JPS6462468A - Metallic mold for molding metallic plate - Google Patents

Metallic mold for molding metallic plate

Info

Publication number
JPS6462468A
JPS6462468A JP21613287A JP21613287A JPS6462468A JP S6462468 A JPS6462468 A JP S6462468A JP 21613287 A JP21613287 A JP 21613287A JP 21613287 A JP21613287 A JP 21613287A JP S6462468 A JPS6462468 A JP S6462468A
Authority
JP
Japan
Prior art keywords
diamond
metallic mold
metallic
molding
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21613287A
Other languages
Japanese (ja)
Inventor
Tomio Kazahaya
Osamu Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Petrochemical Co Ltd
Original Assignee
Idemitsu Petrochemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Petrochemical Co Ltd filed Critical Idemitsu Petrochemical Co Ltd
Priority to JP21613287A priority Critical patent/JPS6462468A/en
Publication of JPS6462468A publication Critical patent/JPS6462468A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

PURPOSE:To provide a metallic mold for molding a metallic plate which is extremely outstanding in a mold parting property, mechanical strength, durability, etc., by coating a film of diamond and/or diamond-like carbon on at least the molding surface of the metallic mold for molding. CONSTITUTION:The film of the diamond and/or diamond-like carbon is formed via an intermediate layer consisting preferably of a simple substance metal layer, metal layer of alloys, etc., or carbide ceramics layer on at least the molding surface of the metallic mold consisting of metals, alloys or ceramics as the stock material. The thickness of the film of the diamond, etc., is usually 100nm-10mum and the thickness of the intermediate layer is 500nm-50mum. The metallic mold of this invention is extremely superior in the mechanical characteristics including the hardness of the molding surface, impact breaking resistance strength, etc., and the molding surface thereof is resistant to flawing as compared to the conventional metallic mold. Since this metallic mold has high heat resistance and is hardly deteriorated by heat cycles, the durability is extremely high.
JP21613287A 1987-08-28 1987-08-28 Metallic mold for molding metallic plate Pending JPS6462468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21613287A JPS6462468A (en) 1987-08-28 1987-08-28 Metallic mold for molding metallic plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21613287A JPS6462468A (en) 1987-08-28 1987-08-28 Metallic mold for molding metallic plate

Publications (1)

Publication Number Publication Date
JPS6462468A true JPS6462468A (en) 1989-03-08

Family

ID=16683764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21613287A Pending JPS6462468A (en) 1987-08-28 1987-08-28 Metallic mold for molding metallic plate

Country Status (1)

Country Link
JP (1) JPS6462468A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03146666A (en) * 1989-10-31 1991-06-21 Shimadzu Corp Formation of hard carbon film
JPH05169162A (en) * 1991-12-25 1993-07-09 Kyocera Corp Metal working jig
JPH06262275A (en) * 1993-03-10 1994-09-20 Toshiba Tungaloy Co Ltd Die for plastic working of metal
US5826628A (en) * 1996-01-24 1998-10-27 Micron Technology, Inc. Form tooling and method of forming semiconductor package leads
US5921131A (en) * 1996-06-28 1999-07-13 Hutchinson Technology Incorporated Method for frictionally guiding and forming ferrous metal
US6207281B1 (en) * 1988-03-07 2001-03-27 Semiconductor Energy Laboratory Co., Ltd. Electrostatic-erasing abrasion-proof coating and method for forming the same
EP1086797A1 (en) * 1999-03-08 2001-03-28 Citizen Watch Co., Ltd. Resin molding mold and method of forming hard coat on resin molding mold
US6224952B1 (en) 1988-03-07 2001-05-01 Semiconductor Energy Laboratory Co., Ltd. Electrostatic-erasing abrasion-proof coating and method for forming the same
US6503060B1 (en) 1999-08-09 2003-01-07 Daikin Industries, Ltd. Fan guard of blower unit and air conditioner
KR100489639B1 (en) * 2002-11-22 2005-05-17 (주)제이 앤 엘 테크 Carbon film coated emc molding die for semiconductor packaging and coating method thereof
JP2010099735A (en) * 2008-09-24 2010-05-06 Hitachi Metals Ltd Coated die for plastic working
CN102078921A (en) * 2009-11-27 2011-06-01 丰田自动车株式会社 Surface-treated mold and method of producing surface-treated mold

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6583481B2 (en) 1988-03-07 2003-06-24 Semiconductor Energy Laboratory Co., Ltd. Electrostatic-erasing abrasion-proof coating and method for forming the same
US6207281B1 (en) * 1988-03-07 2001-03-27 Semiconductor Energy Laboratory Co., Ltd. Electrostatic-erasing abrasion-proof coating and method for forming the same
US7144629B2 (en) 1988-03-07 2006-12-05 Semiconductor Energy Laboratory Co., Ltd. Electrostatic-erasing abrasion-proof coating and method for forming the same
US6224952B1 (en) 1988-03-07 2001-05-01 Semiconductor Energy Laboratory Co., Ltd. Electrostatic-erasing abrasion-proof coating and method for forming the same
US6265070B1 (en) 1988-03-07 2001-07-24 Semiconductor Energy Laboratory Co., Ltd. Electrostatic-erasing abrasion-proof coating and method for forming the same
JPH03146666A (en) * 1989-10-31 1991-06-21 Shimadzu Corp Formation of hard carbon film
JPH05169162A (en) * 1991-12-25 1993-07-09 Kyocera Corp Metal working jig
JPH06262275A (en) * 1993-03-10 1994-09-20 Toshiba Tungaloy Co Ltd Die for plastic working of metal
US5826628A (en) * 1996-01-24 1998-10-27 Micron Technology, Inc. Form tooling and method of forming semiconductor package leads
US5921131A (en) * 1996-06-28 1999-07-13 Hutchinson Technology Incorporated Method for frictionally guiding and forming ferrous metal
US6517339B1 (en) 1999-03-08 2003-02-11 Citizen Watch, Co., Ltd. Resin molding mold
EP1086797A1 (en) * 1999-03-08 2001-03-28 Citizen Watch Co., Ltd. Resin molding mold and method of forming hard coat on resin molding mold
US6503060B1 (en) 1999-08-09 2003-01-07 Daikin Industries, Ltd. Fan guard of blower unit and air conditioner
KR100489639B1 (en) * 2002-11-22 2005-05-17 (주)제이 앤 엘 테크 Carbon film coated emc molding die for semiconductor packaging and coating method thereof
JP2010099735A (en) * 2008-09-24 2010-05-06 Hitachi Metals Ltd Coated die for plastic working
CN102078921A (en) * 2009-11-27 2011-06-01 丰田自动车株式会社 Surface-treated mold and method of producing surface-treated mold
JP2011110587A (en) * 2009-11-27 2011-06-09 Toyota Motor Corp Surface treated mold and method for manufacturing the same
US8657252B2 (en) 2009-11-27 2014-02-25 Toyota Jidosha Kabushiki Kaisha Surface-treated mold and method of producing surface-treated mold
US9433998B2 (en) 2009-11-27 2016-09-06 Toyota Jidosha Kabushiki Kaisha Surface-treated mold and method of producing surface-treated mold

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