JPS6454749U - - Google Patents

Info

Publication number
JPS6454749U
JPS6454749U JP1987150046U JP15004687U JPS6454749U JP S6454749 U JPS6454749 U JP S6454749U JP 1987150046 U JP1987150046 U JP 1987150046U JP 15004687 U JP15004687 U JP 15004687U JP S6454749 U JPS6454749 U JP S6454749U
Authority
JP
Japan
Prior art keywords
housing
electric motor
holds
shaped
brush
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987150046U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987150046U priority Critical patent/JPS6454749U/ja
Priority to US07/251,594 priority patent/US4900967A/en
Publication of JPS6454749U publication Critical patent/JPS6454749U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/14—Means for supporting or protecting brushes or brush holders
    • H02K5/143—Means for supporting or protecting brushes or brush holders for cooperation with commutators
    • H02K5/148—Slidably supported brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R39/00—Rotary current collectors, distributors or interrupters
    • H01R39/02—Details for dynamo electric machines
    • H01R39/38—Brush holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R39/00—Rotary current collectors, distributors or interrupters
    • H01R39/02—Details for dynamo electric machines
    • H01R39/38—Brush holders
    • H01R39/41—Brush holders cartridge type

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Motor Or Generator Frames (AREA)
  • Motor Or Generator Current Collectors (AREA)
  • Manufacture Of Motors, Generators (AREA)
JP1987150046U 1987-09-30 1987-09-30 Pending JPS6454749U (en, 2012)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1987150046U JPS6454749U (en, 2012) 1987-09-30 1987-09-30
US07/251,594 US4900967A (en) 1987-09-30 1988-09-30 Electric motor assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987150046U JPS6454749U (en, 2012) 1987-09-30 1987-09-30

Publications (1)

Publication Number Publication Date
JPS6454749U true JPS6454749U (en, 2012) 1989-04-04

Family

ID=15488323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987150046U Pending JPS6454749U (en, 2012) 1987-09-30 1987-09-30

Country Status (2)

Country Link
US (1) US4900967A (en, 2012)
JP (1) JPS6454749U (en, 2012)

Cited By (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6844615B1 (en) 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices
US6846704B2 (en) 2001-03-27 2005-01-25 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US6873032B1 (en) 2001-04-04 2005-03-29 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US6873041B1 (en) 2001-11-07 2005-03-29 Amkor Technology, Inc. Power semiconductor package with strap
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US6919620B1 (en) 2002-09-17 2005-07-19 Amkor Technology, Inc. Compact flash memory card with clamshell leadframe
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US6927483B1 (en) 2003-03-07 2005-08-09 Amkor Technology, Inc. Semiconductor package exhibiting efficient lead placement
US6953988B2 (en) 2000-03-25 2005-10-11 Amkor Technology, Inc. Semiconductor package
US6965157B1 (en) 1999-11-09 2005-11-15 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6965159B1 (en) 2001-09-19 2005-11-15 Amkor Technology, Inc. Reinforced lead-frame assembly for interconnecting circuits within a circuit module
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
US6995459B2 (en) 2002-09-09 2006-02-07 Amkor Technology, Inc. Semiconductor package with increased number of input and output pins
US7001799B1 (en) 2003-03-13 2006-02-21 Amkor Technology, Inc. Method of making a leadframe for semiconductor devices
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7045396B2 (en) 1999-12-16 2006-05-16 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US7045883B1 (en) 2001-04-04 2006-05-16 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7045882B2 (en) 2000-12-29 2006-05-16 Amkor Technology, Inc. Semiconductor package including flip chip
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7057280B2 (en) 1998-11-20 2006-06-06 Amkor Technology, Inc. Leadframe having lead locks to secure leads to encapsulant
US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7067908B2 (en) 1999-10-15 2006-06-27 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US7102208B1 (en) 1999-10-15 2006-09-05 Amkor Technology, Inc. Leadframe and semiconductor package with improved solder joint strength
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7170150B2 (en) 2001-03-27 2007-01-30 Amkor Technology, Inc. Lead frame for semiconductor package
US7183630B1 (en) 2002-04-15 2007-02-27 Amkor Technology, Inc. Lead frame with plated end leads
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US7253503B1 (en) 1999-11-05 2007-08-07 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US7321162B1 (en) 1999-10-15 2008-01-22 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7598598B1 (en) 2003-02-05 2009-10-06 Amkor Technology, Inc. Offset etched corner leads for semiconductor package
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9275939B1 (en) 2011-01-27 2016-03-01 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9362210B2 (en) 2000-04-27 2016-06-07 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US9431323B1 (en) 2011-11-29 2016-08-30 Amkor Technology, Inc. Conductive pad on protruding through electrode

