JPS6455551A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
JPS6455551A
JPS6455551A JP21156387A JP21156387A JPS6455551A JP S6455551 A JPS6455551 A JP S6455551A JP 21156387 A JP21156387 A JP 21156387A JP 21156387 A JP21156387 A JP 21156387A JP S6455551 A JPS6455551 A JP S6455551A
Authority
JP
Japan
Prior art keywords
formula
alkaline soluble
resist
weight average
methacrylic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21156387A
Other languages
Japanese (ja)
Other versions
JPH0820735B2 (en
Inventor
Yoji Tanaka
Hideo Nakasaki
Hiroki Furubayashi
Kenji Kamio
Kazutaka Masaoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP62211563A priority Critical patent/JPH0820735B2/en
Publication of JPS6455551A publication Critical patent/JPS6455551A/en
Publication of JPH0820735B2 publication Critical patent/JPH0820735B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G03F7/0295—Photolytic halogen compounds

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)

Abstract

PURPOSE:To prevent twining the peeled strip of a resist round the roll of a peeling machine by incorporating a prescribed amount of a film forming polymer composed of two kinds of alkaline soluble vinyl copolymers in the titled composition, thereby reducing minutely the peeled strip of the resist. CONSTITUTION:The titled composition comprises 40-80pts.wt. of the film forming polymer (A), 20-60pts.wt. of an ethylenically unsatd. compd., 0.2-10pts. wt. of an org. halogen compd., and a prescribed amount of a sensitizer capable of forming a free radical by an active ray. And, the polymer A is composed of a mixture of the alkaline soluble copolymer (a) which contains 20-40wt.% of methacrylic acid, 5-30wt.% of styrene and 30-75wt.% of a monomer shown by the formula, and has the weight average mol.wt. of 10,000-50,000, and the alkaline soluble copolymer (b) which contains 20-40wt.% of methacrylic acid and 60-80wt.% of a monomer shown by the formula, and has the weight average mol.wt. of 60,000-150,000. In the formula, R1 is hydrogen atom or methyl group, R2 is 1-12C alkyl group.
JP62211563A 1987-08-26 1987-08-26 Photosensitive resin composition Expired - Lifetime JPH0820735B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62211563A JPH0820735B2 (en) 1987-08-26 1987-08-26 Photosensitive resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62211563A JPH0820735B2 (en) 1987-08-26 1987-08-26 Photosensitive resin composition

Publications (2)

Publication Number Publication Date
JPS6455551A true JPS6455551A (en) 1989-03-02
JPH0820735B2 JPH0820735B2 (en) 1996-03-04

Family

ID=16607863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62211563A Expired - Lifetime JPH0820735B2 (en) 1987-08-26 1987-08-26 Photosensitive resin composition

Country Status (1)

Country Link
JP (1) JPH0820735B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025061A (en) * 1988-02-24 1990-01-09 Hoechst Ag Radiation polymerizable component and radiation sensitive recording material
US5149776A (en) * 1989-11-17 1992-09-22 Mitsubishi Rayon Co., Ltd. Cross-linking hardenable resin composition, metal laminates thereof and metal surface processing method therewith
US5228498A (en) * 1990-05-31 1993-07-20 Kabushiki Kaisha Kobe Seiko Sho Continuous casting equipment and continuous casting method
JPH05241340A (en) * 1992-02-26 1993-09-21 Fuji Photo Film Co Ltd Photopolymerizable composition
JPH05333542A (en) * 1992-06-03 1993-12-17 Nippon Synthetic Chem Ind Co Ltd:The Photosensitive resin composition
US5504730A (en) * 1991-12-11 1996-04-02 Sony Corporation Disk cartridge loading mechanism for use in disk recording and/or regenerating device having a reduced thickness and reduced complexity

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5294388A (en) * 1974-10-04 1977-08-08 Dynachem Corp Photopolymerizable composition and preparation thereof
JPS60225841A (en) * 1984-04-25 1985-11-11 Hitachi Chem Co Ltd Photosensitive resin composition
JPS6259946A (en) * 1985-09-10 1987-03-16 Hitachi Chem Co Ltd Photosensitive resin composition
JPS6275633A (en) * 1985-09-30 1987-04-07 Hitachi Chem Co Ltd Photosensitive resin composition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5294388A (en) * 1974-10-04 1977-08-08 Dynachem Corp Photopolymerizable composition and preparation thereof
JPS61134756A (en) * 1974-10-04 1986-06-21 ダイナケム　コ−ポレ−シヨン Making of photoresist
JPS60225841A (en) * 1984-04-25 1985-11-11 Hitachi Chem Co Ltd Photosensitive resin composition
JPS6259946A (en) * 1985-09-10 1987-03-16 Hitachi Chem Co Ltd Photosensitive resin composition
JPS6275633A (en) * 1985-09-30 1987-04-07 Hitachi Chem Co Ltd Photosensitive resin composition

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH025061A (en) * 1988-02-24 1990-01-09 Hoechst Ag Radiation polymerizable component and radiation sensitive recording material
US5149776A (en) * 1989-11-17 1992-09-22 Mitsubishi Rayon Co., Ltd. Cross-linking hardenable resin composition, metal laminates thereof and metal surface processing method therewith
US5228498A (en) * 1990-05-31 1993-07-20 Kabushiki Kaisha Kobe Seiko Sho Continuous casting equipment and continuous casting method
US5504730A (en) * 1991-12-11 1996-04-02 Sony Corporation Disk cartridge loading mechanism for use in disk recording and/or regenerating device having a reduced thickness and reduced complexity
JPH05241340A (en) * 1992-02-26 1993-09-21 Fuji Photo Film Co Ltd Photopolymerizable composition
JPH05333542A (en) * 1992-06-03 1993-12-17 Nippon Synthetic Chem Ind Co Ltd:The Photosensitive resin composition

Also Published As

Publication number Publication date
JPH0820735B2 (en) 1996-03-04

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