JPS645881Y2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a cleaning technique for cleaning samples such as semiconductor substrates or masks, and particularly relates to an improvement of a cleaning device aimed at improving cleaning efficiency.

(b) Background of the technology Various cleaning treatments applied to semiconductor substrates, such as pretreatments such as oxidation, diffusion, and vapor phase deposition (CVD) deposition;
Alternatively, there may be pretreatment for photoresist application, photoresist film removal, etc. Cleaning is usually performed in the following order: degreasing, removal of real metal, etching, pure water washing, and drying.

Generally, cleaning is a long process and involves repeated use of purified water and cleaning many times, but in semiconductor processes it is extremely necessary to avoid contamination with impurities. Further, pure water is usually purified by pre-treating raw water, such as precipitation and filtering, and then removing dissolved ions through ion exchange treatment. If it is still insufficient, combine reverse osmosis, oxidation, etc.

(c) Prior art and problems Figure 1 is a schematic diagram showing an example of conventional mask cleaning, Figure 2 is a perspective view showing a mask holder, and Figure 3 is a schematic diagram showing an example of conventional mask cleaning.
The figure is a perspective view showing contamination residue on the mask after cleaning.

In the figure, a mask 1 to be cleaned is placed on a holder 2, and purified water is sprayed from above from a shower nozzle 3 to perform cleaning. Usually, the process is carried out in a chamber where clean air is blown to create a clean atmosphere. As shown in FIG. 2, the holder 2 is formed into a frame shape with air permeability, and is constructed so that the washing water flows out and does not remain inside the holder. However, in this method, since the cleaning water flows from the upper surface to the lower surface of the mask 1, the dirt or sewage on the upper surface flows to the lower surface, and in some cases, as shown in FIG. may remain on the lower surface of the mask 1. Therefore, in order to improve the cleaning effect, it is necessary to repeatedly spray and spray the cleaning water, which reduces work efficiency. Such contamination residue 4 adversely affects semiconductor characteristics and deteriorates performance.

(d) Purpose of the invention In view of the above points, the present invention provides a cleaning mechanism that cleans both sides of the sample by arranging a cleaning nozzle inserted between the samples to be processed, and aims to stabilize quality and speed up processing. purpose.

(e) Structure of the invention According to the invention, the above purpose is to provide a holder for holding a plurality of plate-shaped samples to be cleaned so as to face each other with a space provided therebetween, and a plurality of cleaning plates that can be inserted into the space. The plurality of cleaning nozzles are arranged such that one cleaning nozzle can be inserted into each of the spaces between the samples to be cleaned, and the cleaning nozzles are simultaneously applied to both of the pairs of samples constituting the spaces. This is achieved by providing a plurality of cleaning liquid ejection holes in each cleaning nozzle so as to jet out the cleaning liquid, thereby simultaneously cleaning both sides of each sample to be cleaned.

(f) Example of implementation of the idea Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 4 is a side view showing a cleaning mechanism according to an embodiment of the present invention, and FIG. 5 is a perspective view showing the shape of a jet nozzle according to an embodiment of the present invention. A sample 11 to be processed, such as a semiconductor wafer or a mask, is placed on a holder 12, and a flat cleaning nozzle 13 is disposed between the samples 11 to jet pure water to clean the main and back surfaces of the sample 11.

The flat cleaning nozzle 13 branches from the pure water supply conduit 14 and moves in the vertical direction. That is, during cleaning, the pure water supply conduit 14 and the cleaning nozzle 13 are lowered and are brought to rest at approximately the center position between the samples 11 indicated by diagonal lines as shown in the figure. The sample 11 is cleaned by a jet of pure water from the nozzle 13, and upon completion of the cleaning, the pure water piping system consisting of the pure water supply conduit 14 and the cleaning nozzle 13 is pulled upward, and the sample 11 is sent to the next process together with the holder 12. be transported. Flat nozzle 13
As shown in Fig. 5, there are a plurality of jet holes 15 on both sides
With this, both surfaces of the sample 11 can be cleaned over the entire area, and the cleaning efficiency can be improved. In addition, there is no contaminated residue as in the conventional method, and reliability is improved.

In this example, the shape of the cleaning nozzle is a flat plate, but it is not limited to this, and any nozzle shape that can clean the entire sample area may be used.For example, the pipe may be extended and meandered so that it is parallel to the sample surface. You can.

FIG. 6 is a perspective view showing the shape of a cleaning muzzle according to another embodiment of the present invention. An axial nozzle 13' branching from the pure water supply conduit 14' is moved in the direction of the arrow along the sample surface to be cleaned. Thereby, the entire sample surface is cleaned by the cleaning water jetted from the jetting hole 15'.

(g) Effects of the invention As explained in detail above, the cleaning mechanism of the present invention has the effect of making cleaning more efficient and achieving higher reliability than in the past.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing an example of a conventional mask cleaning method, FIG. 2 is a perspective view showing a mask holder, and FIG.
FIG. 4 is a side view showing a cleaning mechanism according to one embodiment of the present invention. FIG. 5 is a perspective view showing the shape of a jet nozzle according to one embodiment of the present invention. FIG. 6 is a perspective view showing the shape of a cleaning nozzle according to another embodiment of the present invention. In the figures, 11 ... sample (semiconductor substrate or mask),
12: holder; 13: nozzle; 14: pure water supply pipe; 15: nozzle hole.

Claims (1)

[Scope of utility model registration request] The holder includes a holder that holds a plurality of plate-shaped samples to be cleaned so as to face each other with a space provided therebetween, and a plurality of cleaning nozzles that can be inserted into the space, and the plurality of cleaning nozzles are arranged to hold a plurality of plate-shaped samples to be cleaned. Each cleaning nozzle is arranged so that one can be inserted into each space between the samples, and a plurality of cleaning liquid ejection holes are provided in each cleaning nozzle so that the cleaning liquid is simultaneously jetted to both of the pair of samples to be cleaned that make up the space. A cleaning device characterized in that: