JPS645914Y2 - - Google Patents

Description

[Detailed description of the invention] [Purpose of the invention] (Field of industrial application) This invention is a device that houses a hybrid IC substrate that is mainly made of a metal plate such as aluminum that also has heat dissipation properties and has multiple through holes. Regarding the case for.

(Prior Art) A hybrid IC substrate has a structure in which patterns and wiring are formed on the substrate body to attach various electronic components such as transistors, resistors, capacitors, diodes, and triacs, as well as output terminals. Recently, a metal plate with excellent heat dissipation properties, such as an aluminum plate, has been used instead of a ceramic plate for the main body of the substrate. In addition, such hybrid IC boards are housed in a case to protect mounted electronic components such as transistors, but this case is made of synthetic resin instead of metal to ensure electrical insulation between the inside and outside. has been done.

By the way, a conventional storage case has a hexagonal case body 1 with one side open, as shown in FIG.
It consists of pins with mounting holes 2a and 2b planted in the left and right ends of the case body 1, and a frame-shaped step part 3 provided in the case body 1 for fixing the hybrid IC board. There is. In order to store a hybrid board on which various electronic components are mounted in the case 4 having such a structure, as shown in FIG. 3, and then the component mounting side of the hybrid IC board 6 is brought into contact with the adhesive sheet 5. In this state, the board 6 is bonded by holding it at 150 to 160°C for 3 to 5 hours while applying pressure. It is fixed and stored in the case 4 via the seat 5. However, these storage means have had various problems as described below.

Since it requires complicated steps such as pasting adhesive sheets and curing, it takes a lot of time to store it.

Since a step of thermosetting the adhesive sheet is required, the case is significantly deformed after storage, and the board is also deformed, which in turn adversely affects the connection reliability of various electronic components mounted on the board.

If a case containing a board is installed so that the board side is in contact with a chassis, etc., and is attached to the chassis using screws passed through the case's mounting hole pins, the surface of the board may be damaged due to deformation or warping of the board. Since the entire surface of the heat sink cannot be brought into close contact with the entire surface, sufficient heat dissipation cannot be ensured.

There is a risk that the adhesive will spread to the surface of the board opposite to the mounting surface, which will impede the heat dissipation of the board.

Since the substrate is housed in the case via a relatively wide adhesive sheet, the periphery of the substrate to which the sheet is adhered becomes a dead space, and the area on the substrate that can be used as a pattern becomes narrow.

(Problems to be solved by the invention) The present invention was made to solve all of the above conventional problems at once.
Moreover, it is an object of the present invention to provide a case in which a hybrid IC substrate can be easily and reliably housed without causing deformation of the substrate.

[Structure of the invention] (Means for solving the problems) The invention mainly consists of a metal plate that also has heat dissipation properties,
In a case for storing a hybrid IC board having multiple through holes, a synthetic resin case body with a U-shaped cross section with an opening on one side and an inner surface facing the opening of this case body are arranged so that they are integrated and facing each other. and a plurality of pins with mounting holes planted in the hybrid
The tip portion into which the through hole of the IC substrate is press-fitted is made smaller in diameter than other portions, and a stepped portion is formed at the boundary between the tip portion and the portion below it, and the substrate is further press-fitted into the outer circumferential side of the tip portion. It is characterized by having a structure in which at least three protrusions that contact the inner circumferential surface of the through hole are formed radially with respect to the axis of the tip and over the entire axial length of the tip. This is a storage case for hybrid IC boards.

(Function) According to the present invention, a plurality of pins with mounting holes are implanted integrally and facing each other on the inner surface facing the opening of the synthetic resin case body, and the tip of each pin with mounting holes is is made smaller in diameter than other parts, and a stepped part is formed at the boundary between the tip part and a part below it;
Furthermore, at least three or more protrusions are formed on the outer circumferential surface of the tip end radially with respect to the axis of the tip end and over the entire axial length of the tip end, and the protrusion portions of the pin with a mounting hole are formed. By press-fitting the through hole of the hybrid IC board into the tip where the
The IC board can be easily and reliably stored without deforming the board, and furthermore, the board can be prevented from being deformed or warped due to the difference in thermal expansion coefficient between the synthetic resin case and the board due to thermal effects.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to FIGS. 1 to 6.

