JPS6458616A - Semiconductor accommodating method - Google Patents

Semiconductor accommodating method

Info

Publication number
JPS6458616A
JPS6458616A JP20372987A JP20372987A JPS6458616A JP S6458616 A JPS6458616 A JP S6458616A JP 20372987 A JP20372987 A JP 20372987A JP 20372987 A JP20372987 A JP 20372987A JP S6458616 A JPS6458616 A JP S6458616A
Authority
JP
Japan
Prior art keywords
lead
tape
end portion
semiconductor
cover tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20372987A
Other languages
Japanese (ja)
Inventor
Yutaka Okuaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP20372987A priority Critical patent/JPS6458616A/en
Publication of JPS6458616A publication Critical patent/JPS6458616A/en
Pending legal-status Critical Current

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  • Packages (AREA)

Abstract

PURPOSE:To prevent the bending and improper pitch of a lead and obtain such a sufficient adhesive strength as not to be affected by outside temperature differences by adhesively bonding emboss tape and cover tape together by heat application, with the lead interposed therebetween. CONSTITUTION:Semiconductors 13, for example, a flat package type, are received upside down in a plurality of recessed embossings formed in an emboss tape 11 in its lengthwise direction. An upper heater 19-1 is provided with a protruding portion 19-3 at a location corresponding to the outside of the end portion of a lead 14 on the semiconductor 13 received in the embossing and this protruding portion 19-3 in contact with a cover tape 17 performs a heating and pressing function, together with a lower heater 19-2. The emboss tape 11 and the cover tape 17 of thermoplastic resins are fused together by heat and pressure application, concurrently with the end portion of the lead 14 securely positioned between these tapes. The end portion of the lead 14 so secured constrains the semiconductor 13 from movement within the embossing, thus preventing the bending of and improper pitches between the leads 14.
JP20372987A 1987-08-17 1987-08-17 Semiconductor accommodating method Pending JPS6458616A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20372987A JPS6458616A (en) 1987-08-17 1987-08-17 Semiconductor accommodating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20372987A JPS6458616A (en) 1987-08-17 1987-08-17 Semiconductor accommodating method

Publications (1)

Publication Number Publication Date
JPS6458616A true JPS6458616A (en) 1989-03-06

Family

ID=16478886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20372987A Pending JPS6458616A (en) 1987-08-17 1987-08-17 Semiconductor accommodating method

Country Status (1)

Country Link
JP (1) JPS6458616A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005138868A (en) * 2003-11-06 2005-06-02 Murata Mfg Co Ltd Electronic component string manufacturing method, and crimp tool
CN105857714A (en) * 2016-05-17 2016-08-17 安庆友仁电子有限公司 Transistor packaging machine
CN106829068A (en) * 2017-01-03 2017-06-13 东莞理工学院 A kind of beans automatic packaging machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005138868A (en) * 2003-11-06 2005-06-02 Murata Mfg Co Ltd Electronic component string manufacturing method, and crimp tool
CN105857714A (en) * 2016-05-17 2016-08-17 安庆友仁电子有限公司 Transistor packaging machine
CN105857714B (en) * 2016-05-17 2019-07-02 安庆友仁电子有限公司 A kind of transistor packing machine
CN106829068A (en) * 2017-01-03 2017-06-13 东莞理工学院 A kind of beans automatic packaging machine
CN106829068B (en) * 2017-01-03 2019-04-23 东莞理工学院 A kind of beans automatic packaging machine

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