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR920005069Y1 (ko) * 1988-08-09 1992-07-27 미쯔비시 덴끼 가부시기가이샤 스타터 장치
JPH083184Y2 (ja) * 1990-04-11 1996-01-29 三菱電機株式会社 回転速度検出器付直流電動機
GB9307671D0 (en) * 1993-04-14 1993-06-02 Johnson Electric Sa A pmdc electric motor with a magnet spacer
DE4433972A1 (de) * 1994-09-23 1996-03-28 Teves Gmbh Alfred Elektromotor, Pumpe sowie ein Elektromotor/Pumpenaggregat
CA2266267C (en) * 1998-04-02 2007-07-10 Chih M. Lin Motor and end frame therefor for machine or pump applications and method of assembling same
DE102006035062A1 (de) * 2006-07-28 2008-01-31 Robert Bosch Gmbh Integriertes Antriebselement
DE102010042133A1 (de) * 2010-10-07 2012-04-12 Robert Bosch Gmbh Spannscheibe zum Befestigen eines Stators im Gehäuse einer elektrischen Maschine

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2249684B2 (de) * 1972-10-11 1978-12-21 Robert Bosch Gmbh, 7000 Stuttgart Elektrische Maschine, insbesondere Kleinmotor
IT8035721U1 (it) * 1980-05-02 1981-11-02 Fabbrica Italiana Magneti Marelli S P A Disco porta spazzole di motorini di avviamento, particolarmente per autovetture
DE3021948A1 (de) * 1980-06-12 1981-12-24 Rau Swf Autozubehoer Elektrische antriebseinheit, insbesondere fuer scheibenwischer eines kraftfahrzeuges
JPS60121940A (ja) * 1983-12-01 1985-06-29 Nippon Denso Co Ltd 小型モ−タ
JPS626831A (ja) * 1985-07-03 1987-01-13 Nissan Motor Co Ltd ４輪駆動車の駆動力配分制御装置
WO1988001801A1 (en) * 1986-08-27 1988-03-10 Swf Auto-Electric Gmbh Electric machine, in particular electric motor

