

Country Status (1)

Country Link
WO (1) WO1995017765A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
DE19606972A1 (en) * 1996-02-24 1997-08-28 Daimler Benz Ag Heatsink for cooling power components
GB2313960A (en) * 1996-06-08 1997-12-10 Marconi Gec Ltd Heat sink including a cooling pipe having a planar section
DE19646195A1 (en) * 1996-11-08 1998-05-14 Austerlitz Electronic Gmbh Modular, extruded, liquid-cooling body with adjustable characteristic
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
FR2777986B1 (en) 1998-04-23 2000-07-28 Ferraz HEAT EXCHANGER, PARTICULARLY FOR COOLING AN ELECTRONIC POWER COMPONENT, AND MANUFACTURING METHOD THEREOF
FI113447B (en) * 1998-10-27 2004-04-15 Abb Oy Apparatus and method for cooling electronics component or module by liquid
SE533224C2 (en) 2008-09-16 2010-07-27 Sapa Profiler Ab Fridge for circuit board components
KR101854966B1 (en) * 2008-11-04 2018-05-04 다이킨 고교 가부시키가이샤 Cooling member, and method and device for manufacturing same
TWI589835B (en) * 2009-12-24 2017-07-01 Shi-Ming Chen Flattened heat pipe manufacturing method and manufacturing equipment
CN109845052B (en) * 2016-08-31 2022-01-11 恩耐公司 Laser cooling system

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2522365A (en) * 1949-01-07 1950-09-12 Edward S Greene Extrusion machine cylinder
GB758524A (en) * 1952-08-27 1956-10-03 Siemens Ag Improvements in or relating to dry-rectifiers with liquid cooling arrangements
GB826625A (en) * 1956-12-04 1960-01-13 Porter & Co Salford Ltd T Improvements relating to heat exchange apparatus
US4185369A (en) * 1978-03-22 1980-01-29 General Electric Company Method of manufacture of cooled turbine or compressor buckets
JPS56137035A (en) * 1980-03-28 1981-10-26 Nippon Alum Mfg Co Ltd:The Heat exchanger unit and manufacture thereof
US4378626A (en) * 1981-06-10 1983-04-05 United Technologies Corporation Cooled mirror construction by chemical vapor deposition
JPS63262861A (en) * 1987-04-21 1988-10-31 Toshiba Corp Cooling body for semiconductor element
CH677293A5 (en) * 1989-01-16 1991-04-30 Asea Brown Boveri Power semiconductor heat sink - has meandering flow path containing insulating hose filled with cooling fluid
JPH03142026A (en) * 1989-10-27 1991-06-17 Nippon Alum Mfg Co Ltd Pipe on sheet type heat exchanger and manufacture thereof
US5154792A (en) * 1990-12-28 1992-10-13 Basf Corporation Bonding method employing urethane adhesives having good heat transfer properties

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2522365A (en) * 1949-01-07 1950-09-12 Edward S Greene Extrusion machine cylinder
GB758524A (en) * 1952-08-27 1956-10-03 Siemens Ag Improvements in or relating to dry-rectifiers with liquid cooling arrangements
GB826625A (en) * 1956-12-04 1960-01-13 Porter & Co Salford Ltd T Improvements relating to heat exchange apparatus
US4185369A (en) * 1978-03-22 1980-01-29 General Electric Company Method of manufacture of cooled turbine or compressor buckets
JPS56137035A (en) * 1980-03-28 1981-10-26 Nippon Alum Mfg Co Ltd:The Heat exchanger unit and manufacture thereof
US4378626A (en) * 1981-06-10 1983-04-05 United Technologies Corporation Cooled mirror construction by chemical vapor deposition
JPS63262861A (en) * 1987-04-21 1988-10-31 Toshiba Corp Cooling body for semiconductor element
CH677293A5 (en) * 1989-01-16 1991-04-30 Asea Brown Boveri Power semiconductor heat sink - has meandering flow path containing insulating hose filled with cooling fluid
JPH03142026A (en) * 1989-10-27 1991-06-17 Nippon Alum Mfg Co Ltd Pipe on sheet type heat exchanger and manufacture thereof
US5154792A (en) * 1990-12-28 1992-10-13 Basf Corporation Bonding method employing urethane adhesives having good heat transfer properties

Also Published As

Publication number Publication date
WO1995017765A2 (en) 1995-06-29

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