JPS6456779A - Adhesive composition and sheetlike adhesive thereof - Google Patents

Adhesive composition and sheetlike adhesive thereof

Info

Publication number
JPS6456779A
JPS6456779A JP5792588A JP5792588A JPS6456779A JP S6456779 A JPS6456779 A JP S6456779A JP 5792588 A JP5792588 A JP 5792588A JP 5792588 A JP5792588 A JP 5792588A JP S6456779 A JPS6456779 A JP S6456779A
Authority
JP
Japan
Prior art keywords
epoxy polymer
adhesive
meth
curing agent
acrylic copolymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5792588A
Other languages
Japanese (ja)
Inventor
Yozo Kirie
Hironori Tabata
Masanori Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP5792588A priority Critical patent/JPS6456779A/en
Publication of JPS6456779A publication Critical patent/JPS6456779A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To obtain the titled composition, consisting of an epoxy polymer, specific acrylic copolymer and curing agent for the epoxy polymer, having great adhesive force and excellent heat resistance, flexibility, electrical insulating properties, etc., and capable of suitably bonding metallic foils. CONSTITUTION:The aimed composition consisting of (A) an epoxy polymer having >=2 epoxy groups in the molecule (e.g. bisphenol A type epoxy polymer), (B) an acrylic copolymer prepared by copolymerizing (i) 25-55wt.%, 30-50wt.% acrylonitrile with (ii) 75-44.5wt.%, preferably 70-49.7wt.% alkyl (meth)acrylate (preferably having 4-8C alkyl group) and (C) <0.5wt.%, preferably <0.3wt.% (meth)acrylic acid and (C) a curing agent for the epoxy polymer (e.g. dicyandiamide) at 30:70-70:30 weight ratio of the components (A) to (B).
JP5792588A 1987-03-12 1988-03-10 Adhesive composition and sheetlike adhesive thereof Pending JPS6456779A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5792588A JPS6456779A (en) 1987-03-12 1988-03-10 Adhesive composition and sheetlike adhesive thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5775487 1987-03-12
JP5792588A JPS6456779A (en) 1987-03-12 1988-03-10 Adhesive composition and sheetlike adhesive thereof

Publications (1)

Publication Number Publication Date
JPS6456779A true JPS6456779A (en) 1989-03-03

Family

ID=26398824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5792588A Pending JPS6456779A (en) 1987-03-12 1988-03-10 Adhesive composition and sheetlike adhesive thereof

Country Status (1)

Country Link
JP (1) JPS6456779A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0292981A (en) * 1988-09-29 1990-04-03 Soken Kagaku Kk Thermosetting adhesive composition for polyimide resin
JPH0292978A (en) * 1988-09-29 1990-04-03 Soken Kagaku Kk Thermally adhesive polyimide resin tape
JP2006104389A (en) * 2004-10-07 2006-04-20 Sekisui Chem Co Ltd Acrylic adhesive and adhesive tape for fixing inorganic adherend
JP2008024772A (en) * 2006-07-19 2008-02-07 Arisawa Mfg Co Ltd Resin composition for adhesive sheet and adhesive sheet for flexible printed wiring board using the composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0292981A (en) * 1988-09-29 1990-04-03 Soken Kagaku Kk Thermosetting adhesive composition for polyimide resin
JPH0292978A (en) * 1988-09-29 1990-04-03 Soken Kagaku Kk Thermally adhesive polyimide resin tape
JP2006104389A (en) * 2004-10-07 2006-04-20 Sekisui Chem Co Ltd Acrylic adhesive and adhesive tape for fixing inorganic adherend
JP2008024772A (en) * 2006-07-19 2008-02-07 Arisawa Mfg Co Ltd Resin composition for adhesive sheet and adhesive sheet for flexible printed wiring board using the composition
US8436126B2 (en) 2006-07-19 2013-05-07 Arisawa Mfg. Co., Ltd. Resin composition for adhesive sheet and adhesive sheet using the composition for flexible printed circuit board

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