JPS61150284A - Photo semiconductor device - Google Patents

Abstract

PURPOSE:To enable sufficient effect of reflection without the use of expensive Ag-soldered layers by a method wherein the reflection surface of a tray reflector on which a light emitting semiconductor element is mounted is made of pure aluminum, aluminum alloy, or aluminum plating. CONSTITUTION:A lead frame 22 provided with the tray reflector 21 on which a light emitting semiconductor element is mounted is made of aluminum. The lead frame has a Cu-plated layer 23 formed over the surface of an aluminum core by excluding the reflector 21. Since no use of expensive Ag is necessary, the effect of cost reduction is very large. Besides, the process of Ag plating and the like are unnecessitated; therefore, the manufacturing process can be simplified. Aluminum alloy can be used for the lead frame instead of a pure aluminum core material; otherwise, the material having iron in the lead frame and plated with aluminum or the like in the reflection surface of said reflector can be used.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an optical semiconductor device that includes a concave reflecting plate and emits light in the blue to infrared range, for example.

[Technical background of the invention and its problems]

Conventional light-emitting semiconductor devices include, for example, LEDs using GaP.
(Light-emitting diodes) are known in which not only the light-emitting surface but also the entire device emits light. In an optical semiconductor device incorporating this type of light emitting semiconductor element, a reflector is generally used to increase its brightness. Further, the reflective plate used has a silver plating layer formed thereon.゛Third
The figure shows the structure of a conventional LED rung equipped with a reflector, Figure 4 is a cross-sectional view of the reflector part included in this conventional LED rung, and Figure 5 is a lead used in manufacturing the above LED rung. A perspective view showing the shape of the frame.
In the cross-sectional view taken along line A-A in the figure, 1 is a dish-shaped reflector, 2.3
1 is a lead having an iron core material 10, 4 is a "light emitting semiconductor element," 5 is a "ponding" wire, 6 is an epoxy resin, and 7 is a lead having an iron core material 10.
1 is a silver plating layer, 8 is a metal strip of the lead frame, 9 is a bridging strip, and 1 is a copper plating layer.

The conventional optical semiconductor device equipped with a reflector 1 on the above-mentioned bow has a high cost because a monovalent silver plating layer 7 is applied to at least the reflective surface of the reflector 1 to obtain the reflector effect. There was a problem with this.

In addition, lead frames equipped with reflectors that are commonly used in the manufacture of such optical semiconductors have conventionally been formed with a silver plating layer formed over the entire surface, which poses the problem of extremely high costs. By the way, if you apply silver plating only to the surface of the reflector of the lead frame,
It is possible to reduce the amount of silver used, but given the rapidly rising prices of precious metals, this would not fundamentally solve the problem.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and aims to provide an optical semiconductor device that does not use an expensive silver plating layer and has a sufficient reflection effect of a reflector.

[Summary of the invention]

In the present invention, a light emitting semiconductor element that emits light in the blue region to infrared region with a wavelength of 400 nm to 950 nm, for example, is mounted on a dish-shaped reflector, and at least the reflective surface of this reflector is made of aluminum. It is characterized by the fact that it is made of

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a sectional view of a lead frame used in the same embodiment.

A feature of the structure of this embodiment is that, as shown in FIG. 1, a lead frame 22 provided with a dish-shaped reflector plate 2 on which a light emitting semiconductor element is mounted is made of aluminum.

This lead frame has an aluminum core (lead 22
), a copper plating layer 23 is formed on the surface thereof, avoiding the dish-shaped reflecting plate 21. This copper plating layer 23 is provided for soldering in a later process.

In the case shown in FIG. 1, there is no need to use expensive silver at all, so the cost reduction effect is extremely large. Moreover, the reflectance of aluminum is as shown in Figure 2 at wavelength 4.
In the region of 00 to 900 nm, it has the second highest reflectance after silver, so high brightness can be obtained. Also wavelength 2
Since it can be used even in the range of 00 to 400 nm, the range of use is widened. Also, since silver plating process etc. are not required,
The manufacturing process can be simplified.

Note that the present invention is not limited to the above embodiments, and can be applied in various ways. For example, in the above embodiment, a core material of pure aluminum was used for the lead frame, but an aluminum alloy may also be used, or the lead frame may be made of iron, and the reflective surface of the dish-shaped reflector plate may be plated with aluminum. You may also use strained ones.

〔Effect of the invention〕

As explained above, according to the present invention, since aluminum is used for at least the reflection plate portion, it is possible to provide an optical semiconductor device that can reduce costs, has high reflectance, and is simple to manufacture.

[Brief explanation of the drawing]

Fig. 1 is a sectional view of a main part of an embodiment of the present invention, Fig. 2 is a characteristic diagram showing the effects of the embodiment, Fig. 3 is a configuration diagram of an LED lamp equipped with a conventional reflector, and Fig. 4 is this conventional LED
A sectional view of the reflector portion provided on the rung, FIG. 5 is the above-mentioned I.
FIG. 6 is a perspective view of a lead frame used for manufacturing a JD rung, and is a sectional view taken along line A--A in FIG. 5. No. 2: Dish-shaped reflector, No. 22: Aluminum lead. '8 g 8 cj2 Kaboui

Claims (1)

[Claims] 1. An optical semiconductor device, wherein at least a reflective surface of a dish-shaped reflective plate on which a light emitting semiconductor element is mounted is made of pure aluminum, an aluminum alloy, or aluminum plating.