JPS6457638U - - Google Patents
Info
- Publication number
- JPS6457638U JPS6457638U JP1987152088U JP15208887U JPS6457638U JP S6457638 U JPS6457638 U JP S6457638U JP 1987152088 U JP1987152088 U JP 1987152088U JP 15208887 U JP15208887 U JP 15208887U JP S6457638 U JPS6457638 U JP S6457638U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- brazing material
- semiconductor device
- ceramic package
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987152088U JPS6457638U (enExample) | 1987-10-02 | 1987-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987152088U JPS6457638U (enExample) | 1987-10-02 | 1987-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6457638U true JPS6457638U (enExample) | 1989-04-10 |
Family
ID=31426705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987152088U Pending JPS6457638U (enExample) | 1987-10-02 | 1987-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6457638U (enExample) |
-
1987
- 1987-10-02 JP JP1987152088U patent/JPS6457638U/ja active Pending