JPS6459892A - Formation of through hole - Google Patents

Formation of through hole

Info

Publication number
JPS6459892A
JPS6459892A JP21685987A JP21685987A JPS6459892A JP S6459892 A JPS6459892 A JP S6459892A JP 21685987 A JP21685987 A JP 21685987A JP 21685987 A JP21685987 A JP 21685987A JP S6459892 A JPS6459892 A JP S6459892A
Authority
JP
Japan
Prior art keywords
tool
hole
mesh
air
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21685987A
Other languages
Japanese (ja)
Inventor
Hiroaki Morimoto
Tatenobu Arai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21685987A priority Critical patent/JPS6459892A/en
Publication of JPS6459892A publication Critical patent/JPS6459892A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C45/00—Preparation of compounds having >C = O groups bound only to carbon or hydrogen atoms; Preparation of chelates of such compounds
    • C07C45/61—Preparation of compounds having >C = O groups bound only to carbon or hydrogen atoms; Preparation of chelates of such compounds by reactions not involving the formation of >C = O groups
    • C07C45/67—Preparation of compounds having >C = O groups bound only to carbon or hydrogen atoms; Preparation of chelates of such compounds by reactions not involving the formation of >C = O groups by isomerisation; by change of size of the carbon skeleton
    • C07C45/68—Preparation of compounds having >C = O groups bound only to carbon or hydrogen atoms; Preparation of chelates of such compounds by reactions not involving the formation of >C = O groups by isomerisation; by change of size of the carbon skeleton by increase in the number of carbon atoms
    • C07C45/72—Preparation of compounds having >C = O groups bound only to carbon or hydrogen atoms; Preparation of chelates of such compounds by reactions not involving the formation of >C = O groups by isomerisation; by change of size of the carbon skeleton by increase in the number of carbon atoms by reaction of compounds containing >C = O groups with the same or other compounds containing >C = O groups
    • C07C45/74—Preparation of compounds having >C = O groups bound only to carbon or hydrogen atoms; Preparation of chelates of such compounds by reactions not involving the formation of >C = O groups by isomerisation; by change of size of the carbon skeleton by increase in the number of carbon atoms by reaction of compounds containing >C = O groups with the same or other compounds containing >C = O groups combined with dehydration

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To penetrate only through holes selectively by installing a mesh-like tool which blocks holes excluding the through hole below the thick-film circuit substrate and by sucking air from the lower part of tool. CONSTITUTION:A mesh-like tool 9 is placed between a substrate 6 and a printing machine 3, a squeegee 8 is shifted, and air is sucked through a suction hole 4 simultaneously with or after printing. No air is discharged since holes 11 other than the through hole are sealed by a sealer 10 within a mesh-like tool 9. A through hole 5 is formed since air passes through a mesh-like tool 9.
JP21685987A 1987-08-31 1987-08-31 Formation of through hole Pending JPS6459892A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21685987A JPS6459892A (en) 1987-08-31 1987-08-31 Formation of through hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21685987A JPS6459892A (en) 1987-08-31 1987-08-31 Formation of through hole

Publications (1)

Publication Number Publication Date
JPS6459892A true JPS6459892A (en) 1989-03-07

Family

ID=16695027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21685987A Pending JPS6459892A (en) 1987-08-31 1987-08-31 Formation of through hole

Country Status (1)

Country Link
JP (1) JPS6459892A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5630272A (en) * 1994-11-02 1997-05-20 Lpkf Cad/Cam Systeme Gmbh Method of forming contacts through bores in multi-layer circuit boards
US5761803A (en) * 1996-06-26 1998-06-09 St. John; Frank Method of forming plugs in vias of a circuit board by utilizing a porous membrane
US5887345A (en) * 1993-11-17 1999-03-30 International Business Machines Corporation Method for applying curable fill compositon to apertures in a substrate
CN109413861A (en) * 2018-11-22 2019-03-01 奥士康科技股份有限公司 A kind of PCB air guide board manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5887345A (en) * 1993-11-17 1999-03-30 International Business Machines Corporation Method for applying curable fill compositon to apertures in a substrate
US5630272A (en) * 1994-11-02 1997-05-20 Lpkf Cad/Cam Systeme Gmbh Method of forming contacts through bores in multi-layer circuit boards
US5761803A (en) * 1996-06-26 1998-06-09 St. John; Frank Method of forming plugs in vias of a circuit board by utilizing a porous membrane
CN109413861A (en) * 2018-11-22 2019-03-01 奥士康科技股份有限公司 A kind of PCB air guide board manufacturing method
CN109413861B (en) * 2018-11-22 2020-12-25 奥士康科技股份有限公司 Method for manufacturing PCB (printed circuit board) air guide plate

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