JPS6467304A - Manufacture and device of resin tablets for encapsulating semiconductor - Google Patents

Manufacture and device of resin tablets for encapsulating semiconductor

Info

Publication number
JPS6467304A
JPS6467304A JP22581887A JP22581887A JPS6467304A JP S6467304 A JPS6467304 A JP S6467304A JP 22581887 A JP22581887 A JP 22581887A JP 22581887 A JP22581887 A JP 22581887A JP S6467304 A JPS6467304 A JP S6467304A
Authority
JP
Japan
Prior art keywords
joint
punches
rotated
resin powder
lower punch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22581887A
Other languages
Japanese (ja)
Other versions
JPH0729299B2 (en
Inventor
Noboru Aoki
Tetsuo Yoshida
Shinichi Shimizu
Yoshio Fujimura
Yasuhiko Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NICHIEI SEIKO KK
Shin Etsu Chemical Co Ltd
Original Assignee
NICHIEI SEIKO KK
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NICHIEI SEIKO KK, Shin Etsu Chemical Co Ltd filed Critical NICHIEI SEIKO KK
Priority to JP22581887A priority Critical patent/JPH0729299B2/en
Publication of JPS6467304A publication Critical patent/JPS6467304A/en
Publication of JPH0729299B2 publication Critical patent/JPH0729299B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/06—Making preforms by moulding the material
    • B29B11/12—Compression moulding

Abstract

PURPOSE:To manufacture tablets of high gravity, small in shape and weight and of stabilized quality with good workability by rotating both punches respectively at the time of giving maximum pressure to resin powder by means of the both punches of a tablet manufacturing device. CONSTITUTION:Both shafts 18a and 18b are rotated respectively by 1/64-1/2 at the time of compressing resin powder 2 with the maximum pressure by means of upper and lower punches 4 and 3 in a cavity 7, while an upper punch 3 is rotated through a joint 19a, a joint 17 and a key 20a, a shaft 16 and a lower punch holder 14, and a lower punch 4 is rotated through a joint 19b, a small shaft 22, a joint 21 and a key 20b and a lower punch holder 15 in the opposite direction respectively by 1/64-1/2 integratedly with the rotation of both shafts 18a and 18b. By said arrangement, resin powder is prevented from adhering to the pressing end surfaces of the both punches 3 and 4, and even small resin tablets can be manufactured securely without defects such as breakage and the like.
JP22581887A 1987-09-09 1987-09-09 Method and apparatus for manufacturing resin tablet for semiconductor encapsulation Expired - Fee Related JPH0729299B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22581887A JPH0729299B2 (en) 1987-09-09 1987-09-09 Method and apparatus for manufacturing resin tablet for semiconductor encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22581887A JPH0729299B2 (en) 1987-09-09 1987-09-09 Method and apparatus for manufacturing resin tablet for semiconductor encapsulation

Publications (2)

Publication Number Publication Date
JPS6467304A true JPS6467304A (en) 1989-03-14
JPH0729299B2 JPH0729299B2 (en) 1995-04-05

Family

ID=16835280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22581887A Expired - Fee Related JPH0729299B2 (en) 1987-09-09 1987-09-09 Method and apparatus for manufacturing resin tablet for semiconductor encapsulation

Country Status (1)

Country Link
JP (1) JPH0729299B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259864A (en) * 1985-09-06 1987-03-16 ゼロツクス　コ−ポレ−シヨン Device and method for measuring speed of belt
JP2006339226A (en) * 2005-05-31 2006-12-14 Nitto Denko Corp Semiconductor sealing tablet, its manufacturing method, and semiconductor device using the same
JP2008112977A (en) * 2006-10-06 2008-05-15 Hitachi Chem Co Ltd Tablet molding die, tablet, manufacturing method for optical semiconductor element-mounting substrate and optical semiconductor device
JP2013206968A (en) * 2012-03-27 2013-10-07 Kaneka Corp Tablet molding die for optical semiconductor package, and manufacturing method of tablet using the die

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6259864A (en) * 1985-09-06 1987-03-16 ゼロツクス　コ−ポレ−シヨン Device and method for measuring speed of belt
JP2006339226A (en) * 2005-05-31 2006-12-14 Nitto Denko Corp Semiconductor sealing tablet, its manufacturing method, and semiconductor device using the same
JP2008112977A (en) * 2006-10-06 2008-05-15 Hitachi Chem Co Ltd Tablet molding die, tablet, manufacturing method for optical semiconductor element-mounting substrate and optical semiconductor device
JP2013206968A (en) * 2012-03-27 2013-10-07 Kaneka Corp Tablet molding die for optical semiconductor package, and manufacturing method of tablet using the die

Also Published As

Publication number Publication date
JPH0729299B2 (en) 1995-04-05

Similar Documents

Publication Publication Date Title
JPS6467304A (en) Manufacture and device of resin tablets for encapsulating semiconductor
ES486858A1 (en) Method and device for manufacturing a cooking-pot.
ES8700557A1 (en) Process for the manufacture of lollipops, a device to be used for this purpose and the product obtained from this process.
JPS6489346A (en) Semiconductor substrate
JPS57202930A (en) Chamfering device for pipe and part
AU594574B2 (en) A process for the production of alloy powders for dental amalgams
CN217885817U (en) Extrusion formula nut cracker
CN207840776U (en) A kind of upper ring body batch cutting groove jig of speed reducer lock sleeve
CN214178852U (en) Rotary device for processing and forming different moon cakes
JPS5680400A (en) Powder molding method
JPH037107Y2 (en)
CN205867123U (en) High -efficient tablet manufacturing installation
JPS61237433A (en) Resin tablet for semiconductor device
Brantov et al. Composite silicon-carbon materials for structural applications(Kompozitsionnye kremnii-uglerodnye materialy konstruktsionnogo naznacheniia)
JPS5925642B2 (en) Flexible graphite particle forming equipment
JPS5270259A (en) Sintered bearing in aluminium and its manufacturing process
Schultz Method of Manufacturing a Metallic Article From an Amorphous Alloy
JPS5244162A (en) Method of processing semiconductor wafer
SU1507292A1 (en) Apparatus for making spherical cores of sweets
Adolf Advances in Compacting Press Technology
GB1179974A (en) Apparatus for the Production of Pressings.
JPS52111012A (en) Screw compressor
Moszumanski et al. Pulsating-Load Presses for Powders
JPS57131109A (en) Working device for quartz oscillator and the like
JPS5550405A (en) Production of deformed sintered parts

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees