JPS6458616A - Semiconductor accommodating method - Google Patents
Semiconductor accommodating methodInfo
- Publication number
- JPS6458616A JPS6458616A JP20372987A JP20372987A JPS6458616A JP S6458616 A JPS6458616 A JP S6458616A JP 20372987 A JP20372987 A JP 20372987A JP 20372987 A JP20372987 A JP 20372987A JP S6458616 A JPS6458616 A JP S6458616A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tape
- end portion
- semiconductor
- cover tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Packages (AREA)
Abstract
PURPOSE:To prevent the bending and improper pitch of a lead and obtain such a sufficient adhesive strength as not to be affected by outside temperature differences by adhesively bonding emboss tape and cover tape together by heat application, with the lead interposed therebetween. CONSTITUTION:Semiconductors 13, for example, a flat package type, are received upside down in a plurality of recessed embossings formed in an emboss tape 11 in its lengthwise direction. An upper heater 19-1 is provided with a protruding portion 19-3 at a location corresponding to the outside of the end portion of a lead 14 on the semiconductor 13 received in the embossing and this protruding portion 19-3 in contact with a cover tape 17 performs a heating and pressing function, together with a lower heater 19-2. The emboss tape 11 and the cover tape 17 of thermoplastic resins are fused together by heat and pressure application, concurrently with the end portion of the lead 14 securely positioned between these tapes. The end portion of the lead 14 so secured constrains the semiconductor 13 from movement within the embossing, thus preventing the bending of and improper pitches between the leads 14.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20372987A JPS6458616A (en) | 1987-08-17 | 1987-08-17 | Semiconductor accommodating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20372987A JPS6458616A (en) | 1987-08-17 | 1987-08-17 | Semiconductor accommodating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6458616A true JPS6458616A (en) | 1989-03-06 |
Family
ID=16478886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20372987A Pending JPS6458616A (en) | 1987-08-17 | 1987-08-17 | Semiconductor accommodating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6458616A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005138868A (en) * | 2003-11-06 | 2005-06-02 | Murata Mfg Co Ltd | Electronic component string manufacturing method, and crimp tool |
CN105857714A (en) * | 2016-05-17 | 2016-08-17 | 安庆友仁电子有限公司 | Transistor packaging machine |
CN106829068A (en) * | 2017-01-03 | 2017-06-13 | 东莞理工学院 | A kind of beans automatic packaging machine |
-
1987
- 1987-08-17 JP JP20372987A patent/JPS6458616A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005138868A (en) * | 2003-11-06 | 2005-06-02 | Murata Mfg Co Ltd | Electronic component string manufacturing method, and crimp tool |
CN105857714A (en) * | 2016-05-17 | 2016-08-17 | 安庆友仁电子有限公司 | Transistor packaging machine |
CN105857714B (en) * | 2016-05-17 | 2019-07-02 | 安庆友仁电子有限公司 | A kind of transistor packing machine |
CN106829068A (en) * | 2017-01-03 | 2017-06-13 | 东莞理工学院 | A kind of beans automatic packaging machine |
CN106829068B (en) * | 2017-01-03 | 2019-04-23 | 东莞理工学院 | A kind of beans automatic packaging machine |
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