JPS646038U - - Google Patents

Info

Publication number
JPS646038U
JPS646038U JP1987100847U JP10084787U JPS646038U JP S646038 U JPS646038 U JP S646038U JP 1987100847 U JP1987100847 U JP 1987100847U JP 10084787 U JP10084787 U JP 10084787U JP S646038 U JPS646038 U JP S646038U
Authority
JP
Japan
Prior art keywords
wire bonding
conductive pattern
chip
chip mount
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987100847U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987100847U priority Critical patent/JPS646038U/ja
Publication of JPS646038U publication Critical patent/JPS646038U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/50—

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1987100847U 1987-06-30 1987-06-30 Pending JPS646038U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987100847U JPS646038U (cg-RX-API-DMAC10.html) 1987-06-30 1987-06-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987100847U JPS646038U (cg-RX-API-DMAC10.html) 1987-06-30 1987-06-30

Publications (1)

Publication Number Publication Date
JPS646038U true JPS646038U (cg-RX-API-DMAC10.html) 1989-01-13

Family

ID=31329295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987100847U Pending JPS646038U (cg-RX-API-DMAC10.html) 1987-06-30 1987-06-30

Country Status (1)

Country Link
JP (1) JPS646038U (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0922961A (ja) * 1995-07-06 1997-01-21 Nec Corp Ｂｇａ型半導体装置
JP2007059837A (ja) * 2005-08-26 2007-03-08 Stanley Electric Co Ltd 表面実装型ｌｅｄ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0922961A (ja) * 1995-07-06 1997-01-21 Nec Corp Ｂｇａ型半導体装置
JP2007059837A (ja) * 2005-08-26 2007-03-08 Stanley Electric Co Ltd 表面実装型ｌｅｄ

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