JPS6462461A - Sputtering device - Google Patents
Sputtering deviceInfo
- Publication number
- JPS6462461A JPS6462461A JP21540287A JP21540287A JPS6462461A JP S6462461 A JPS6462461 A JP S6462461A JP 21540287 A JP21540287 A JP 21540287A JP 21540287 A JP21540287 A JP 21540287A JP S6462461 A JPS6462461 A JP S6462461A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- film
- grain size
- voltage
- permalloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To obtain a sputtering device capable of changing the direction of collision of particles, controlling the growth of a columnar structure and reducing the grain size of a formed film by setting a substrate so that the substrate is vibrated by impressing AC voltage on a piezoelectric plate as a substrate holder. CONSTITUTION:A vacuum treating chamber 1 is filled with an Ar atmosphere under about 2Torr and a target 2 kept at cathode potential is sputtered with a negative high voltage power source 6. A substrate 3 is adhered to the surface of a piezoelectric element 4 placed on an insulator 5 and AC voltage is impressed on the element 4 in the direction of the thickness with an AC power source 7 to vibrate the substrate 3 together with the element 4. For example, when the target 2 is made of 'Permalloy(R)' and AC voltage of 10kHz and 300V is impressed on the element 4, a Permalloy film of 20-50nm grain size is formed on the substrate 3. When the substrate 3 is not vibrated, the grain size of a formed film is 300-1,000nm. Since the grain size of the Permalloy film formed by this invention is reduced, the coercive force of the film is reduced to about 1/3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21540287A JPS6462461A (en) | 1987-08-31 | 1987-08-31 | Sputtering device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21540287A JPS6462461A (en) | 1987-08-31 | 1987-08-31 | Sputtering device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6462461A true JPS6462461A (en) | 1989-03-08 |
Family
ID=16671731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21540287A Pending JPS6462461A (en) | 1987-08-31 | 1987-08-31 | Sputtering device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6462461A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03162566A (en) * | 1989-11-19 | 1991-07-12 | Ken Takahashi | Formation of thin film and thin film forming device, element, electro-magnetic device, information recording and reproducing device, signal processor and formation of molten crystal |
US5277740A (en) * | 1990-08-31 | 1994-01-11 | Mitsubishi Denki Kabushiki Kaisha | Apparatus and method for forming a fine pattern |
WO1995000676A1 (en) * | 1993-06-17 | 1995-01-05 | Materials Research Corporation | Ultrasonic enhancement of aluminum step coverage and apparatus |
-
1987
- 1987-08-31 JP JP21540287A patent/JPS6462461A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03162566A (en) * | 1989-11-19 | 1991-07-12 | Ken Takahashi | Formation of thin film and thin film forming device, element, electro-magnetic device, information recording and reproducing device, signal processor and formation of molten crystal |
US5277740A (en) * | 1990-08-31 | 1994-01-11 | Mitsubishi Denki Kabushiki Kaisha | Apparatus and method for forming a fine pattern |
WO1995000676A1 (en) * | 1993-06-17 | 1995-01-05 | Materials Research Corporation | Ultrasonic enhancement of aluminum step coverage and apparatus |
US5520784A (en) * | 1993-06-17 | 1996-05-28 | Sony Corporation | Ultrasonic enhancement of aluminum step coverage and apparatus |
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