JPS6465882A - Light emitting equipment - Google Patents

Light emitting equipment

Info

Publication number
JPS6465882A
JPS6465882A JP62222720A JP22272087A JPS6465882A JP S6465882 A JPS6465882 A JP S6465882A JP 62222720 A JP62222720 A JP 62222720A JP 22272087 A JP22272087 A JP 22272087A JP S6465882 A JPS6465882 A JP S6465882A
Authority
JP
Japan
Prior art keywords
light emitting
lead
edge
emitting device
bowl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62222720A
Other languages
Japanese (ja)
Inventor
Masaru Jinno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP62222720A priority Critical patent/JPS6465882A/en
Publication of JPS6465882A publication Critical patent/JPS6465882A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To acquire high quality light emitting equipment by partially applying a metal foil which is highly light-reflective and by eliminating the necessity of plating when brightening the inner surface of a bowl-shaped recess formed at a lead edge. CONSTITUTION:Metal foil 3 having a high light-reflectiveness and good bonding properties is applied on the inner surface of a bowl-shaped recess 1b which is provided at the edge of a lead 1 and an edge 2a of a lead 2. Then a light emitting device 4 is die-bonded to the inside of the bowl-shaped recess 1b by conductive paste. An electrode provided on the upper surface of the light emitting device 4 is electrically connected to the lead 1 through the metal foil 3. Moreover, wire bonding is conducted between the electrode provided on the upper surface of the light emitting device 4 and the edge 2a of the lead 2 in reducing gas by a conducting wire 5 such as Cu. The edges of leads 1, 2 and the area around the light emitting device are molded by a translucent resin 9 such as epoxy resin to detach from hoop members as well as to cut off the parts connected between leads, and thus separate display is obtained.
JP62222720A 1987-09-04 1987-09-04 Light emitting equipment Pending JPS6465882A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62222720A JPS6465882A (en) 1987-09-04 1987-09-04 Light emitting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62222720A JPS6465882A (en) 1987-09-04 1987-09-04 Light emitting equipment

Publications (1)

Publication Number Publication Date
JPS6465882A true JPS6465882A (en) 1989-03-13

Family

ID=16786851

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62222720A Pending JPS6465882A (en) 1987-09-04 1987-09-04 Light emitting equipment

Country Status (1)

Country Link
JP (1) JPS6465882A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856483A (en) * 1981-09-30 1983-04-04 Toshiba Corp Photosemiconductor device
JPS60137076A (en) * 1983-12-26 1985-07-20 Toshiba Corp Optical semiconductor device
JPS61150284A (en) * 1984-12-24 1986-07-08 Toshiba Corp Photo semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856483A (en) * 1981-09-30 1983-04-04 Toshiba Corp Photosemiconductor device
JPS60137076A (en) * 1983-12-26 1985-07-20 Toshiba Corp Optical semiconductor device
JPS61150284A (en) * 1984-12-24 1986-07-08 Toshiba Corp Photo semiconductor device

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