JPS6459988A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6459988A
JPS6459988A JP21731887A JP21731887A JPS6459988A JP S6459988 A JPS6459988 A JP S6459988A JP 21731887 A JP21731887 A JP 21731887A JP 21731887 A JP21731887 A JP 21731887A JP S6459988 A JPS6459988 A JP S6459988A
Authority
JP
Japan
Prior art keywords
board
circuit
insulating
film
catalyst
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21731887A
Other languages
Japanese (ja)
Inventor
Hajime Nakayama
Yoshiyuki Tsuru
Akishi Nakaso
Naoki Fukutomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP21731887A priority Critical patent/JPS6459988A/en
Publication of JPS6459988A publication Critical patent/JPS6459988A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To manufacture a printed wiring board employing an insulating board which have excellent characteristics such as heat-resistant, abrasion-resistant, flexible, insulating and chemical-resistant characteristics which are necessary for the insulating board for the printed wiring board by a method wherein an oxide gel film in which non-electroplating catalyst is dispersed is formed on the insulating board and a circuit pattern is formed on the insulating board. CONSTITUTION:Plating catalyst (Pd) is dispersed in modified alkysilicate varnish whose solvent component is methanol and hardener is added to produce soft biscous solution. The biscous solution is applied to an Al board 1. The Al board 1 is heated to elevate its temperature from a room temperature to 150 deg.C and then subjected to natural cooling to form an insulating film 2. After the catalyst is exposed by polishing the surface of the film 2, a copper film is formed by non-electro copper plating. Then the copper film is etched to form a circuit 3. Then resist 4 for lift-off is applied only to the interlayer connection part of the circuit and a gel film is formed. The resist 4 is removed to form a hole for interlayer connection. The plating catalyst is exposed and, after plating resist for an upper circuit is applied, the interlayer connection and the upper circuit are formed simultaneously to form a double-layer circuit board.
JP21731887A 1987-08-31 1987-08-31 Manufacture of printed wiring board Pending JPS6459988A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21731887A JPS6459988A (en) 1987-08-31 1987-08-31 Manufacture of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21731887A JPS6459988A (en) 1987-08-31 1987-08-31 Manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPS6459988A true JPS6459988A (en) 1989-03-07

Family

ID=16702288

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21731887A Pending JPS6459988A (en) 1987-08-31 1987-08-31 Manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPS6459988A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175479A (en) * 1990-02-13 1992-12-29 Hitachi, Ltd. Moving body position control apparatus and signal reproducing apparatus
JP2004228170A (en) * 2003-01-20 2004-08-12 Matsushita Electric Works Ltd Wiring board and light emitting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5175479A (en) * 1990-02-13 1992-12-29 Hitachi, Ltd. Moving body position control apparatus and signal reproducing apparatus
JP2004228170A (en) * 2003-01-20 2004-08-12 Matsushita Electric Works Ltd Wiring board and light emitting device

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