JPS645821A - Voidless bonding press of multilayer printed board - Google Patents

Voidless bonding press of multilayer printed board

Info

Publication number
JPS645821A
JPS645821A JP62159602A JP15960287A JPS645821A JP S645821 A JPS645821 A JP S645821A JP 62159602 A JP62159602 A JP 62159602A JP 15960287 A JP15960287 A JP 15960287A JP S645821 A JPS645821 A JP S645821A
Authority
JP
Japan
Prior art keywords
held
pressure
chamber
interior
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62159602A
Other languages
Japanese (ja)
Other versions
JPH0673948B2 (en
Inventor
Hideyasu Murooka
Masayuki Kyoi
Noriaki Ujiie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62159602A priority Critical patent/JPH0673948B2/en
Publication of JPS645821A publication Critical patent/JPS645821A/en
Publication of JPH0673948B2 publication Critical patent/JPH0673948B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
    • B29C65/544—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To check the generation of voids in bonding process by a method wherein adhesive is melted under the state that minute spaced between printed board and insulating adhesive material are sucked by vacuum for filling the minute spaces with the adhesive and, after that, the interior of a chamber is pressurized up to a pressure having the specified value or higher so as to be held until the adhesive cures. CONSTITUTION:Firstly, the interior of a chamber 35 is held at vacuum of 1Torr for about 10min in order to fully remove the air left at the central part of a laminate 4. Bonding pressure is applied to the laminates pinched between an upper and a lower jig plates 56 and at the same time hot plates 78 are heated and held at 130 deg.C. After that, the bonding pressure is raised and held. After the start of pressurizing, the interior of the chamber 35 is brought back to atmospheric pressure and held. Finally, the chamber is filled with dry air or the like so as to be pressurized up to a pressure, which is higher than the vapor pressure of 'water content and solvent' contained in resin at heating temperature. Thus, 'water content and solvent' can be prevented from vaporizing during bonding.
JP62159602A 1987-06-29 1987-06-29 Adhesive press machine for multilayer printed boards Expired - Lifetime JPH0673948B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62159602A JPH0673948B2 (en) 1987-06-29 1987-06-29 Adhesive press machine for multilayer printed boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62159602A JPH0673948B2 (en) 1987-06-29 1987-06-29 Adhesive press machine for multilayer printed boards

Publications (2)

Publication Number Publication Date
JPS645821A true JPS645821A (en) 1989-01-10
JPH0673948B2 JPH0673948B2 (en) 1994-09-21

Family

ID=15697289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62159602A Expired - Lifetime JPH0673948B2 (en) 1987-06-29 1987-06-29 Adhesive press machine for multilayer printed boards

Country Status (1)

Country Link
JP (1) JPH0673948B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009034819A1 (en) * 2007-09-11 2009-03-19 Konica Minolta Medical & Graphic, Inc. Microchip manufacturing method, microchip and vacuum bonding apparatus
CN106476405A (en) * 2016-09-30 2017-03-08 生益电子股份有限公司 The lamination sheeting process of PCB and PCB

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009034819A1 (en) * 2007-09-11 2009-03-19 Konica Minolta Medical & Graphic, Inc. Microchip manufacturing method, microchip and vacuum bonding apparatus
CN106476405A (en) * 2016-09-30 2017-03-08 生益电子股份有限公司 The lamination sheeting process of PCB and PCB

Also Published As

Publication number Publication date
JPH0673948B2 (en) 1994-09-21

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