Reference numeral 11 in the figure is a case body made of synthetic resin, such as epoxy resin, and having a U-shaped cross section with one side open. Opening 1 in this case body 11
The hybrid IC to be stored is on the edge 13 of 2.
A step with the same height as the thickness of the substrate is formed.
A notch 14 is formed in one side wall surface of the case body 11 for extending one end of the hybrid IC substrate to be accommodated. Two pins with mounting holes 15 ₁ and 15 ₂ are implanted in the case body 11 integrally and facing each other near the short edge of the inner wall surface facing the opening 12 of the case body 11. ing. These pins with mounting holes 15 ₁ ,
15 ₂ is a tip portion 16 ₁ into which the through hole of the hybrid substrate is press-fitted, as shown in FIGS. 3 and 4.
16 ₂ is made smaller in diameter than the other portions, and a stepped portion 17 ₁ is at the same level as the stepped portion of the edge 13 of the main body 11;
17 ₂ is formed. The tip portions 16 ₁ , 16
Four protrusions 18 ₁ , 18 ₂ are provided on the outer circumferential side of the hybrid IC substrate ₂ to make contact with the inner circumferential surface of the through hole of the hybrid IC substrate.
are formed radially with respect to the axes of the tip portions 16 ₁ , 16 ₂ and over the entire length of the tip portions 16 ₁ , 16 ₂ in the axial direction. In addition, each protrusion 18 ₁ ,
The end surfaces of the tip portions 16 _{1 ,} 16 ₂ at 18 2 on the side opposite to the outer circumferential surfaces are flat so as to be parallel to the tangents of the tip portions 16 ₁ , 16 ₂ .

Further, the mounting hole pin 1 is provided near the corner of the inner wall surface facing the opening of the case body 11.
5 ₁ , 4 empty pins with smaller diameter than 15 ₂ 19 ₁ , 1
9 ₄ is integrally implanted in the case body 11. These hollow pins 19 ₁ to 19 ₄ have tip portions 20 ₁ , 20 ₂ to 20 ₄ into which the through holes of the hybrid IC substrate are press-fitted, as shown in FIGS. 5 and 6, with a smaller diameter than other portions. The edge 13 of the main body 11
The stepped portions 21 ₁ , 21 ₂ to be at the same level as the stepped portions of
21 ₄ is formed.

Four protrusions 22 ₁ , 22 ₂ - 22 ₄ that come into contact with the inner circumferential surface of the through hole of the hybrid IC substrate are provided on the outer circumferential side of _the tip parts 20 ₁ , 20 ₂ - 20 ₄ . It is formed radially with respect to the axes 20 ₂ to 20 ₄ and over the entire length of the tip portions 20 ₁ and 20 ₂ to 20 ₄ in the axial direction. Note that the tip portion 2 of each protrusion 22 ₁ , 22 ₂ to _{22 4}
The end surface opposite to the outer peripheral side surface of 0 ₁ , 20 ₂ to 20 ₄ is
The tip portions 20 ₁ , 20 ₂ to 20 ₄ are flat and parallel to tangents.

However, the storage case of this invention has a hybrid design.
To explain the procedure for storing IC boards, first,
A hybrid IC substrate 26 shown in FIG. 7 is prepared. This hybrid IC board 26 has a pattern 23 and wiring (not shown) for mounting various electronic components such as transistors and output terminals on its surface, and also has mounting hole pins 15 ₁ of the case body 11,
Large through holes 24 ₁ and 24 at locations corresponding to 15 ₂ , respectively.
₂ are bored, and the empty pins 19 ₁ to 1 of the case body 11
Small through holes 25 ₁ to 25 at locations corresponding to 19 _4
4 is perforated. Various predetermined electronic components are mounted on the pattern 23 of the hybrid IC board 26, and the peripheral edge of the board 26 is placed on the stepped part of the edge 13 of the case body 11, so that the pattern 23 side of the board is located inside the case body 11. At the same time, the large through holes 24 ₁ and 24 ₂ of the board 26 are brought into contact with the mounting hole pins 1 of the case body 11.
The same substrate 26 is attached to the tip portions 16 ₁ and 16 ₂ of 5 ₁ and 15 ₂ .
When the small through-holes 25 ₁ to 25 ₄ are press-fitted into the tips 20 ₁ and 20 ₂ to 20 ₄ of the empty pins 19 ₁ to 19 ₄ of the case body 11, respectively, the board 26 is attached to the case as shown in FIG. It will be stored. By housing the hybrid IC board 26 in the case, one end of the board 26 extends from the notch 14 of the case body 11, and a terminal (not shown) is attached to this extended part.

When storing the hybrid IC board 26 described above, the mounting hole pins 15 ₁ ,
15 ₂ and empty pins 19 ₁ to 19 ₄ each have stepped portions 17 ₁ , 17 ₂ , 21 ₁ , 21 ₂ to 21 ₄ having the same height as the thickness of the hybrid IC substrate 26, so that the substrate 26 is The substrate 26 can be stored in the case body 11 in a state where the surface of the board 26 and the end face of the edge 13 are flush without protruding from the edge 13 of the case body 11.