Cited By (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7560804B1 (en) 1998-06-24 2009-07-14 Amkor Technology, Inc. Integrated circuit package and method of making the same
US7112474B1 (en) 1998-06-24 2006-09-26 Amkor Technology, Inc. Method of making an integrated circuit package
US7332375B1 (en) 1998-06-24 2008-02-19 Amkor Technology, Inc. Method of making an integrated circuit package
US7071541B1 (en) 1998-06-24 2006-07-04 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US7030474B1 (en) 1998-06-24 2006-04-18 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6893900B1 (en) 1998-06-24 2005-05-17 Amkor Technology, Inc. Method of making an integrated circuit package
US9224676B1 (en) 1998-06-24 2015-12-29 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8963301B1 (en) 1998-06-24 2015-02-24 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US7005326B1 (en) 1998-06-24 2006-02-28 Amkor Technology, Inc. Method of making an integrated circuit package
US7057280B2 (en) 1998-11-20 2006-06-06 Amkor Technology, Inc. Leadframe having lead locks to secure leads to encapsulant
US7564122B2 (en) 1998-11-20 2009-07-21 Amkor Technology, Inc. Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
US7067908B2 (en) 1999-10-15 2006-06-27 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US7535085B2 (en) 1999-10-15 2009-05-19 Amkor Technology, Inc. Semiconductor package having improved adhesiveness and ground bonding
US7321162B1 (en) 1999-10-15 2008-01-22 Amkor Technology, Inc. Semiconductor package having reduced thickness
US7102208B1 (en) 1999-10-15 2006-09-05 Amkor Technology, Inc. Leadframe and semiconductor package with improved solder joint strength
US7253503B1 (en) 1999-11-05 2007-08-07 Amkor Technology, Inc. Integrated circuit device packages and substrates for making the packages
US6965157B1 (en) 1999-11-09 2005-11-15 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US7045396B2 (en) 1999-12-16 2006-05-16 Amkor Technology, Inc. Stackable semiconductor package and method for manufacturing same
US6953988B2 (en) 2000-03-25 2005-10-11 Amkor Technology, Inc. Semiconductor package
US9362210B2 (en) 2000-04-27 2016-06-07 Amkor Technology, Inc. Leadframe and semiconductor package made using the leadframe
US7045882B2 (en) 2000-12-29 2006-05-16 Amkor Technology, Inc. Semiconductor package including flip chip
US6967395B1 (en) 2001-03-20 2005-11-22 Amkor Technology, Inc. Mounting for a package containing a chip
US7170150B2 (en) 2001-03-27 2007-01-30 Amkor Technology, Inc. Lead frame for semiconductor package
US7521294B2 (en) 2001-03-27 2009-04-21 Amkor Technology, Inc. Lead frame for semiconductor package
US6846704B2 (en) 2001-03-27 2005-01-25 Amkor Technology, Inc. Semiconductor package and method for manufacturing the same
US6873032B1 (en) 2001-04-04 2005-03-29 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7064009B1 (en) 2001-04-04 2006-06-20 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7045883B1 (en) 2001-04-04 2006-05-16 Amkor Technology, Inc. Thermally enhanced chip scale lead on chip semiconductor package and method of making same
US7485952B1 (en) 2001-09-19 2009-02-03 Amkor Technology, Inc. Drop resistant bumpers for fully molded memory cards
US6965159B1 (en) 2001-09-19 2005-11-15 Amkor Technology, Inc. Reinforced lead-frame assembly for interconnecting circuits within a circuit module
US6998702B1 (en) 2001-09-19 2006-02-14 Amkor Technology, Inc. Front edge chamfer feature for fully-molded memory cards
US7176062B1 (en) 2001-09-19 2007-02-13 Amkor Technology, Inc. Lead-frame method and assembly for interconnecting circuits within a circuit module
US6873041B1 (en) 2001-11-07 2005-03-29 Amkor Technology, Inc. Power semiconductor package with strap
US7183630B1 (en) 2002-04-15 2007-02-27 Amkor Technology, Inc. Lead frame with plated end leads
US6995459B2 (en) 2002-09-09 2006-02-07 Amkor Technology, Inc. Semiconductor package with increased number of input and output pins
US7211471B1 (en) 2002-09-09 2007-05-01 Amkor Technology, Inc. Exposed lead QFP package fabricated through the use of a partial saw process
US6919620B1 (en) 2002-09-17 2005-07-19 Amkor Technology, Inc. Compact flash memory card with clamshell leadframe
US9406645B1 (en) 2002-11-08 2016-08-02 Amkor Technology, Inc. Wafer level package and fabrication method
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US8952522B1 (en) 2002-11-08 2015-02-10 Amkor Technology, Inc. Wafer level package and fabrication method
US7598598B1 (en) 2003-02-05 2009-10-06 Amkor Technology, Inc. Offset etched corner leads for semiconductor package
US6927483B1 (en) 2003-03-07 2005-08-09 Amkor Technology, Inc. Semiconductor package exhibiting efficient lead placement
US7001799B1 (en) 2003-03-13 2006-02-21 Amkor Technology, Inc. Method of making a leadframe for semiconductor devices
US6844615B1 (en) 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices
US7095103B1 (en) 2003-05-01 2006-08-22 Amkor Technology, Inc. Leadframe based memory card
US6879034B1 (en) 2003-05-01 2005-04-12 Amkor Technology, Inc. Semiconductor package including low temperature co-fired ceramic substrate
US7008825B1 (en) 2003-05-27 2006-03-07 Amkor Technology, Inc. Leadframe strip having enhanced testability
US6897550B1 (en) 2003-06-11 2005-05-24 Amkor Technology, Inc. Fully-molded leadframe stand-off feature
US7245007B1 (en) 2003-09-18 2007-07-17 Amkor Technology, Inc. Exposed lead interposer leadframe package
US6921967B2 (en) 2003-09-24 2005-07-26 Amkor Technology, Inc. Reinforced die pad support structure
US7138707B1 (en) 2003-10-21 2006-11-21 Amkor Technology, Inc. Semiconductor package including leads and conductive posts for providing increased functionality
US7214326B1 (en) 2003-11-07 2007-05-08 Amkor Technology, Inc. Increased capacity leadframe and semiconductor package using the same
US7144517B1 (en) 2003-11-07 2006-12-05 Amkor Technology, Inc. Manufacturing method for leadframe and for semiconductor package using the leadframe
US7211879B1 (en) 2003-11-12 2007-05-01 Amkor Technology, Inc. Semiconductor package with chamfered corners and method of manufacturing the same
US7057268B1 (en) 2004-01-27 2006-06-06 Amkor Technology, Inc. Cavity case with clip/plug for use on multi-media card
US7091594B1 (en) 2004-01-28 2006-08-15 Amkor Technology, Inc. Leadframe type semiconductor package having reduced inductance and its manufacturing method
US7190062B1 (en) 2004-06-15 2007-03-13 Amkor Technology, Inc. Embedded leadframe semiconductor package
US7202554B1 (en) 2004-08-19 2007-04-10 Amkor Technology, Inc. Semiconductor package and its manufacturing method
US7473584B1 (en) 2004-10-22 2009-01-06 Amkor Technology, Inc. Method for fabricating a fan-in leadframe semiconductor package
US7217991B1 (en) 2004-10-22 2007-05-15 Amkor Technology, Inc. Fan-in leadframe semiconductor package
US7507603B1 (en) 2005-12-02 2009-03-24 Amkor Technology, Inc. Etch singulated semiconductor package
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US9275939B1 (en) 2011-01-27 2016-03-01 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9508631B1 (en) 2011-01-27 2016-11-29 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9431323B1 (en) 2011-11-29 2016-08-30 Amkor Technology, Inc. Conductive pad on protruding through electrode
US9129943B1 (en) 2012-03-29 2015-09-08 Amkor Technology, Inc. Embedded component package and fabrication method
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9543235B2 (en) 2013-10-24 2017-01-10 Amkor Technology, Inc. Semiconductor package and method therefor

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