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ISHIWATA KK
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ISHIWATA KK
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Application filed by ISHIWATA KKfiledCriticalISHIWATA KK
Priority to JP22125887ApriorityCriticalpatent/JPS6465293A/en
Publication of JPS6465293ApublicationCriticalpatent/JPS6465293A/en
PURPOSE:To improve finish after plating and to make polishing unnecessary when a thin metallic plate having a watermark is plated, by carrying out plating with Ni for an underlayer and plating with a metal such as Ag, Au or Rh and by specifying the thickness of the plate and that of the resulting plating layer. CONSTITUTION:A thin metallic plate of 0.2-1mm thickness having a watermark is prepd. Both sides of the plate are plated with Ni to form an underlayer and the plated sides are electroplated with a metal such as Ag, Au, Rh or Cr. The thickness of the resulting plating layer is regulated to 5-30mum.
JP22125887A1987-09-041987-09-04Method for plating thin metallic plate
PendingJPS6465293A
(en)