JPS6466091A - Laser beam machine - Google Patents

Abstract

PURPOSE:To reduce the size of a two-dimensional scanning means by calculating a laser beam irradiation position to minimize the number of irradiation pulses of half one side from a shape of a laser convergent beam, an irradiation pitch and dimensions of material to be worked to increase the number of wafers which can be processed in the service life of the laser beam. CONSTITUTION:An excimer laser output beam from a laser beam oscillator 11 is led to a condenser lens 13 by a mirror 14 and condensed on a wafer 15 held on an XYtheta stage 12 as a linear machining spot. A control part 16 constituted of a computer calculates the laser beam irradiation position from bits of information such as an inputted machining pitch and wafer size and controls the XYtheta stage 12 and issues a pulse output command with respect to the laser beam oscillator 11 at a point of time to pass the position indicated on a table. When the laser beam irradiation on half one side of the wafer 15 is finished, a theta stage part of the XYtheta stage is rotated by 180 deg. and the laser beam is projected on the remaining half one side according to the irradiation position table. Accordingly, the scanning range of in the (y) axial direction is finished with about half the wafer size and the size of the scanning means can be reduced.