In addition, a pin with a mounting hole 15 ₁ of the case body 11,
On the outer circumferential side of the tips 16 ₁ and 16 ₂ in 15 ₂ , there are four flat protrusions 18 ₁ parallel to the tangents thereof.
18 ₂ , and four flat protrusions 22 ₁ parallel to the tangents on the outer peripheral side surfaces of the tips 20 ₁ , 20 ₂ to 20 ₄ of the empty pins 19 ₁ to 19 ₄ ,
22 ₂ to 22 ₄ are provided. However, the large through holes 24 ₁ , 24 ₂ of the hybrid IC board 26 are inserted into the tips 16 ₁ , 16 2 of the pins 15 1 , 15 ₂ with mounting holes of the case body 11 , and the tips of the empty pins 19 ₁ to 19 ₄ are inserted into the large through holes 24 ₁ , 24 ₂ of the hybrid IC board 26 . When the small through holes 25 ₁ to 25 ₄ of the substrate 26 are press-fitted into the parts 20 ₁ , 20 ₂ to _{20 4} , the through holes 24 ₁ , 24 ₂ , 2 are formed as shown in FIGS. 9 and 10.
The inner peripheral surfaces of 5 ₁ to 25 ₄ are each pin 15 ₁ , 15 ₂ , 19 ₁
〜19 ₄ tip portions 16 ₁ , 16 ₂ , 20 ₁ , 20 ₂ 〜2
Projections 18 ₁ , 18 ₂ , 22 ₁ , 2 provided on 0 ₄
2 ₂ to 22 ₄ , these protrusions 18
Each pin 15 ₁ , 15 ₂ , _{19 1 to} 19 ₄ and the through hole 24 due to the elastic action of 1 , 18 2 , 22 ₁ , 22 ₂ to 22 _4
1 , 24 ₂ , 25 ₁ to 25 ₄ is increased, and the board 26 can be firmly housed in the case. In fact, the pins with mounting holes 15 ₁ , 15 implanted in the case body 11
_2. The positional accuracy of empty pins ₁₉₁ to ₁₉₄ is ±0.1mm,
Large through holes 24 ₁ , 24 ₂ and small through holes 25 of substrate 26
When the position accuracy of ₁ to 25 ₄ is ±0.15 mm, the projections 18 ₁ , 18 _of each pin 15 ₁ , 15 ₂ , 19 1 to 19 ₄ for each through hole 24 1 , 24 ₂ , _{25 1} to 25 ₄
Tip part _{16 1 ,} 1 including ₂ , 22 _{1 , 22 2} to 22 ₄
If the diameter of 6 ₂ , 20 ₁ , 20 ₂ to 20 ₄ is about 0 to 0.1 mm, the hybrid IC substrate 26 will have sufficient strength.
could be stored in the case.

Furthermore, when the hybrid IC undergoes a temperature cycle change due to self-heating after storage is completed, the aluminum substrate 26 and the epoxy resin case, which have different coefficients of thermal expansion, expand, but the case body 1
The pins with mounting holes 15 ₁ , 15 ₂ and empty pins 19 ₁ to 19 ₄ implanted in 1 have elasticity themselves, and the tip portions 16 ₁ of each pin 15 ₁ , 15 ₂ , 19 ₁ to 19 ₄ , 16 ₂ , 20 ₁ , 20 ₂ to 20 ₄ are provided with projections 18 ₁ , 18 ₂ , 22 ₁ , 22 ₂ to 22 ₄ on the outer circumferential side surfaces of each pin 15 ₁ , 15 ₂ , 19 ₁ to 19 _{4 .} and the large through holes 24 ₁ , ₂₄ 2 of the substrate 26 press-fitted into the tip portions 16 ₁ , _{16 2 ,} 20 ₁ , 20 ₂ to 20 ₄ and the tip portions 16 ₁ , 16 ₂ , 20 ₁ , 20 _{2 to 20 4} , the projections 18 ₁ , 18 are located between the small through holes 25 ₁ to 25 ₄ .
₂ , 22 ₁ , 22 ₂ to 22 ₄ are interposed to form gaps. As a result, the difference in thermal expansion between the substrate 26 and the case can be reduced by each pin 15 ₁ , 15 ₂ , 19 ₁
~19 ₄ elastic force and each pin 15 ₁ , 15 ₂ , 19 ₁
〜19 ₄ tip portions 16 ₁ , 16 ₂ , 20 ₁ , 20 ₂ 〜2
0 ₄ and each of the through holes 24 ₁ , 24 ₂ , 25 ₁ to 25 ₄ can absorb the heat, thereby preventing the substrate 26 from deforming or warping. In fact, heating and cooling tests at 130℃ for 1000 hours [(-30℃; 30 minutes), (25℃; 5 minutes),
(130°C; 30 minutes)], deformation of the substrate 26,
No abnormalities such as occurrence of warping were observed.

