JPS645772U - - Google Patents
Info
- Publication number
- JPS645772U JPS645772U JP9889087U JP9889087U JPS645772U JP S645772 U JPS645772 U JP S645772U JP 9889087 U JP9889087 U JP 9889087U JP 9889087 U JP9889087 U JP 9889087U JP S645772 U JPS645772 U JP S645772U
- Authority
- JP
- Japan
- Prior art keywords
- section
- temperature
- setting
- tip
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 14
- 238000005476 soldering Methods 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987098890U JPH0421649Y2 (pt) | 1987-06-27 | 1987-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987098890U JPH0421649Y2 (pt) | 1987-06-27 | 1987-06-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS645772U true JPS645772U (pt) | 1989-01-13 |
| JPH0421649Y2 JPH0421649Y2 (pt) | 1992-05-18 |
Family
ID=31325549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987098890U Expired JPH0421649Y2 (pt) | 1987-06-27 | 1987-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0421649Y2 (pt) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008139623A1 (ja) * | 2007-05-15 | 2008-11-20 | Hakko Corporation | 温度ロック機構を有するはんだ取扱用温度制御装置 |
| JP2015160245A (ja) * | 2014-02-28 | 2015-09-07 | 白光株式会社 | 給電ユニット、制御ユニット、管理装置、および給電制御装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49143423U (pt) * | 1973-04-11 | 1974-12-11 |
-
1987
- 1987-06-27 JP JP1987098890U patent/JPH0421649Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49143423U (pt) * | 1973-04-11 | 1974-12-11 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008139623A1 (ja) * | 2007-05-15 | 2008-11-20 | Hakko Corporation | 温度ロック機構を有するはんだ取扱用温度制御装置 |
| US7886954B2 (en) | 2007-05-15 | 2011-02-15 | Hakko Corporation | Solder handling temperature controller with temperature lock mechanism |
| JP5066181B2 (ja) * | 2007-05-15 | 2012-11-07 | 白光株式会社 | 温度ロック機構を有するはんだ取扱用温度制御装置 |
| JP2015160245A (ja) * | 2014-02-28 | 2015-09-07 | 白光株式会社 | 給電ユニット、制御ユニット、管理装置、および給電制御装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0421649Y2 (pt) | 1992-05-18 |