Therefore, the hybrid IC substrate storage case of the present invention has various effects as described below.

(a) The hybrid IC board can be stored in the case by press-fitting without using an adhesive sheet.
The case and storage operation can be made extremely simple, and the case and the board can also be collected.

(b) It is possible to prevent deformation of the board due to thermal effects after storage is completed, and it is possible to improve the connection reliability of electronic components such as transistors mounted on the board.

(c) Place the case containing the hybrid IC board on a chassis, etc., so that the surface of the board (the surface opposite to the mounting surface of various electronic components) is in contact with the chassis surface, and make the mounting holes in the case body. When attached to the chassis with screws passed through the attached pins, the board is flush with the edge end face of the case body and does not deform or warp, so the board can be closely attached to the entire chassis surface and good heat dissipation can be ensured.

(d) The tips of the pins with mounting holes and the empty pins embedded in the case body are press-fitted into the through-holes of the hybrid IC board, and the pins are formed at the edge of the opening of the case body. Since the width of the step can be narrowed, the area where the peripheral edge of the board contacts the case body (dead space) can be reduced, and the area on the board that can be used as a pattern can be expanded.

In addition, in the above embodiment, there are
Although three protrusions are provided, the present invention is not limited to this, and three or five or more protrusions may be provided. Further, the shape of the protrusion may be arbitrary, such as spherical or triangular prism.

[Effects of the invention] As detailed above, the hybrid IC of the invention
According to the storage case for the hybrid circuit board, it is possible to store the hybrid circuit board simply and reliably without using an adhesive sheet, without causing deformation of the hybrid circuit board, and to prevent the board from deforming or warping due to heat effects after storage is completed. , when attached to a chassis etc., it is possible to bring the substrate into close contact with the entire surface of the chassis, resulting in remarkable effects such as ensuring good heat dissipation.

[Brief explanation of the drawing]

Figure 1 shows a hybrid system showing an embodiment of the present invention.
A plan view showing the IC board storage case, Figure 2 is a side view of the storage case shown in Figure 1, Figure 3 is a sectional view taken along the - line in Figure 1, and Figure 4 shows the mounting holes shown in Figure 3. A plan view of the attached pin, FIG. 5 is a sectional view taken along the - line in FIG. 1, and FIG. 6 is a plan view of the empty pin in FIG. 5.
Figure 7 is a plan view showing the hybrid IC board to be stored, and Figure 8 is the hybrid IC board to be stored in the case.
A perspective view showing the state in which the IC board is housed, Figure 9 is a sectional view taken along the - line in Figure 8, Figure 10 is a sectional view taken along the - line in Figure 8, and Figure 11 is a conventional case. FIG. 2 is a perspective view showing a state in which a hybrid IC substrate is housed. 11... Case body made of epoxy resin, 12...
…Opening, 15 ₁ , 15 ₂ … Pin with mounting hole, 16
₁ , 16 ₂ , 20 ₁ , 20 ₂ to 20 ₄ ... tip, 17
₁ , 17 ₂ , 21 ₁ , 21 ₂ to 21 ₄ ... step portion, 18
₁ , 18 ₂ , 22 ₁ , 22 ₂ to 22 ₄ ...Protrusion, 19
₁ to 19 ₄ ... blank pin, 24 ₁ , 24 ₂ ... large through hole, 25 ₁ to 25 ₄ ... small through hole, 26 ... hybrid IC substrate.

Claims (1)

[Scope of utility model registration request] In a case that houses a hybrid IC board that is mainly made of a metal plate that also serves as a heat dissipator and has multiple through holes, a synthetic resin case body with a U-shaped cross section with an opening on one side faces the opening of the case body. A plurality of pins with mounting holes are embedded integrally and facing each other on the inner surface of the hybrid IC substrate, and each of the pins with mounting holes has a tip portion into which a through hole of the hybrid IC substrate is press-fitted. A stepped portion is formed at the boundary between the tip portion and a portion below the tip portion, and furthermore, at least three step portions are formed on the outer circumferential side of the tip portion to be in contact with the inner circumferential surface of the through hole when the substrate is press-fitted. 1. A storage case for a hybrid IC substrate, characterized in that the protrusion is formed radially with respect to the axis of the tip and extends over the entire length of the tip in the axial direction.